PTQ/SB/05 (08-08)
`Approved for use through 09/30/2010. OMB 0651-0032
`U.S. Patent and Trademark Office. U.S. DEPARTMENT OF COMMERCE
`Under the Paperwork Reduction Act of 1995 no oersons are reauired to resoond to a collection of information unless it displavs a valid OMB control number.
`
`UTILITY
`PATENT APPLICATION
`TRANSMITTAL
`(Only for new nonprovisiona! applications under 37 CFR 1.53(b))
`
`'-
`
`Attorney Docket No.
`
`ALI-001
`
`First Inventor
`
`Title
`
`Scott Fullam
`
`COMPONENT PROTECTIVE ...
`
`Express Mail Label No. N/A
`
`...)
`
`APPLICATION ELEMENTS
`See MPEP chapter 600 concerning utility patent application contents.
`
`ADDRESS TO:
`
`Commissioner for Patents
`P.O. Box 1450
`Alexandria VA 22313-1450
`
`1.0 Fee Transmittal Form (e.g., PTO/SB/17)
`
`ACCOMPANYING APPLICATION PARTS
`
`2.0 Applicant claims small entity status.
`See 37 CFR 1.27.
`32
`[Total Pages
`3.0 Specification
`Both the claims and abstract must start on a new page
`(For Information on the preferred arrangement, see MPEP 608,01(a))
`[Total Sheets
`4.1ZJ Drawing(s) (35 U.S. C. 113)
`10
`
`1
`
`5. Oath or Declaration
`
`[Total Sheets
`
`a. EJ Newly executed (original or copy)
`0or continuation/divisional with Box 18 completed)
`
`b.
`
`A copy from a prior application (37 CFR 1.63(d))
`
`i.
`
`DELETION OF INVENTOR(S)
`Signed statement attached deleting lnventor(s)
`name In the prior application, see 37 CFR
`1.63(d)(2) and 1.33(b).
`
`9. 0
`
`Assignment Papers (cover sheet & document(s))
`
`Name of Assignee
`
`1
`1
`
`10. 0
`
`37 CFR 3,73(b) Statement
`(when there Is an assignee)
`
`DPowerof
`Attorney
`
`11. 0
`English Translation Document (if applicable)
`12. D lnfoEjtion Disclosure Statement (PTO/SB/08 or PT0-1449)
`Copies of citations attached
`
`6.[{] Application Data Sheet. See 37 CFR 1.76
`
`7.0 CD-ROM or CD-R in duplicate, large table or
`~puter Program (Appendix)
`Landscape Table on CD
`
`13. D Preliminary Amendment
`14. D Return Receipt Postcard (MPEP 503)
`(Should be specifically itemized)
`15. 0 Certified Copy of Priority Document(s)
`(ifforeign priority is claimed)
`
`16. 0 Nonpublication Request under 35 U.S.C. 122(b)(2)(B)(i).
`Applicant must attach form PTO/SB/35 or equivalent.
`17. D Other:
`
`8. Nucleotide and/or Amino Acid Sequence Submission
`(if applicable, items a. - c. are required)
`'!. D Computer Re<~dable Form (CRF)
`Specification Sequence Listing on:
`b.
`D
`CD-ROM or CD-R (2 copies); or
`i.
`D
`II.
`Paper
`c. D Statements verifying identity of above copies
`18. If a CONTINUING APPLICATION, check appropriate box, and supply the requisite information below and in the first sentence ofthe
`specification following the title, or in an Application Data Sheet under 37 CFR 1. 76:
`D Continuation-in-part (CIP)
`
`0
`
`Continuation
`
`D
`
`Divisional
`
`of prior application No.: .................................
`
`Prior application information:
`
`Examiner
`
`Art Unit:
`
`19. CORRESPONDENCE ADDRESS
`
`[{]The address associated with Customer Number: I
`
`15516
`
`I OR D Correspondence address below
`
`Name
`
`Address
`
`City
`
`Country
`
`Signature
`
`Name
`(Print/Type)
`
`I State I
`
`1 Telephone 1
`
`~?~
`Scott S. Kokka
`
`1 Zip Code
`
`I Email
`1 Date June 1 0, 2011
`Registration No. I
`(Attornev/Aqent) 51 •893
`
`This collection of information is required by 37 CFR 1.53(b). The information is required to obtain or retain a benefit by the public which is to file (and by the
`USPTO to process) an application. Confidentiality is governed by 35 U.S.C. 122 and 37 CFR 1.11 and 1.14. This collection is estimated to take 12 minutes to
`complete, including gathering, preparing, and submitting the completed application form to the USPTO. Time will vary depending upon the individual case. Any
`comments on the amount of time you require to complete this form and/or suggestions for reducing this burden, should be sent to the Chief Information Officer,
`U.S. Patent and Trademark Office, U.S. Department of Commerce, P.O. Box 1450, Alexandria, VA 22313-1450. DO NOT SEND FEES OR COMPLETED
`FORMS TO THIS ADDRESS. SEND TO: Commissioner for Patents, P.O. Box 1450, Alexandria, VA 22313-1450.
`If you need assistance in completing tile form, ca/11-800-PT0-9199 and select option 2.
`
`1 of 275
`
`FITBIT EXHIBIT 1017
`
`

`
`Application Data Sheet
`
`Application Information
`
`Filing Date::
`
`Application Type::
`
`Subject Matter::
`
`Suggested Group Art Unit::
`
`CD~ROM or CD~R?::
`
`Title::
`
`June 10, 2011
`
`Regular
`
`Utility
`
`None
`
`None
`
`COMPONENT PROTECTIVE
`OVERMOLD!NG
`
`Attorney Docket Number::
`
`ALI-001
`
`Request for Early Publication?::
`
`Request for Non-Publication?::
`
`Suggested Drawing Figure;;
`
`Total Drawing Sheets::
`
`Small Entity::
`
`Petition included?::
`
`Secrecy Order in Parent Appl.?::
`
`Applicant Information
`
`No
`
`No
`
`6A
`
`10
`
`No
`
`No
`
`No
`
`Applicant Authority type::
`
`Inventor
`
`Primary Citizenship Country::
`
`United States of America
`
`Status::
`
`Given Name::
`
`Family Name::
`
`City of Residence::
`
`Full Capacity
`
`Scott
`
`Fullam
`
`Palo Alto
`
`1
`
`2 of 275
`
`

`
`State or Province of Residence::
`
`CA
`
`Country of Residence::
`
`United States of America
`
`Street of mailing address::
`
`3982 Sutherland Dr.
`
`City of mailing address::
`
`Palo Alto
`
`Country of mailing address::
`
`United States of America
`
`State or Province of mailing address::
`
`GA
`
`Postal or Zip Code of mailing address:: 94303
`
`Applicant Authority type::
`
`Inventor
`
`Primary Citizenship Country::
`
`United States of America
`
`Status::
`
`Given Name::
`
`Family Name::
`
`Full Capacity
`
`Skip
`
`Orvis
`
`City of Residence:.:
`
`Sunnyvale
`
`State or Province of Residence::
`
`CA
`
`Country of Residence::
`
`United States of America
`
`Street of mailing address::
`
`687 W, Maude Avenue
`
`City of mailing address::
`
`Sunnyvale
`
`Country of mailing address::
`
`United States of America
`
`State or Province of mailing address:: CA
`
`Postal or Zip Code of mailing address:: 94085
`
`2
`
`3 of 275
`
`

`
`Correspondence Information
`
`Customer Number::
`
`15516
`
`Name::
`
`Kokka & Backus, PC
`
`Street of mailing address::
`
`703 High Street
`
`City of mailing address::
`
`Palo Alto
`
`Country of mailing address::
`
`USA
`
`State or Province of mailing address:: CA
`
`Postal or Zip Code of mailing address:: 94301
`
`Telephone::
`
`Fax::
`
`(650) 566-9921
`
`(650) 566-9922
`
`Representative Information
`
`Representative Customer Number::
`
`·15516
`
`Representative
`
`Registration Number::
`
`Name::
`
`Designation::
`
`Primary
`
`51,893
`
`Scott S. Kokka
`
`Assignee Information
`
`Name:: A!iphCom, Inc.
`
`Mailing address:: 687 W. Maude Avenue, Sunnyvale, CA 94085
`
`3
`
`4 of 275
`
`

`
`1/10
`
`FIG. 1
`
`108
`
`'104
`
`102
`
`100
`
`102
`
`200
`
`104
`
`FIG. 2
`
`5 of 275
`
`

`
`2/10
`
`104
`
`FIG. 3
`
`40
`10~. . \:-"""41 0
`40o-jl • ~
`
`106 208
`
`104
`
`FIG. 4
`
`302
`
`102
`
`300
`
`40
`
`,
`
`..... ··
`400
`
`6 of 275
`
`

`
`3/10
`
`
`
`¢.V¢..<.’.‘o.,¢.V¢..<.’.‘o.,
`
`
`0. *4/*9 * "9 '9 ’/*2-'0. *4/*9 * "9 '9 ’/*2-'
`
`
`‘‘~z.‘~z.V«5.‘.’¢w>.».‘~5.$‘‘~z.‘~z.V«5.‘.’¢w>.».‘~5.$
`
`
`FIG. SA
`
`
`
`- “.‘t“3l“!v“¥“5"?‘Vb‘Vb‘VJ"i“‘i*“’b“¢‘“:"i\“{\“‘}“‘}“é"{\“i\“’}“§“‘}“¢“{\“i\‘- “.‘t“3l“!v“¥“5"?‘Vb‘Vb‘VJ"i“‘i*“’b“¢‘“:"i\“{\“‘}“‘}“é"{\“i\“’}“§“‘}“¢“{\“i\‘
`
`51
`
`FIG. 58
`
`
`
`3.\..................................................................................................................................3.\..................................................................................................................................
`
`FIG. 5C
`
`7 of 275
`
`

`
`4/10
`
`602
`
`Forrn protective layer
`
`Form inner molding
`
`Perform function test
`
`604
`
`606
`
`608
`
`No
`
`612
`
`Form outer molding
`
`614
`
`Perform final test
`
`616
`
`610
`
`618
`
`Perform visual inspection
`
`··"
`600
`
`FIG. 6A
`
`8 of 275
`
`

`
`5/10
`
`622
`
`Selectively apply
`protective material over
`e!ernents coupled to
`frarnework
`
`624
`
`Forrn inner molding over
`framework, elernents, and
`protective material
`
`626
`
`628
`
`Forn1 outer molding over
`inner molding, framewor~<:,
`~------..,
`elements, and protective
`rnaterlal
`
`Perform inspection of
`outer rnolding to
`determine if defect is
`present
`
`630
`
`Rernove outer molding
`
`632
`
`.. ~
`
`620
`
`FIG. 68
`
`9 of 275
`
`

`
`6/10
`
`642
`
`Selectively apply securing
`coating over components
`on frame\'l.lOrk
`
`644
`
`Form molding over
`securing coating,
`cornponents, and
`framework
`
`640
`
`FIG. 6C
`
`10 of 275
`
`

`
`7/10
`
`652
`
`654
`
`656
`
`Place elements on
`framework
`
`Secure elements to
`framework using curable
`materia!
`
`Perform inspection of
`curable materia! after
`!a~lering on framework
`and elements
`
`658
`
`Forrn one or more
`moldings over curable
`material, framevmrk, and
`elements
`
`666
`
`660
`
`Perform inspection for
`defects in moldings
`
`Reform molding over
`curable material ;
`framework, and elements
`
`662
`
`Remove defective
`molding
`
`664
`
`650
`
`FIG. 6D
`
`11 of 275
`
`

`
`0
`
`-~ oc
`
`~
`
`t--
`0
`~
`
`~
`
`12 of 275
`
`

`
`0 -0\
`
`13 of 275
`
`

`
`c
`"""""" c,
`
`14 of 275
`
`

`
`Electronic Acknowledgement Receipt
`
`EFSID:
`
`Application Number:
`
`10283855
`
`13158372
`
`International Application Number:
`
`Confirmation Number:
`
`9277
`
`Title of Invention:
`
`COMPONENT PROTECTIVE OVERMOLDING
`
`First Named Inventor/Applicant Name:
`
`Scott Fullam
`
`Customer Number:
`
`15516
`
`Filer:
`
`Scott Susumu Kokka
`
`Filer Authorized By:
`
`Attorney Docket Number:
`
`ALI-001
`
`Receipt Date:
`
`10-JUN-2011
`
`Filing Date:
`
`TimeStamp:
`
`23:48:41
`
`Application Type:
`
`Utility under 35 USC 111 (a)
`
`Payment information:
`
`Submitted with Payment
`
`I no
`
`File Listing:
`
`Document
`Number
`
`1
`
`Document Description
`
`File Name
`
`File Size( Bytes)/
`Message Digest
`
`Multi
`Part /.zip
`
`Pages
`(ifappl.)
`
`ALI-001_Application_asfi led.
`pdf
`
`10530251
`
`b 1 bc4ef54f7798e76d87ba48353bb283889
`55715
`
`yes
`
`46
`
`15 of 275
`
`

`
`Multipart Description/PDF files in .zip description
`
`Document Description
`
`Start
`
`End
`
`Transmittal of New Application
`
`Application Data Sheet
`
`Specification
`
`Claims
`
`Abstract
`
`Drawings-only black and white line drawings
`
`1
`
`2
`
`5
`
`30
`
`36
`
`37
`
`1
`
`4
`
`29
`
`35
`
`36
`
`46
`
`Warnings:
`
`Information:
`
`Total Files Size (in bytes)
`
`10530251
`
`This Acknowledgement Receipt evidences receipt on the noted date by the USPTO of the indicated documents,
`characterized by the applicant, and including page counts, where applicable. It serves as evidence of receipt similar to a
`Post Card, as described in MPEP 503.
`
`New A~~lications Under 35 U.S.C. 111
`If a new application is being filed and the application includes the necessary components for a filing date (see 37 CFR
`1.53(b)-(d) and MPEP 506), a Filing Receipt (37 CFR 1.54) will be issued in due course and the date shown on this
`Acknowledgement Receipt will establish the filing date of the application.
`
`National Stage of an International A~~lication under 35 U.S.C. 371
`If a timely submission to enter the national stage of an international application is compliant with the conditions of 35
`U.S.C. 371 and other applicable requirements a Form PCT/DO/E0/903 indicating acceptance of the application as a
`national stage submission under 35 U.S.C. 371 will be issued in addition to the Filing Receipt, in due course.
`
`New International A~~lication Filed with the USPTO as a Receiving Office
`If a new international application is being filed and the international application includes the necessary components for
`an international filing date (see PCT Article 11 and MPEP 181 0), a Notification of the International Application Number
`and of the International Filing Date (Form PCT/R0/1 OS) will be issued in due course, subject to prescriptions concerning
`national security, and the date shown on this Acknowledgement Receipt will establish the international filing date of
`the application.
`
`16 of 275
`
`

`
`APPLICATION FOR UNITED STATES PATENT
`
`COMPONENT PROTECTIVE OVERMOLDlNG
`
`ALI-001
`
`By Inventors:
`
`Scon Fullam
`3982 Sutherland Dr
`Palo Alto, CA 94303
`A Citizen of the United States of America
`
`Skip Orvis
`687 W. Maude Avenue
`Sunnyvale, CA 94085
`A Citizen of the United States of America
`
`Assignee: AliphCom, Inc.
`
`KOKKA & BACKUS. PC
`70) High Street
`Palo Alto. CA 94JO I
`Tel: (650) 566-9921
`
`17 of 275
`
`

`
`ALI-001
`
`COMPONENT PROTECTIVE OVKRMOLDING
`
`FIELD
`
`[000 I]
`
`The present invention relates generally to electrical and electronic hardware,
`
`computer software, wired and wireless network communications, and computing devices.
`
`5 More specifically, techniques for component protective ovem10lding are described.
`
`BACKGROUND
`
`[0002] With the advent of greater computing capabilities in smaller mobile form
`
`factors and an increasing number of applications (i.e., computer and Internet software or
`
`programs) for different uses, consumers (i.e., users) have access to large amounts of data;
`
`I 0
`
`personal or otherwise. Information and data are often readily available, but poorly
`
`captured using conventional data capture devices. Conventional devices typically lack
`
`capabilities that can record, store, analyze, communicate, or use data in a contextually-
`
`meaningful, comprehensive, and eflicient manner. Further, conventional solutions are
`
`often limited to specific individual purposes or uses, demanding that users invest in
`
`I 5 multiple devices in order to perfonn different activities (e.g., a sports watch for tracking
`
`time and distance, a GPS receiver for monitoring a hike or run, a cyclometer for
`
`gathering cycling data, and others). Although a wide range of data and information is
`
`available, conventional devices and applications generally fail to provide effective
`
`solutions that comprehensively capture data for a given user across numerous disparate
`
`20
`
`activities.
`
`[0003]
`
`Some conventional solutions combine a small number of discrete functions.
`
`Functionality for data capture, processing. storage, or communication in conventional
`I
`
`18 of 275
`
`

`
`ALI-001
`
`devices such as a watch or timer with a heart rate monitor or global positioning system
`
`("GPS") receiver are available, but are expensive to manufacture and typically require
`
`purchasing multiple, expensive devices. Other conventional solutions for combining data
`
`capture facilities often present numerous design and manufacturing problems such as size
`
`5
`
`specifications, materials requirements, lowered tolerances for defects such as pits or holes
`
`in coverings for water-resistant or waterproof devices, wueliability, higher failure rates,
`
`increased manufacturing time, and expense. Subsequently, conventional devices such as
`
`fitness watches, heart rate monitors, GPS-enabled fitness monitors, health monitors (e.g.,
`
`diabetic blood sugar testing units}, digital voice recorders, pedometers, altimeters, and
`
`I 0
`
`other conventional data capture devices are generally manufactured for conditions that
`
`occur in a single or small groupings of activities and, subsequently, are limited in tenns
`
`of commercial appeal to consumers.
`
`[0004]
`
`Generally, if the number of data inputs accessible by conventional data
`
`capture devices increases, there is a corresponding rise in design and manufacturing
`
`15
`
`requirements and device size that results in significant consumer expense and/or
`
`decreased consumer appeal, which eventually becomes prohibitive to both investment
`
`and commercialization. Still further, conventional manufacturing techniques are often
`
`limited and ineffective at meeting increased requirements to protect sensitive hardware,
`
`circuitry, and other components that are susceptible to damage, but which are required to
`
`20
`
`perform various data capture activities. As a conventional example, sensitive electronic
`
`components such as printed circuit board assemblies ("PCBA"), sensors, and computer
`
`memory (hereafter "memory") can be significantly damaged or destroyed during
`
`2
`
`19 of 275
`
`

`
`ALI-001
`
`manufacturing processes where protective overmoldings or layers of material occurs
`
`using techniques such as injection molding, cold molding, and others. Damaged or
`
`destroyed items subsequently raises the cost of goods sold and can deter not only
`
`investment and commercialization, but also innovation in data capture and analysis
`
`5
`
`technologies, which are highly compelling fields of opportunity.
`
`[0005]
`
`Thus, what is needed is a solution for efficiently manufacturing devices
`
`without the limitations of conventional techniques.
`
`3
`
`20 of 275
`
`

`
`ALI-001
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0006)
`
`Various embodiments or examples ("examples") are disclosed in the
`
`following detailed description and the accompanying drawings:
`
`[0007)
`
`FIG. l illustrates a cross-sectional view of an exemplary process for providing
`
`5
`
`protective material in component protective ovem1olding;
`
`[0008)
`
`FIG. 2 illustrates another cross-sectional view of an exemplaty process for
`
`providing protective material in component protective overmolding;
`
`[0009]
`
`FIG. 3 illustrates a cross-sectional view of an exemplary process for forming
`
`an inner molding in component protective overmolding;
`
`10
`
`[0010]
`
`FIG. 4 illustrates another cross~sectional view of an exemplary process for
`
`forming an outer molding in component protective overmolding;
`
`[00 l I)
`
`FIG. 5A illustrates an exemplary design applied during component protective
`
`ovennolding;
`
`[0012]
`
`FIG. 5B illustrates another exemplary design applied during component
`
`IS
`
`protective overmolding;
`
`[00 13]
`
`FIG. 5C illustrates a further exemplary design applied during component
`
`protective ovennolding;
`
`(0014)
`
`FIG. 6A illustrates an exemplary process for component protective
`
`ovem1olding;
`
`20
`
`[0015]
`
`FIG. 6B illustrates an alternative exemplary process for component protective
`
`ovem1olding;
`
`4
`
`21 of 275
`
`

`
`AU-001
`
`[00 16]
`
`FIG. 6C illustrates another alternative exemplary process for component
`
`protective overmolding;
`
`[00 17]
`
`FIG. 6D illustrates yet another alternative exemplary process for component
`
`protective overmolding;
`
`5
`
`(0018]
`
`FIG. 7 illustrates a view of an exemplary data-capable strapband configured to
`
`receive overmolding;
`
`(0019]
`
`FIG. 8 illustrates a view of an exemplary data-capable strapband having a first
`
`molding; and
`
`[0020)
`
`FIG. 9 illustrates a view of an exemplary data-capable strapband having a
`
`I 0
`
`second molding.
`
`5
`
`22 of 275
`
`

`
`DETAILED DESCRIPTION
`
`ALI-001
`
`[0021]
`
`Various embodiments or examples may be implemented in numerous ways,
`
`including as a system, a process, an apparatus, a user interface, or a series of program
`
`instructions on a computer readable medium such as a computer readable storage medium
`
`5
`
`or a computer network where the program instructions are sent over optical, electronic, or
`
`wireless communication links. In general, operations of disclosed processes may be
`
`perfonned in an arbitrary order, unless otherwise provided in the claims.
`
`(0022]
`
`A detailed description of one or more examples is provided below along with
`
`accompanying figures. The detailed description is provided in connection with such
`
`10
`
`examples, but is not limited to any particular example. The scope is limited only by the
`
`claims and numerous alternatives, modifications, and equivalents are encompassed.
`
`Numerous specific details are set forth in the following description in order to provide a
`
`thorough understanding. These details are provided for the purpose of example and the
`
`described techniques may be practiced according to the claims without some or a II of
`
`15
`
`these specific details. For clarity, technical material that is known in the technical fields
`
`related to the examples has not been described in detail to avoid unnecessarily obscuring
`
`the description.
`
`[0023]
`
`FIG. I illustrates a cross-sectional view of an exemplary process for providing
`
`protective material in data-capable strapband ovennolding. Here, device I 00 includes
`
`20
`
`framework I 02, elements 104-106, and covering I 08. In some examples, framework I 02
`
`may be referred to interchangeably as a substrate, wafer, board (printed, unprinted, or
`
`otherwise), or other surface upon which elements 104-106 may be mounted, placed, or
`
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`otherwise fixed. The type and configuration of clements may be varied and arc not
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`limited to any given type of electrical, electronic, or mechanical component. For
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`example, element I 04 may be implemented as a microvibrator or motor configured to
`
`provide a vibratory signal for an alarm or other indicator. Element 104 may also be a
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`5
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`printed circuit board assembly ("PCBA"), logic, processor, microprocessor, memory
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`(e.g., solid state, RAM, ROM, DRAM, SDRAM, or others), or other computing element
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`and is not limited to any specific type of component. Further, element I 04 may be
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`coupled electrically or electronically to element I 06, which may also be an electrical,
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`electronic, or mechanical component that can be placed on framework 102. When placed
`
`I 0
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`on framework I 02, elements 104-106 may be fixed using various techniques, including
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`adhesives, mechanical fixing stmctures (e.g., posts and holes), or others, without
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`limitation.
`
`[0024]
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`As shown, covering I 08 may be placed over element I 04 in order to protect
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`the latter from damage resulting from the application of subsequent layers, coverings,
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`15 moldings, or other protective material, regardless of environmental conditions (e.g.,
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`temperature, pressure, thickness, and others). As shown, element I 04 is covered by
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`covering I 08 and element I 06 is uncovered. However, other protective materials may be
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`used to cover element I 06. In still other examples, protective materials such as covering
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`108 may not be used if elements 104 or 106 are manufactured to resist the formation,
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`20
`
`deposit, layering, or covering of other protective materials at various temperatures,
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`pressures, or other atmospheric conditions. In other examples, device 1 00 and the above~
`
`described elements may be varied and are not limited to those shown and described.
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`[0025]
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`FIG. 2 illustrates another cross-sectional view of an exemplary process for
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`providing protective material in data-capable strapband overmolding. Here, device 200
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`includes framework 102, elements 104-106, covering 108, syringe 202, arrows 204-206,
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`and protective coating 208. In some examples, covering I 08 and protective coating 208
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`5 may be referred to as "protective material" interchangeably and without limitation. As
`
`shown, like numbered elements shown in this drawing and others may refer to the same
`
`or a substantially similar element previously described.
`
`(0026]
`
`.,.. In some examples, an applicator (e.g., syringe 202) may be used to selectively
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`apply protective coating 208 to cover as a protective layer over element I 06. As used
`
`I 0
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`herein, "selectively applying" may refer to the application, placement, positioning,
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`formation, deposition, growth, or the like, of protective material to one, some_, all, or none
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`of any underlying elements (e.g., elements 104-1 06). In some examples, "protective
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`material" may also be used interchangeably with "protective layer," "covering,"
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`"housing," or "structure" regardless of the composition of material or matter used,
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`15
`
`without limitation. In other words, covering I 08 and protective coating 208 may each be
`
`referred to as "protective material" and used to protect underlying elements (e.g.,
`
`elements 104-106 (FIG. I)) as described herein.
`
`[0027] When the plunger of syringe 202 is depressed in the direction of arrow 204,
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`protective coating 208 is forced through applicator tip 210 and applied as a protective
`
`20
`
`layer over element I 06. As an example, protective coating 208 may be applied at
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`substantially atmospheric pressure by applying 1-2 psi of pressure to the plunger of
`
`syringe 202. When applied, protective coating 208 may be, for example, an ultraviolet
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`("UV") curable adhesive or other material. In other words, when protective coating 208
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`is applied (i.e., layered over element 106) and exposed to ultraviolet radiation (or other
`
`curing conditions) at levels similar to those found in natural sunlight or artificial light, it
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`coalesces and hardens into a covering that prevents the underlying element (e.g., element
`
`5
`
`1 06) from being damaged when other protective materials or layers are applied such as
`
`those shown and described below. Exemplary types of protective coating 208 may
`
`include coatings, adhesives, gels, liquids, or any other type of material that hardens to
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`protect, prevent, minimize, or otherwise aid in avoiding damage to a protected element.
`
`Examples of UV curable coatings include Loctite® coatings produced by Henkel & Co
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`I 0 AG of Dusseldorf, Gem1any such as, for example, Loctite® 5083 curable coating. Other
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`types of curable coatings, in addition to those that are UV curable, may be used to protect
`
`underlying elements without limitation or restriction to any given type.
`
`[0028)
`
`In some examples, protective material such as Loctite® or others may be
`
`applied selectively to one, some, or all electrical, electronic, mechanical, or other
`
`15
`
`elements. Protective coating 208 may also be applied in different environmental
`
`conditions (e.g., atmospheric pressure, under vacuum, in a molding cavity or chamber,
`
`within a deposition chamber, or the like) and is not limited to the examples shown and
`
`described. As shown, protective coating 208 has been selectively applied to element 106,
`
`but not element 104, the latter ofwhich is being protected by covering 108. As an
`
`20
`
`alternative, covering I 08 may be used as protective material in the fonn of an enclosure
`
`or physical structure that is used to protect an underlying element. As described herein,
`
`protective coating 208 may be selectively applied by determining whether sensitive
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`components, parts, or other elements ("clements") arc susceptible to damage or
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`destruction from subsequent processes, for example, to deposit additional protective
`
`layers, such as those described in greater detail below. In other examples, device 200 and
`
`the above-described elements may be varied in function, structure, configuration,
`
`5
`
`implementation, or other aspects and are not limited to those provided.
`
`[0029]
`
`FIG. 3 illustrates a cross-sectional view of an exemplary process for forming
`
`an inner molding in data-capable strapband ovennolding. Here, device 300 includes
`
`framework l 02, elements l 04-1 06, covering I 08, syringe 202, arrows 204-206,
`
`protective coating 208, mold cavity 302, nozzle 304, arrows 306-310, and inner molding
`
`I 0
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`312. In some examples, framework I 02 and elements I 04-l 06 having selectively applied
`
`protective coating 208 may be placed in mold cavity 302 where another protective layer
`
`or coating (e.g., inner molding 312) may be applied from nozzle 304 in the direction of
`
`arrows 306-310. Types of materials that may be used for inner molding 312 include
`
`plastics, thermoplastics, thennoplastic elastomers, polymers, elastomers, or any other
`
`15
`
`organic or inorganic material that can molded in mold cavity 302. As shown, mold
`
`cavity 302 may be implemented using a variety of molding techniques. For example, an
`
`injection molding machine may be used to inject a thennoplastic polymer elastomer
`
`("TPE") into mold cavity 302. When injected under temperature (e.g., 400 to 460
`
`degrees Fahrenheit) and pressure (e.g., 200 to 600 psi, but which may be adjusted to
`
`20
`
`higher or lower pressure, without limitati.on), inner molding 208 forms a protective layer
`
`around framework I 02, elements I 04-106, covering I 08, protective coating 208,
`
`providing a layer of additional protective material (e.g., inner molding 312), which may
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`completely or incompletely surround an object (e.g., framework 102). In some examples,
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`inner molding 312 may be formed to provide a watertight or hennetic seal around
`
`framework I 02 and elements I 04-106. Types of materials that may be used as inner
`
`molding 312 include TPEs such as Versaflex 9545-l as manufactured by PolyOne
`
`5 Corporation ofMcHenry, Illinois. Other types of materials such as epoxies, polymers,
`
`elastomers, thermoplastics, thenuoplastic polymers, thenuoplastic polymer elastomers,
`
`and others may be used to form inner molding 312, witliout limitation to a specific
`
`material. In other examples, device 300 and the above-described elements may be varied
`
`in function, structure, configuration, implementation, or other aspects and are not limited
`
`I 0
`
`to those provided.
`
`(0030)
`
`FIG. 4 illustrates another cross-sectional view of an exemplary process for
`
`forming an outer molding in data-capable strapband overmolding. Here, device 400
`
`includes framework I 02, elements 104-106, covering I 08, syringe 202, arrows 204-206,
`
`protective coating 208, inner molding 312, mold cavity 402, nozzle 404, arrows 406-41 0,
`
`15
`
`and outer molding 412. In some examples, mold cavity 402 may be the same or different
`
`from that described above in connection with FIG. 3. In other words, mold cavity 402
`
`may be the same mold cavity as mold cavity 302, but which is used to injection mold
`
`outer molding 412. As shown, framework I 02, elements 104- I 06, protective coating
`
`208, and inner molding 312 are placed in mold cavity 402. Material (e.g., TPE) may be
`
`20
`
`injected through nozzle 404 in the direction of arrows 406-410 into mold cavity 402 in
`
`order to form outer molding 412. Once fonned, sprue or other extraneous material may
`
`be present in inner molding 312 or outer molding 412, which may be removed after
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`device 400 is taken out of molding cavity 402. A visual inspection, in some examples,
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`may be perfom1ed to determine if defects are present in either inner molding 312 or outer
`
`molding 4 I 2. If defects are found in outer molding 412, then removal may occur and a
`
`new outer molding may be formed using mold cavity 402. The inspection and, if defects
`
`5
`
`are found, the removal of outer molding 412 allows for higher quality moldings to be
`
`developed at a lower cost without requiring the discarding of sensitive, expensive
`
`electronics. Outer molding 412, in some examples, may also be used to provide surface
`
`ornamentation to a given object. The use of thermoplastics or TPE material may be used
`
`to form outer molding 412 and to provide material in which a surface texntre, design, or
`
`I 0
`
`pattern may be imprinted, contoured, or otherwise formed. In so doing, various types of
`
`patterns, designs, or textures may be formed of various types. For example, miniature
`
`"hills" and "valleys" may be formed in the protective material of outer molding 412 in
`
`order to produce a "denim" feel or texture to a given object. Examples of different
`.
`patterns for outer molding 412 may be found in FIGs. 5A-5C, as shown by patterns 502,
`
`I 5
`
`512, and 522, respectively. Patterns 502, 512, and 522 are provided for purposes of
`
`illustration and are neither limiting nor restrictive with regard to the types, patterns,
`
`designs, or textures of surface ornamentation that may be applied to outer molding 4 I 2,
`
`as described herein. Protective material (e.g., TPE) injected into mold cavity 402 may be
`
`used to form these pattems. Various types of injection molding processes and equipment
`
`20 may be used and are not limited to any specific type, make, manufacture, model, or other
`
`speci ftcation.
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`(0031)
`
`Referring back to FIG. 4, the usc of the described techniques allows for more
`
`precise tolerances in forming moldings that are fonn-fitting to various types of devices.
`
`Still further, the use of the above-described techniques also allows for relatively small
`
`devices having sensitive electronics to be subjected to harsh environmental conditions
`
`5
`
`during molding processes in order to fonn protective layers (e.g., inner molding 312,
`
`outer molding 412) over various types of devices. As shown and described, the disclosed
`
`techniques may be used on a variety of devices, without limitation or restriction. In other
`
`examples, device 400 and the above-described elements may be varied in function,
`
`structure, configuration, implementation, or other aspects and are not limited to those
`
`l 0
`
`provided.
`
`(0032)
`
`FIG. 6A illustrates an exemplary process for component protective
`
`ovennolding. Here, the start of process 600 includes fom1ing a protective layer on, for
`
`example, framework 102 (FIG. 1) (602). In some examples, a protective layer may refer
`
`to protective material, layers, or covers such as protective material 108 (FIG. 2) or
`
`15
`
`structures that are fom1ed to protect und