United States Patent [19]
`Gloton et al.
`
`llllllIlllllllllllllllllllll||||lllllllllllllll|l|||lllllllllllllllllllllll
`5,569,879
`Oct. 29, 1996
`
`US005569879A
`[11] Patent Number:
`[45] Date of Patent:
`
`[54] INTEGRATED CIRCUIT MICROMODULE
`OBTAINED BY THE CONTINUOUS
`ASSEMBLY OF PATTERNED STRIPS
`
`[75] Inventors: Jean-Pierre Gloton, La Ciotat; Damien
`Laroche, Chateauneuf 1e Rouge; Joel
`Turin, Marseille; Michel Fallah,
`Carnoux, all of France
`
`[73] Assignee: Gemplns Card International,
`Gemenos, France
`
`[21] Appl. No.: 413,379
`[22] Filed:
`Mar. 30, 1995
`
`Related U.S. Application Data
`
`[62] Division of Ser. No. 107,710, ?led as PCT/FR92/00l58,
`Feb. 19, 1991, Pat. No. 5,470,411,
`Foreign Application Priority Data
`
`[30]
`
`Feb, 19, 1991 [FR]
`
`France ................................. .. 91 01934
`
`[51] Int. Cl.6 ................................................... .. H01L 23/28
`[52] U.S. Cl. ........................ .. 174/52.2; 361/728; 257/678
`[58] Field of Search ................................ .. 174/52.1, 52.2,
`174/523, 52.4; 257/678, 787, 788, 687,
`700, 702, 729; 361/728; 29/841
`
`[56]
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`5,008,734
`5,012,386
`
`4/1991 Dutta et a1. ............................. .. 257/74
`4/1991 McShane et a1.
`361/386
`
`5,034,800
`
`7/1991 Marchisi . . . . . . . . . . . . . .
`
`. . . .. 357/72
`
`5,051,275
`
`9/1991 Wong . . . . . . . . . . .
`
`. . . .. 427/58
`
`5,087,961
`
`2/1992 Long et a1. ..
`
`357/69
`
`5,115,298
`
`5/1992 Loh . . . . . . . . . . . . . .
`
`. . . .. 357/70
`
`5,173,766 12/1992 Long et a1. ..
`
`..... .. 257/687
`
`5,175,397 12/1992 Lindberg .... ..
`.. 174/524
`5,261,157 11/1993 Chang ..................................... .. 29/844
`
`Primary Examiner—Kristine L. Kincaid
`Assistant Examiner-—Robert J. Decker
`Attorney, Agent, or Firm-Nilles & Nilles, SC.
`
`[57]
`
`ABSTRACT
`
`A micromodule includes a slotted metal strip and a perfo
`rated dielectric stiip having a thickness of less than 70
`micrometers, preferably between 30 and 50 micrometers.
`The metal strip is bonded to the dielectiic strip so as to
`overlie the slots in the metal strip. A chip is bonded to the
`dielectric strip and connected to the metal strip through the
`perforations in the dielectric strip. An insulating resin layer
`encapsulates the chip and is bonded to the dielectric strip.
`The micromodule may be used, for example, in a smart card,
`as a radiating antenna, or as an identi?cation label.
`
`4,800,419
`
`1/1989 Long et a1. ............................. .. 357/70
`
`20 Claims, 4 Drawing Sheets
`
`100
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`13
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`102
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`US. Patent
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`Oct. 29, 1996
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`Sheet 1 0f 4
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`5,569,879
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`U.S. Patent
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`Oct. 29, 1996
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`Sheet 2 of 4
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`5,569,879
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`US. Patent
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`Oct. 29, 1996
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`Sheet 3 of 4
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`5,569,879
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`100
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`U.S. Patent
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`0a. 29, 1996
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`Sheet 4 of 4
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`5,569,879
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`1
`INTEGRATED CIRCUIT MICROMODULE
`OBTAINED BY THE CONTINUOUS
`ASSEMBLY OF PATTERNED STRIPS
`
`REFERENCE TO AN APPLICATION
`
`This application is a division of Ser. No. 08/107,710, ?led
`as PCT/FR92/00l58 Feb. 19, 1991, now US. Pat. No.
`5,470,411.
`
`10
`
`BACKGROUND OF THE INVENTION
`
`2
`A third method is known through the European patent
`application published under No. 0 296 511 and ?led under
`N0. 88 1097420 on 18th Jun. 1988. This patent application
`relates to a method for the manufacture of a ribbon designed
`to provide modules to equip electronic cards, also called
`“smart cards.” However, the approach proposed in this
`patent application is not satisfactory.
`Indeed, this method entails taking a metal strip with a
`thickness that is typically equal to 75 micrometers but may
`vary between 50 micrometers and 150 micrometers. This
`strip is provided with (1) perforations enabling it to be
`carried along and (2) apertures obtained by stamping that
`demarcate the arrays of conductors of the circuits. A set of
`l25-micrometer-thick insulating foils having, on one face, a
`thermoplastic or thermosetting material for hot bonding, is
`also taken. The foils have a set of holes with an arrangement
`that corresponds to thelocation of the connections and a
`central hole for the location of the circuit.
`The foils are bonded to the metal strip by heating. The
`heating prompts a certain shrinkage of the insulator material
`which makes it difficult to use bigger foils, especially in the
`longitudinal direction. With cold bonding, this problem
`would not arise. However, the adhesion to the metal during
`cold bonding is poor.
`Furthermore, it is imperatively necessary to make a per
`foration in each insulator foil at the position reserved for the
`circuit in order to house the circuit therein and thus keep
`within the requisite tolerances as regards thickness for the
`manufacture of the chip cards.
`Reference could also be made, as part of the prior art, to
`the document GB 2031796 A which describes a device for
`the assembling of an adhesive insulator strip to a conductive
`strip. In the device described, the adjusting of the tension is
`done only on the insulator strip by modifying the rotational
`speed of the wheels between which this strip passes. A
`device such as this does not enable the use of very thin (30
`to 50 um) insulator strips as is made possible by the
`invention.
`
`OBJECTS AND SUMMARY OF THE
`INVENTION
`
`The present invention makes it possible to overcome these
`problems. Its object is to provide an integrated circuit
`micromodule comprising a pre-slotted metal grid, a perfo
`rated dielectric strip with a thickness of less than 70
`micrometers, a chip (1) bonded either to this dielectric strip
`or to the metal strip through a perforation of the dielectric
`strip and (2) connected to the metal strip through other
`perforations of the dielectric strip.
`Another object of the present invention is to provide an
`integrated circuit module in which the dielectric strip cov
`ering the grid constitutes the dielectric of an electromagnetic
`transmission or reception antenna, the pre-slotted grid of
`which constitutes an active part.
`The dielectric strip, may, for example, constitute the
`dielectric of an electromagnetic antenna, the pre-slotted
`metal strip of which constitutes an active part. Alternatively,
`the dielectric strip may constitute an identi?cation label.
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`Other characteristics and advantages of the present inven
`tion shall appear from the following description, made with
`reference to the appended drawings in which like reference
`characters represent like parts throughout and in which:
`
`1. Field of the Invention
`The present invention relates to an integrated circuit
`micromodule obtained by the continuous assembly of pat—
`terned strips. Such micromodules go into the production of
`the portable ?at cards known as “chip cards.” In these cards,
`the rnicromodules are formed by a set of elements compris
`ing: a chip in integrated circuit form, metal contacts used for
`the connection of the micromodule with external devices,
`linking wires to link the chip to the metal contacts, and a
`protective coat formed by a resin covering the chip, the
`linking wires and, partially, the metal contacts.
`2. Discussion of the Related Art
`To manufacture a micromodule and then incorporate it
`into a card, a ?rst known method consists in mounting the
`chip on a metal strip that has been pre-slotted in the form of
`a conductor grid, soldering the chip to a zone of this grid
`where it is connected by wires soldered to other Zones of the
`grid, coating the chip and the wires with a drop of protective
`resin of the epoxy or silicone type in leaving the conductors
`of the grid partially bared, cutting up the metal strip into
`individual micromodules, each comprising a coated chip and
`bared external contacts, and then bonding the micromodule
`to a surface cavity of a card made of plastic material in such
`a way that grid portions not coated with resin are ?ush with
`the surface of the card and constitute the external connector
`of the card.
`According to a second method which is also known, the
`initial pre-cut metal strip is replaced with a metallized
`dielectric strip etched with a connection pattern to be
`determined. The dielectric strip, in this case, forms the main
`support of the chip. The connections have a very small
`thickness and are obtained by the pre-deposition of a metal
`layer on the photo-etching plastic strip of this metal layer.
`The chip is connected by soldered wires to Zones of the
`metallized layer.
`These methods have a certain number of drawbacks. In
`the case of the use of a pre-cut metal strip, the encapsulation
`resin of the micromodule adheres poorly to the conductors
`of the grid, all the more so as, in practice, the resin is on only
`one side of the strip, the other side being reserved to leave
`the conductors accessible to act as connectors. The result
`thereof is a problem of reliability that is di?icult to resolve,
`caused chie?y by the passage of moisture between the resin
`and conductors.
`In the case of the use of a metallized and photo-etched
`dielectric strip, the strip must necessarily be made of a
`sufficiently rigid material, and must stand up well to tem
`perature so as not to warp when the temperature rises, which
`makes it necessary for the de?nition of the conduction
`pattern to be executed only by photo-etching on the dielec
`tric strip and makes this second method far costlier than a
`mechanical cutting-out operation, for example.
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`FIG. 1 is a top view of a pre-slotted metal strip usable in
`a micromodule constructed according to the invention;
`FIG. 2 is a top view of a perforated dielectric strip usable
`in the micromodule and designed to be bonded to the metal
`strip of FIG. 1;
`FIG. 3 is a view showing the juxtaposition of the two
`strips being bonded;
`FIG. 4 shows a device for the implementation of a method
`of making a micromodule constructed according to the
`invention;
`FIG. 5 represents a press used for the implementation of
`the micromodule production method;
`FIG. 6 shows the micromodule according to the invention,
`at an intermediate stage of manufacture;
`FIG. 7 shows the micromodule according to the invention,
`at a ?nal stage of manufacture;
`FIG. 8 represents a micromodule constituting a transmis
`sion/reception antenna; and
`FIG. 9 represents a micromodule constituting an identi
`?cation label.
`
`DETAILED DESCRIPTION OF THE
`PREFERRED EMBODIMENT
`
`15
`
`25
`
`The pro-slotted metal strip 10 which is shown in FIG. 1
`is formed by a strip of copper or tinned copper with a
`thickness of about 35 to 70 micrometers. Its width is de?ned
`to correspond to the ?nal connection width to be obtained,
`and may be of the order of one centimeter to several
`centimeters. The strip 10 is slotted with a repetitive pattern
`of slots 102 which, as the case may be, is done by stamping
`to de?ne the separate contacts 3 used as connection pins
`between the interior and the exterior of the micromodule to
`be assembled on the strip.
`In the representation shown in FIG. 1, which is given by
`way of an example, the pattern of slots 102 is the one that
`enables the connection of a micromodule for ?at chip cards,
`the contacts 3 shown being eight in number. The eight
`separate contacts 3 can be seen inside a closed line 4. These
`contacts are separated by cutting lines 5 that cut out the
`patterns 2. Outside the lines 4, the contacts 3 are joined to
`ensure the continuity of the strip 10 from one micromodule
`to another.
`The strip 10 comprises regular perforations 6 distributed
`along the longitudinal edges of the strip on one or both of its
`sides. These perforations are used to carry the strip along by
`a toothed wheel system.
`The slotted metal strip 10 forms the main support of the
`chips constituting the core of the rnicromodules. This strip
`10 is covered with a dielectric strip 11 of the type shown in
`FIG. 2, comprising pre-cut perforations (P1~P8) designed to
`come before conductive zones 3 of the conductive pattern
`cut out of the metal strip 10. An indexing hole (1) serves as
`a reference mark and enables the precise positioning of the
`perforations (Pl-P8) facing the conductive zones 3 during
`the operation for the hot bonding of the two strips to each
`other.
`As indicated in FIG. 3, the indexing hole is located, when
`the bonding operation is terminated, at the intersection of the
`two bonding axes, respectively, the horizontal axis X and the
`vertical axis Y formed by the cutting lines 5. This position
`ing is done by the strip assembling device shown in FIG. 4
`This device comprises a press 7 comprising two plates or,
`possibly, two juxtaposed rollers 8 and 9, between which
`there move patterned strips 10 and 11 that have to be
`
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`assembled by bonding. In FIG. 4, the upper plate or roller 8
`is heated up to a bonding temperature of about 200° C. by
`an electrical resistor R supplied by an external electrical
`current supply device (not shown). The lower plate 9 is
`cooled by a water circulation circuit 12 going through a heat
`pump type of temperature exchanger 13 or any other equiva
`lent device activated by a pump 14. The strips 10 and Ill,
`once bonded, are carried along in a translation motion
`between the two plates or rollers 8 and 9 by a sprocket wheel
`15, the teeth of which engage in the perforations 6 of the
`support strip or cross-motion clamp system. The sprocket
`wheel 15 is moved by a motor 16. The strips 10 and 11 are
`paid out, respectively, from two loading rollers 17 and 18.
`Indeed, in order to obtain a continuous assembly of the strips
`10 and 11, these strips are each mounted on an unwinder and
`moved by a motor (not shown).
`The strip 10 is mounted on the roller 17 while the strip 11
`is mounted on the roller 18. The strip 10 is wound on itself
`with an interposed strip 41 that falls away when the strip 10
`unwinds. This interposed strip 41 prevents the patterns from
`getting imbricated with one another. The strip 11 is also
`wound on itself. An intercalary strip 51 may be planned too,
`to prevent problems during the unwinding of the strip 11.
`The traction of the supporting strip 10 is adjusted by a
`pressure wheel 19 on a beam 20 of the supporting strip 10.
`The beam 20 then retains the strip 10 by friction and
`procures the tension of this strip. The tension of the strip to
`be bonded 11 is adjusted by two pinch rollers 21 and 22 with
`calibrated friction. A controller 23 provides, ?rstly, for the
`rotational control of the motor 16 and the pump 14 and,
`secondly, for that of the presser wheel 19. The controller 23
`receives information elements coming, ?rstly, from a camera
`24 by means of an image analyzer 25 and, secondly, a
`temperature sensor 26 connected to the fluid circulation
`circuit 12, as well as a device 27 formed by a tensiometer or
`any other equivalent device to measure the tension of the
`supporting strip 10. Thus, when the two strips 10 and II
`driven by the traction of the motor 16 move past under the
`rollers or between the two plates 8 and 9, the image analyzer
`25 can permanently provide information on the o?set Delta
`X and Delta Y of the reference hole or indexation hole with
`respect to the reference axes X and Y of each pattern. The
`value of this arrangement is that, through the controller 23,
`it enables action jointly or separately on the pressure exerted
`on the strip 10 or the strip 11, respectively, by (l) the presser
`wheel 19 in order to adjust the tension of the strip 10 or the
`strip 11 by the pinch rollers 21 and 22 and by (2) the
`adjusting of the temperatures of the two plates or pinch
`rollers 8 and 9 in order to adjust, by extension or expansion,
`the position of one strip with respect to the other one to
`obtain the coinciding of the pattern pitch of the two strips by
`cancelling the offsets Delta X and Delta Y of the reference
`hole with respect to the reference axes X and Y. It must be
`noted, however, that adjustment of the pitch by the simple
`extension of one of the two strips in relation to the other is
`valid only for the small offsets Delta X and/or Delta Y of the
`values of the pitch, and that big offsets can be e?iciently
`compensated for only by an adjustment of the relative
`temperatures of the plates or rollers 8 and 9 with respect to
`each other. In practice, when an offset Delta X exceeds a
`predetermined threshold, the compensation for this offset is
`achieved by the controller 23 acting on the cooling of the
`plate 9. In the case of small offsets, the compensation is
`achieved by acting on the pinch rollers 19 or 21, 22.
`However, for the system to work efficiently, it is preferable
`to apply the strip that has the highest expansion coe?icient
`to the plate or roller 9 which is cooled, the other strip 11
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`being applied to the plate or roller 8 that is heated. Thus, for
`example, for a bonding of a copper roll which has an
`expansion coe?icient of 17><lO'6/°C. on a roll of a plastic
`material, commercially available under the registered mark
`“Kapton”, which has an expansion coe?icient of 20><l0"6/
`°C., the Kapton should be applied to the plate or roller 9 and
`the copper to the plate or pinch roller 8.
`During the bonding operation, it should naturally be seen
`to it, when the plates/rollers 8 and 9 come under pressure,
`that these elements 8 and 9 move properly solely in the
`direction Z normal to the plane (X, Y) of the two strips. The
`problem can be resolved easily by using either column
`presses or presses with distribution springs. However, to
`avoid having the positions, between the axes, that evolve
`with the temperatures, it is desirable, in the case of the
`column presses, to use steels with a low expansion coeffi
`cient by using, for example, steel that is commercially
`distributed under the known registered mark “Invar” for
`example.
`The approach using a rod-type press, a diagram of the
`embodiment of which is shown in FIG. 5, has the advantage
`of being easy to make and of providing homogeneous
`pressure between the two plates. As can be seen in FIG. 5,
`where the elements homologous to those of FIG. 4 are
`shown with the same references, a press comprises a lower
`plate 9 formed by a steel board 28 mounted on an insulating
`board 29 and an upper plate 8 formed by a steel board 30
`comprising a hollow insulating cap 31 enclosing the head 32
`of a rod 33. The steel board 28, on its surface facing the steel
`board 30, has distribution springs 34 which enable the rod
`head 32, the steel board 30 and the spring 34 to be all in
`contact together before the pressure of the two boards 28 and
`30 is exerted on the two strips 10 and 11, thus preventing any
`motion in the directions X and Y during the clamping of the
`two plates.
`Once the bonding is done, it can be ?nther homogenized,
`possibly by a second press (not shown), which then has the
`same temperatures on both plates, or by two rollers similar
`to those already used in the prior art.
`Naturally, the method that has just been described can
`equally well be applied with the same e?iciency for the
`indexed assembly of any material with identical or multiple
`pitch patterns. The method can also be applied to the
`bonding of any number N of strips by the interposing of N
`pre-bonding presses before the homogenization station. The
`usefulness then is that it enables the continuous production
`of multilayer ?lms.
`Thus, the method according to the invention enables the
`manufacture of integrated circuit micromodules, this manu
`facture comprising the formation of a preslotted metal strip
`comprising notably regular perforations enabling the strip to
`be carried along by a toothed wheel (as with the forward
`feed of a cinema ?lm), the formation of a very thin perfo
`rated dielectric strip; and then bonding the two strips to each
`other, the bonding of an integrated circuit chip to the thin
`dielectric strip, and the formation of electrical connections
`between the chip and the metal strip through the slots of the
`dielectric strip. In principle, the dielectric strip will be
`narrower than the metal strip: it will include no periodic
`lateral slots enabling it to be carried along by a toothed
`wheel and, furthermore, it will generally be too thin to be
`carried along by a toothed wheel. During the bonding of the
`dielectric strip to the metal strip, the slots enabling the metal
`strip to be carried along will not be covered by the dielectric
`strip owing to the smaller width of this strip.
`The other manufacturing operations may be standard
`ones, for example: the deposition of a drop of resin to coat
`
`6
`the chip and the connections with the chip, on the dielectric
`strip side but not on the metal strip side, and possibly the
`leveling down of the drop to a determined height; the
`separation of the micromodule from the rest of the strip. The
`rrricromodule is then ready to be inserted into a cavity of a
`plastic card.
`It is furthermore observed that, by this method, it is no
`longer the dielectric strip that is used to carry the unit along
`during the assembly line manufacture of micromodules out
`of a continuous strip, as might have been the case in the prior
`art technique when a dielectric strip was provided for. The
`thickness of the dielectric strip 11 is far smaller than in the
`prior art, 30 to 50 micrometers instead of 100 to 200
`micrometers, for example. This is very important, for the
`total thickness of the micromodule is a decisive factor for the
`possibility of making very ?at chip cards.
`Furthermore, in view of this very small thickness, the chip
`may be bonded to either the dielectric strip 11 or to the metal
`strip 10. Cases where it is not necessary to provide for a rear
`face contact are indeed frequent in CMOS technology. When
`mechanical stresses are exerted on the card, the thin dielec
`tric placed beneath the card plays the role of an elastic buffer
`which, in certain cases, prevents the chip from deterioration.
`During manufacture, the small thickness of the dielectric
`strip 11 facilitates a very e?icient bonding of the two strips
`to each other, without any risk of their getting separated
`during the subsequent treatment.
`Finally, the bonding of the chip to the dielectric makes it
`possible to provide for only one micromodule manufactur
`ing line, whatever the dimension of the chip to be encap
`sulated, this being achieved with a single model of pre
`slotted metal strip, the sole condition being that there should
`be provided a modi?able or detachable punching tool for the
`formation of the slots in the electrical strip; indeed, the chip
`is insulated from the metal grid, and only the location of the
`perforations in the dielectric de?nes the position of the
`connections between the chip and the grid. For a larger-sized
`chip, the perforations will be placed at a greater distance
`from the center of the chip. For a smaller chip, the perfo
`rations will be brought closer to the center. It is naturally
`su?icient for the perforations to remain above the appropri
`ate metal zones, but these zones may be fairly wide in the
`case of micromodules with a small number of external
`contacts (6 or 8 for example).
`Referring to FIGS. 6 and 7, a micromodule is illustrated
`which is constructed in accordance with a preferred embodi
`ment of the invention and which may be constructed via the
`process described above. In FIG. 6, the micromodule is
`illustrated in an intermediate stage of manufacture in which
`it comprises a slotted metal grid or strip 10 bonded to a very
`thin perforated dielectric strip 11 (the thickness of the
`dielectric strip 11 preferably being smaller than 50 microme
`ters, more generally between 30 and 70 micrometers), with
`a chip 100 bonded either to the metal strip 10 or to the
`dielectric strip 11 and connected to the metal strip 10
`through the perforations P1, P5 of the dielectric strip 11 via
`conductors 103.
`The chip 100 is then coated with a protective insulator
`101, preferably an epoxy resin or a silicone resin that can be
`deposited in drops above the chip 100 (FIG. 7).
`It will be noted that, contrary to what happens in the
`technique using a slotted metal strip without a dielectric, the
`resin 101 cannot ?ow between the conductors 103; i.e., in
`the slots 102 of the metal strip 10 since, in principle, all of
`these slots 102 are covered with the dielectric strip 11, at
`least in the part that will constitute the micromodule after the
`slotting of the strip 10.
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`The mechanical stresses on the chip 100 are particularly
`low during and after manufacture owing to the interposition,
`between the metal strip 10 and the chip 100, of a small
`thickness of polyamide or another dielectric strip 11 which
`behaves like a buffer of plastic or another insulating mate
`rial. This is important when the rnicromodule is incorporated
`into a ?at chip card for these cards are subject to very
`substantial twisting and bending stresses.
`Given that it is possible to be satis?ed with a very small
`thickness of dielectric, the height of the micromodule
`remains limited to an acceptable value despite the fact that
`the chip lies on the dielectric. By way of an indication, the
`chip 100 may have a thickness of about 250 micrometers and
`the strips 10 and 11 a thickness of less than 70 micrometers,
`typically about 50 micrometers each.
`The encapsulation resin 101 adheres to a dielectric sur
`face, which is better than if it were to adhere to a metal
`surface. There is no risk of any penetration of moisture up
`to the chip which is surrounded with resin wherever it does
`not touch the dielectric strip.
`When the micromodule is ?nished (FIG. 7) after the
`leveling down of the resin 101 to a maximum desired height,
`it may, if necessary, be separated from the rest of the strip by
`being cut out mechanically along the line 4 of FIGS. 1 and
`2. If it is a micromodule for chip cards whose connector is
`constituted by the accessible face of the conductors 103, the
`micromodule is placed in a cavity of the chip card, the face
`that bears the chip being pointed towards the bottom of the
`cavity and the conductors remaining accessible at the upper
`part.
`In one variation of the invention (of. FIG. 8), which is
`especially promising in the case of chip cards working in
`microwave applications and designed to receive and/or send
`an electromagnetic radiation, it is possible to provide for an
`arrangement where the dielectric strip 11 constitutes the
`dielectric of a radiating or electromagnetic antenna, of which
`the slotted metal strip or grid 10 constitutes an active part.
`The antenna is of the microstrip type constituted, for
`example, by conductors cut out in the metal strip 10 and
`acting as antennas instead of as connectors. An electrical
`ground plane 25 can then be provided for on the other side
`of the dielectric. This ground plane 25 can be formed either
`by means of a second metal strip 10 mechanically cut out
`and bonded to the upper face of the dielectric strip 11 before
`the positioning of the chips 100 or by means of a photo
`etched metallization on the upper face of the dielectric strip
`11. Conversely, it can be provided for the ground plane to be
`beneath (formed in the metal strip 10) and the microstrip
`antenna above (formed in the metallization of a metallized
`dielectric strip 11, or formed in a second metal strip bonded
`to the side of the chip).
`According to one alternative embodiment, the micromod
`ule may constitute an identi?cation label. To this end, the
`grid 10 forms an inductor. The chip 100 can be placed in a
`metal zone and can be connected to both ends of the inductor
`90. Advantageously, a low-cost dielectric will be used, for
`example, cardboard. A micromodule such as this is shown in
`FIG. 9 and constitutes a low-cost identi?cation label.
`What is claimed is:
`1. A micromodule comprising a slotted metal strip bonded
`to a perforated dielectric strip having a thickness of less than
`70 micrometers, and a chip bonded to one of the dielectric
`strip and the metal strip and connected to the metal strip
`through the perforations of the dielectric strip.
`2. Micromodule according to claim 1, wherein the dielec
`tric strip constitutes the dielectric of an electromagnetic
`antenna and the metal strip of which constitutes an active
`part of the antenna.
`
`8
`3. Micromodule according to claim 1, wherein the metal
`strip constitutes an inductor and the chip is connected to the
`ends of the inductor.
`4. Micromodule according to claim 1, wherein the dielec
`tric strip is made of a plastic material having an expansion
`coef?cient of 20><1O_6/°C.
`5. Micromodule according to claim 1, wherein the dielec
`tric strip is made of cardboard.
`6. Micromodule according to claim 3, wherein said micro
`module constitutes an identi?cation label.
`7. A micromodule comprising:
`(A) a perforated dielectric strip having a thickness of less
`than 70 micrometers;
`(B) a slotted metal strip bonded to said dielectric strip; and
`(C) a chip bonded to one of said dielectric strip and said
`metal strip and connected to said metal strip through
`the perforations of said dielectric strip.
`8. A micromodule as de?ned in claim 7, wherein said
`metal strip comprises an inductor and said chip is connected
`to opposed ends of said inductor.
`9. A micromodule as de?ned in claim 8, wherein said
`micromodule forms a radiating antenna, wherein said dielec
`tric strip de?nes a dielectric portion of said antenna, and
`wherein said metal strip de?nes an active portion of said
`antenna.
`10. A micromodule as de?ned in claim 9, further com
`prising a ground plane provided on a side of said dielectric
`portion opposite said active portion.
`11. A micromodule as de?ned in claim 10, wherein said
`ground plane comprises a second slotted metal strip bonded
`to said dielectric portion.
`12. A micromodule as de?ned in claim 7, wherein said
`micromodule forms an identi?cation label.
`13. A micromodule as de?ned in claim 7, wherein said
`dielectric strip is made of a plastic material having an
`expansion coe?icient of 20><l()‘6/°C.
`14. A micromodule as de?ned in claim 7, wherein said
`dielectric strip is made of cardboard.
`15. A micromodule as de?ned in claim 7, wherein said
`dielectric strip has a thickness of between 30 and 50
`micrometers.
`16. A micromodule as de?ned in claim 7, further com
`prising a layer of an insulating resin encapsulating said chip
`and bonded to said dielectric strip.
`17. A micromodule as de?ned in claim 16, wherein said
`chip is bonded onto said dielectric strip and said dielectric
`strip overlies the slots in said metal strip and seals the slots
`in said metal strip from said insulating resin.
`18. A micromodule comprising:
`(A) a slotted metal strip; '
`(B) a perforated dielectric strip having a thickness of
`between 30 and 50 micrometers and being bonded to
`said metal strip so as to overly the slots in said metal
`strip;
`(C) a chip bonded to said dielectric strip and connected to
`said metal strip through the perforations of said dielec»
`tric strip; and
`(D) an insulating resin layer encapsulating said chip and
`bonded to said dielectric strip.
`19. Micromodule according to claim 1, wherein said chip
`is bonded to said dielectric strip.
`20. Micromodule according to claim 1, wherein said
`dielectric strip has a thickness of between 30 micrometers
`and 50 micrometers.
`
`20
`
`25
`
`35
`
`40
`
`45
`
`55
`
`9/9
`
`DOJ EX. 1019