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UNITED STATES PATENT AND TRADEMARK OFFICE
`_______________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`
`_______________
`
`
`
`SONY CORPORATION,
`SAMSUNG ELECTRONICS, CO., LTD.,
`SAMSUNG ELECTRONICS AMERICA, INC. and
`SAMSUNG SEMICONDUCTOR, INC.
`Petitioners
`
`v.
`
`RAYTHEON COMPANY,
`Patent Owner
`_______________
`
`Case: IPR2016-00209
`
`Patent 5,591,678
`_______________
`
`UPDATED PATENT OWNER EXHIBIT LIST
`
`
`
`
`
`
`
`

`
`
`
`EXHIBIT LIST
`
`
`
`*2001
`*2002
`
`*2003
`
`*2004
`
`*2005
`
`Exhibit Description
`*2001PR First page of Docket Control Order in 15-cv-341, August
`17, 2015
`*2002PR Defendants’ Invalidity Contentions and Disclosures
`Pursuant to Patent Rules 3-3 and 3-4, October 2, 2015
`*2003PR Defendants’ Motion to Stay Cases Pending Inter Partes
`Review, January 4, 2016
`Declaration of Eugene Fitzgerald
` Excerpts from prosecution history of Application Serial No.
`08/006,120, Office action dated December 10, 1993
`U.S. Patent 4,612,083, “Process of Fabricating Three-Dimensional
`Semiconductor Device,” Masaaki Yasumoto, issued Sept. 16, 1986
`U.S. Patent 4,815,208, “Method of Joining Substrates for Planar
`Electrical Interconnections of Hybrid Circuits,” Curt R. Raschke,
`issued March 28, 1989
`Raytheon FAQ’s
`http://investor.raytheon.com/phoenix.zhtml?c=84193&p=irol-
`faq#25748
`Raytheon 2015 Annual Report
`“Raytheon Acquires Hughes Wing in $9.5-Billion Deal,” James F.
`Peltz, January 17, 1997, http://articles.latimes.com/1997-01-
`17/news/mn-19463_1_hughes-aircraft
`Declaration of John J. Drab
`STC Bepi-Colombo Article
`OmniVisionTech YouTube Video: OmniVision’s Backside
`Illumination (BSI) Explained
`Raytheon Co. v. Samsung Electronics Co., Ltd., Civil Action No.
`1:15-CV-341-JRG-RSP, Dkt. 90 “Joint Statement Construction and
`Prehearing Statement” (E.D.T.X. Dec. 9, 2015), and Dkt. 116-1,
`“Claim Construction Chart” (E.D.T.X Feb. 17, 2016)
`Declaration of A. Bruce Buckman, Raytheon Co. v. Samsung
`Electronics Co., Ltd., Civil Action No. 1:15-CV-341-JRG-RSP, Dkt.
`No. 100-2 (E.D.T.X Dec. 9, 2015) (“Buckman Decl.”)
`“The Technological Impact of Transistors”, J.A. Morton and W.J.
`Pietenpol, Proceedings of Institute the of Radio Engineers (1958)
`955. (Ex. 2020.)
`
`*2006
`*2007
`
`*2008
`*2009
`*2010
`
`*2011
`
`*2012
`
`*2013
`
`2
`
`

`
`
`
`*2017
`
`*2018
`
`*2020
`
`*2021
`
`*2022
`*2023
`
`*2024
`
`*2015
`*2016
`
`Exhibit Description
`*2014
`U.S. Patent No. 2,981,877, “Semiconductor Device-and-Lead
`Structure,” Robert N. Noyce, issued Apr. 25, 1961
`“VLSI Technology,” S.M. Sze, McGraw-Hill, New York (1983).
`“Cramming more components onto integrated circuits”, G.E. Moore,
`Electronics 38 (1965).
`“Progress in Digital Integrated Electronics”, G.E. Moore,
`International Electron Devices Meeting, IEEE, 1975, pp. 11-13.
`“Silicon Processing”, D.C. Gupta, ASTM Special Technical
`Publication 804, Philadelphia (1983).
`*2019A-F Raytheon’s Technology Tutorial originally submitted in Raytheon
`Co. v. Samsung Electronics Co., Ltd., Civil Action No. 1:15-CV-
`341-JRG-RSP (E.D.T.X.)
`“High-efficiency AlGaAs/GaAs concentrator solar cells”, R. Sahai,
`D. D. Edwall, and J. S. Harris Jr., Applied Physics Letters 34, 147
`(1979).
`“Bulk impurity charge trapping in buried channel charge coupled
`devices”, McNutt, M.J.; Meyer, W.E., Journal of the Electrochemical
`Society, v 128, n 4, p 892-6, April 1981.
`Definition of forming and furnish
`“Integrated Movable Micromechanical Structures for Sensors and
`Actuators”, L.S. Fan, Y.C. Tai, R.S. Muller, IEEE Transactions on
`Electronic Devices 35, (1998) p. 724.
`“New Opportunities for Micro Actuators”, H. Fujita and K.J. Gabriel,
`Transducers '91, 1991 International Conference on Solid-State
`Sensors and Actuators. Digest of Technical Papers (Cat.
`No.91CH2817-5), p 14-20, 1991.
`“Failure Mechanisms and Fault Classes for CMOS-Compatible
`Microelectromechanical Systems”, A. Castillejo, D. Veychard, S.
`Mir, J.M. Karam, and B. Courtois”, Proceedings International Test
`Conference 1998 (IEEE Cat. No.98CH36270), p 541-50, 1998.
`“Sony develops back-illuminated CMOS image sensor, realizing
`high picture quality, nearly twofold sensitivity and low noise”, June
`11, 2008
`“Sony Develops “Exmor RS,” the World’s First Stacked CMOS
`Image Sensor Also introduces imaging modules that deliver high
`picture quality and compact size, for use in mobile devices such as
`smartphones and tablets”, August 20, 2012
`OmniBSI™ Technology Backgrounder, OmniVision Technologies,
`
`*2025
`
`*2026
`
`*2027
`
`*2028
`
`3
`
`

`
`
`
`Exhibit Description
`Inc., Michael Okincha, Senior Staff Technical Production Manager,
`June 22, 2009
`OmniVision BSI Presentation
`Corrected Patent Owner Response Redline dated October 6, 2016
`RAY00009970-00010007 redacted
`Fitzgerald Declaration dated March 11, 2016 (filed in IPR2015-
`01201 as Ex. 2019)
`
`*2029
`2030
`2031
`2032
`
`
`*Patent owner’s exhibits 2001-2029 were previously filed and listed here again
`pursuant to 37 C.F.R. § 42.63.
`
`
`
`Dated: October 7, 2016
`
`
`
`
`
`Customer Number: 27890
`Steptoe & Johnson, LLP
`115 S. LaSalle Street, Suite 3100
`Chicago, IL 60603
`
`Telephone: (312) 577-1252
`
`
`
` Respectfully submitted,
`
`
`
`
`
`
`
`
`/Thomas J. Filarski/
`Thomas J. Filarski
`Reg. No. 31,612
`
`Counsel for Raytheon Company
`
`
`
`
`
`
`
`
`
`
`4
`
`

`
`
`
`CERTIFICATE OF SERVICE
`
`The undersigned certifies that a copy of the foregoing UPDATED
`
`PATENT OWNER’S EXHIBIT LIST was served on October 7, 2016 by filing
`
`this document through the Patent Trial and Appeal Board End to End system
`
`(PTAB E2E) as well as by delivering a copy via electronic mail to the following:
`
`
`Matthew A. Smith
`Jennifer Seraphine
`Jacob Zweig
`TURNER BOYD LLP
`smith@turnerboyd.com
`seraphine@turnerboyd.com
`zweig@turnerboyd.com
`
`Robert Hails
`T. Cy Walker
`BAKER & HOSTETLER LLP
`rhails@bakerlaw.com
`cwalker@bakerlaw.com
`
`Attorneys for Petitioner Sony
`Corporation
`
`Date: October 7, 2016
`
`
`
`

`
`Heath J. Briggs
`Patrick J. McCarthy
`GREENBERG TRAURIG, LLP
`briggs@gtlaw.com
`mccarthy@gtlaw.com
`
`Attorneys for Petitioners Samsung
`Electronics, Co. Ltd., Samsung
`Electronics America, Inc. and Samsung
`Semiconductor, Inc.
`
`By:
`
`/Thomas J. Filarski/
`Thomas J. Filarski
`Reg. No. 31,612
`Steptoe & Johnson LLP
`115 S. LaSalle Street, Suite 3100
`Chicago, IL 60603
`
`Telephone: (312) 577-1252
`
`Counsel for Raytheon Company

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