Paper No. ___
`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`
`____________________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`
`____________________
`
`
`
`SAMSUNG ELECTRONICS CO., LTD.;
`MICRON TECHNOLOGY, INC.; and
`SK HYNIX INC.
`Petitioner
`
`v.
`
`ELM 3DS INNOVATIONS, LLC
`Patent Owner
`
`____________________
`
`Case No. IPR2016-00387
`U.S. Patent No. 8,841,778
`____________________
`
`PETITIONER’S AMENDED EXHIBIT LIST
`
`
`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`
`____________________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`
`____________________
`
`
`
`SAMSUNG ELECTRONICS CO., LTD.;
`MICRON TECHNOLOGY, INC.; and
`SK HYNIX INC.
`Petitioner
`
`v.
`
`ELM 3DS INNOVATIONS, LLC
`Patent Owner
`
`____________________
`
`Case No. IPR2016-00387
`U.S. Patent No. 8,841,778
`____________________
`
`PETITIONER’S AMENDED EXHIBIT LIST
`
`
`
`Paper No. ___
`Case No. IPR2016-00387
`Patent No. 8,841,778
`
`AMENDED LIST OF EXHIBITS1
`Ex. 1001: U.S. Patent No. 8,841,778
`
`Ex. 1002: Declaration of Dr. Paul D. Franzon
`
`Ex. 1003:
`
`Curriculum Vitae of Dr. Paul D. Franzon
`
`Ex. 1004: U.S. Patent No. 5,202,754 to Bertin et al., issued April 13, 1993
`
`Ex. 1005: U.S. Patent No. 5,162,251 to Poole et al., issued November 10, 1992
`
`Ex. 1006: U.S. Patent No. 5,354,695 to Leedy, issued October 11, 1994
`
`Ex. 1007:
`
`Japanese Patent Publication No. 3-151637 to Kowa including
`Japanese-language version, English-language translation, and
`translation certification
`
`Ex. 1008: U.S. Patent No. 5,627,106 to Hsu, issued May 6, 1997
`
`Ex. 1009:
`
`RESERVED
`
`Ex. 1010:
`
`RESERVED
`
`Ex. 1011:
`
`RESERVED
`
`Ex. 1012:
`
`RESERVED
`
`Ex. 1013:
`
`RESERVED
`
`Ex. 1014:
`
`RESERVED
`
`Ex. 1015:
`
`RESERVED
`
`Ex. 1016:
`
`RESERVED
`
`
`
` 1
`
` Citations to non-patent publications are to the original page numbers of the
`
`publication, and citations to U.S. patents are to column:line number of the patents.
`
`1
`
`
`
`
`Paper No. ___
`Case No. IPR2016-00387
`Patent No. 8,841,778
`
`Ex. 1017:
`
`Prosecution History for U.S. Patent No. 8,841,778
`
`Ex. 1018:
`
`Ex. 1019:
`
`Ex. 1020:
`
`Ex. 1021:
`
`Ex. 1022:
`
`Ex. 1023:
`
`Ex. 1024:
`
`Ex. 1025:
`
`Ex. 1026:
`
`Prosecution History of U.S. Patent No. 8,907,499 - Office Action
`dated May 29, 2013
`
`Prosecution History of U.S. Patent No. 8,907,499 - Response to
`Office Action dated June 20, 2013
`
`Prosecution History of U.S. Patent No. 8,907,499 - As-Filed Patent
`Application
`
`Prosecution History of U.S. Patent App. No. 12/497,652 - Response
`to Office Action dated September 26, 2013
`
`Prosecution History of U.S. Patent App. No. 12/497,653 - Response
`to Office Action dated October 24, 2013
`
`Prosecution History of U.S. Patent App. No. 12/497,652 - Response
`to Office Action dated 4/5/13
`
`Prosecution History of U.S. Patent No. 5,915,167 - Response to
`Office Action dated April 28, 1998
`
`Prosecution History of U.S. Patent No. 5,915,167 - Response to
`Office Action dated September 8, 1998
`
`Prosecution History of U.S. Patent No. 8,629,542 - Response to
`Office Action dated July 30, 2012
`
`Ex. 1027:
`
`RESERVED
`
`Ex. 1028:
`
`Ex. 1029:
`
`Ex. 1030:
`
`Prosecution History of U.S. Patent No. 7,705,466 - Response to
`Office Action dated February 16, 2009
`
`Prosecution History of U.S. Patent No. 7,705,466 - Response to
`Office Action dated June 25, 2009
`
`Prosecution History of U.S. Patent No. 8,928,119 - Response to
`Office Action dated September 4, 2012
`
`Ex. 1031:
`
`Prosecution History of U.S. Patent No. 8,928,119 - Appeal Brief
`
`2
`
`
`
`
`Paper No. ___
`Case No. IPR2016-00387
`Patent No. 8,841,778
`
`dated June 3, 2013
`
`Ex. 1032:
`
`Ex. 1033:
`
`Ex. 1034:
`
`Ex. 1035:
`
`Ex. 1036:
`
`Prosecution History of U.S. Patent No. 8,410,617 - Response to
`Office Action dated December 14, 2010
`
`Prosecution History of U.S. Patent Application No. 12/497,652 -
`Final Office Action dated August 27, 2014
`
`Prosecution History of U.S. Patent Application No. 12/497,652 -
`Express Abandonment dated November 20, 2014
`
`Prosecution History of U.S. Patent Application No. 12/497,653 -
`Advisory Action dated August 27, 2014
`
`Prosecution History of U.S. Patent Application No. 12/497,653 -
`Express Abandonment dated November 20, 2014
`
`Ex. 1037:
`
`RESERVED
`
`Ex. 1038:
`
`RESERVED
`
`Ex. 1039:
`
`Concept One CVD System Process Specifications from Novellus
`
`Ex. 1040: Wolf et al., Processing for the VLSI Era, Volume 1 - Process
`Technology (1986).
`
`Ex. 1041: U.S. Patent No. 3,508,980 to Jackson et al., issued April 28, 1970
`
`Ex. 1042: U.S. Patent No. 3,044,909 to Shockley, issued July 17, 1962
`
`Ex. 1043:
`
`Fahey et al., Stress-induced dislocations in silicon integrated
`circuits, IBM J. Res. Develop. Vol. 36, No. 2, March 1992
`
`Ex. 1044: Hass et al., Physics of Thin Films: Advances in Research and
`Development (1966)
`EerNisse, E.P., Stress in thermal SiO2 during growth, Appl. Phys.
`Lett. 35(1), July 1, 1979
`
`Ex. 1045:
`
`Ex. 1046: Klokholm, Erik, Delamination and fracture of thin films, IBM J. Res.
`Develop., Vol. 31, No. 5, September 1987
`
`3
`
`
`
`
`Paper No. ___
`Case No. IPR2016-00387
`Patent No. 8,841,778
`
`Ex. 1047: U.S. Patent No. 4,948,482 to Kobayashi et al., issued August 14,
`1990
`
`Ex. 1048:
`
`Isobe et al., Dielectric Film Influence on Stress-Migration, June 12-
`13 IEEE VMIC Conference (1990)
`
`Ex. 1049: Van de Ven, et al., Advantages of Dual Frequency PECVD for
`Deposition of ILD and Passivation Films, June 12-13 IEEE VMIC
`Conference (1990)
`
`Ex. 1050: U.S. Patent No. 5,160,998 to Itoh et al., issued November 3, 1992
`
`Ex. 1051: Garrou, Philip, Polymer Dielectrics for Multichip Module Packaging,
`Proceedings of the IEEE, Vol. 80, No. 12, December 12, 1992
`
`Ex. 1052: Grief et al., Warpage and Mechanical Strength Studies of Ultra Thin
`150MM Wafers, IEEE/CPMT Int’l Electronics Manufacturing
`Technology Symposium (1996)
`
`Ex. 1053:
`
`Tatsuno, Sheridan, Japan’s Push into Creative Semiconductor
`Research: 3-Dimensional ICs, Solid State Technology, March 1987
`
`Ex. 1054: Akasaka, Yoichi, Three-Dimensional IC Trends, Proceedings of the
`IEEE, Vol. 74, No. 12, December 1986
`
`Ex. 1055: Hayashi, Yoshihiro, Evaluation of Cubic (Cumulatively Bonded IC)
`Devices, 9th Symposium on Future Electron Devices, November 14-
`15, 1990
`
`Ex. 1056: Williams et al., Future WSI Technology: Stacked Monolithic WSI,
`IEEE Transactions on Components, Hybrids, and Manufacturing
`Technology, Vol. 16, No. 7, November 1993
`
`Ex. 1057:
`
`Crowley et al., 3-D Multichip Packaging for Memory Modules,
`MCM ’94 Proceedings, 1994
`
`Ex. 1058: Malinak, David, Memory-Chip Stacks Send Density Skyward,
`Electronic Design, August 22, 1994
`
`Ex. 1059: Kuhn et al., Interconnect Capacitances, Crosstalk, and Signal Delay
`in Vertically Integrated Circuits, IEEE 1995
`
`4
`
`
`
`
`Paper No. ___
`Case No. IPR2016-00387
`Patent No. 8,841,778
`
`CERTIFICATE OF SERVICE
`
`I hereby certify that on January 13, 2016, I caused a true and correct copy of
`
`PETITIONER’S AMENDED EXHIBIT LIST to be served via express mail and
`
`electronically on the following attorney of record as listed on PAIR:
`
`Michael J. Ure
`
`info@usefulartsip.com
`
`USEFUL ARTS IP
`
`10518 Phil Place
`
`Cupertino, CA 95014
`
`A courtesy copy was also sent via express mail and electronically to the Patent
`
`Owner’s litigation counsel listed below:
`
`Samuel L. Walling
`
`swalling@robinskaplan.com
`
`ROBINS KAPLAN LLP
`
`800 LaSalle Avenue, Suite 2800
`
`Minneapolis, MN 55402
`
`
`
`
`/Jason A. Engel/
`Jason A. Engel (Reg. No. 51,654)
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