Henkel
`Electronic Solutions
`
`i of iii
`
`FITBIT EXHIBIT 1015
`
`

`
`Worldwide Manufacturing
`
`Table of Contents
`
`The electronics group of Henkel is the world’s
`true global supplier of materials solutions for
`electronic packaging and assembly.
`
`Emphasizing compatibility between
`materials from wafer-level to
`board-level and final assembly,
`Henkel delivers a wide range of
`off-the-shelf and custom-developed
`solutions to respond to every
`requirement of your application.
`
`The Henkel portfolio brings you
`industry leading brands: Hysol®
`semiconductor and electronic
`materials, Loctite® adhesives and
`phase change thermal interface
`materials and Multicore® solder
`products. Each maintains the lead in
`its field through continuous, targeted
`research and development, backed by
`Henkel’s continuing reinvestment. Our
`network of research laboratories
`positions key resources close to our
`customers in all territories, with
`capabilities including accurate
`modeling and simulation for rapid
`
`and cost-effective turnaround. This is
`just one facet of the Henkel experience
`that will give you the edge over your
`competition.
`
`Henkel is directly represented in more
`than 80 countries. We deliver
`consistent products and superior
`technical support, no matter where
`you are located. We provide the
`responsiveness and flexibility of a
`focused specialist, combined with the
`strength of one of the world’s largest
`specialty chemicals corporations – our
`parent company, Henkel KGaA.
`
`Your business choices just
`became stronger.
`
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`5-6
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`9
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`11-12
`13-14
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`5-8
`17-18
`19-20
`21-25
`26
`27-28
`29-32
`33-34
`35-36
`
`37
`
`Lead-Free Solutions
`
`Packaging Materials
`Die Attach Adhesives
`Underfills
`Encapsulants
`Chip-On-Board Glob Tops
`Non-Conductive Pastes
`Semiconductor Molding Compounds
`Optoelectronic Materials
`Electronic Coating Powders
`Electronic Molding Compounds
`
`Board Level Assembly Materials
`Underfills & Encapsulants
`Phase Change Thermal Interface Materials
`Thermal Management Adhesives
`Solder & Flux Materials
`Electrically Conductive Adhesives
`Surface Mount Adhesives
`Circuit Board Protection
`Low Pressure Molding
`Solution Circuit Board
`
`Global Locations
`
`electronics.henkel.com
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`ii of iii
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`

`
`MATERIALS
`PACKAGING
`
`Henkel materials are compatible
`with conventional oven cure as
`well as Snap Cure. You can also use
`SkipCure™ and SkipPrebake™[*].
`Our organic products can also be
`converted to their CCSP™
`(Controlled Collapse Spacer Paste)
`versions without changing the
`base paste properties. The ability
`to exercise these three options,
`SkipCure™, SkipPrebake™, and
`spacers at zero or minimal
`switching costs reduces both the
`cost of use and the cost of
`ownership you will experience.
`
`* For products designed for organic
`laminates.
`
`With spacer die
`
`With spacer paste
`
`Eliminates the need for dummy die in the stack by
`using spacers in the adhesive.
`
`Hysol® Die Attach Adhesives
`
`Elevated lead-free processing temperatures demand electronic
`packaging materials that can withstand polymer decomposition
`during reflow, increased interfacial stresses, and adhesive and
`cohesive strength.
`
`Lead-free processing capability is
`achieved by using Hysol® patented
`BMI chemistry which allows for
`lower moisture absorption, lower
`stress, and higher adhesion to
`gold and preplated leadframes
`compared to older epoxy
`technology. Newer no/low bleed
`formulations are providing the
`performance that today’s smaller
`package designs and thinner die
`requirements demand.
`
`Based on the ultra-hydrophobic
`chemistry, Bismaleimide (BMI),
`Hysol® die attach adhesives offer
`very high adhesive strength,
`elongation at break, and cohesive
`energy at high reflow
`temperatures. These properties
`help electronic packages retain
`adhesive strength and structural
`integrity during moisture soak
`and absorb stresses during the
`deformations associated with lead-
`free reflow processing.
`
`Designed to deliver superior
`quality and reliability, Hysol® die
`attach adhesives have won a
`number of supplier quality
`awards. Several products are
`formulated with PTFE, an
`extremely low dielectric constant
`material that will not abrade
`polyimide and other die
`passivation.
`
`Our fast reaction kinetics and
`solvent-free formulation enable
`inline SkipCure™ processing that
`increases throughput in Units Per
`Hour (UPH) for adhesive cure,
`eliminates the need for separate
`curing equipment, and decreases
`package warpage. Our adhesives
`for organic substrates eliminate
`substrate prebaking, while our
`patented polymeric spacers deliver
`consistent bondline thickness,
`reduce tilt, and enable high UPHs
`for die placement.
`
`Lead-Free Solutions
`
`The elimination of lead and other hazardous substances from
`electronic packaging and assembly materials is making much
`existing knowledge and characterization data obsolete.
`
`Henkel recognized this fact early,
`and is already leading the race to
`acquire the necessary data and
`re-qualify material sets. As a true
`solutions provider, we believe it is
`essential for us to do this for our
`customers. Henkel delivers turnkey
`solutions, including the technical
`and engineering support crucial to
`your process engineers. We will not
`leave you to fill in the blanks.
`
`Henkel’s ‘Lead-Free That Works’
`initiative is ready for action,
`minimizes the risks of conversion,
`and gives you the confidence to
`introduce new lead-free products
`and processes quickly, in high
`volumes, and at high quality from
`the outset. The Henkel range
`includes lead-free solder, as well as
`materials for board-level assembley
`such as surface mount adhesives,
`conformal coating, underfill and
`potting materials. In addition,
`Henkel offers lead-free
`semiconductor materials including
`die attach, mold compounds,
`underfill, and liquid encapsulants
`for semiconductors and other
`components.
`
`• Multicore® solder materials offer a
`variety of solder paste, flux and
`multiple cored wires for use in lead-
`free applications.
`
`• Hysol® die attach adhesives offer
`very high adhesion strength and
`elongation at lead-free solder reflow
`temperatures to ensure the entire
`package will not crack or popcorn.
`
`• Hysol® fast-flow underfill materials
`offer excellent adhesion to a variety
`
`of no-clean flux residues that will
`not crack after thermal shock or
`thermal cycling.
`
`• Hysol® liquid encapsulants are
`designed to withstand up to 260°C
`peak solder reflow temperatures
`without degradation, and meet
`JEDEC Level 2A standards.
`
`•Hysol® molding compounds meet
`flammability requirements without
`the use of antimony, bromine, or
`phosphorous flame retardant
`compounds. They provide excellent
`long term high temperature
`performance and lead-free processing
`for packaging a variety of power
`devices, sensors, ICs, and passive
`components.
`
`CHALLENGE OF
`260°C PROCESSING
`By striving to continuously
`improve the JEDEC performance
`of our packaging materials, we
`have acquired an in-depth
`understanding of the increased
`interactions between all packaging
`components at the higher
`processing temperatures required
`by lead-free applications. Our
`experienced research and
`technical service professionals,
`equipped with the most advanced
`analytical resources, are ready to
`work with you to accurately map
`these interactions and thereby
`maximize the reliability, stability,
`and performance of components
`and assemblies.
`
`Using our knowledge throughout
`all phases of package
`development, you can quickly
`identify optimal material
`
`combinations to greatly accelerate
`your development project. Our
`advanced techniques include finite
`element modeling and acoustic
`microscopy, for example.
`
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`
`MATERIALS
`PACKAGING
`
`Hysol® Die Adhesives for Non-Hermetic Packages
`
`Hysol® Die Adhesives for Non-Hermetic Packages
`
`MATERIALS
`PACKAGING
`
`For organic substrates including laminates, array, BGA and CSP packages
`
`For substrates including Cu, Pd, Ag & Au plating, ceramic, and black oxide CONTINUED
`
`Product
`
`Description/Application
`
`Filler
`
`Thermal
`Conductivity
`
`QMI536™
`
`PTFE
`
`0.3 W/mK
`
`Tg
`(°C)
`
`-31
`
`Boron
`Nitride
`
`0.9 W/mK
`
`4
`
`CTE
`α1/α2
`
`93
`174
`
`66
`177
`
`Modulus @
`25°C
`
`Viscosity
`5 rpm @ 25°C
`
`0.3 GPa
`
`8,500 cps
`
`0.9 GPa
`
`13,000 cps
`
`Oven Cure/SkipCureTM
`
`15 min @ 150°C Oven
`10 s @ 150°C SkipCureTM
`
`15 min @ 150°C Oven
`10 s @ 150°C SkipCureTM
`
`Product
`
`Description/Application
`
`Filler
`
`Oven Cure/SkipCureTM
`
`Viscosity
`5 rpm @ 25°C
`
`Thermal
`Conductivity
`
`9,200 cps
`
`2.1 W/mK
`
`Tg
`(°C)
`
`96
`
`CTE
`α1/α2
`
`65
`130
`
`87
`171
`
`Modulus
`@ 25°C
`
`4.0 GPa
`
`0.30 GPa
`
`General purpose silver-filled epoxy for
`general bonding purposes that require
`electrical and thermal conductivity.
`
`Silver
`
`15 min @ 150°C Oven
`(No SkipCureTM)
`
`K00125™
`
`QMI534™
`
`PTFE
`
`15 min @ 175°C Oven
`10 s @ 200°C SkipCureTM
`
`9,000 cps
`
`0.4 W/mK
`
`-35
`
`Industry standard for die-to-die
`bonding, dielectric, high adhesive
`strength.
`QMI536HT™ High thermal version of QMI536 for
`mixed stacked die applications and
`single die BGA.
`
`QMI550SI™ Low CTE version of QMI550 for low
`shrinkage and low warpage on laminate
`and flex substrates.
`QMI538NB™ Very low stress dielectric die attach for
`SCSP.
`
`QMI600™
`
`For stacked die applications where the
`bonding wires go through the die attach
`paste and mold compound.
`
`Silica
`
`0.6 W/mK
`
`42
`
`PTFE
`
`Silica
`
`0.3 W/mK
`
`0.6 W/mK
`
`-70
`
`74
`
`36
`90
`
`85
`149
`
`31
`95
`
`1.5 GPa
`
`17,000 cps
`
`0.1 GPa
`
`8,500 cps
`
`9.3 GPa
`
`10,200 cps
`
`15 min @ 150°C Oven
`10 s @ 150°C SkipCureTM
`
`15 min @ 175°C Oven
`10 s @ 200°C SkipCureTM
`
`15 min @ 175°C Oven
`10 s @ 175°C SkipCureTM
`
`For substrates including Cu, Pd, Ag & Au plating, ceramic, and black oxide
`
`Filler
`
`Oven Cure/SkipCureTM
`
`Non-Conductive, small die non-conductive,
`very high adhesive strength on metal
`substates for die sizes less than 500x500
`mil./13x13 mm.
`UV Cure – CCD/CMOS glass lid sealing non-
`conductive, UV curing resin with excellent
`adhesion to glass. Ideal for glass lid-sealing
`CCD or CMOS lenses.
`No Bleed, large die non-conductive, very low
`stress QMI600 on metal substates for die
`sizes greater than 500x500 mil./13x13 mm.
`
`QMI536UV™
`
`QMI538NB™
`
`PTFE
`
`10 s @ 2500mW
`
`6,700 cps
`
`0.3 W/mK
`
`26
`
`PTFE
`
`15 min @ 175°C Oven
`10 s @ 200°C SC
`
`8,500 cps
`
`0.3W/mK
`
`-70
`
`62
`136
`
`85
`149
`
`0.70 GPa
`
`0.10 GPa
`
`Hysol® Die Adhesives for Hermetic Packages
`
`Product
`
`Description/Application
`
`Resin
`
`Filler
`
`Recommended Cure
`
`Viscosity 5
`rpm @ 25°C
`
`Thermal
`Conductivity
`
`Tg
`(°C)
`
`Modulus
`@ 25°C
`
`Storage
`Temp
`
`Product
`
`Description/Application
`
`QMI168™
`
`Cost effective version of QMI519,
`similar properties as QMI519.
`QMI505MT™ JEDEC L3 260 in low k CDBGA
`application. Superior adhesion to
`palladium, alloy 42 gold and black
`oxide finishes.
`
`Silver
`
`Silver
`
`Thermal
`Conductivity
`
`3.8 W/mK
`
`2.4 W/mK
`
`Tg
`(°C)
`
`75
`
`-10
`
`CTE
`α1/α2
`
`40
`140
`72
`170
`
`Modulus @
`25°C
`
`Viscosity
`5 rpm @ 25°C
`
`5.3 GPa
`
`9,000 cps
`
`.9 GPa
`
`12,000 cps
`
`15 min @ 185°C Oven
`10 s @ 200°C SkipCureTM
`15 min @ 185°C Oven
`10 s @ 200°C SkipCureTM
`
`QMI519™
`
`Silver
`
`3.6 W/mK
`
`75
`
`5.3 GPa
`
`9,000 cps
`
`QMI2419™
`
`QMI2569™
`
`QMI301™
`
`Glass/
`Solvent
`
`Silver
`
`Glass/
`Solvent
`
`Silver
`
`See ramp profile
`7-10 min @
`420-460°C
`
`See ramp profile
`7-10 min @
`360-440°C
`
`27,000 cps
`
`>60 W/mK
`
`300
`
`35,800 cps
`
`>60 W/mK
`
`250
`
`Silver
`
`10 min @ 150°C
`
`11,400 cps
`
`1.9 W/mK
`
`245
`
`CTE
`α1/α2
`21
`N/A
`
`16
`N/A
`
`45
`85
`
`15.1 GPa
`
`15.1 GPa
`
`RT on
`Rollers
`
`RT on
`Rollers
`
`6.9 GPa
`
`-40°C
`
`JEDEC L1 260°C for SOIC, industry
`standard for QFN packages. Good for
`all preplated leadframes and barE
`copper. High adhesion, excellent
`electrical and thermal performance.
`QMI529HT™ JEDEC L1 260°C for exposed pad
`TSOP. Highly filled version of QMI519.
`N E W
`For component attach or die attach
`where very high electrical and thermal
`conductivity is required. Suitable for
`high heat dissipation devices and solder
`replacement applications.
`
`QMI529LB™ Reduced bleed version of the
`QMI519. JEDEC L1 260°C for Cu,
`AgCu and NiPdAu leadframe. High
`adhesion with excellent thermal and
`electrical performance.
`QMI529LS™ Lower stress version of QM519 for
`die larger than 300 x 300 mil.
`N E W
`QMI529NB™ No bleed version of QMI519, for use
`on NiPdAu, and Alloy 42 leadframes.
`N E W
`QMI529NC™ Dielectric, low CTE version of QMI519.
`Silica filled for low shrinkage and low
`N E W
`warpage.
`
`Silver
`
`7.0 W/mK
`
`16
`
`Silver
`
`3.8 W/mK
`
`36
`
`Silver
`
`2.8 W/mK
`
`Silver
`
`3.8 W/mK
`
`Silver
`
`0.6 W/mK
`
`10
`
`24
`
`22
`
`40
`140
`
`50
`127
`
`63
`121
`
`65
`192
`
`41
`104
`
`50
`126
`
`15 min @ 185°C Oven
`10 s @ 200°C SkipCureTM
`
`3.3 GPa
`
`18,000 cps
`
`30 min @ 185°C Oven
`60 s @ 185°C SkipCureTM
`
`3.5 GPa
`
`14,300 cps
`
`30 min @ 185°C Oven
`10 s @ 200°C SkipCureTM
`
`2.1 GPa
`
`11,000 cps
`
`15 min @ 185°C Oven
`150-190°C ramp Snap Cure
`
`6.3 GPa
`
`15,000 cps
`
`1.9 GPa
`
`13,000 cps
`
`30 min @ 185°C Oven
`30 s @ 175°C SkipCureTM
`
`30 min @ 185°C Oven
`10 s @ 185°C SkipCureTM
`
`3
`
`Fig. 1
`
`electronics.henkel.com
`
`No-dry Ag glass die attach for glass-
`sealed packages. Very high thermal
`conductivity and >450°C temperature
`resistance.
`No-dry Ag glass die attach for glass,
`solder, and seamed sealed packages.
`Very high thermal conductivity
`applications for die as large as 0.80 in2.
`Solder and seamed sealed packages
`Low temperature cure material with very
`high adhesion and >340°C temperature
`resistance for solder-sealed hermetric
`packages.
`QMI3555R™ No-dry Ag glass die attach for glass,
`solder and seamed sealed packages.
`Very high thermal conductivity and
`>450°C temperature resistance for
`glass-sealed hermetric packages.
`
`Cyanate
`Ester
`
`Glass/
`Solvent
`
`Silver
`
`See ramp profile
`7-10 min @
`300-450°C
`
`40,000 cps
`
`>80 W/mK
`
`150
`
`16
`N/A
`
`11.5 GPa
`
`RT on
`Rollers
`
`All Hysol® QMI500 series, BMI-based die attach
`adhesives use free radical cure, enabling extremely
`fast cure rates (Fig.1). Adhesives in this series cure in
`seconds at the appropriate temperature. Not
`minutes or hours, but seconds. Adhesives can now
`be cured in-line right on the diebonder,
`immediately after the substrate is indexed onto the
`post-bond cure station, or on the wirebonder
`preheater. This enables high UPH, which translates
`to low total cost-of-use. SkipCure™ also improves the
`quality of the cured part by holding the substrate
`flat during die attach cure, for significantly lower
`warpage compared to oven-cured substrates.
`Furthermore, the short distance between bondsite
`and post-bond cure station minimizes adhesive
`slump and die movement before cure, allowing
`more consistent bondline thickness.
`
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`

`
`MATERIALS
`& ASSEMBLY
`PACKAGING
`
`Tg
`(°C)
`
`150
`
`115
`
`138
`
`CTE (1)
`(PPM/°C)
`
`Modulus
`
`% Filler
`
`60
`
`22
`
`46
`
`3.2
`
`9.5
`
`5.5
`
`20
`
`65
`
`42
`
`Recommended
`Cure
`
`1 hr @ 165°C
`
`30 min @
`165°C
`
`30 min @
`165°C
`
`FP0108™
`
`FP4548FC™
`
`FP4549SI™
`
`Low-k/Cu flip chip
`applications; Sn/Pb
`bumped packages.
`Lead-free flip chip packages
`(L3/260C); low-k/Cu flip chip
`packages with hi-Pb bumps.
`
`Fast-flowing, low stress
`underfill for fine-pitch
`flip chip applications.
`
`Viscosity
`@ 25°C
`
`900 cps
`
`Very Fast
`
`Medium
`
`25,000 cps
`
`Very Fast
`
`2,500 cps
`
`Hysol® Underfills
`
`Package Level Underfills
`
`Product
`
`Description/Application
`
`Flow Speed
`
`Hysol® Underfills
`
`MATERIALS
`PACKAGING
`
`Modern hand held devices and the trend toward thinner, less
`rigid PCBs are driving the demand for improved shock
`resistance and increased electronic device reliability.
`
`Hysol® package level underfill
`encapsulants meet stringent JEDEC
`testing requirements and are
`compatible with the high temperature
`processing required for lead-free
`assembly. Our environmentally
`friendly materials are developed to
`meet demanding end use
`requirements, including low
`warpage/low stress, fine pitch, high
`reliability, and high adhesion.
`
`The latest technology from Henkel
`includes underfills for low k die, new
`chemistries offering pot life measured
`in weeks instead of hours, and high
`throughput Snap Cure processing.
`Further innovations include unique
`reworkable formulations, fluxing no-
`flow underfills, wafer/pre-applied for
`flip chip and CSPs, and pre-applied
`cornerbond adhesives for CSPs that
`eliminate post-reflow dispense and
`cure steps.
`
`Board Level CSP/BGA and Flip Chip Underfills
`
`Product
`
`Description/Application
`
`Viscosity
`
`Pot Life
`
`Cure Schedule
`
`3,200 cps
`
`2 days
`
`15 min @ 120°C or
`30 min @ 100°C
`
`Tg
`(°C)
`72
`
`CTE (1)
`(PPM/°C)
`30
`
`Capillary
`Flow
`Medium
`
`Storage
`Temp
`-15°C
`
`2,000 cps
`
`7 days
`
`20 min @ 120°C or
`40 min @ 100°C
`
`61
`
`66
`
`Fast
`
`5°C
`
`4,500 cps
`
`7 days
`
`5 min @ 150°C
`
`110
`
`50
`
`Fast
`
`5°C
`
`3518™
`
`3551™
`
`3593™
`
`Hysol® CSP/BGA underfills offer easy
`reworkability as well as excellent
`vibration and impact resistance. These
`underfills offer many processing
`advantages such as fast flow, fast cure,
`and long pot life. Our CornerbondTM
`technology fits easily into an SMT
`process flow and eliminates a separate
`underfill dispense and cure process,
`saving time and money.
`
`The industry standard for flip chip,
`Hysol® underfills are used in devices
`such as FC CSPs and FC BGAs for
`ASICs, chipsets, graphics chips, digital
`processors, and microprocessors.
`These fast flow materials permeate
`easily under large die. Offering
`excellent adhesion when used with a
`variety of no-clean fluxes, these
`underfills will not crack after thermal
`shock or thermal cycling.
`
`Henkel is partnering with leading
`technology companies and research
`universities to develop future
`technologies to support forthcoming
`nanometer-scale semiconductor
`devices.
`
`Non-reworkable underfill.
`Designed for high reliabiltiy
`requirements. Low CTE for
`improved thermal cycle
`perfomance for packages
`with small bump diameter.
`Note: Not sold in the U.S.
`Reworkable underfill for
`improvement of mechanical
`reliability. Design to cure at
`low temperature for heat
`sensitive components and
`fast flow for improved
`process time.
`Non-reworkable underfill for
`high mechanical reliability.
`Fast flow and snap cure for
`improved process time.
`Reworkable underfill for
`improvement of mechanical
`reliability. Fast flow and snap
`cure for improved process
`time.
`For corner reinforcement.
`Designed to cure during
`reflow while allowing self
`alignment of the IC package.
`For corner reinforcement.
`Designed to cure during
`reflow while allowing self
`alignment of the IC package.
`Compatible with lead-free
`profile.
`CSP/BGA and flip chip
`fluxing underfill for tin/lead
`reflow process.
`Fluxing underfill for lead-free
`reflow process. Designed to
`improve overall process by
`minimizing dispense time
`and eliminate use of underfill
`cure time after reflow.
`
`Snap cure flip chip underfill
`for FPC. Designed for gap size
`down to 25 micron.
`
`Snap Cure flip chip underfill
`for FPC and laminates.
`Designed for gap size down
`to 75 micron.
`Snap Cure flip chip underfill
`for FPC. Designed for gap
`size down to 75 micron.
`
`FP6101™
`
`3515™
`
`3509™
`
`FF2200™
`
`FF2300™
`
`FP4530™
`
`FP4531™
`
`FP4532™
`
`5
`
`electronics.henkel.com
`
`3,700 cps
`
`14 days
`
`5 min @ 165°C or
`10 min @ 150°C
`
`7,400 cps
`
`7 days
`
`134,000 cps
`
`1 day
`
`3,600 cps
`
`16 hrs
`
`2,500 cps
`
`16 hrs
`
`Reflow cure
`(see TDS)
`
`Reflow cure
`(see TDS)
`
`Reflow cure
`(see TDS)
`
`Reflow cure
`(see TDS)
`
`3,000 cps
`
`24 hrs
`
`7 min @ 160°C
`
`9,000 cps
`
`24 days
`
`7 min @ 160°C
`
`16,000 cps
`
`12 hrs
`
`5 min @ 150°C
`
`15
`
`73
`
`111
`
`72
`
`75
`
`148
`
`144
`
`140
`
`80
`
`98
`
`72
`
`72
`
`75
`
`44
`
`28
`
`30
`
`Fast
`
`-20°C
`
`N/A
`
`N/A
`
`N/A
`
`N/A
`
`Fast
`
`Fast
`
`Fast
`
`5°C
`
`-40°C
`
`-40°C
`
`-40°C
`
`-40°C
`
`-40°C
`
`-40°C
`
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`

`
`MATERIALS
`PACKAGING
`
`Tg
`(°C)
`
`145
`
`150
`
`15
`
`CTE (1)
`(PPM/°C)
`
`% Filler
`
`24
`
`21
`
`80
`
`72
`
`73
`
`9
`
`Hysol® Encapsulants
`
`Hysol® Encapsulants
`
`MATERIALS
`PACKAGING
`
`Flow Control/Dam Materials
`
`Product
`
`Description/Application
`
`Recommended Cure
`
`30 min @ 125°C or
`+90 min @ 165°C
`
`30 min @ 125°C or
`+90 min @ 165°C
`
`Viscosity
`@ 25°C
`
`900,000 cps
`
`300,000 cps
`
`FP4451™
`
`FP4451TD™
`
`FP6401™
`
`Industry standard damming materials for
`BGAs.
`
`Tall dam version of FP4451 for applications
`requiring a taller, narrow dam. Ionically cleaner
`also.
`Zero stress dam for ceramic or large array
`packages.
`
`Fill Encapsulants
`
`30 min @ 165°C
`
`3,700 cps
`
`Product
`
`Description/Application
`
`Recommended Cure
`
`Flow Speed
`
`CB0260™
`
`High adhesion version of FP4450
`for 260C L2A JEDEC.
`
`1 hr @ 110°C or
`+2 hrs @ 160°C
`
`High
`
`Viscosity
`@ 25°C
`
`40,000 cps
`
`Tg
`(°C)
`
`145
`
`150
`
`CTE (1)
`(PPM/°C)
`
`% Filler
`
`18
`
`8
`
`74
`
`86
`
`CHIP ON BOARD LIQUID
`ENCAPSULANTS
`Henkel encapsulants cure with
`unmatched void-free characteristics
`for chip-on-board encapsulation
`applications. Our low-CTE
`formulations minimize stress on
`wire bonds during thermal cycling.
`These encapsulants are easy-to-
`dispense, minimize induced stresses,
`provide improved temperature
`cycling performance, and offer
`excellent chemical resistance.
`
`SEMICONDUCTOR LIQUID
`ENCAPSULANTS
`Enabling today’s smaller, thinner,
`and lighter packages requires new
`materials that support high-
`throughput, low-cost package
`assembly processes. Hysol® high
`purity encapsulants are self-leveling
`materials that offer unprecedented
`performance for transistors, system
`in package (SIP), microprocessors,
`and ASICs. Our co-cure dam and fill
`encapsulants cure in one easy step.
`We created high-purity liquid-epoxy
`encapsulants that work together as
`dam-and-fill materials for bare chip
`encapsulation, protecting gold wire
`bonds and silicon die from
`mechanical damage and corrosion.
`The low viscosity “fill” materials can
`also be used alone in devices that
`contain a cavity.
`
`Hysol® encapsulants meet stringent
`JEDEC-level testing requirements and
`are compatible with the high
`temperature processing demanded
`for lead-free assembly. Our green
`materials are developed to meet the
`demands of end-use requirements.
`
`CB064™
`
`FP4450™
`
`FP4450HF™
`
`FP4450LV™
`
`FP4460™
`
`FP4470™
`
`FP4652™
`
`Ultra low CTE, low stress version
`of FP4450 for large array packages.
`Industry standard fill material for
`dam and fill or cavity down BGAs.
`
`2 hr @ 110°C or
`+2 hrs @ 160°C
`30 min @ 125°C or
`+90 min @ 165°C
`
`High flow version of FP4450LV
`using synthetic filler for use in fine
`wire and low alpha application.
`Low viscosity version of FP4450
`incorporating cleaner resins.
`Glob top version of FP4450.
`
`High adhesion version of FP4450
`for 260°C L3 JEDEC performance.
`Fast cure, low stress version of
`FP4450 for large array packages.
`
`30 min @ 125°C or
`+90 min @ 165°C
`
`30 min @ 125°C or
`+90 min @ 165°C
`1 hr @ 125°C or
`+2 hrs @ 160°C
`30 min @ 125°C or
`+90 min @ 165°C
`15 min @ 110°C or
`+30 min @ 165°C
`
`Low
`
`Medium
`
`80,000 cps
`
`50,000 cps
`
`Very High
`
`32,000 cps
`
`High
`
`Low
`
`High
`
`35,000 cps
`
`300,000 cps
`
`48,000 cps
`
`Medium
`
`180,000 cps
`
`155
`
`160
`
`155
`
`170
`
`148
`
`150
`
`22
`
`19
`
`22
`
`20
`
`18
`
`14
`
`73
`
`73
`
`72
`
`75
`
`75
`
`80
`
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`

`
`MATERIALS
`PACKAGING
`
`Hysol® Chip-On-Board Glob Tops
`
`Hysol® Non-Conductive Pastes
`
`MATERIALS
`PACKAGING
`
`Product
`
`Description/Application
`
`EO1016™ UL94-VO encapsulant for smart cards and watch ICs.
`Non-abrasive filler allows for grinding if necessary.
`
`Pot Life
`@ 25°C
`
`Recommended Cure
`
`3 months
`
`20 min @ 150°C
`
`EO1060™ Low glob formulation for lower CTE and lower ionic than
`EO1016 content for more demanding applications.
`
`25 days
`
`4-6 hrs @ 125°C
`
`EO1061™ Medium glob version of EO1060.
`
`25 days
`
`4-6 hrs @ 125°C
`
`EO1062™ High glob version of EO1060.
`
`25 days
`
`4-6 hrs @ 125°C
`
`EO1072™ One component, high performance encapsulant with high Tg and
`low extactable ionics.
`EO1080™ Low CTE version of EO1016.
`
`1 month
`
`5 min @ 140/150°C
`
`3 months
`
`20 min @ 150°C
`
`Tg
`(°C)
`
`115
`
`125
`
`125
`
`125
`
`135
`
`121
`
`CTE (1)
`PPM/°C
`
`Filler Type
`
`Storage
`Temp
`
`46
`
`40
`
`40
`
`40
`
`43
`
`35
`
`Calcium
`Carbonate
`
`Calcium
`Carbonate
`
`Calcium
`Carbonate
`Calcium
`Carbonate
`
`Silica
`
`Silica
`
`4°C
`
`4°C
`
`4°C
`
`4°C
`
`4°C
`
`4°C
`
`Hysol® NCP encapsulants are designed to provide a high level
`of reliability for flip chip in package application with excellent
`moisture and thermal cycling resistance for thermal
`compression bonding processes.
`
`Our materials also meet stringent
`JEDEC level testing requirements
`and are compatible with the high
`temperature processing required
`for lead-free assembly. Our
`environmentally friendly
`materials are developed to meet
`demanding end-use requirements,
`including low warpage/low stress,
`fine pitch, high reliability and
`high adhesion.
`
`THERMAL COMPRESSION
`BONDING PROCESS
`By using an innovative process of
`thermal compression bonding,
`flipchip interconnection process can
`be significantly simplified (see figure
`2). Unlike traditional C4 process,
`thermal compression bonding
`process requires no flux, achieves
`shorter assembly cycle time, and
`forms lead-free interconnection
`with proper bump and pad
`material selection.
`
`Au Bump
`
`NCP Dispensing
`
`Positioning
`
`Heat Bonding
`
`Fig. 2. Schematic of Thermal Compression Bonding Process
`
`Hysol® Package Level NCPs
`
`Product
`
`Description/Application
`
`Viscosity
`
`Pot Life
`
`Cure Schedule
`
`FP5000™
`
`FP5001™
`
`Excellent MSL and PCT resistance. Compatible with both
`constant and pulse heat tool.
`
`110,000 cps
`
`30 days
`
`4 s @ 240˚C
`
`Excellent thermal cycling resistance. Compatible with both
`constant and pulse heat tool.
`
`60,000 cps
`
`30 days
`
`4 s @ 240˚C
`
`Tg
`(°C)
`
`171
`
`164
`
`CTE
`
`36
`
`30
`
`% Filler Storage
`Temp
`
`53
`
`53
`
`-15˚C
`
`-15˚C
`
`9
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`
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`
`

`
`MATERIALS
`PACKAGING
`
`Typical Package
`Type
`
`TO, PDIP
`
`TO, PDIP
`
`1,620
`
`11.0
`
`0.40
`
`J3
`
`TO, PDIP. SMD
`
`1,700
`
`12.0
`
`0.37
`
`J1
`
`SMD, SO
`
`•
`
`160
`
`34
`
`1.83
`
`19
`
`70
`
`1,550
`
`13.4
`
`0.47
`
`PDIP, TO, SOIC
`
`1,550
`1,700
`
`13.4
`14.1
`
`0.47
`0.35
`
`Properties and Features
`
`Green FR
`Precondition
`260°C Reflow Profile
`
`(85/85 168 hrs)
`Moisture Absorption
`
`(kg/mm2)
`Flexural Strength
`
`(kg/mm2)
`Flexural Modulus
`
`CTE, α2 (PPM/°C)
`
`CTE, α1 (PPM/°C)
`
`Specific Gravity
`
`177°C, in.
`Spiral Flow @
`
`Temperature, Tg (°C)
`Glass Transition
`
`Hysol® Electronic Molding Compounds
`
`Product
`
`General Description
`
`Hysol® Semiconductor Molding Compounds
`
`Hysol® Semiconductor Molding Compounds combine low stress
`and low water absorption properties with high physical strength.
`
`MATERIALS
`PACKAGING
`
`MG15F-35A™
`
`MG15F-60A™
`N E W
`MG15F-MOD2™
`
`190
`
`26
`
`1.80
`
`23
`
`190
`
`25
`
`1.81
`
`21
`
`195
`
`39
`
`1.90
`
`18
`
`235
`
`35
`
`1.95
`
`14
`
`71
`
`70
`
`60
`
`55
`
`1,550
`
`11.5
`
`0.45
`
`1,550
`
`12.3
`
`0.45
`
`The result: excellent performance
`across many processes and diverse
`applications – from discrete/power
`devices to array packages. Henkel
`molding compounds for
`low environmental impact meet
`reliability requirements for
`regular and lead-free applications.
`They also meet flammability
`requirements without the use of
`antimony, bromine, or
`phosphorous flame retardant
`compounds. Our patented SIGMA
`technology virtually eliminates
`intermetallic failures at high
`temperatures. The use of novel ion
`scavengers provides advanced
`moisture resistance.
`
`Maximize your productivity when
`assembling flip chip array-type
`packages including CSPs: our
`molded flip chip underfill
`materials allow the package
`matrix to be underfilled as a unit
`before dicing, rather than
`processing each chip individually.
`Also, no liquid underfill is
`required. JEDEC Level-3
`performance, up to 260°C, allows
`you to boost throughput even in
`the most demanding applications,
`including lead-free.
`
`Anhydride Chemistry
`MG15F-R™
`Power discrete, RF and high voltage rectifier. Designed
`for high voltage power applications requiring good
`electrical stability at high temperature.
`Power discrete, RF and high voltage rectifier. Designed
`for high voltage power applications requiring good
`electrical stability at high temperature.
`Anhydride chemistry with spherical fused silica filler.
`Designed for high voltage power applications requiring
`good electrical stability at high temperature.
`Asymmetric and surface mount packages. Very high Tg,
`low stress, power CSP.
`Low Stress – ECN/DCP Chemistry
`MG46F™
`Low stress, designed for encapsulation of TO, PDIP &
`SOIC packages. Applicable for devices having chip
`dimensions up to 250 mils2.
`Automold version of MG46F.
`Low stress, designed for SOIC, SSOP and PLCC
`devices. Also can be used for large PDIP, power discrete
`and high voltage applications.
`Ultra low stress, green (non-bromine/antimony)
`Designed for large package/die, high temperature
`N E W
`performance.
`Through Hole Discrete
`MG21-02™
`High productivity, low cost material designed for low
`N E W
`voltage diodes and small signal transistors.
`Low cost, through hole discretes, diode, and IC.
`
`GR330™
`
`GR360™
`
`GR380™
`
`MG46F-AM™
`MG52F-08™
`N E W
`
`GR860™
`
`160
`160
`
`26
`32
`
`1.83
`1.88
`
`17
`14
`
`195
`
`38
`
`1.92
`
`14
`
`185
`
`150
`
`170
`
`25
`
`30
`
`30
`
`1.82
`
`1.85
`
`1.82
`
`19
`
`17
`
`19
`
`160
`
`34
`
`1.84
`
`17
`
`70
`58
`
`57
`
`62
`
`55
`
`65
`
`70
`
`1,050
`
`10.5
`
`0.30
`
`J1
`Q101
`
`1,500
`
`11.9
`
`0.40
`
`1,700
`
`14.0
`
`0.40
`
`1,700
`
`14.0
`
`0.45
`
`1,350
`
`13.0
`
`0.35
`
`PDIP, TO, SOIC
`TSSOP, PLCC
`SO, QFP
`
`SMD, PSO
`
`Diode, TO
`
`TO
`
`TO, PDIP
`
`PDIP, SO
`SMD, QFM
`
`•
`
`•
`
`•
`
`•
`
`40
`
`1,750
`
`13.0
`
`0.25
`
`J1
`
`SMD
`
`GR640™
`
`High performance, good reliability, low cost, applicable
`for low pin count PDIP ICs. Also available in automold
`version.
`SMD PDIP SOIC packages and QFP. Low stress, high
`voltage rectifier, power discrete and small outline
`transistors.
`Surface Mount Discrete
`GR625™
`Surface mount discrete, IC, QFP. Passes JEDEC Level 1,
`260°C reflow.
`Designed for small signal and small outline transistors,
`high speed automold, very fast cure.
`High Temperature Application
`GR725-AG™
`Automotive (20,000 hrs @ 185°C), green, designed for
`surface mount discrete packages operating at high
`N E W
`temperature. Passes JEDEC Level 1.
`Medium thermal conductivity, green mold compound.
`Designed for low voltage diodes, small signal and
`outline transistors.
`High thermal conductivity – isolated packages, green, designed to
`improve thermal management for semiconductor devices.
`High adhesion to copper and copper alloys.
`
`GR735™
`
`GR750™
`
`N E W
`
`140
`
`165
`
`39
`
`21
`
`1.91
`
`1.82
`
`13
`
`21
`
`135
`
`41
`
`1.95
`
`12
`
`170
`
`28
`
`2.05
`
`30
`
`160
`
`24
`
`2.30
`
`23
`
`65
`
`1,620
`
`15.5
`
`0.40
`
`J2
`
`35
`
`80
`
`70
`
`39
`
`45
`
`2,000
`
`11.6
`
`0.28
`
`J1
`
`1,700
`
`13.4
`
`0.45
`
`1,950
`
`12.0
`
`0.40
`
`2,000
`
`12.3
`
`0.34
`
`1,800
`
`12.7
`
`0.25
`
`J1
`
`J1
`
`•
`
`•
`
`•
`
`•
`
`•
`
`•
`
`SOT, SOD
`
`SO, PSO, SMD
`
`SOT, ISOT
`SOD, SO
`
`ISOTO, FPAC
`
`SOIC
`
`Surface Mount IC
`GR818™
`N E W
`
`Green, lower cost, designed for SO type packages.
`
`131
`
`42
`
`1.91
`
`14
`
`11
`
`GR9840™
`
`Green mold compound designed for smart card packages.
`
`165
`
`electronics.henkel.com
`
`Asymmetric Packages
`GR9800™
`Molded flip chip encapsulant designed for flip chip in array
`package applications. Applicable for underfill and overmolding
`flip chip assemblies with gap sizes as low as 40 micron.
`Laminate based packages. Designed for use as
`an overmold, low warpage, green, JEDEC
`Level 2 capability.
`Matrix QFN, green, very low stress, ultra low warpage,
`adhesion can be optimized for specific lead frame metalization.
`JEDEC Level 1 capable.
`Single cavity QFN lead frame packages passes JEDEC Level 1. 145
`
`GR9810™
`
`GR9820™
`
`GR9825™
`
`200
`
`195
`
`195
`
`GR828™
`
`Green, specifically designed for SO packages up to
`TSSOP/TQFP. Passes JEDEC Level 1 @ 260°C reflow.
`
`145
`
`40
`
`1.91
`
`13
`
`41
`
`45
`
`40
`
`40
`
`21
`
`1.85
`
`14
`
`2.01
`
`11
`
`2.01
`
`11
`
`1.91
`
`1.81
`
`13
`
`22
`
`48
`
`35
`
`35
`
`45
`
`66
`
`1,500
`
`11.0
`
`0.40
`
`J2
`
`2,300
`
`12.0
`
`0.30
`
`J2
`
`2,200
`
`11.0
`
`0.30
`
`J1
`
`1,800
`
`12.7
`
`0.25
`
`J1
`
`1,600
`
`15.5
`
`0.40
`
`•
`
`•
`
`•
`
`•
`
`•
`
`•
`
`SOIC, SSOP, SOP
`QSOP, TQFP
`
`MFC
`
`SIP, BGA
`
`QFN
`
`QFN
`
`Smart Card
`
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`
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`

`
`MATERIALS
`PACKAGING
`
`Hysol® Optoelectronic Encapsulants
`
`Optoelectronic Mold Compounds
`
`Product
`
`Description/Application
`
`Mold Cycle
`
`Post Cure
`
`Spiral
`Flow
`(in.)
`
`Glass
`Transition
`(Tg, °C)
`
`Alpha 1
`(PPM/°C)
`
`Mold
`Shrinkage
`(%)
`
`Flexural
`Modulus
`(kg/MM2)
`
`Dielectric
`Factor
`(100kHz)
`
`Dissipation
`Factor
`(100kHz)
`
`Dielectric
`Strength
`(volts/mil)
`
`MG18™
`
`Transparent epoxy molding
`compound for LEDs, image
`sensors, and opto sensors.
`
`MG18-5129™ Visually opaque, black epoxy
`molding compound specifically
`designed for IR electronic
`applications such as IR
`transievers and IR photo modules.
`
`MG97-8000™ Transparent epoxy molding
`compound specifically designed
`for surface mount optoelectronic
`devices such as LEDs, image
`sensors, and opto sensors.
`
`OP1000™ Premier pelletized optoelectronic
`molding compound.
`
`OP2000™ Pelletized optoelectronic
`molding compound with
`advanced adhesion properties.
`OP3000™ Pelletized optoelectronic
`molding compound with
`advanced adhesion properties,
`enhanced cure speed.
`
`25-40
`
`4 min @ 150°C 4 hrs @ 150°C 125
`
`25-40
`
`4 min @ 150°C 4 hrs @ 150°C 125
`
`70
`
`70
`
`1.6
`
`1.6
`
`364
`
`352
`
`3.7
`
`3.7
`
`0.017
`
`1140
`
`0.017
`
`1140
`
`25-40
`
`4 min @ 150°C 4 hrs @ 150°C 140
`
`72
`
`1.7
`
`377
`
`3.4
`
`0.015
`
`1230
`
`25-40
`
`4 min @ 150°C 4 hrs @ 150°C 140
`
`25-40
`
`4 min @ 150°C 4 hrs @ 150°C 131
`
`25-40
`
`4 min @ 150°C 4 hrs @ 150°C 124
`
`72
`
`74
`
`70
`
`89
`
`1.7
`
`1.5
`
`1.6
`
`359
`
`379
`
`313
`
`3.4
`
`3.4
`
`3.5
`
`0.015
`
`0.017
`
`1229
`
`1016
`
`0.016
`
`1260
`
`1.6
`
`322
`
`3.5
`
`0.017
`
`904
`
`Hysol® Optoelectronic Materials
`
`For over 30 years, manufacturers of optoelectronic devices have
`depended on Hysol® liquid casting and molding materials.
`
`MATERIALS
`PACK