111111
`
`1111111111111111111111111111111111111111111111111111111111111
`US008529811B2
`
`c12) United States Patent
`Drysdale et al.
`
`(10) Patent No.:
`(45) Date of Patent:
`
`US 8,529,811 B2
`*Sep.10,2013
`
`(54) COMPONENT PROTECTIVE
`OVERMOLDING USING PROTECTIVE
`EXTERNAL COATINGS
`
`(75)
`
`Inventors: Richard Lee Drysdale, Santa Cruz, CA
`(US); Scott Fullam, Palo Alto, CA (US);
`Skip Thomas Orvis, San Jose, CA (US);
`Nora Elam Levinson, Washington, DC
`(US)
`
`(73) Assignee: AliphCom, San Francisco, CA (US)
`
`( *) Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 0 days.
`
`This patent is subject to a terminal dis(cid:173)
`claimer.
`
`(21) Appl. No.: 13/427,839
`
`(22) Filed:
`
`Mar. 22, 2012
`
`(65)
`
`Prior Publication Data
`
`US 2012/0315379 Al
`
`Dec. 13, 2012
`
`Related U.S. Application Data
`
`(63) Continuation of application No. 13/135,728, filed on
`Jul. 12, 2011, which is a continuation-in-part of
`application No. 13/158,416, filed on Jun. 11, 2011,
`which is a continuation-in-part of application No.
`13/158,372, filed on Jun. 10, 2011.
`
`(51)
`
`(2006.01)
`
`Int. Cl.
`B29C 45114
`(52) U.S. Cl.
`USPC ........... 264/135; 264/261; 264/265; 264/263;
`264/272.14; 264/272.17; 264/255
`(58) Field of Classification Search
`None
`See application file for complete search history.
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`5,974,262 A
`10/1999 Fuller eta!.
`D439,981 S
`4/2001 Kasabach et a!.
`6,254,815 B1 *
`7/2001 Cheperak ...................... 264/135
`12/2001 Kasabach eta!.
`D451,604 S
`6,356,940 B1
`3/2002 Short
`7/2002 Sica et a!.
`D460,971 S
`6,486,801 B1
`1112002 Jones
`3/2003 Stivoric eta!.
`6,527,711 B1
`6,595,929 B2
`7/2003 Stivoric eta!.
`8/2003 Teller et al.
`6,605,038 B1
`6,714,859 B2
`3/2004 Jones
`6,904,359 B2
`6/2005 Jones
`6,952,645 B1
`10/2005 Jones
`(Continued)
`
`CA
`CA
`
`FOREIGN PATENT DOCUMENTS
`2441962
`9/2003
`2496579
`3/2004
`(Continued)
`
`OTHER PUBLICATIONS
`
`U.S. Appl. No. 13/405,240, filed Feb. 25, 2012, Drysdale et al.
`
`Primary Examiner- Edmund H. Lee
`(74) Attorney, Agent, or Firm- Kokka & Backus, PC
`
`(57)
`
`ABSTRACT
`
`Techniques for component protective overmolding using pro(cid:173)
`tective external coatings include selectively applying a pro(cid:173)
`tective material substantially over one or more elements
`coupled to a framework configured to be worn, the elements
`including at least a sensor, and forming one or more moldings
`substantially over a subset or all of the framework, the pro(cid:173)
`tective material and the elements, after the protective material
`has been selectively applied, at least one of the one or more
`moldings having a protective property.
`
`26 Claims, 12 Drawing Sheets
`
`1 of 21
`
`FITBIT EXHIBIT 1001
`
`

`

`US 8,529,811 B2
`Page 2
`
`(56)
`
`References Cited
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`3/2006 Stivoric et al.
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`7,060,216 B2 * 6/2006 Schuurmans ............ 264/272.15
`7,153,262 B2
`12/2006 Stivoric et al.
`8/2007 Teller eta!.
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`7,647,195 B1
`112010 Kahnet a!.
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`3/2010 Teller eta!.
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`7,839,279 B2
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`1112010 Kahnet a!.
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`112011 Kasabach et a!.
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`6/2011 Stivoric et al.
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`7,987,070 B2
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`7,993,276 B2
`8/2011 Nazarian eta!.
`9/2011 Kasabach et a!.
`D645,968 S
`8,040,382 B2
`10/2011 Kahnet a!.
`8,047,966 B2
`1112011 Dorogusker et a!.
`1112011 Kahnet a!.
`8,049,614 B2
`8,064,759 B1
`1112011 Kahnet a!.
`8,073,707 B2
`12/2011 Teller eta!.
`
`12/2011 Ng eta!.
`8,083,643 B2
`2002/0068873 A1 * 6/2002 Nissila .......................... 600/509
`2004/0167409 A1 * 8/2004 Lo et al . ........................ 600/485
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`2560323
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`2358266
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`1414340
`5/2004
`EP
`1639939
`3/2006
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`1702560
`9/2006
`EP
`1734858
`12/2006
`EP
`2126828
`8/2008
`EP
`1743571
`5/2009
`EP
`167045
`6/2003
`IL
`178183
`6/2005
`IL
`153516
`7/2007
`IL
`160079
`IL
`212009
`153478
`3/2009
`IL
`158067
`3/2009
`IL
`200251105
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`212002
`2004-500949
`112004
`JP
`200750091
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`JP
`2005-536260
`12/2005
`JP
`4125132
`5/2008
`JP
`4283672
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`JP
`1020027017160
`10/2002
`KR
`1020027017525
`10/2002
`KR
`1020037012845
`10/2003
`KR
`102004001744
`10/2004
`KR
`1020057003029
`6/2005
`KR
`MX
`PA2005002024
`3/2005
`wo
`W0/0 1196986
`12/2001
`wo
`W0/02/00 111
`1/2002
`wo
`W0/02/078538
`10/2002
`wo
`W0/03/0 15005
`2/2003
`wo W0/2004/0 19172
`3/2004
`wo W0/2005/0 16124
`2/2005
`wo W0/2005/092177
`10/2005
`wo W0/2008/101248
`8/2008
`wo W0/20 10/065067
`6/2010
`* cited by examiner
`
`2 of 21
`
`

`

`U.S. Patent
`
`Sep. 10, 2013
`
`Sheet 1 of 12
`
`US 8,529,811 B2
`
`FIG. 1
`
`i02 ~::::::::!:~:::::::::::::::l:::::::::::::::~::~::::::::::::::::::::::::::~~::~:~:::~i:~:~:::~::::::::::::::::::J
`
`~206 208
`
`tO£
`
`100
`
`104
`
`...
`200
`
`FIG. 2
`
`3 of 21
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`

`

`U.S. Patent
`
`Sep.10,2013
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`Sheet 2 of 12
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`US 8,529,811 B2
`
`104
`
`.. ?f
`.. ··
`300
`
`FIG. 3
`
`.~
`.. ·····
`400
`
`i04
`
`FIG. 4
`
`4 of 21
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`

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`U.S. Patent
`
`Sep.10,2013
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`Sheet 3 of 12
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`US 8,529,811 B2
`
`FIG. 5A
`
`FIG. 58
`
`FIG~ 5C
`
`5 of 21
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`

`

`U.S. Patent
`US. Patent
`
`Sep. 10, 2013
`Sep.10,2013
`
`Sheet 4 of 12
`Sheet 4 of 12
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`US 8,529,811 B2
`US 8,529,811 B2
`
`-
`
`v8? mm?
`
`17mm
`
`Naming;
`
`a WWW mmm ma:
`
`1
`
`fismimn 1%: V
`
`.
`
`Em
`
`,...... ....... ........~: ............... ....._. ew
`.
`'
`'
`: mm?
`-::::::z,--..~: R~i~ct a~m
`
`52mm gut—£2: mgzfiziéag
`
`finfi'firm flan? imé‘
`
`9 .
`
`' FEW {£2231
`
`was
`
`égafiwm
`
`ifiswiziim
`
`FIG. 6A
`
`6 of 21
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`

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`U.S. Patent
`
`Sep.10,2013
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`Sheet 5 of 12
`
`US 8,529,811 B2
`
`Selectively apply
`protec1ive materia! <rver
`eternents coupled to
`ftarne:.-,~tc'tk
`
`Fmn·llnn~r rnokling over
`624 · · framewor~;, a!~ments, and
`p!·otective materia!
`
`Fofm outer rno:lt$.t~Q ov'er
`innat m<Old.ing, fr~mewort<:,,
`______ """'~
`14
`f:!<!~m~nt~.,. ~nrl pto..t~chv~
`material
`
`628:
`
`Partorm i:nspactlon of
`out~r molding to
`determine if defoot is
`pf:e:sent
`
`63(l ~ ... ·~Oe~$Ct f~----­
`
`.. ~ No··
`
`,
`
`End
`
`·.
`
`632
`
`FIG. 68
`
`7 of 21
`
`

`

`U.S. Patent
`
`Sep.10,2013
`
`Sheet 6 of 12
`
`US 8,529,811 B2
`
`Start
`
`642
`
`Se!ectlve!y apply securing
`coating over components
`on frarn~wmk
`
`Form molding over
`securing coating,
`components; and
`kam~-~votk.
`
`'ff
`...... ···
`
`FIG. 6C
`
`8 of 21
`
`

`

`U.S. Patent
`
`Sep.10,2013
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`Sheet 7 of 12
`
`US 8,529,811 B2
`
`65.2
`
`Pl~ce elements on
`tramew'Ork
`
`Secure lli*::Jm~nti>c to
`fr~mework using cut~b~~
`m~tet~~l
`
`6S6-
`
`ct.lfabl£'l rm~!~Ol:!'ial ~*t~l:f
`l:ayed!'lg Of'l framework
`and e!:emen1s
`
`F orrn C!t'ie or 1'001'$
`moldlng:s <wet Ctltabif:e
`matada( fmmewnrk, t:~nd
`elem~nts
`
`Pertorm W~SY$C!ton tor
`de-fects in mokiiilgs
`
`Refonn rno!ding over
`c-.:~Jreb!e m~ter.l~!,
`·f~·afne>Nork, .:md e!ernents
`
`Remove defective
`mo!din:g
`
`FIG. 6D
`
`9 of 21
`
`

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`Sep. 10, 2013
`Sep.10,2013
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`Sheet 8 of 12
`Sheet 8 of 12
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`US 8,529,811 B2
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`U.S. Patent
`US. Patent
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`US 8,529,811 B2
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`10 of 21
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`US 8,529,811 B2
`US 8,529,811 B2
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`W3:
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`Sep. 10, 2013
`Sep.10,2013
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`Sheet 9 of 12
`Sheet 9 of 12
`
`U.S. Patent
`US. Patent
`
`:~:
`
`11 of 21
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`Sep.10,2013
`Sep. 10, 2013
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`21f001teehS
`Sheet 10 of 12
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`US 8,529,811 B2
`US 8,529,811 B2
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`U.S. Patent
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`US. Patent
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`12 of 21
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`

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`U.S. Patent
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`Sep.10,2013
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`Sheet 11 of 12
`
`US 8,529,811 B2
`
`( .. Start
`
`Selecbvely apply ma:terk.d
`substanth~Uy over
`tranw'Notk with ccuplad
`a laments
`
`rv1old protective layer over
`1004""' fra;mev;ork, e!ett'h:)nta; and
`selecttvaly applied
`rnatedal
`
`Fonn c.oa!tng over
`protac-ti:va layer
`
`(
`
`End
`
`• .. ···
`... ··
`1000
`
`13 of 21
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`

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`U.S. Patent
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`Sep.10,2013
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`Sheet 12 of 12
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`US 8,529,811 B2
`
`1102.
`
`~'W:P!Y n1ater!a~ over
`$tructure of device
`
`Form coating over
`mateda! ttl: pwvld.e
`protective property
`
`••
`1100
`
`FIG,. 11
`
`'1202
`
`Selecthtely apply tnataria~
`over fram~;:rw;::wk coupled
`with e~ernents
`
`h'1old ona ot 11:ote layers
`over frame>s;vork ar1d
`t204 material tc protect and
`
`1200
`
`14 of 21
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`

`

`US 8,529,811 B2
`
`1
`COMPONENT PROTECTIVE
`OVERMOLDING USING PROTECTIVE
`EXTERNAL COATINGS
`
`CROSS-REFERENCE TO RELATED
`APPLICATIONS
`
`This application is a continuation of U.S. patent applica(cid:173)
`tion Ser. No. 13/135,728, filed Jul. 12, 2011, Pending, entitled
`"Component Protective Overmolding Using Protective
`External Coatings," which is a continuation-in-part of U.S.
`patent application Ser. No. 13/158,416, filed Jun. 11, 2011,
`Pending, entitled "Component Protective Overmolding,"
`which is a continuation-in-part ofU.S. patent application Ser.
`No. 13/158,372, filed Jun. 10, 2011, Pending, entitled "Com(cid:173)
`ponent Protective Overmolding," all of which are hereby
`incorporated by reference in entirety for all purposes.
`
`FIELD
`
`The present invention relates generally to electrical and
`electronic hardware, computer software, wired and wireless
`network communications, and computing devices. More spe(cid:173)
`cifically, techniques for component protective overmolding
`using protective external coatings are described.
`
`BACKGROUND
`
`2
`Generally, if the number of data inputs accessible by con(cid:173)
`ventional data capture devices increases, there is a corre(cid:173)
`sponding rise in design and manufacturing requirements and
`device size that results in significant consumer expense and/
`or decreased consumer appeal, which eventually becomes
`prohibitive to both investment and commercialization. Still
`further, conventional manufacturing techniques are often lim(cid:173)
`ited and ineffective at meeting increased requirements to
`protect sensitive hardware, circuitry, and other components
`10 that are susceptible to damage, but which are required to
`perform various data capture activities. As a conventional
`example, sensitive electronic components such as printed
`circuit board assemblies ("PCBA"), sensors, and computer
`15 memory (hereafter "memory") can be significantly damaged
`or destroyed during manufacturing processes where protec(cid:173)
`tive overmoldings or layers of material occurs using tech(cid:173)
`niques such as injection molding, cold molding, and others.
`Damaged or destroyed items subsequently raises the cost of
`20 goods sold and can deter not only investment and commer(cid:173)
`cialization, but also innovation in data capture and analysis
`technologies, which are highly compelling fields of opportu(cid:173)
`nity.
`Thus, what is needed is a solution for efficiently manufac-
`25 turing devices without the limitations of conventional tech(cid:173)
`niques.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`With the advent of greater computing capabilities in
`smaller mobile form factors and an increasing number of 30
`applications (i.e., computer and Internet software or pro(cid:173)
`grams) for different uses, consumers (i.e., users) have access
`to large amounts of data, personal or otherwise. Information
`and data are often readily available, but poorly captured using
`conventional data capture devices. Conventional devices 35
`typically lack capabilities that can record, store, analyze,
`communicate, or use data in a contextually-meaningful, com(cid:173)
`prehensive, and efficient manner. Further, conventional solu(cid:173)
`tions are often limited to specific individual purposes or uses,
`demanding that users invest in multiple devices in order to 40
`perform different activities (e.g., a sports watch for tracking
`time and distance, a GPS receiver for monitoring a hike or
`run, a cyclometer for gathering cycling data, and others).
`Although a wide range of data and information is available,
`conventional devices and applications generally fail to pro- 45
`vide effective solutions that comprehensively capture data for
`a given user across numerous disparate activities.
`Some conventional solutions combine a small number of
`discrete functions. Functionality for data capture, processing,
`storage, or communication in conventional devices such as a 50
`watch or timer with a heart rate monitor or global positioning
`system ("GPS") receiver are available, but are expensive to
`manufacture and typically require purchasing multiple,
`expensive devices. Other conventional solutions for combin(cid:173)
`ing data capture facilities often present numerous design and
`manufacturing problems such as size specifications, materi(cid:173)
`als requirements, lowered tolerances for defects such as pits
`or holes in coverings for water-resistant or waterproof
`devices, unreliability, higher failure rates, increased manu(cid:173)
`facturing time, and expense. Subsequently, conventional 60
`devices such as fitness watches, heart rate monitors, GPS(cid:173)
`enabled fitness monitors, health monitors (e.g., diabetic blood
`sugar testing units), digital voice recorders, pedometers,
`altimeters, and other conventional data capture devices are
`generally manufactured for conditions that occur in a single
`or small groupings of activities and, subsequently, are limited
`in terms of commercial appeal to consumers.
`
`Various embodiments or examples ("examples") are dis(cid:173)
`closed in the following detailed description and the accom(cid:173)
`panying, drawings:
`FIG. 1 illustrates a cross-sectional view of an exemplary
`process for providing protective material in component pro(cid:173)
`tective overmolding;
`FIG. 2 illustrates another cross-sectional view of an exem(cid:173)
`plary process for providing protective material in component
`protective overmolding;
`FIG. 3 illustrates a cross-sectional view of an exemplary
`process for forming an inner molding in component protec(cid:173)
`tive overmolding;
`FIG. 4 illustrates another cross-sectional view of an exem(cid:173)
`plary process for forming an outer molding in component
`protective overmolding;
`FIG. SA illustrates an exemplary design applied during
`component protective overmolding;
`FIG. SB illustrates another exemplary design applied dur(cid:173)
`ing component protective overmolding;
`FIG. SC illustrates a further exemplary design applied dur(cid:173)
`ing component protective overmolding;
`FIG. 6A illustrates an exemplary process for component
`protective overmolding;
`FIG. 6B illustrates an alternative exemplary process for
`55 component protective overmolding;
`FIG. 6C illustrates another alternative exemplary process
`for component protective overmolding;
`FIG. 6D illustrates yet another alternative exemplary pro(cid:173)
`cess for component protective overmolding;
`FIG. 7 illustrates a view of an exemplary data-capable
`strap band configured to receive overmolding;
`FIG. 8 illustrates a view of an exemplary data-capable
`strap band having a first molding;
`FIG. 9 illustrates a view of an exemplary data-capable
`65 strap band having a second molding;
`FIG. 10 illustrates an exemplary process for component
`protective overmolding using protective external coatings;
`
`15 of 21
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`

`

`US 8,529,811 B2
`
`3
`FIG. 11 illustrates an alternative exemplary process for
`component protective overmolding using protective external
`coatings; and
`FIG. 12 illustrates another alternative exemplary process
`for component protective overmolding using protective exter(cid:173)
`nal coatings.
`
`DETAILED DESCRIPTION
`
`Various embodiments or examples may be implemented in
`numerous ways, including as a system, a process, an appara(cid:173)
`tus, a user interface, or a series of program instructions on a
`computer readable medium such as a computer readable stor(cid:173)
`age medium or a computer network where the program
`instructions are sent over optical, electronic, or wireless com- 15
`munication links. In general, operations of disclosed pro(cid:173)
`cesses may be performed in an arbitrary order, unless other(cid:173)
`wise provided in the claims.
`A detailed description of one or more examples is provided
`below along with accompanying figures. The detailed
`description is provided in connection with such examples, but
`is not limited to any particular example. The scope is limited
`only by the claims and numerous alternatives, modifications,
`and equivalents are encompassed. Numerous specific details
`are set forth in the following description in order to provide a
`thorough understanding. These details are provided for the
`purpose of example and the described techniques may be
`practiced according to the claims without some or all of these
`specific details. For clarity, technical material that is known in
`the technical fields related to the examples has not been
`described in detail to avoid unnecessarily obscuring the
`description.
`FIG. 1 illustrates a cross-sectional view of an exemplary
`process for providing protective material in data-capable
`strapband overmolding. Here, device 100 includes frame(cid:173)
`work 102, elements 104-106, and covering 108. In some
`examples, framework 102 may be referred to interchangeably
`as a substrate, wafer, board (printed, unprinted, or otherwise),
`or other surface upon which elements 104-106 may be
`mounted, placed, or otherwise fixed. The type and configu(cid:173)
`ration of elements may be varied and are not limited to any
`given type of electrical, electronic, or mechanical component.
`For example, element 104 may be implemented as a microvi(cid:173)
`brator or motor configured to provide a vibratory signal for an
`alarm or other indicator. Element 104 may also be a printed
`circuit board assembly ("PCBA"), logic, processor, micro(cid:173)
`processor, memory (e.g., solid state, RAM, ROM, DRAM,
`SDRAM, or others), or other computing element and is not
`limited to any specific type of component. Further, element
`104 may be coupled electrically or electronically to element
`106, which may also be an electrical, electronic, or mechani(cid:173)
`cal component that can be placed on framework 102. When
`placed on framework 102, elements 104-106 may be fixed
`using various techniques, including adhesives, mechanical
`fixing structures (e.g., posts and holes), or others, without
`limitation.
`As shown, covering 108 may be placed over element 104 in
`order to protect the latter from damage resulting from the
`application of subsequent layers, coverings, moldings, or
`other protective material, regardless of environmental condi(cid:173)
`tions (e.g., temperature, pressure, thickness, and others). As
`shown, element 104 is covered by covering 108 and element
`106 is uncovered. However, other protective materials may be
`used to cover element 106. In still other examples, protective
`materials such as covering 108 may not be used if elements
`104 or 106 are manufactured to resist the formation, deposit,
`layering, or covering of other protective materials at various
`
`4
`temperatures, pressures, or other atmospheric conditions. In
`other examples, device 100 and the above-described elements
`may be varied and are not limited to those shown and
`described.
`FIG. 2 illustrates another cross-sectional view of an exem(cid:173)
`plary process for providing protective material in data-ca(cid:173)
`pable strapband overmolding. Here, device 200 includes
`framework 102, elements 104-106, covering 108, syringe
`202, arrows 204-206, and protective coating 208. In some
`10 examples, covering 108 and protective coating 208 may be
`referred to as "protective material" interchangeably and with(cid:173)
`out limitation. As shown, like numbered elements shown in
`this drawing and others may refer to the same or a substan-
`tially similar element previously described.
`In some examples, an applicator (e.g., syringe 202) may be
`used to selectively apply protective coating 208 to cover as a
`protective layer over element 106. As used herein, "selec(cid:173)
`tively applying" may refer to the application, placement,
`positioning, formation, deposition; growth, or the like, of
`20 protective material to one, some, all, or none of any underly(cid:173)
`ing elements (e.g., elements 104-106). In some examples,
`"protective material" may also be used interchangeably with
`"protective layer," "covering," "housing," or "structure"
`regardless of the composition of material or matter used,
`25 without limitation. In other words, covering 108 and protec(cid:173)
`tive coating 208 may each be referred to as "protective mate(cid:173)
`rial" and used to protect underlying elements (e.g.; elements
`104-106 (FIG. 1)) as described herein.
`When the plunger of syringe 202 is depressed in the direc-
`30 tion of arrow 204, protective coating 208 is forced through
`applicator tip 210 and applied as a protective layer over ele(cid:173)
`ment 106. As an example, protective coating 208 may be
`applied at substantially atmospheric pressure by applying 1-2
`psi of pressure to the plunger of syringe 202. When applied,
`35 protective coating 208 may be, for example, an ultraviolet
`("UV") curable adhesive or other material. In other words,
`when protective coating 208 is applied (i.e., layered over
`element 106) and exposed to ultraviolet radiation (or other
`curing conditions) at levels similar to those found in natural
`40 sunlight or artificial-light, it coalesces and hardens into a
`covering that prevents the underlying element (e.g., element
`1 06) from being damaged when other protective materials or
`layers are applied such as those shown and described below.
`Exemplary types of protective coating 208 may include coat-
`45 ings, adhesives, gels, liquids, or any other type of material that
`hardens to protect, prevent, minimize, or otherwise aid in
`avoiding damage to a protected element. Examples of UV
`curable coatings include Loctite® coatings produced by Hen(cid:173)
`kel & Co AG of Dusseldorf, Germany such as, for example,
`50 Loctite® 5083 curable coating. Other types of curable coat(cid:173)
`ings, in addition to those that are UV curable, may be used to
`protect underlying elements without limitation or restriction
`to any given type.
`In some examples, protective material such as Loctite® or
`55 others may be applied selectively to one, some, or all electri(cid:173)
`cal, electronic, mechanical, or other elements. Protective
`coating 208 may also be applied in different environmental
`conditions (e.g., atmospheric pressure, under vacuum, in a
`molding cavity or chamber, within a deposition chamber, or
`60 the like) and is not limited to the examples shown and
`described. As shown, protective coating 208 has been selec(cid:173)
`tively applied to element 106, but not element 104, the latter
`of which is being protected by covering 108. As an alterna(cid:173)
`tive, covering 108 may be used as protective material in the
`65 form of an enclosure or physical structure that is used to
`protect an underlying element. As described herein, protec(cid:173)
`tive coating 208 may be selectively applied by determining
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`5
`whether sensitive components, parts, or other elements ("ele(cid:173)
`ments") are susceptible to damage or destruction from sub(cid:173)
`sequent processes, for example, to deposit additional protec(cid:173)
`tive layers, such as those described in greater detail below. In
`other examples, device 200 and the above-described elements
`may be varied in function, structure, configuration, imple(cid:173)
`mentation, or other aspects and are not limited to those pro(cid:173)
`vided.
`FIG. 3 illustrates a cross-sectional view of an exemplary
`process for forming an inner molding in data-capable strap(cid:173)
`band overmolding. Here, device 300 includes framework
`102, elements 104-106, covering 108, syringe 202, arrows
`204-206, protective coating 208, mold cavity 302, nozzle
`304, arrows 306-310, and inner molding 312. In some
`examples, framework 102 and elements 104-106 having
`selectively applied protective coating 208 may be placed in
`mold cavity 302 where another protective layer or coating
`(e.g., inner molding 312) may be applied from nozzle 304 in
`the direction of arrows 306-310. Types of materials that may
`be used for inner molding 312 include plastics, thermoplas(cid:173)
`tics, thermoplastic elastomers, polymers, elastomers, or any
`other organic or inorganic material that can molded in mold
`cavity 302. As shown, mold cavity 302 may be implemented
`using a variety of molding techniques. For example, an injec(cid:173)
`tion molding machine may be used to inject a thermoplastic
`polymer elastomer ("TPE") into mold cavity 302. When
`injected under temperature (e.g., 400 to 460 degrees Fahren(cid:173)
`heit) and pressure (e.g., 200 to 600 psi, but which may be
`adjusted to higher or lower pressure, without limitation),
`inner molding 208 forms a protective layer around framework
`102, elements 104-106, covering 108, protective coating 208,
`providing a layer of additional protective material (e.g., inner
`molding 312), which may completely or incompletely sur(cid:173)
`round an object (e.g., framework 102). In some examples,
`inner molding 312 may be formed to provide a watertight or
`hermetic seal around framework 102 and elements 104-106.
`Types of materials that may be used as inner molding 312
`include TPEs such as Versaflex 9545-1 as manufactured by
`PolyOne Corporation of McHenry, Ill. Other types of mate(cid:173)
`rials such as epoxies, polymers, elastomers, thermoplastics,
`thermoplastic polymers, thermoplastic polymer elastomers,
`and others may be used to form inner molding 312, without
`limitation to a specific material. In other examples, device
`300 and the above-described elements may be varied in func(cid:173)
`tion, structure, configuration, implementation, or other 45
`aspects and are not limited to those provided.
`FIG. 4 illustrates another cross-sectional view of an exem(cid:173)
`plary process for forming an outer molding in data-capable
`strapband overmolding. Here, device 400 includes frame(cid:173)
`work 102, elements 104-106, covering 108, syringe 202,
`arrows 204-206, protective coating 208, inner molding 312,
`mold cavity 402, nozzle 404, arrows 406-410, and outer
`molding 412. In some examples, mold cavity 402 may be the
`same or different from that described above in connection
`with FIG. 3. In other words, mold cavity 402 may be the same
`mold cavity as mold cavity 302, but which is used to injection
`mold outer molding 412. As shown, framework 102, elements
`104-106, protective coating 208, and inner molding 312 are
`placed in mold cavity 402. Material (e.g., TPE) may be
`injected through nozzle 404 in the direction of arrows 406-
`410 into mold cavity 402 in order to form outer molding 412.
`Once formed, sprue or other extraneous material may be
`present in inner molding 312 or outer molding 412, which
`may be removed after device 400 is taken out of molding
`cavity 402. A visual inspection, in some examples, may be
`performed to determine if defects are present in either inner
`molding 312 or outer molding 412. If defects are found in
`
`6
`outer molding 412, then removal may occur and a new outer
`molding may be formed using mold cavity 402. The inspec(cid:173)
`tion and, if defects are found, the removal of outer molding
`412 allows for higher quality moldings to be developed at a
`lower cost without requiring the discarding of sensitive,
`expensive electronics. Outer molding 412, in some examples,
`may also be used to provide surface ornamentation to a given
`object. The use of thermoplastics or TPE material may be
`used to form outer molding 412 and to provide material in
`10 which a surface texture, design, or pattern may be imprinted,
`contoured, or otherwise formed. In so doing, various types of
`patterns, designs, or textures may be formed of various types.
`For example, miniature "hills" and "valleys" may be formed
`in the protective material of outer molding 412 in order to
`15 produce a "denim" feel or texture to a given object. Examples
`of different patterns for outer molding 412 may be found in
`FIGS. 5A-5C, as shown by patterns 502, 512, and 522,
`respectively. Patterns 502, 512, and 522 are provided for
`purposes of illustration and are neither limiting nor restrictive
`20 with regard to the types, patterns, designs, or textures of
`surface ornamentation that may be applied to outer molding
`412, as described herein. Protective material (e.g., TPE)
`injected into mold cavity 402 may be used to form these
`patterns. Various types of injection molding processes and
`25 equipment may be used and are not limited to any specific
`type, make, manufacture, model, or other specification.
`Referring back to FIG. 4, the use of the described tech(cid:173)
`niques allows for more precise tolerances in forming mold(cid:173)
`ings that are form-fitting to various types of devices. Still
`30 further, the use of the above-described techniques also allows
`for relatively small devices having sensitive electronics to be
`subjected to harsh environmental conditions during molding
`processes in order to form protective layers inner molding
`312, outer molding 412) over various types of devices. As
`35 shown and described, the disclosed techniques may be used
`on a variety of devices, without limitation or restriction. In
`other examples, device 400 and the above-described elements
`may be varied in function, structure, configuration, imple(cid:173)
`mentation, or other aspects and are not limited to those pro-
`40 vided.
`FIG. 6A illustrates an exemplary process for component
`protective overmolding. Here, the start of process 600
`includes forming a protective layer on, for example, frame(cid:173)
`work 102 (FIG.1) (602). In some examples, a protective layer
`may refer to protective material, layers, or covers such as
`protective material108 (FIG. 2) or structures that are formed
`to protect underlying elements (e.g., covering 108 (FIG. 1).
`Examples of material that may be used to form a protective
`layer include UV curable materials such as those described
`50 above, including coatings, adhesives, liquids, gels, and others
`that cure when exposed to ultraviolet radiation in various
`concentrations and exposure levels without limitation. After
`forming a protective layer (e.g., protective coating 208), an
`inner molding (e.g., inner molding 312 (FIG. 3)) is formed
`55 (604). After forming an inner molding, a function test is
`performed to determine whether the inner molding and pro(cid:173)
`tective layer have damaged the underlying item (606). In
`some examples, a function test may be performed as part of an
`inspection and include applying an electrical current to an
`60 underlying electronic element to identifY proper voltage or
`current flow or other parameters that indicate whether dam(cid:173)
`age has occurred during the formation of a protective layer, an
`inner molding, or, in other examples, an outer molding.
`Inspections may be performed at various stages of the manu-
`65 facturing process in order to identify defects early and reduce
`costs incurred with re-applying protective layers or moldings.
`In other examples, a function test may be performed to deter-
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`US 8,529,811 B2
`
`7
`mine whether the inner molding has sufficiently coated
`desired underlying
`items
`(e.g., electrical, electronic,
`mechanical, or any structure or elements thereof that are
`being protected from damage using one or more moldings). In
`still further examples, the function test may be performed to
`determine whether the formation of an inner molding dam(cid:173)
`aged underlying items that were previously protected by the
`formation of protective layer, the latter of which may be
`performed outside of a mold device or cavity (e.g., mold
`cavity 302 (FIG. 3) or mold cavity 402 (FIG. 4)) at room 10
`temperature and/or atmospheric conditions, including atmo(cid:173)
`spheric or ambient temperatures, pressures, and humidity
`levels, without limitation.
`in some examples, a determination is made as to whether a
`function test is passed or failed (608). Here, if an item having 15
`a protective layer and an inner molding fails to pass, the item
`is rejected and the process ends ( 61 0). Alternatively, if an item
`(e.g., framework 102 and elements 106-108 (FIG.1)) fails to
`pass a function test due to the