PTO/SB/05 (06·08)
`Approved for use through 09/30/2010. OMB 0651-0032
`U.S. Patent and Trademark Office. U.S. DEPARTMENT OF COMMERCE
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`U.S. PTO
`13/135728
`07/12/2011
`
`UTILITY
`PATENT APPLICATION
`TRANSMITTAL
`(Only for new nonprovisional applications under 37 CFR 1.53(b))
`
`Attorney Docket No.
`
`ALI-001CIP1CIP1
`
`First Inventor
`
`Richard Lee Drysdale
`
`Title
`Express Mail Label No. EG 551122656 US
`
`COMPONENT PROTECTIVE OVERMOL. ..
`
`..1
`
`. -
`r.n
`"'0
`-j
`0
`
`APPLICATION ELEMENTS
`See MPEP chapter 600 concerning utility patent application contents.
`
`ADDRESS TO:
`
`Commissioner for Patents
`P.O. Box 1450
`Alexandria VA 22313-1450
`
`1.0 Fee Transmittal Form (e.g., PTO/SB/17)
`
`ACCOMPANYING APPLICATION PARTS
`
`2.0 Applicant claims small entity status.
`See 37 CFR 1 .27.
`[Total Pages
`3.0 Specification
`34
`Both the claims and abstrad must start on a new page
`(For info1111ation on the preferred arrangement, see MPE.P 608.01 (a))
`4.[ZJ Drawing(s) (35 U.S. C. 113)
`(Total Sheets
`12
`
`5. Oath or Declaration
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`A copy from a prior application (37 CFR 1 .63(d))
`
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`0or continuation/divisional with Box 18 completed)
`
`L
`
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`Signed statement attached deleting inventor(s)
`name in the prior application, see 37 CFR
`1 .63(d)(2) and 1.33(b).
`
`6.[2] Application Data Sheet. See 37 CFR 1.76
`
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`18. If a CONTINUING APPLICATION, check appropriate box, and supply the requisite information below and in the first sentence of the
`specification following the title, or in an Application Data Sheet under 37 CFR 1. 76:
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`Prior application information:
`Examiner !.!D~DQlll£0
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`of prior application No.: 1.3/.1 PaA l6. ... . ' . . ' . . . . . . .
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`
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`1 Telephone
`
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`
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`
`c;:::::::: , ~ ..;rV"/
`..,
`Scott S. Kokka
`
`1 Date July 12, 2011
`
`Registration No. I
`(Attorney/Agent) 51 •893
`
`This collection of information is required by 37 CFR 1.53(b). The information is required to obtain or retain a benefit by the public which is to file (and by the
`USPTO to process) an application. Confidentiality is governed by 35 U.S.C. 122 and 37 CFR 1,11 and 1. 14. This collection is estimated to take 12 minutes to
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`1 of 290
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`FITBIT EXHIBIT 1016
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`

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`ALI-OOICIPICIPJ
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`APPLICATION FOR UNITED STATES PATENT
`
`COMPONENT PROTECTIVE OVERMOLDING USING
`
`PROTECTIVE EXTERNAL COATINGS
`
`By Inventors:
`
`Richard Lee Drysdale
`23 5 Isbei Drive
`Santa Cruz, ,CA 95060
`A Citizen of the United States of America
`
`ScottFutlam
`3982 Sutherland Drive
`Palo Alto, CA94303
`A Citizen of the United States of America
`
`Skip Thomas Orvis
`6287 Shadelands Drive
`San Jose, CA 95123
`A Citizen of the United States of America
`
`Nora Elam Levinson
`3731 Fessenden Street NW
`Washington, DC 20016
`A Citizen of the United States of America
`
`Assignee:
`
`·AlipbCom
`
`KOKKA& BACKUS,.PC
`703 High Street
`Palo Alto. CA 94301
`Tel: ( 650) 566-9921
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`ALI-OOlCIPlCIPl
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`COMPONENT PROTECTIVE OVERMOLDING USING
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`PROTECTIVE EXTERNAL,COATINGS
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`CROSS-REF,ERENCE TO RELATED APPLICATIONS
`
`[0001]
`
`This application is a continuation-in-part ofU~S. Patent Application No.
`
`5
`
`13/158,416, filed June 11,2011 (Attorney Docket No.: ALI-OOICIPI), entitled
`
`"Component Protective Overmolding," which is a continuation-in-part ofU.S .. Patent
`
`Application No. 13/158,372, filed June 10, 2011 (Attorney Docket No.: ALI-001 ),
`
`entitled "Component Protective Ovennolding," all of which are hereby incorporated by
`
`. reference in entirety for all purposes.
`
`FIELD
`
`[0002]
`
`The present invention relates generally to electrical and electronic hardware,
`
`computer software, wired and wireless network communications, and computing devices.
`
`More specifically, techniques for component protective overmolding using protective
`
`external coatings are described.
`
`BACKGROUND
`
`10
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`15
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`[0003] With the advent of greater computing capabilities in smaller mobile form
`
`factors and an increasing number of applications (i.e., computer and Internet software or
`
`programs) for different uses, consumers (i.e., users) have access to large amounts of data,
`
`personal or otherwise. Information and data are often readily available, but poorly
`
`20
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`c~ptured using conventional data capture devices. Conventional devices typically lack
`
`capabilities that can record, store, analyze, communicate, or use data in a contextually(cid:173)
`
`meaningful, .comprehensive, and efficient manner. Further, conventional solutions are
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`3 of 290
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`AU-00 l CIPl CIPI
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`often limited to specific individual purposes or uses, demanding that users invest in
`
`multiple devices in order to perform different activities (e.g., a sports watch fpr tracking
`
`time and distance, a GPS receiver for monitoring a hike or run, a cyclometer for
`
`gathering cycling data, and others). Although a wide range of data and information is
`
`5
`
`available, conventional devices and applications generally fail to provide effective
`
`solutions that cQrqprehensively capture data for.~ given user across numerous disparate
`
`activities.
`
`[0004]
`
`Some conventional solutions combine a small number of discrete functions.
`
`Functionality for data capture, processing, storage, or communication in conventional
`
`10
`
`devices such as a watch or til:ner with a heart rate monitor or global positioning system
`
`("GPS") receiver are available, but are expensive to manufacture and typically .require
`
`purchasing multiple, .expensive devices. Other conventional solutions for combining data
`
`capture facilities·often. present numerous design and manufacturing problet:DS such .as size
`
`specifications, materiaJs.requirements, lowered-tolerances for defects such·as pits or holes
`
`15
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`in coverings for water-resisumt or waterproof devices, unreliability, higher failure rates,
`
`increased manufacturing time, and expense. Subsequently, conventional devices such as
`
`'fitness watChes, heart rate monitors, GPS-enabled fitness monitors, health monitors (e;g.,
`
`diabetic·blood sugar testing units), digital voice recorders, pedometers, altimeters, and
`
`other conventional clata capture devices are generally manufactured for conditions that
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`20
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`occur in a single or small b'Toupings of activities and, subsequently, are limited in terms
`
`of commercial appeal to consumers.
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`[0005]
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`Generally, if the number of data inputs accessible by conventional data
`
`capture devices increases, there is a corresponding rise in design and manufacturing
`
`requirements and device size that results in significant consumer expense and/or
`
`decreased consumer appeal, which eventual1y becomes prohibitive to both investment
`
`5
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`and commercialization. Still further, conventional manufacturing techniques are often
`
`limited and ineffective at meeting increased requirements to protect sensitive hardware,
`
`circuitry, and other components that are susceptible to damage, but which are required to
`
`perform various data capture activities. As a conventional example, sensitive electronic
`
`components such as printed circuit board assemblies ("PCBA"), sensors, and computer
`
`10 memory (hereafter "memory") can be significantly damaged or destroyed during
`
`manufacturing processes.where protective oveniloldings·or layers of material occurs
`
`using .t~chniques such as injection molding, cold molding, and others. Damaged or
`
`destroyed items subsequently raises the cost ofgoods sold and can deter not only
`
`investment and commercializ.ation, but also innovation .in data capture and analysis
`
`15
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`technologies, which are highly compelling fields of opportunity.
`
`[0006]
`
`Thus, what is needed is a solution for efficiently manufacturing devices
`
`without the limitations of conventional techniques.
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`BRIEF DESCRIPTION OF THE DRAWINGS
`
`[0007]
`
`Various embodiments or examples ("examples") are disclosed in the
`
`following detailed description and the accompanying drawings:
`
`[0008]
`
`FIG. l illustrates a cross-sectional view of an exemplary process for providing
`
`5
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`protective material in component protective overmolding;
`
`[0009]
`
`FIG. 2 illustrates another cross-sectional view of an exemplary process for
`
`providing protective material in component protective ovennolding;
`
`[0010]
`
`FIG. 3 illustrates a cross-sectional view of an exemplary process for forming
`
`an inner molding in component protective overmolding;
`
`10
`
`[0011]
`
`FIG. 4 illustrates another cross-sectional view of an exemplary process for
`
`forming an outer .molding in component protective overmolding;
`
`[0012]
`
`FIG. SA illustrates an exemplary design applied during component protective
`
`.overmolding;
`
`[0013]
`
`,fJG. 5B Hlustrates another exemplary design applied during component
`
`15
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`protective overmolding;
`
`[0014]
`
`FIG. SC .illustrates a further exemplary design applied during component
`
`protective overmolding;
`
`[0015)
`
`FIG. 6A illustrates an exemplary process for component protective
`
`overmolding;
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`[0016)
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`FIG. 68 illustmtes.an alternative exemplary process for.cornponent protective
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`overmolding;
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`[0017]
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`FIG. 6C illustrates another alternative exemplary process for component
`
`protective overmolding;
`
`[0018]
`
`FIG. 6D illustrates yet another alternative exemplary process for component
`
`protective overmolding;
`
`5
`
`[0019]
`
`FIG. 7 illustrates a view of an exemplary data-capable strapband configured to
`
`receive overmolding;
`
`[0020]
`
`FIG. S. illustrates a view ofan exemplary data-capable strapband having a first
`
`molding;
`
`[0021]
`
`FIG. 9 illustrates a view of an exemplary data-capable strapband having a
`
`10
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`second molding;
`
`[0022]
`
`FIG. J 0 illustrates an exemplary process for component protective
`
`overmo'lding using protective external coatings;
`
`[0023]
`
`.FIG. 11 illustrates an alternative exemplary process for component protecti.ve
`
`6vermo1ding using protective external coatings; and
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`15
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`[0024]
`
`FIG. 12 illustrates another alternative exemplary process for component
`
`protective overmolding using protective external coatings.
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`DETAILED DESCRIPTION
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`ALI·OOICIPICIPJ
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`[0025]
`
`Various embodiments or examples may be implemented in numerous ways,
`
`including as a system, a process, an apparatus, a user interface, or a series of program
`
`instructions on a computer readable medium such as a computer readable storage medium
`
`5
`
`or a computer network where the program instructions are sent over optical, electronic, or
`
`wireless communication links. In general, operations of disclosed. processes m~y be
`
`performed in an arbitrary order, unless otherwise provided in the claims.
`
`[0026]
`
`A detailed description of one or more examples is provided below along with
`
`accompanying figures. The detailed description is provided in connection with such
`
`10
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`examples, but is not limited to any particular example. The scope is limited only by the
`
`claims and numerous alternatives, modifications, .and equivalents are encompassed;
`
`Numerous specific details are set forth in the foHowing description in order to provide a
`
`thorough understanding. These details are provided for the purpose of example ·and the
`
`described techniques may be practiced according to the claims without some or all of
`
`15
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`these specific details. For clarity, technical material that is known in the technical fields
`
`related to the examples has not been described in detail to avoid unnecessarily obscuring
`
`the description.
`
`[0027]
`
`FIG. 1 illustrates a cross-sectiona:l view of an exemplary process for providing
`
`protective material in data-capable strapband overmolding. Here, device 100 includes
`
`20
`
`framework 102, elements .1 04-1 06, and covering 1 08. In some examples, framework I 02
`
`may be referred to interchangeably as a substrate, wafer, board (printed, unprinted, or
`
`otherwise), or other surface upon which elements 104-106 may be mounted, placed, or
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`otherwise fixed. The type and configuration of elements maybe varied and are not
`
`limited to any given type of electrical, electronic, or mechanical component. For
`
`example, element 104 may be implemented as a microvibrator or motor configured to
`
`provide a vibratory signal for an alarm or other indicator. Element 104 may also be a
`
`5
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`printed Circuit boaql assembly ("PCBA"), logic, processor, microprocessor, memory
`
`.(e:g~. solid s~ate, RAM, ROM, DRAM, SDRAM, or others), orother.cQmputing,element
`
`and is not limited to any specific type of component. Further, element 104 may be
`
`coupled electrically or electronically to element 106, which may also be an electrical,
`
`electronic, or mechanical component that can be placed on framework 102. When placed
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`10
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`on framework 102, elements 1 04-106 may be fixed using various techniques, including
`
`adhesives, mechanical fixings®.ctures{e.g., posts and holes), or others, without
`
`limitation.
`
`[0028]
`
`As shown, covering 108 may be placed over element 104 in order to protect
`
`'the latter from damage resulting from the application ofsubsequent layers, coverings,
`
`15 moldings, or other protective material, regardless of environmental conditions (e.g.,
`
`temperature, pressure, thickness, and others). As shown, element 104 is covered by
`
`covering 108 and element 106 is uncovered. However, other protective materials may be.
`
`used to cover element 106. 1n still C>ther examples, protective materials such as covering
`
`108 may not be 4sed if elements J 04 or l 06 are manufactured to resist .the formation,
`
`20 · deposit, layering, or covering of other protective materials at various temperatures,
`
`pressures, or other atmospheric conditions. In other examples, device 100 and the above(cid:173)
`
`described elements may be varied and are not limited to those shown and described.
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`[0029]
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`FIG. 2 illustrates another cross-sectiomil view of an exemplary process for
`
`providing protective material in data-capable strapband overmolding. Here, device 200
`
`includes framework 102, elements 104-106, covering 108, syringe 202, arrows 204-206,
`
`and protective coating 208. ln some examples, covering 108 and protective coating 208
`
`5 may .be referred to as "protective material" interchangeably and without limitation. As
`
`showp,like.nwnbered elements shown:in this drawing:and others may refer to the same
`
`or a substantially similar element previously described.
`
`[0030]
`
`In some examples, an applicator (e.g., syringe 202) may be used to selectively
`
`apply protective coating 208 to cover as a protective layer over element 106. As used
`
`10
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`herein, "selectively applying" may refer to the application, placement, positioning,
`
`formation, deposition, growth, or the like, of protective material to one, some, all, or none
`
`ofany underlying elements(e.g., elements 104-106). In some examples, "protective
`
`material" may also be used interchangeably with "protective layer,"·"covering,"
`
`"housing," or "structure" regardless of the composition of material or matter used,
`
`15 without limitation. In other words, covering 108 and protective coating 208 may each be
`
`referred to as "protective material" and used to protect underlying elements (e.g.,
`
`elements J 04-106 (FIG. 1)) as described herein.
`
`[0031] When the plunger of syringe 202 is depressed in the direction of arrow 204,
`
`protective coating 208 is forced through applicator tip2IO and applied as.a.protective
`
`20
`
`layer over element 106. As an example, protective coating 208 may be applied at
`
`substantially atmospheric pressure by applying 1-2 psi of pressure to the plunger of
`
`syringe 202. When applied, protective coating 208 may be, for example, an ultraviolet
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`("UV") curable adhesive or other material. ln other words, ·when protective coating 208
`
`is applied (i.e., layered over element 1 06) and exposed to ultraviolet radiation (or other
`
`curing conditions) at levels similar to those found in natural sunlight or artificial light, it
`
`coalesces and hardens into a covering that prevents the underlying element (e.g., element
`
`5
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`1 06) from being damaged when other protective materials or layers are applied such as
`
`those shown and de$cri})ed below. Exemplary types of protective coating 208 may
`
`inClude· coatings, adhesives, gels, liquids, or any other type of material that hardens to
`
`protect, prevent, minimize, or otherwise aid in avoiding damage to a protected element.
`
`Examples ofUV curable coatings include Loctite® coatings produced by Henkel & Co
`
`10 AG ofDusseldorf, Germany such as, for example, Loctite® 5083 cilrable coating. Other
`
`'types of curable coatings, in addition to those that are UVcurable, may be used to protect
`
`underlying elementS without limitation or restriction to any :given type.
`
`[0032]
`
`In some examples, protective material such as Loctite®.or.others may be
`
`applied selectively to one, some, or alLelectrical, electronic, mechanical, or other
`
`15
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`elements. Protective coating 208 may also be applied in different environmental
`
`conditions (e.g., atmospheric pressure, under vacuum, in a molding cavity or chamber,
`
`within.a deposition chamber, or the like) and is not limited to the examples .shown and
`
`described. As shown, protective coating 208 has been selectively applied to element 106,
`
`but not element 104, the latter of which ·is being protected by covering 108. As an
`
`20
`
`alternative, covering 108 may be used as protective material in the form of an enclosure
`
`or physical structure that is used to protect an·underlying element. As described herein,
`
`protective coating 208 may be selectively applied by determining whether sensitive
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`components, parts, or other elements ("elements") are susceptible to damage or
`
`destruction from subsequent processes, for example, to deposit additional protective
`
`layers, such as those described in greater detail below. In other examples, device 200 and
`
`the above-described elements may be varied in function, structure, configuration,
`
`5
`
`implementation, .or other aspects and are not limited to those provided.
`
`[0033]
`
`.FIG. 3 illustrates a cross-sectional view of an exemplary process for forming
`
`an inner molding in data-capable strapband ovennolding. Here, device 300 includes
`
`framework 102, elements I 04-106, covering 108, syringe 202, arrows 204-206,
`
`protective coating 208, mold cavity 302, nozzle 304, arrows 306-310, and inner molding
`
`10
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`312. In some examples, framework I 02 and elements I 04-106 having selectively applied
`
`protective coating 208 may be placed in mold cavity 302 where another protective layer
`
`or coating (e;g., inner molding 312) may be applied from nozzle 304 in the direction of
`
`arrows 306,.31 0. Types ofmaterials tha:t may be used for inner molding 312 include
`
`plastics, thermoplastics, thermoplastic elastomers, polymers, elastomers, or.any other
`
`15
`
`organic or inorganic material that can molded in mold cavity 302. As shown, mold
`
`cavity 302 may be implemented using a variety of molding techniques. For example, an
`
`injection molding machine .may be used to inject a thermoplastic polymer elastomer
`
`{"TPE") into mold cavity 302. When injected under temperature (e.g., 400 to 460
`
`degrees Fahrenheit) and pressure. (e.g., 200 to 600 psi, but which maybe adjusted to
`
`20
`
`higher or lower pressure, without limitation), inner molding 208 fonns a protective layer
`
`around framework 1 02, elements 1 04-106, covering l 08, protective coating 208,
`
`providing a layer of additional protective material (e.g., inner molding 312), which may
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`completely or incompletely surround an object (e.g., framework 1 02). In some examples,
`
`inner molding 312 may be formed to provide a watertight or hermetic seal around
`
`framework 1 02 and elements l 04-106. Types of materials that may be used as inner
`
`molding 312 include TPEs such as Versaflex 9545-1 as manufactured by PolyOne
`
`5 Corporation of McHenry, Illinois. Other types of materials such as epoxies, polymers,
`
`elastomers, thermoplastics, thermoplastic polymers, thermoplastic polymer elastomers,
`
`and others may be used to form inner molding 312, without limitation to a specific
`
`material. In other examples, device 300 and the above-described elements may be varied
`
`in function, structure, configuration, implementation, or other aspects and are not limited
`
`1 0
`
`to those provided.
`
`[0034]
`
`FIG. 4 illustrates another cross-sectional view of an exemplary process for
`
`forming an outer molding.in data-capable strapband overmolding. Here,.device 400
`
`includes framework 102, elements 104-106, covering 108, syringe202, arrows 204-206,
`
`protective coating 208, inner molding312, mold cavity 402, nozzJe,404, arrows 406-410,
`
`15
`
`and outer molding 412. In some examples, mold cavity 402 may be the same or different
`
`from that described above in connection with FIG. 3. In other words, mold cavity 402
`
`may be the same mold cavity as mold cavity 302,. but which is used to injection mold
`
`outer molding 412. As shown, framework 102, elements 104-106, protective coating
`
`208, and inner molding 312 are placed in mqld cavity 402. Material (e.g., TPE) may be
`
`20
`
`injected through nozzle 404 in the direction of arrows 406-41 0 into mold cavity 402 in
`
`order to form outer molding 412. Once formed, sprue or other extraneous material may
`
`be present in inner molding 312 or outer molding 412, which may be removed after
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`device 400 is taken out of molding cavity 402. A visual inspection, in some examples,
`
`may be performed to determine if defects are present in either inner molding 312 or outer
`
`molding 412. If defects are foQ.Dd in outer molding 412, then removal may occur and a
`
`new outer molding may be formed using mold cavity 402. The inspection and, if defects
`
`5
`
`are found, the removal of outer molding 412 allows for higher quality moldings to be
`
`developed at i.ilower cost without requiring the discarding. of sensitive, expensive
`
`electronics. Outer molding 412, in some examples, may also be used to provide surface
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`ornamentation to a given object. The use of thermoplastics or TPE material may be used
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`to form outer molding 412 and to provide material in which a surface texture, design, or
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`1 0
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`pattern may be imprinted, contoured, or otherwise formed. In so doing, various types of
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`patterns, designs, or textures may be formed ofvarious.types. For example, miniature
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`"hills" and •'valleys" may be formed in the protective materi~l of outer molding 412 in
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`order to produce a "denim" feel or texture to a given .object. Examples of different
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`patterns for outer molding 412·may·befoundin FlGs. 5A-5C, as shown by patterns 502,
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`15
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`512, and 522, respectively. Patterns 502, 512, and 522 ~tte provided for purposes of
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`illustration and are neither limiting nor restrictive with regard to the types, patterns,
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`designs, or textures of surface ornamentation that may be applied to outer molding 412,
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`as described herein. Protective material ~e;g., TPE) injected into mold cavity 402 may be
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`used to form these patterns. Various types of injection molding proces!?eS and .equipment
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`20 may be used and are not limited to any specific type, make, manufacture, model, or other
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`specification.
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`[0035]
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`Referring back to FIG. 4, the use of the described techniques allows for more
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`precise tolerances in forming moldings that are form-fitting to various types of devices.
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`Still further, the use of the above-described techniques also allows for relatively small
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`devices having sensitive electronics to be subjected to harsh environmental conditions
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`5
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`during molding processes in order to form protective layers (e.g., inner molding 312,
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`outer moldiqg 412) over various types ofdevic~s. As shownand.described, the disclosed
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`techniques may be used on a variety of devices, without limitation or restriction. In other
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`examples, device 400 and the above-described elements may be varied in function,
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`structure, configuration, implementation, or other aspects and are not limited to those
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`10
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`provided.
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`[0036]
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`.FIG. 6A illustrates an exemplary process for. component protective
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`overmolding. Here, the start of process 600 includes forming ;a protective layer on, for
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`example, framework 102 (FIG.l) (602). In some examples, a protective layer may refer
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`to protective material, layers, or covers such a.s·protective material I 08 (FIG. 2) or
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`15
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`structures that are formed to protect underlying elements (e.g., covering 108 (FIG. I).
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`Examples of material that may be used to form a protective layer include UV curable
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`matenals such as. those described above, including coatings, adhesives, liquids, gels, and
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`others that cure when.exposed to ultraviolet radiation in various concentrations and
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`exposure levels without .limitation. After forming a protective.layer (e.g., protective
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`20
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`coating 208), an inner molding (e.g., inner molding 312 (FIG. 3)) is fom1ed (604). After
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`forming an inner molding, a function test is performed to detennine whether the inner
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`molding and protective layer have damaged the underlying .item (606). In some
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`AU-OOICIPICIPl
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`examples, a function test may be performed as part of an inspection and include applying
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`an electrical current to an underlying electronic element to identify proper voltage or
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`current flow or other parameters that indicate whether damage has occurred during the
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`formation of a protective layer, an inner molding, or, in other examples, an outer
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`5
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`m~lding. Inspections may be performed at various stages of the manufacturing process in
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`order to identify defects early and reduce costs incurred with re-applying protective
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`layers or moldings. In other examples, a function test may be performed to determine
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`whether the inner molding has sufficiently coated desired underlying items (e.g.,
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`electrical, electronic, mechanical, or any structure or elements thereof that are being
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`10
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`protected from damage using on:e or more moldings). In still further examples, the
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`function test may be performed to detemiine whether the formation of an inner molding
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`damaged underlying items that were previously protected by the·formation of protective
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`layer, the latter ofwhic:;h may be performed outside of a mold device or cavity (e.g., mold
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`cavity 302 {FIG. 3) or mold cavity 402 (FIG. 4)) at room temperature and/or atmospheric
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`15
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`conditions, including atmospheric or ambient temperatures, pressures, and humidity
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`levels, without limitation.
`
`[0037]
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`In some examples, a determination is made as to whether a function test is
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`passed or failed ( 608). Here, if an item having a protective layer and an inner molding
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`fails to pass, the item is rejected and the process ends (61 0). Alternatively, if an item
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`20
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`(e.g., framework 102 .and elements 1 06-1 08 (FIG. 1 )) fails to pass a .function test due to
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`the presence of one or more defects, the inner molding may be removed and re-applied.
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`In other examples, the underlying item may be rejected (i.e., destroyed, recycled, or
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`otherwise removed from a lot of items that have successfully passed a function test). lf a
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`determination is made that a function test has passed as part of an inspection, then an
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`outer molding is formed over the inner molding and protective layer (612).
`
`[0038]
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`ln some examples, the protective layer, inner molding, and outer molding may
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`5
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`be selectively, partially, or completely applied to a given item. As described here, an
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`outer .molding may also be configured to completely enclose or encase an underlying
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`'item in order to protect the inner molding, the protective layer, and any elements from
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`damage. Further, outer molding may be used to form patterns, designs, or other surface
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`features or contours for usable, functional, or aesthetic purposes. As shown here, after an
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`1 0
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`outer molding is formed, a final test is performed to determine whether defects are
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`present orthe formation of the- outer molding met desired parameters ( e;g., did the outer
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`moldi:Qg fully coat an item, were any undetlyingitems damaged, and the like) (614). In
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`:some examples, a final test may also be a function test, as described above. In other
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`examples, a final test may also·evaluate an item coated with.an outer molding for other
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`15
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`purposes. If the final test is not passed, then the item may be rejected and, in some
`
`examples, the outer molding may be removed and re-applied(i.e., re-formed) (610). In
`
`other example, a failed final test may also result in the item being rejected and destroyed,
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`recycled, or otherwise handled as 'unacceptable. Finally, after a final test is performed a
`
`.
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`visualinspection may be performed to determine whether an item has been.covered by
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`20
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`the formed outer molding as desired ( 618). In other examples, process 600 may be
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`implemented differently in the order, function, configuration, or other aspects described
`
`and is not limited to the examples shown and described above.
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`[0039]
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`:FIG. 6B illustrates an alternative exemplary process for component protective
`
`overmolding. Here, process 620 beings be selectively applying protective material (e.g.,
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`protective coating 208 (FIG. 2)) to one or more elements (e.g., electrical, electronic,
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`mechanical, structural, or others) (622). In some examp.les, selectively applying
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`5
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`protective material may include manually using an applicator ( e~g., syringe '202 (FIG. 2)
`
`or any other type of instrument, device, tool, or implemf!nt used to apply protective
`
`material) to deposit a layer, covering, co~ning, or the like over a desired element. In other
`
`examples, selectively applying may also include the application of protective material to
`
`one, some, all, or none of the elements present on a given item. In other words,
`
`1 0
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`selectively applying protective material may be performed uniformly or non-uniformly
`
`without limitation. Types of protective materials may include curable or non-curable
`
`materials .such as those described above, including UV -curable coatings that, when
`
`,exposed to ultraviolet radiation, cure. In other examples, other types of coatings may be
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`used that, when exposed to artificial or man-made conditions, cure. Stil