United States Patent [19]
`Horejs, Jr. et al.
`
`I lllll llllllll Ill lllll lllll lllll lllll lllll lllll lllll lllll llllll Ill lllll llll
`US005581445A
`5,581,445
`[11] Patent Number:
`[45] Date of Patent:
`Dec. 3, 1996
`
`[54] PLASTIC INTEGRATED CIRCUIT CARD
`WITH REINFORCEMENT STRUCTURE FOR
`PROTECTING INTEGRATED CIRCUIT
`MODULE
`
`[75]
`
`.Inventors: Charles F. Horejs, Jr., Morgan Hill;
`Thomas H. Templeton, Jr., Fremont,
`both of Calif.
`
`[73] Assignee: US3, Inc., Santa Clara County, Calif.
`
`[21] Appl. No.: 197,022
`
`[22] Filed:
`
`Feb. 14, 1994
`
`Int. Cl.6
`..•••••••••••••.••.•••••.•••••......•.••••••..•..•.•..• H05K 1/18
`[51]
`[52] U.S. CI •............................................. 361/737; 3611761
`[58] Field of Search ..................................... 257/679, 723,
`257/724; 235/1 D, 492, 495; 3611737, 729,
`761, 807, 809; 902/25, 26
`
`[56]
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`4,264,917
`4,857,483
`4,908,937
`4,914,057
`4,941,257
`
`4/1981 Ugon .
`8/1989 Steffen et al ..
`3/1990 Gloton et al ..
`4/1990 Gloton.
`711990 Gloton.
`
`7 /1990 Gloton et al ..
`4,943,464
`2/1991 Yabe et al ............................... 235/492
`4,994,659
`5,041,395
`8/1991 Steffen .................................... 437/206
`4/1992 Steffen .
`5, 107,073
`9/1992 Steffen .
`5, 147,982
`5/1993 Dupre et al ......................... 3611737 X
`5,214,566
`5,264,990 1111993 Venarnbre ............................... 3611761
`
`OTHER PUBLICATIONS
`
`Machinery's Handbook, Fifth Edition, The Industrial Press,
`copyright 1914, pp. 297-299.
`
`Primary Examiner-Michael W. Phillips
`Attorney, Agent, or Firm-Skjerven, Morrill, MacPherson
`Franklin & Friel; David W. Heid; E. Eric Hoffman
`
`[57]
`
`ABSTRACT
`
`A reinforcement structure to protect an integrated circuit
`module located within a smart card. The reinforcement
`structure, which has a modulus of elasticity higher than the
`modulus of elasticity of the smart card, substantially later(cid:173)
`ally surrounds the integrated circuit module in certain
`embodiments. In other embodiments, the reinforcement
`structure is a plate positioned adjacent to the integrated
`circuit module. The reinforcement structure relieves stress
`on the integrated circuit module during bending and torsion
`of the card.
`
`11Claims,14 Drawing Sheets
`
`~306
`
`~306a
`
`~03
`~303a
`
`rrn~305
`~05a
`308 ~307a
`307 ~.
`
`3011]~
`
`302b
`
`(300
`
`~301
`
`Wao1a
`
`~304
`
`w304a
`
`1/21
`
`DOJ EX. 1005
`
`

`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 1of14
`
`5,581,445
`
`(101
`
`FIG. 1
`
`200
`/
`
`(300
`
`~306
`
`~306a
`
`~~ ~301
`
`305a
`
`301a
`
`~~
`
`303a
`
`308 ~307a
`
`307
`
`30~302
`
`302b
`
`FIG. 3
`
`®3~
`304a
`
`2/21
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`

`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 2of14
`
`5,581,445
`
`/400
`
`/500
`
`~2
`50~
`
`506~05a
`505
`
`j
`I
`•-.!
`
`503~1
`, __
`
`1
`
`I
`
`503a
`
`504a v
`
`~504
`
`FIG. 5
`
`3/21
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`

`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 3of14
`
`5,581,445
`
`600\
`
`603
`
`Fig. 6
`
`703
`
`(700a
`
`702
`
`(700b
`
`Fig. 7a
`
`Fig. 7b
`
`(700c
`
`(700d
`
`Fig. 7c
`
`Fig. 7d
`
`4/21
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`

`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 4of14
`
`5,581,445
`
`800\
`
`900\
`
`1000\
`
`831
`
`820
`
`831
`
`820
`
`FIG. 8
`
`920
`FIG. 9
`
`931
`
`FIG. 10
`
`FIG. 11
`
`5/21
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`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 5of14
`
`5,581,445
`
`1220
`
`FIG. 12
`
`1220
`
`/1300
`1333
`1320
`1305
`----------~-----~~_._~..-1-~-'-~~....__---13M
`
`1303
`
`1331
`
`1332
`1331
`FIG. 13
`
`/1400
`1405
`1431
`r-..-~........,.................,~ ...................... ~""-"""---+-<-.._...... .......................... __...-.1-o.-........... -'T-o<-...,,..........1404
`
`1403
`
`1420
`
`1420
`
`FIG. 14
`
`6/21
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`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 6of14
`
`5,581,445
`
`/1500
`1505
`~------------__..,~-+----~--~__.+.,,__i--,,__.....J-__ ,,_15~
`
`FIG. 15
`
`1620
`FIG. 16
`
`/1600
`1605 1604
`
`1720
`FIG. 17
`
`1731
`
`7/21
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`

`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 7of14
`
`5,581,445
`
`/1800
`
`1802
`
`1831
`
`1820
`FIG. 18
`
`1805
`
`/1900
`
`1905 1904
`
`/2000
`2005 2004
`
`FIG. 19
`
`FIG. 20
`
`8/21
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`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 8of14
`
`5,581,445
`
`2132
`FIG. 21
`
`FIG. 22
`
`FIG. 23
`
`FIG. 24
`
`9/21
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`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 9of14
`
`5,581,445
`
`2520
`2520
`FIG. 25
`
`2731
`
`2720
`FIG. 27
`
`2820
`FIG. 28
`
`2831
`
`10/21
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`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 10 of 14
`
`5,581,445
`
`(2900
`
`FIG. 29
`
`/3000
`I
`3005
`3002
`
`FIG. 30
`
`3021
`
`3120
`
`3152
`
`(3100
`3105
`
`FIG. 31
`
`3006
`
`3106
`
`11/21
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`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 11 of 14
`
`5,581,445
`
`(3200
`
`3202
`
`FIG. 32
`
`203
`
`3305
`
`3352
`
`(3300
`
`FIG. 33
`
`FIG. 34
`
`12/21
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`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 12 of 14
`
`5,581,445
`
`3501
`
`FIG. 35
`
`3632
`FIG. 36
`
`13/21
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`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 13of14
`
`5,581,445
`
`FIG. 37
`
`3702
`
`3703
`
`(3731
`
`3701~~~~~ ~~~"\J
`FIG. 38a
`
`3702
`3701 ~~~~~~~'\ _..___..
`
`3703
`
`FIG. 38c
`
`3702
`·3701 ~~~~~~~,~~
`3703
`
`3720
`FIG. 38d
`
`14/21
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`
`U.S. Patent
`
`Dec. 3, 1996
`
`Sheet 14 of 14
`
`5,581,445
`
`3902 ~~........_~+-+-~~-a.'I~~~~~~~~~'"""
`3901
`3903
`
`3920
`FIG. 39
`
`4102
`
`4002
`4001
`4003
`
`4200~
`4220-2
`
`4020
`FIG. 40
`
`FIG. 41
`
`FIG. 42
`
`15/21
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`5,581,445
`
`1
`PLASTIC INTEGRATED CIRCUIT CARD
`WITH REINFORCEMENT STRUCTURE FOR
`PROTECTING INTEGRATED CIRCUIT
`MODULE
`
`FIELD OF THE INVENTION
`
`The present invention relates to protection of an inte(cid:173)
`grated circuit module.
`
`BACKGROUND OF THE INVENTION
`
`5
`
`10
`
`2
`7816-1 sets forth the standards for bending and torsion
`which must be met by integrated circuit cards. The standard
`provides:
`A.1 Bending properties
`A.1.1 Procedure
`Place the card between the two jaws of a machine, one
`of them being a moving part and bend
`a) the long side:
`deflection (f): 2 cm;
`periodicity: 30 bendings per minute;
`b) the short side:
`deflection (f): 1 cm;
`periodicity: 30 bendings per minute;
`Check the functioning of the card in the writing or
`reading mode every 125 bendings. Recommended
`test duration: at least 250 passes in each of the four
`test orientations.
`A.1.2 Criteria for acceptability
`The card shall still function and shall not show any
`cracked part after 1,000 bendings.
`A.2 Torsion properties
`A.2.1 Procedure
`Place the card in a machine which applies torsion to its
`short sides,
`the maximum displacement being
`through 15°±1° in alternate directions at a rate of 30
`torsions per minute. Check the correct functioning of
`the card in the writing and/or reading mode (as
`appropriate) every 125 torsions.
`A.2.2 Criteria for acceptability
`The card shall still function and shall not show any
`cracked part after 1,000 torsions.
`Accordingly, it is desirable to have a integrated circuit
`card which is able to meet the bending and torsion require-
`35 ments of this standard.
`
`There are a wide variety of applications that can make use
`of a flexible structure including electronic and/or electro(cid:173)
`magnetic devices, the devices being used for information 15
`input and output to and from the flexible structure, infor(cid:173)
`mation processing and information storage. One example of
`such a flexible structure is a flexible identification card.
`An identification card, as defined by the International
`Standards Organization (ISO) in ISO 7810, is "[a] card 20
`identifying its bearer and issuer which may carry data
`required as input for the intended use of the card and for
`transactions based thereon." Identification cards can have
`one of three nominal sizes (as specified in ISO 7810): 1) 25
`3.370 inch (85.60 mm) width, 2.125 inch (53.98 mm) height,
`0.030 inch (0.76 mm) thickness; 2) 4.134 inch (105 mm)
`width, 2.913 inch (74 mm) height, 0.030 inch (0.76 mm)
`thickness; 3) 4.921 inch (125 mm) width, 3.465 inch (88
`mm) height, 0.030 inch (0.76 mm) thickness.
`Some identification cards include an integrated circuit and
`are known as "integrated circuit cards" or "smart cards."
`More generally, herein, "smart card" refers to any portable
`card-like device which includes one or more electronic
`components, i.e., active components such as integrated
`circuits, transistors and diodes, and passive components
`such as resistors, capacitors and inductors. The integrated
`circuits can be formed on an integrated circuit chip and/or
`printed circuit board that is, in tum, attached to the main 40
`body of the smart card. Smart cards can be used for a wide
`variety of applications such as prepaid "debit" cards (e.g.,
`phone cards, transit passes, electronic purse), subscriber
`cards (e.g., bank ATM cards, credit cards, point-of-sale 45
`cards), loyalty scheme cards (e.g., frequent flier cards),
`security access and identification cards, health insurance and
`service cards (with optional protected memory), GSM (glo(cid:173)
`bal system management for European Cellular Phones)
`cards and encryption/decryption cards.
`Smart cards are used with a reader/writer that includes an
`interface ("external interface") that is used to transmit
`information to or from the smart card. Some smart cards
`include electrical contacts which are used to make electrical 55
`connection between electrical circuitry on or within the
`smart card and the external interface i.e., contact-type smart
`cards. Other smart cards do not include electrical contacts
`and accomplish the transfer of information to and from the
`smart card through another means such as, for example, an 60
`inductive coil formed in or on the smart card that is used in
`combination with an external interface that produces and
`responds to an electromagnetic field, i.e., electromagnetic
`contact-less smart cards. Other types of contact-less cards
`use electro-static or capacitive coupling to accomplish the
`transfer of data and instructions to and from the card. ISO
`
`30
`
`SUMMARY OF THE INVENTION
`
`Accordingly, a card having a reinforcement structure
`disposed within one or more layers of the card is provided.
`The reinforcement structure has a higher modulus of elas(cid:173)
`ticity (it is stiffer) than the card. A module containing an
`electronic component is also disposed within one or more
`layers of the card. The reinforcement structure relieves stress
`which would otherwise be experienced by the module
`during bending and torsion of either contact-type or contact(cid:173)
`less cards.
`This invention will be more fully understood in light of
`the following drawings taken together with the detailed
`description.
`
`50
`
`BRIEF DESCRIPTION OF THE DRAWINGS
`FIG. 1 is a cross section of a typical integrated circuit
`module which is located within a card;
`FIG. 2 is a cross section of a single layer, contact-type
`card having a washer-type reinforcement structure;
`FIG. 3 is a top view of various washer-type reinforcement
`structures positioned on a card;
`FIG. 4 is a cross section of a single layer contact-less card
`having a plate-type reinforcement structure;
`FIG. 5 is a top view of various plate-type reinforcement
`65 structures positioned on a card;
`FIG. 6 is a cross section of a single layer contact-less card
`having a cap-type reinforcement structure;
`
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`3
`FIGS. 1a-d are isometric views of various cap-type
`reinforcement structures;
`FIG. 8 is a cross section of a single layer contact-type card
`having a washer-type reinforcement structure;
`FIG. 9 is a cross section of a single layer contact-type card
`having a plate-type reinforcement structure;
`FIG. 10 is a cross section of a single layer contact-type
`card having a cap-type reinforcement structure;
`FIG. 11 is a cross section of a molded contact-less card 10
`having a washer-type reinforcement structure;
`FIGS. 12-17 are cross sections of different embodiments
`of two layer contact-less cards, each card having a rein(cid:173)
`forcement structure;
`FIGS. 18-21 are cross sections of different embodiments
`of two layer contact-type cards, each card having a rein(cid:173)
`forcement structure;
`FIGS. 22-24 are cross sections illustrating the steps used
`to create the card of FIG. 21;
`FIGS. 25-28 are cross sections of different embodiments
`of two layer contact-type cards, each card having a rein(cid:173)
`forcement structure;
`FIGS. 29-31 are cross sections of contact-less cards
`having a reinforcement structure which receives a module;
`FIGS. 32-34 are cross sections of contact-type cards
`having a reinforcement structure which receives a module;
`FIG. 35 is a cross section of a card which is being bent;
`FIG. 36 is a cross section of a contact-type card having a
`structure similar to the card of FIG. 21, in which an 30
`additional layer is added;
`FIG. 37 is a cross section of a card according to an
`alternate embodiment of the present invention;
`FIGS. 38a-d are cross sections illustrating a method for
`fabricating the card of FIG. 37;
`FIGS. 39 and 40 are cross sections of cards which
`illustrate alternate embodiments of the card of FIG. 37; and
`FIGS. 41 and 42 are cross sections of cards according to
`alternate embodiments of the present invention.
`
`35
`
`4
`or a polyphenylene sulfide molding compound, in liquid
`form, is placed in first opening 231. The molding compound
`is then cured to form solid reinforcement structure 220.
`Integrated circuit module 230 is similarly affixed in second
`5 opening 232. Contacts, such as contact 208 on the surface of
`the module 230, are exposed at the upper surface 202 of
`layer 201. First and second openings 231-232 are formed by
`punching, milling, machining or etching layer 201. First and
`second openings 231-232 do not extend completely through
`layer 201 and are dimensioned to closely receive reinforce(cid:173)
`ment structure 220 and module 230, respectively. Various
`materials may be used to make reinforcement structure 220
`in accordance with the present invention. Acceptable mate(cid:173)
`rials include plastics such as polyester, PVC, polycarbonate,
`15 PET and polysulfone, metals, fabrics, and graphite compos(cid:173)
`ite materials. The material used for the reinforcement struc(cid:173)
`ture 220 preferably has a higher modulus of elasticity than
`the material for layer 201. It is understood that, (1) the
`reinforcement structures and modules shown in FIGS. 2-36
`20 are enlarged with respect to the layer(s) of the cards to better
`illustrate these elements and (2) the gaps shown between the
`reinforcement structures, the modules and the card layer(s)
`are similarly enlarged.
`Reinforcement structure 220 is a washer-type reinforce-
`25 ment structure. That is, the reinforcement structure substan(cid:173)
`tially laterally surrounds the module 230. FIG. 3 is a top
`view of various washer-type reinforcement structures in
`accordance with the present invention. Circular reinforce(cid:173)
`ment structure 301, square reinforcement structure 302,
`rhombic reinforcement structure 303 and octagonal rein(cid:173)
`forcement structure 304 protect modules 301a, 302a-302b,
`303a and 304a, respectively, on card 300. Any polygonal or
`round (including an oval shape) shape may be used for a
`washer-type reinforcement structure. A washer-type rein-
`forcement structure may also consist of a "broken" shape as
`shown by the "broken" circular reinforcement structure 305,
`which protects module 305a. A washer-type reinforcement
`structure may also consist of more than one piece as shown
`by reinforcement structure 306 which protects module 306a.
`40 A washer type reinforcement structure may also consist of
`concentric reinforcement structures as shown by reinforce(cid:173)
`ment structures 307 and 308. These reinforcement structures
`provide increased protection for module 307 a by further
`stiffening the area of the card surrounding module 307 a.
`45 More than two concentric reinforcement structures may be
`used to form a reinforcement structure. In fact, a washer(cid:173)
`type reinforcement structure can be virtually any size, shape
`or geometry as long as it substantially laterally surrounds the
`module which it is protecting. FIG. 3 also illustrates several
`50 other aspects of the present invention. First, certain embodi(cid:173)
`ments of the present invention utilize more than one rein(cid:173)
`forcement structure and/or module on a single card. In
`addition, a reinforcement structure/module pair may be
`located at various positions within the card. Furthermore,
`55 more than one module may be disposed within a single
`reinforcement structure.
`FIG. 4 is a cross section of a reinforcement structure for
`a single layer contact-less card. In this embodiment, the
`reinforcement structure 420 is a plate-type reinforcement
`60 structure disposed into first opening 431 in upper surface
`402 of layer 401. Module 430 is disposed into second
`opening 432. The plate-type reinforcement structure is sub(cid:173)
`stantially planar. FIG. 5 is a top view of various plate-type
`reinforcement structures in accordance with the present
`invention. Circular reinforcement structure 501, square rein(cid:173)
`forcement structure 502, rhombic reinforcement structure
`503 and octagonal reinforcement structure 504 protect
`
`DETAILED DESCRIPTION
`
`FIG. 1 illustrates a cross section of a typical integrated
`circuit module 101 which is located within a card of the
`present invention. Module 101 includes a substrate 103, an
`electronic component 105, and an encapsulant 107. Electri(cid:173)
`cal contacts, such as electrical contact 108 (shown in
`enlarged detail), are formed on the underside of substrate
`103 to provide access to an external interface for a contact
`type card. Module 101 must be protected during bending or
`torsion of the card in which the module is located. Inad(cid:173)
`equate protection may result in damage to the integrated
`circuit module 101 which may further result in failure of the
`card.
`FIG. 2 is a cross section of a single layer contact-type card
`in accordance with the present invention. The card 200 is
`constructed of a single layer 201 having an upper surface
`202 and a lower surface 203. Layer 201 may be made of a
`material including plastics such as polyester, polyvinyl
`chloride (PVC), polycarbonate, polyethelynetelephthalate
`(PET) and polysulfone. First opening 231 and second open(cid:173)
`ing 232 are formed in the upper surface 202 of layer 201.
`Reinforcement structure 220 is affixed in first opening 231
`using an adhesive such as an acrylic adhesive, a thermal set
`adhesive, or any other suitable adhesive. In an alternate
`embodiment, a molding compound, such as a molding epoxy
`
`65
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`5
`underlying modules 501a, 502a-502b, 503a and 504a,
`respectively, on card 500. Any polygonal or round shape
`may be used for a plate-type reinforcement structure. A
`plate-type reinforcement structure, such as reinforcement
`structure 505, can be combined with a washer-type rein(cid:173)
`forcement structure, such as reinforcement structure 506 to
`protect a module such as module 505a.
`FIG. 6 is a cross section of a reinforcement structure for
`a single layer contact-less card. In this embodiment, the
`reinforcement structure 620 is a cap-type reinforcement
`structure. The cap-type reinforcement structure has a sub(cid:173)
`stantially planar portion 650 like the plate-type reinforce(cid:173)
`ment structure, plus a flange 651 (or flanges) which extend
`into first opening 631 in the upper surface 602 of layer 601.
`Module 630 is disposed into second opening 632 in upper
`surface 602. FIGS. 7a-d are isometric views of various
`cap-type reinforcement structures in accordance with the
`present invention. FIGS. 7a-d illustrate circular reinforce(cid:173)
`ment structure 700a, square reinforcement structure 700b,
`rhombic (or diamond-shaped) reinforcement structure 700c
`and octagonal reinforcement structure 700d, respectively.
`Referring to FIG. 7a, it will be noted that reinforcement
`structure 700a includes wall 701 which terminates at edge
`702 and surface 703. The thickness of well 701 is indicated
`by T between
`the arrows. Reinforcement structures
`700b-700d, although shaped differently, each have a wall
`which terminates at an edge and a surface, upper and lower
`edges providing a cap-type structure. Any polygonal or
`round shape may be used as the substantially planar portion
`of a cap-type reinforcement structure.
`Although the embodiments of FIGS. 4 and 6 show plate(cid:173)
`type and cap-type reinforcement structures in contact-less
`embodiments, these reinforcement structures can also be
`used in single layer contact type embodiments as shown in
`FIGS. 8-10. In FIG. 8, a first opening 831 is formed in the
`lower surface 803 of layer 801 (of card 800). Washer-type
`reinforcement structure 820 is affixed within first opening
`831. Module 830 is affixed in second opening 832 in upper
`surface 802 of layer 801. Contacts, such as contact 808, are
`exposed at the upper surface 802 of layer 801.
`Similarly, in FIG. 9, washer-type reinforcement structure 40
`920 is affixed in a first opening 931 formed in the lower
`surface 903 of layer 901 (of card 900). Module 930 is affixed
`in second opening 932 in upper surface 902 of layer 901.
`Contacts, such as contact 908, are exposed at the upper
`surface 902 of layer 901.
`In FIG. 10, cap-type reinforcement structure 1020 is
`affixed in a first opening 1031 in the lower surface 1003 of
`layer 1001 (of card 1000). Module 1030 is affixed in second
`opening 1032 in the upper surface 1002 of layer 1001.
`Contacts, such as contact 1008, are exposed at the upper
`surface 1002 of layer 1001.
`FIG. 11 is a cross section of a molded contact-less type of
`card in accordance with the present invention. The card 1100
`is constructed of a single molded layer 1101 which encloses
`the reinforcement structure 1120 and the module 1130. As in
`the other embodiments, the reinforcement structure 1120 has
`a higher modulus of elasticity than the molded layer 1101.
`The reinforcement structure of this embodiment is not
`limited to washer-type reinforcement structure 1120, but
`also includes plate-type and cap-type reinforcement struc(cid:173)
`tures. In alternate embodiments of the present invention, the
`card containing the module and reinforcement structure is
`laminated. FIGS. 12-17 illustrate two-layer embodiments
`which may be used for contact-less cards.
`FIG. 12 is cross section of a contact-less card 1200 in
`accordance with the present invention. As shown in FIG. 12,
`
`6
`a reinforcement structure 1220, is affixed in first opening
`1231 in the upper surface 1202 of first layer 1201. Module
`1230 is similarly affixed in second opening 1232 in the upper
`surface 1202. Lower surface 1206 of second layer 1204 is
`5 affixed to the upper surface 1202 of first layer 1201 to form
`a laminated structure. This affixing may be performed using
`various methods including but not limited to a heat activated
`adhesive, a contact adhesive, thermal fusing, ultrasonic
`welding or an epoxy adhesive. The reinforcement structure
`of this embodiment is not limited to washer-type reinforce(cid:173)
`ment structure 1220, but also includes plate-type and cap(cid:173)
`type reinforcement structures.
`FIG. 13 illustrates a cross section of a reinforcement
`structure which extends through multiple layers of contact(cid:173)
`less card 1300. Reinforcement structure 1320 is disposed in
`15 a first opening 1331 in upper surface 1302 of first layer 1301.
`Module 1330 is disposed in a second opening 1332 in upper
`surface of first layer 1301. Reinforcement structure 1320 is
`also disposed in a third opening 1333 in lower surface 1306
`of second layer 1304. Module 1330 is also disposed in a
`fourth opening 1334 in lower surface 1306 of second layer
`1304. The upper surface 1302 and lower surface 1306 are
`then affixed to one another using one of the methods
`previously described. First opening 1331, second opening
`1332, third opening 1333 and fourth opening 1334 are
`25 created in first and second layers 1301, 1304, with proper
`alignment, prior to assembly.
`FIG. 14 illustrates a cross section of a reinforcement
`structure located within a single layer of multiple layer,
`contact-less card 1400. Reinforcement structure 1420 is
`30 disposed in a first opening 1431 in upper surface 1402 of
`first layer 1401. Module 1430 is partially disposed in a
`second opening 1432 in upper surface of first layer 1401. A
`portion of module 1430 is disposed in a third opening 1433
`in lower surface 1406 of second layer 1404. The upper
`35 surface 1402 and lower surface 1406 are affixed to one
`another using one of the methods previously described.
`Second opening 1432 and third opening 1433 are created in
`first and second layers 1401, 1404, with proper alignment,
`prior to assembly.
`FIG. 15 illustrates a cross section of a reinforcement
`structure which extends through multiple layers of contact(cid:173)
`less card 1500. Reinforcement structure 1520 is disposed in
`a first opening 1531 in upper surface 1502 of first layer 1501.
`Module 1530 is disposed in a second opening 1532 in upper
`45 surface of first layer 1501. Reinforcement structure 1520 is
`also disposed in a third opening 1533 in lower surface 1506
`of second layer 1504. The upper surface 1502 and lower
`surface 1506 are affixed to one another using one of the
`methods previously described. First opening 1531 and third
`50 opening 1533 are created in first and second layers 1501,
`1504, respectively, with proper alignment prior to assembly.
`FIG. 16 illustrates a cross section of a reinforcement
`structure located within a single layer of multiple layer,
`contact-less card 1600. Reinforcement structure 1620 is
`55 disposed in a first opening 1631 in lower surface 1603 of
`first layer 1601. A first portion of module 1630 is disposed
`in a second opening 1632 in upper surface 1602 of first layer
`1601. Another portion of module 1630 is disposed in a third
`opening 1633 in lower surface 1606 of second layer 1604.
`60 Upper surface 1602 and lower surface 1606 are affixed to
`one another using one of the methods previously described.
`Second opening 1632 and third opening 1633 are created in
`first and second layers 1601, 1604, with proper alignment,
`prior to assembly. The reinforcement structure of this
`65 embodiment is not limited to plate-type reinforcement struc(cid:173)
`ture 1620, but also includes washer-type and cap-type rein(cid:173)
`forcement structures.
`
`18/21
`
`DOJ EX. 1005
`
`

`
`5,581,445
`
`7
`FIG. 17 is cross section of a contact-less card 1700 in
`accordance with the present invention. As shown in FIG. 17,
`a reinforcement structure 1720, is affixed in first opening
`1731 in the lower surface 1703 of first layer 1701. Module
`1730 is similarly affixed in second opening 1732 in the upper
`surface 1702. Lower surface 1706 of second layer 1704 is
`bonded to the upper surface 1702 of first layer 1701 using
`one of the bonding methods previously described. The
`reinforcement structure of this embodiment is not limited to
`plate-type reinforcement structure 1720, but also includes 10
`washer-type and cap-type reinforcement structures.
`FIGS. 18-21 illustrate two-layer embodiments which may
`be used for contact-type cards.
`FIG. 18 is cross section of a contact type card 1800 in
`accordance with the present invention. Reinforcement struc(cid:173)
`ture 1820, is affixed in first opening 1831 in the lower
`surface 1803 of first layer 1801. Module 1830 is affixed in
`second opening 1832 in the upper surface 1802 of first layer
`1801. Contacts, such as contact 1808 of module 1830, are
`exposed at the upper surface 1802 of first layer 1801. Lower
`surface 1803 of first layer 1801 is bonded to the upper
`surface 1805 of second layer 1804 using one of the methods
`previously described to form a laminated structure. The
`reinforcement structure of this embodiment is not limited to
`plate-type reinforcement structure 1820, but also includes 25
`washer-type and cap-type reinforcement structures.
`FIG. 19 illustrates a cross section of a reinforcement
`structure which extends through multiple layers of contact
`type card 1900. Reinforcement structure 1920 is disposed in 30
`a first opening 1931 in upper surface 1902 of first layer 1901.
`Reinforcement structure 1920 is also disposed in a third
`opening 1933 in lower surface 1906 of second layer 1904.
`Module 1930 is disposed in a second opening 1932 which
`extends through second layer 1904 and into upper surface
`1902 of first layer 1901. Contacts, such as contact 1908 of
`module 1930, are exposed at the upper surface 1905 of
`second layer 1904. Lower surface 1906 of second layer 1904
`is bonded to the upper surface 1902 of first layer 1901 using
`one of the methods previously described to form a laminated 40
`structure.
`FIG. 20 illustrates a cross section of a reinforcement
`structure which is contained within a single layer of contact
`type card 2000. Reinforcement structure 2020 is disposed in
`a first opening 2031 in upper surface 2002 of first layer 2001. 45
`Module 2030 is disposed in a second opening 2032 which
`extends through second layer 2004 and into upper surface
`2002 of first layer 2001. Contacts, such as contact 2008 of
`module 2030, are exposed at the upper surface 2005 of
`second layer 2004. Lower surface 2006 of second layer 2004 50
`is bonded to the upper surface 2002 of first layer 2001 using
`one of the methods previously described to form a laminated
`structure.
`FIG. 21 illustrates an alternate embodiment of the struc(cid:173)
`ture of FIG. 20, substituting a plate-type reinforcement 55
`structure for the washer-type reinforcement structure. FIGS.
`22-24 illustrate the steps used to create the structure of FIG.
`21. First opening 2131 (FIG. 22) is formed in the upper
`surface 2102 of first layer 2101 by punching, milling,
`machining or etching first layer 2101. First opening 2131 is 60
`dimensioned to receive plate-type reinforcement structure
`2120. Reinforcement structure 2120, is affixed in opening
`2131 with an adhesive or by a method previously described
`(FIG. 23). Second layer 2104 is then bonded to first layer
`2101. Second opening 2132 is then formed by punching, 65
`milling, machining or etching through second layer 2104
`and plate 2120. In an alternate embodiment, second opening
`
`8
`2132 may extend into first layer 2101. Module 2130 is
`affixed in opening 2132 using an adhesive (or another
`method as previously described), resulting in the structure of
`FIG. 21. Contacts, such as contact 2108 of module 2130, are
`5 exposed at the upper surface 2105 of second layer 2104.
`Alternately, the card of FIG. 21 may be constructed by
`using a reinforcement structure and second layer which have
`pre-formed openings such that the second opening is formed
`when the first layer and second layer are bonded together.
`FIG. 25 illustrates a cross section of a reinforcement
`structure which extends through multiple layers of contact
`type card 2500. Reinforcement structure 2520 is disposed in
`a first opening 2531 in upper surface 2502 of first layer 2501.
`Reinforcement structure 2520 is also disposed in a third
`15 opening 2533 which extends into the lower surface 2506 of
`second layer 2504. Lower surface 2506 of second layer 2504
`is bonded to the upper surface 2502 of first layer 2501 using
`one of the methods previously described. Module 2530 is
`disposed in second opening 2532 in upper surface 2505 of
`second layer 2504. Contacts, such as contact 2508 of module
`20 2530, are exposed at the upper surface 2505 of second layer
`2504.
`FIG. 26 illustrates a cross section of a reinforcement
`structure which is contained within a single layer of contact
`type card 2600. Reinforcement structure 2620 is disposed in
`a first opening 2631 in lower surface 2603 of first layer 2601.
`Module 2630 is disposed in a second opening 2632 which
`extends through second layer 2604 and into upper surface
`2602 of first layer 2601. Contacts, such as contact 2608 of
`module 2630, are exposed at the upper surface 2605 of
`second layer 2604. Lower surface 2606 of second layer 2604
`is bonded to the upper surface 2602 of first layer 2601 using
`one of the methods previously described to form a laminated
`structure. The reinforcement structure of this embodiment is
`not limited to plate-type reinforcement structure 2620, but
`also includes washer-type and cap-type reinforcement struc(cid:173)
`tures.
`FIG. 27 illustrates a cross section of a reinforcement
`structure which is contained within a single layer of contact
`type card 2700. Reinforcement structure 2720 is disposed in
`a first opening 2731 in upper surface 2702 of first layer 2701.
`Module 2730 is disposed in a second opening 2732 in the
`upper surface 2705 of second layer 2