United States Patent; [191
`Lane et a1.
`
`[11] Patent Number:
`[45] Date of Patent:
`
`4,967,381
`Oct. 30, 1990
`
`[54] PROCESS CONTROL INTERFACE SYSTEM
`FOR MANAGING MEASUREMENT DATA
`
`4,812,996 3/ 1989 Stubbs ............................... .. 364/487
`4,823,283 4/1989 Diehm et a1. .... ..
`
`[73]
`
`Assignee:
`
`
`[75] Inventors: Leslie A. Lane, Santa Clara; Lynn V. Lybeck, MOSS Beach; David S.
`Perloff, Sunnyvale; Shoji Kumagi,
`Santa Clara, all of Calif.
`Prometrix Corporation, Santa Clara,
`Calif.
`375,898
`Jul. 6, 1989
`
`[21]
`[22]
`
`Appl. No.:
`Filed:
`
`
`
`
`
`4,835,700 5/1989 Tanaka et a1. 4,843,538 6/1989 Lane et a1. 4,873,643 10/1989 Powell et a1. ................. .. 364/188 X
`
`Primary Examiner—Parshotam S. Lall
`Assistant Examiner-Edward R. Cosimano
`Attorney, Agent, or Firm-Flehr, Hohbach, Test,
`Albritton 8: Herbert
`[57]
`ABSTRACT
`A system and method for computer control of machine
`processes. The system and method provide a set of
`prede?ned data management or data analysis tasks
`which an operator of the system can use when using the
`system to run a selected process.
`Measurement data structures for storing data measured
`during the running of processes, and related data, for a
`multiplicity of processes are de?ned and stored. Data is
`added to these data structures each time a process is run,
`and this data is automatically accessed when the opera
`tor requests data analysis on the data collected during
`previous uses of a selected process.
`Access to measurement data for detailed data manage
`ment tasks is provided graphically through the use of
`trend charts and statistical quality control charts. These
`charts depict trends in the measurement data for se
`lected processes. By pointing at any data point in the
`chart, the user can access the corresponding record of
`data for detailed data analysis or for use in a data man
`agement task.
`
`15 Claims, 27 Drawing Sheets
`
`[60]
`
`[51]
`[52]
`
`[53]
`
`[56]
`
`Related US. Application Data
`Division of Ser. No. 50,925, May 15, 1987, Pat. No.
`4,873,623, which is a continuation-in-part of Ser. No.
`864,024, May 16, 1986, Pat. No. 4,805,089, which is a
`continuation-in-part of Ser. No. 729,153, Apr. 30, 1985,
`Pat. No. 4,679,137.
`
`Int. Cl.5 ........................................... .. GOIR 23/16
`US. Cl. ............................. .. 364/551.01; 364/146;
`364/188; 364/192; 364/487
`Field of Search ............. .. 364/200, 146, 188, 192,
`364/550, 900, 551.01, 485, 486, 487
`References Cited
`U.S. PATENT DOCUMENTS
`4,072,851 2/1978
`4,104,725 8/1978
`4,507,740 3/1985
`4,663,704 5/1987
`4,679,137 7/ 1987
`4,805,089 2/1989
`
`34
`
`KYBD
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`CONTROL
`PROGRAMS
`
`CONTROL SIGNALS
`
`:’
`:
`
`1
`
`PHYSICAL PROCESSING
`SYSTEM
`122
`
`

`
`US. Patent Oct.30, 1990
`
`Sheet 1 of 27
`
`4,967,381
`
`34
`
`KYBD
`
`DISPLAY
`
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`

`
`US. Patent Oct.30, 1990
`
`Sheet 2 of 27
`
`4,967,381
`
`

`
`US‘. Patent 0a. 30, 1990
`
`Sheet 3 of 27
`
`4,967,381
`
`TUBE 2
`BASE
`File 02374 Base Test for Tube 2
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`MIDDLE
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`FIGURE 4
`
`94
`
`

`
`US. Patent Oct.30, 1990
`
`Sheet 4 of 27
`
`4,967,381
`
`BASE
`
`TUBE 2
`
`MIDDLE
`
`Process Date Limits ;
`7 CHART
`
`01/01/87 - 05/07/87
`
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`
`FIGURE 5
`
`

`
`US. Patent 0ct.30, 1990
`
`Sheet 5 of 27
`
`4,967,381
`
`Cabinet
`
`I//////
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`

`
`US. Patent Oct.30, 1990
`
`A Sheet 6 0f 27
`
`4,967,381
`
`
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`
`US. Patent 0ct.30, 1990
`
`Sheet 7 of 27
`
`4,967,381
`
`
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`

`
`US. Patent 011.30, 1990
`
`Sheet 8 0f 27
`
`4,967,381
`
`- RADIAL—— THETA -
`1 .000
`0.0
`0.000
`0.0
`1.000
`180.0
`. 1.000
`90.0
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`
`-——- QUICK TEST—-
`1 ASTM-A
`‘
`2 ASTM-B
`3 ASTM-C
`4 semi-A
`5 semi-B
`6 semi-C
`7 PROMETRIX 1
`' 8 PROMETRIX 3
`9 PROMETRIX 5
`10 PROMETRIX 6
`11 PROMETRIX 9
`12 PROMETRIX 10
`13 PROMETRIX RING 4
`14 PROMETRIX RING 8
`15 PROMETRIX STGGRD
`
`1
`2
`3
`4
`5
`6
`7
`8
`9
`10
`11
`12
`13
`14
`15
`
`PAGE
`
`SELECT
`
`PAGE
`
`UPDATE
`
`MAIN
`MENU
`
`VARIABLE NAME
`OUICK_TYPE
`
`FORMAT
`CHAR (30x21)
`
`DESCRIPTION
`NAME OF QUICK TEST TYPE
`
`RADIAL
`THETA
`
`REAL 30x30)
`REAL 30x30)
`
`RADIAL POSITION OF TEST SITES
`ANGULAR POSITION OF TEST SITES
`
`FIGURE 9
`
`

`
`US. Patent Oct. 30,1990
`
`Sheet 9 of 27
`
`4,967,381
`
`1-— QUICK TEST-T
`15 SPECIAL TEST #1
`'
`17 SPECIAL TEST #2
`13
`19
`20
`21
`'22
`23
`24
`25
`25
`27
`23
`29
`30
`
`- RADlAL—- THETA -
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`9
`10
`11
`12
`13
`14
`15
`
`PAGE
`
`
`
`UPDATE FIGURE 9a
`
`1-— ou|c1< TEST-——-
`15 GSWs TEST #1
`'
`17 SPECIAL FOR DRP
`13
`19
`20
`21
`22
`23
`24
`25
`25
`27
`28
`29 v
`30
`
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`15
`17
`19
`19
`20
`21
`22
`23
`24
`25
`25
`27
`23
`29
`30
`
`'
`
`PAGE
`
`UPDATE
`
`FIGURE 9b
`
`

`
`US. Patent’
`
`Oct. 30, 1990
`
`Sheet 10 of 27
`
`4,967,381
`
`Points Failing Stability Tests are
`Marked with an 'X“
`
`Upper Control Limit
`
`zone A
`Zone 8
`Zone C
`zone c, \y
`“Zone 8'
`
`5°": A‘.
`Lower Control Limit
`
`A L x
`/ \ / "
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`
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`
`RULE SUBSETS
`
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`Full Set
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`Firs‘ Test
`
`“998'
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`Chan
`
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`Control
`Chan
`
`other
`Tests
`
`Single point beyond upper control limit
`-
`2 out of 3 m Zone A or above
`4 out of 5 in Zone B or above
`8 in a row in Zone 0 or above
`
`8 in a row in Zone C‘ or below
`4 out of 5 in Zone 8' or below
`2 out of 3 in Zone A’ or below
`Single point beyond lower control limit
`
`15 points in a row in Zone C and C‘
`8 poims in a row are outside Zones 0 8. C‘
`
`Update
`
`Main
`Menu
`
`FIGURE 10
`
`

`
`US. Patent 0a. 30, 1990
`
`Sheet 11 0f 27
`
`4,967,381
`
`/
`124
`NNA Name: Cabinet 1
`NNA Name: Cabinet 2
`A/NA Name: Cabinet 3
`
`/122
`
`/120
`
`Name: Cabinet 9
`
`Figure 11a
`
`134 /
`A/NA Name: Drawer 1
`A/NA Name: Drawer 2
`NNA Name: Drawer 3
`
`A/NA Name: Drawer 81
`
`130 /
`
`Figure 11b
`
`COLL. COMB
`YIN
`YIN
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`
`Name: Folder 1
`Name: Folder 2
`Name: Folder 3
`
`142 /
`
`/140
`
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`
`Name: Folder 729
`
`144
`
`Figure 11c
`
`

`
`US. Patent 0111.304991]
`
`Sheet 12 of 27
`
`4,967,381
`
`PCP Trpe
`F/S/U/A Parameter 1 Value
`F/S/U/A Parameter 2 Value
`F/SlU/A Parameter 3 Value
`
`F/SIU/A Parameter 11 Value
`
`153
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`Index Card 2
`Index Card 3
`
`Fonnat
`Format
`Format
`
`Index Card N
`
`Format
`
`157
`
`156
`
`Index Card 1
`Index Card 2
`Index Card 3
`
`Format
`Format
`Format
`
`Index Card N
`
`Format
`
`Figure 12
`
`

`
`US. Patent 0ct.30, 1990
`
`Sheet 13 of 27
`
`4,967 ,381
`
`PCP 729
`
`Raw Data File p
`
`Raw Data File 2
`
`Raw Data File 1
`
`PCP 1 I
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`
`PCP 1 / Record n - 1
`
`Figure 13
`
`

`
`US. Patent 000301990
`
`Sheet 14 of 27
`
`4,967,381
`
`FILM NAME
`
`COMPONENT LAYERS
`
`POLY 1
`‘ POLY2
`NITRIDE ON $iO2
`NITRIDE ON POLY
`OXIDE ON POLY
`
`'
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`POLY
`
`4
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`1
`
`SILICON
`
`SUBSTRATE
`
`TOGGLE EDIT
`ACTIVE ACTIVE UPDATE OPT'ON
`
`MAIN
`MENU
`
`FIGURE 14
`
`FILM COMPONENT
`
`OLY
`221050
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`SILICON
`GALIUM ARSENIDE
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`PYROLYTIC Si3N4
`THERMAL SiO2
`SPUTTERED SiO2
`
`-
`
`CAUCHY COEFFICIENTS
`
`1.54700 E+0O
`n1
`n2 3.92400 E+06
`n3 1.00700 E+13
`k1
`0.00
`k2 0.00
`k3 0.00
`
`SELECT
`
`UPDATE
`
`FIGURE 15
`
`

`
`US. Patent Oct.30, 1990
`
`Sheet 15 0f 27
`
`4,967,381
`
`FILM NAME
`FILM NAME
`
`FILM COMPONENTS (3)
`FILM COMPONENTS (3)
`
`SUBSTRATE OP 1
`SUBSTRATE
`OP 1
`
`FILM NAME
`
`FILM COMPONENTS (3)
`
`SUBSTRATE
`
`OP 10
`
`CAUCHY TEXT
`CAUCHY TEXT
`
`CAUCHY VALUES (6)
`CAUCHY VALUES (6)
`
`1
`2
`
`CAUCHY TEXT
`
`CAUCHY VALUES (6)
`
`2O
`
`VARIABLE NAME
`FILM_NAME
`FILM_OP
`
`DESCRIPTION
`NAME OF FILM SEQUENCE
`FLAG DENOTING AVAILABILITY FOR USE
`O=NOT AVAILABLE. 1=AVAILABLE
`FILM_COMPONENT CHAR 15X5X21) FILM COMPONENTNAMES IN SECUENCE
`SUB_TYPE
`CHAR 15x21)
`NAME OF SUBSTRATE
`
`FORMAT
`CHAR (15x21)
`BIN (15)
`
`CHAR 20x21)
`CAUCHY_TEXT
`CAUCHY_VALUES REAL( 0X6)
`
`CAUCHY FILM COMPONENT NAMES
`CAUCHYCOEFFICIENTS
`
`FIGURE 16
`
`

`
`US. Patent Oct.30, 1990
`
`Sheet 16 of 27
`
`4,967,381
`
`\ E
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`
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`
`
`// 222:5 Sun 52.
`
`

`
`US. Patent
`
`Oct. 30, 1990
`
`Sheet 17 of 27
`
`4,967,381
`
`Measurement
`Controller
`
`339
`
`V
`
`Measurement
`Unit
`
`322
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`Value
`V
`
`Measurement Collection
`and Analysis Computer
`352
`
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`Matrix
`
`3531
`
`324
`
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`
`Control lnionnation
`
`Wafer Stage
`Position Controller
`
`00
`
`Wafer
`Stage
`
`354
`
`\ 320
`
`Figure 18
`
`

`
`US. Patent Oct.30, 1990
`
`Sheet 18 of 27
`
`4,967,381
`
`
`
`
`
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`
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`
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`

`
`US. Patent 0ct.30, 1990
`
`Sheet 19 0f 27
`
`4,967,381
`
`SETUP READY FLAG
`MASK FILE POINTER
`(# FIELDS. # CHIPS/FIELD, # MODULES,
`# STRUCTURES IN MODULE A, # STRUCTURES IN MODULE B, ...)
`
`FIELD SELECTION FLAGS
`
`CHIP SELECTION PATTERN
`
`MODULE SELECTION PATTERNS:
`[o]1]1]1]1j0|1|1|1|1|o|MoDuLEA
`
`[1[1]1|1|1|o]1]1|1]1|1|1|1|MoDuLEc
`
`FIGURE 20
`
`

`
`U.SI Patent
`
`Oct. 30, 1990
`
`Sheet 20 of 27
`
`4,967,381
`
`DEFINITIONS —-\
`
`
`
`
`
`OPCODE LIST OF TEST STRUCTURES
`
`OPCODE LIST OF TEST STRUCTURES
`
`TARGET, LIMIT VALUES
`
`TARGET, LIMIT VALUES
`
`
`
`SMART CHART 1
`
`SMART CHART 2
`
`SMART CHART 3
`
`OPCODE LIST OF TEST STRUCTURES
`TARGET LIMIT VALUES
`
`
`SMART CHART 40 OPCODE LIST OF TEST STRUCTURES
`
`TARGET, LIMIT VALUES
`
`DATA —\
`CHART
`1
`
`CHART
`2
`
`CHART
`40
`
`
`
`MEAN. STDV MEAN, STDV - - -
`
`MEAN. STDV MEAN, STDV
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`FIGURE 21
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`US. Patent
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`Oct. 30, 1990
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`Sheet 21 of 27
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`4,967,381
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`FIRST ENABLED CHIP IN 1ST ENABLED FIELD
`DATA FOR SELECTED TEST STRUCTURES IN MODULE A
`
`SECOND ENABLED CHIP IN 1ST ENABLED FIELD
`DATA FOR SELECTED TEST STRUCTURES IN MODULE A
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`LAST ENABLED CHIP IN 1ST ENABLED FIELD
`DATA FOR SELECTED TEST STRUCTURES IN MODULE A
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`FIRST ENABLED CHIP IN 2ND ENABLED FIELD
`DATA FOR SELECTED TEST STRUCTURES IN MODULE A
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`SECOND ENABLED CHIP IN 2ND ENABLED FIELD
`DATA FOR SELECTED TEST STRUCTURES IN MODULE A
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`LAST ENABLED CHIP IN LAST ENABLED FIELD
`DATA FOR SELECTED TEST STRUCTURES IN MODULE A
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`DATA FOR SELECTED TEST STRUCTURES IN MODULE B
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`DATA FOR SELECTED TEST STRUCTURES IN LAST MODULE
`
`FIGURE 22
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`US. Patent
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`Oct. 30, 1990
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`Sheet 22 of 27
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`4,967,381
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`U.S. Patent
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`Oct. 30, 1990
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`Sheet 23 of 27
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`4,967,381
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`U.S. Patent
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`Oct. 30, 1990
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`Sheet 24 of 27
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`4,967,381
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`US. Patent
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`Oct. 30, 1990
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`Sheet 25 of 27
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`4,967,381
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`US. Patent
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`Oct. 30, 1990
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`Sheet 26 of 27
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`US. Patent
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`0ct;30, 1990
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`Sheet 27 of 27
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`4,967,381
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`1
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`4,967,381
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`2
`TABLES—continued
`
`Description
`
`Chart Scaling
`Directory Listing
`Parameter Data Structure for one Process
`Main Menu
`Engineer's Folder Selection Menu
`Film Type index card
`Mask Definition
`File Directory Format
`
`TABLE #
`16
`17
`18
`19
`20
`21
`22
`23
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`20
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`25
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`30
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`45
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`50
`
`This invention relates generally to systems and meth-
`ods for computer control of machine processes and in
`particular to systems and methods for computer control
`which involve menu driven approaches to selection of
`processes including processes rim by a machine and.
`related data management processes.
`BACKGROUND OF THE INVENTION
`
`Database Management for Industrial Process Control
`
`While many computer controlled machines are de-
`signed to automatically record data relevant to the
`performance of the machine, the analysis of this data is
`generally not automatic. This is especially true for ma-
`chines which are used to perform a variety of different
`processes in an industrial environment. Furthermore,
`the operators who run such machines are rarely as-
`signed to data analysis and database management tasks.
`This combination of circumstances tends to cause the
`discovery of process control problems to be delayed
`until there is a noticeable degradation in the quality of
`the product being made or in the process being per-
`formed.
`
`The present invention provides a system and method
`of database management
`that facilitates the perfor-
`mance of data management and analysis tasks by opera-
`tors, rather than by the engineers who have normally
`performed such tasks in the past. In particular, the pres-
`ent invention employs the san1e easy to use menu driven
`selection method for selecting a process to be rim and
`for requesting an analysis of the data collected from
`previous runs of the selected process. At the push ofjust
`a few buttons by the operator, the present invention
`automatically sorts through the measurement data
`stored in the system and performs a specified data man-
`agement task, such as printing a trend chart for previ-
`ously recorded data for the process specified by the
`operator.
`As a result, the operator can initiate a data manage-
`ment task before or after running a selected process,
`using the same type of menus as he uses for selecting
`and nmning the selected process.
`
`Sheet Resistance Mapping of Semiconductor Wafers
`
`The invention described in this specification may be
`applied generally in computer controlled machines
`which perform various production or testing processes.
`It may also be applied to data collection and data base
`management programs. However, the detailed descrip-
`tion of the invention will be given in terms of the con-
`trol of an automated resistivity tester for performing
`sheet resistance mapping of semiconductor wafers. This
`equipment is used to characterize the performance of
`semiconductor wafer manufacturing equipment utilized
`to form surface layers of specific target conductivity
`value as part of the process of manufacturing semicon-
`
`PROCESS CONTROL INTERFACE SYSTEM FOR
`MANAGING MEASUREMENT DATA
`
`This application is a divisional continuation of appli-
`cation Ser. No. 07/050,925, filed May 15, 1987, now
`U.S. Pat. No. 4,873,623, entitled PROCESS CON-
`TROL INTERFACE WITH SIMULTANEOUSLY
`DISPLAYED THREE LEVEL DYNAMIC MENU.
`Ser. No. 07/050,925 was a continuation in part of patent
`application Ser. No. 06/864,024, filed May 16, 1986,
`now U.S. ‘Pat. No. 4,805,089, entitled PROCESS CON-
`TROL INTERFACE FOR MANAGING MEA-
`SUREMENT DATA. Ser. No. 06/864,024 was a con-
`tinuation in part of Ser. No. 06/729,153, filed Apr. 30,
`1985, now U.S. Pat. No. 4,679,137, entitled PROCESS
`CONTROL INTERFACE SYSTEM FOR DE-
`SIGNER AND OPERATOR. Application Ser. Nos.
`06/864,024 and 06/729,153 are both hereby incorpo-
`rated herein in their entirety by reference.
`TABLE OF CONTENTS
`
`BACKGROUND OF THE INVENTION
`SUMMARY OF THE INVENTION
`BRIEF DESCRIPTION OF THE DRAWINGS
`DESCRIPTION OF THE PREFERRED EMBODI-
`MENTS
`Dynamic Menu Selection Method
`Operator Control Program
`Process Selection
`Parameter Entry
`Toggle and Edit Field Feature
`Running the Selected Process
`Data Analysis and Management Tasks
`Trend Charts
`SQC Charts
`Directory Listings
`Combined Process Data Analysis
`Data Structures
`
`Process Names and Availability Flags
`Parameter Formats and Data Structures
`Measurement Data Structures
`SQC Rule Subsets
`Engineering Set Up Control Program
`Task Selection
`Defining the Operator Prompts
`Test Definition
`
`.
`Process Definition Duplication
`Quick Test Toggle/Edit Field Definition
`Overview of First Preferred Embodiment
`Alternate Embodiments
`Film Thickness Measurement System
`Multiparameter Measurement System
`CLAIMS
`
`TABLES
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`
`
`TABLE #
`l-4
`5
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`6
`7
`8a—b
`9
`10
`11
`12
`13
`14
`15
`
`Description
`Dynamic Menu - Folder Selection
`Table of Index Card Screens
`Index Card Screens:
`Wafer Setup: Wafer Facts
`Memos & Notes
`Test Type
`Current Setup
`File Summary
`Data Summary
`Maps &. Graphs
`Trend Charts: Chart Set-Up
`Chart Scaling
`Chart Set-Up
`
`Test Setup:
`
`Test Results:
`
`SQC Charts:
`
`

`
`3
`ductor devices such as, for example, large scale inte-
`grated circuits.
`The preferred version of an automated resistivity
`tester to be controlled by this invention is disclosed in
`copending and commonly assigned U.S. patent applica-
`tion Ser. No. 726,498, filed on Apr. 24, 1985, now U.S.
`Pat. No. 4,755,746 entitled “APPARATUS AND
`METHODS FOR SEMICONDUCTOR WAFER
`TESTING.” Application 726,498
`is
`incorporated
`herein by reference for background information regard-
`ing importance of performing automated resistivity
`testing on semiconductor wafers which have been sub-
`jected to ion implantation.
`The correctness and uniformity of implant dosage
`across a semiconductor wafer can be determined in an
`automatic sheet resistance mapping system which has
`the capability of taking multiple test readings in both a
`contour map and diameter scan mode. From these tests
`and printouts, the engineer in charge of a process can
`determine whether the ion implantation equipment is
`operating properly.
`To encourage the use of testing equipment such as
`automated resistivity testers, it is important to provide
`an overall computer control program for the tester
`which is easy for the engineer to set up to perform
`in-process monitoring measurements which will pro-
`vide meaningful data. It is also important for the control
`program to be simple for the operator to run with confi-
`dence and consistency to produce meaningful data.
`Engineer and operator convenience and confidence
`are the keys to increasing acceptance of automated
`process control and testing in all industries.
`
`' Prior Art Computer Control Methods
`
`It has become a standard approach in the art to use a
`programmed digital computer to control the operation
`of various types of machinery which have the capability
`to perform a variety of tasks or the capability to per-
`form the same task in a variety of ways.
`Computer control of industrial machines generally
`involves a complex set of processes and a large number
`of parameters which must be entered for the machine to
`carry out a selected process. Because of this complexity,
`the set up of the machine for performing a desired pro-
`cess is usually done by an engineer who understands the
`overall functioning of the system and the interaction of
`the process parameters with the process control pro-
`grams of the machine In the better designed systems,
`this engineering set up is facilitated by a machine con-
`trol program which provides the engineer with a se-
`quence of different menus or prompts which direct
`process selection and parameter entry. These menus or
`prompts are typically presented individually and in
`sequence. In situations requiring a substantial number of
`menu screens, process or parameter value choices on
`one screen may be affected by earlier or later choices
`several screens away. Thus the engineering set up oper-
`ation may require continuous paging back and forth
`between screens to check on processes selected or pa-
`rameters previously entered so that overall meaningful
`and consistent process selection and parameter entry
`can be achieved at each screen level.
`
`The complexity and inconvenience of the engineer-
`ing set up protocol of most computer controlled ma-
`chines tends to discourage their use except by the more
`sophisticated engineers at the most sophisticated com-
`panies. Even when these systems are used, the require-
`ment to provide written operator instructions intro-
`
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`4,967,381
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`duces a frustration that tends to discourage widespread
`use of the technology to achieve the benefits it could
`produce.
`SUMMARY OF THE INVENTION
`
`In summary, the present invention is a system and
`method for computer control of machine processes. A
`dynamic menu feature is used in the selection of pro-
`cesses, data management tasks, and the definition and
`selection of operating parameters used by a process
`control program to direct the performance of the pro-
`cess by the machine.
`The system and method of this invention incorporates
`the feature of providing a set of predefined data man-
`agement or data analysis tasks which the operator of the
`system can use when using the system to run a selected
`process. The same type of menus used for selecting a
`process to run are used for initiating data management
`tasks.
`
`Measurement data structures for storing data mea-
`sured during the running of processes, and related data,
`for a multiplicity of processes are defined and stored.
`Data is added to these data structures each time a pro-
`cess is run, and this data is automatically accessed when
`the operator requests data analysis on the data collected
`during previous uses of a selected process.
`Access to measurement data for detailed data man-
`agement tasks is provided not only through the dynamic
`menu feature, but also graphically through the use of
`trend charts and statistical quality control charts. These
`charts depict trends in the measurement data for se-
`lected processes. By pointing at any data point in the
`chart, the user can access the corresponding record of
`data for detailed data analysis or for use in a data man-
`agement task.
`BRIEF DESCRIPTION OF THE DRAWINGS
`
`Additional objects and features of the invention will
`be more readily apparent from the following detailed
`description and appended claims when taken in con-
`junction with the drawings, in which:
`FIG. 1 is a block diagram of a process control system
`in accordance with the present invention.
`FIG. 2 is a contour map and FIG. 3 is a three dimen-
`sional wafer resistivity map generated by a resistivity
`mapping program in the preferred embodiment.
`FIG. 4 depicts a trend chart generated by the pre-
`ferred embodiment of the present invention.
`FIG. 5 depicts a statistical quality control chart gen-
`erated by the preferred embodiment of the present in-
`vention.
`
`FIG. 6 is a flow chart of the dynamic menu aspect of
`the present invention.
`'
`FIG. 7 is a conceptual flow chart of the data collec-
`tion and analysis tasks performed by the present inven-
`tion.
`
`FIGS. 8a and 8b depicts the “index card” parameter
`entry screens as seen by operators, and engineers setting
`up a process, respectively.
`FIGS. 9, 9a and 9b depict the screens and data struc-
`tures used to define and select from a list of Quick Test
`types through the use of a toggle/edit field.
`FIG. 10 depicts a typical set of rules or guidelines for
`determining the presence of a quality control problem,
`and a mechanism for defining different subsets of those
`rules to be applied in different circumstances.
`FIGS. 11a—11c depict the data structures used for
`defining process names in the preferred embodiment.
`
`

`
`5
`FIG. 12 depicts the data structures used for defining
`parameters in the preferred embodiment.
`FIG. 13 depicts the data structures used for storing
`measurement data and related information.
`FIGS. 14-16 depict the displays and data structures
`associated with a two level edit field in a first alternate
`embodiment.
`
`FIG. 17 depicts the test structure hierarchy usedin a
`second alternate embodiment of the invention in which
`multiple parameters are measured and analyzed.
`FIG. 18 depicts a lithography tester.
`FIG. 19 depicts the file organization used in the sec-
`ond alterate embodiment.
`
`FIG. 20 depicts a test definition data structure.
`FIG. 21 depicts a trend chart definition and data
`storage data structure.
`FIGS. 22 and 22a depict a test data file.
`FIG. 23 depicts the relationships between several
`different types of files in the second alterate embodi-
`_ ment.
`FIGS. 24-26 depict displays used for setting up trend
`charts.
`
`FIG. 27 depicts a defect data map.
`FIG. 28 depicts a display for selecting a trend chart to
`be generated.
`DESCRIPTION OF THE PREFERRED
`EMBODIMENTS
`
`The description below describes the present inven-
`tion as used in three embodiments. As indicated above,
`the bulk of the description relates to the user interface
`for a semiconductor wafer resistivity tester The other
`two embodiments, which are discussed solely to show
`important additional features of the invention not used
`in the first embodiment, are a film thickness measure-
`ment system and a multiparameter lithography tester.
`The film thickness system is discussed to show how
`complex parameters which incorporate several levels of
`information can be set up in a way that is both flexible
`for engineers and convenient for use by both the engi-
`neers and operators in a production environment. The
`multiparameter lithography tester is discussed to show
`how the features and advantages of the present inven-
`tion can be applied to systems which need to measure
`and analyze numerous parameters (as opposed to the
`measurement of a single parameter, as in the resistivity
`and film thickness measurement systems) in a produc-
`tion environment.
`Referring to FIG. 1, there is shown a block diagram
`of a system 20 incorporating the apparatus of this inven-
`tion and capable of carrying out the method of this
`invention. A physical processing system 22, such as a
`semiconductor wafer resistivity tester, is controlled by a
`computer based control system 24. The control system
`24, in accordance with this invention, includes an engi-
`neering set up module 26 and an operator module 28.
`The control system 24 further includes a set of process
`control programs 30, each of which is used to control
`the physical system 22 while it is performing a specified
`type of process.
`The control system 24 includes a computer central
`process unit (CPU) 32, a keyboard 34 or equivalent
`device for entering commands and data into the system
`24, a display device 36 such as a color monitor with a
`touch sensitive screen, and a printer 38. A removable 40
`megabyte hard disc cartridge is used to store data struc-
`tures 42 which define the process parameters used in the
`processes performed by the physical system 22; it is also
`
`4,967,381
`
`6
`used to store the measurement data generated by the
`physical system 22 during operation and measurement
`derived data generated by the CPU 32 such as mean
`values and standard deviations.
`
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`As will be explained in greater detail below (and as
`explained in copending application Ser. No., 729,153
`now U.S. Pat. No. 4,679,137), the engineering module
`26 is a set up control program (called the engineering
`set up control program) which is used by engineers to
`define the degree and types of restraints which limit and
`control the types of processes which can be run using
`the physical system 22. In the preferred embodiment,
`the computer used is a Hewlett Packard Vectra (an
`IBM PC/AT compatible computer).
`The engineering module furthermore includes means
`for storing a representation of the set of decisions made
`by the person using the engineering set up program on
`a portable magnetic disc 40. These choices are repre-
`sented by entries in a set of data structures 42 which are
`used by both the engineering set up and process control
`programs.
`The operator module 28 is an operator process con-
`trol program used by an operator (i.e., a person) to
`select and run processes on the physical system 22
`which have been previously set up using the engineer-
`ing set up module 26.
`As will be described in greater detail below, the oper-
`ator process control program 28 includes a process
`selection program for selecting which of the available
`processes is to be run on the physical system 22, a pa-
`rameter entry program for specifying parametric values
`for use in conjunction with the process to be run by the
`physical system 22, and a data analysis or data manage-
`ment program for analyzing the measurement data col-
`lected by the control system 24 from the physical sys-
`tem 22.
`In the preferred embodiment, the same computer can
`be used for engineering set up, process control, and data
`management. On the other hand, an engineer can use
`one computer to set up the processes he wants the oper-
`ator to run, and can then hand the operator the disc 40
`for use on a separate computer control system 24. Oper-
`ators are denied access to the engineering module 26 by
`requiring knowledge of a password to use the engineer-
`ing module 26.
`In the preferred embodiment the physical system 22 is
`a wafer resistivity tester and there are three process
`control programs 30. One process control program,
`called Contour Map, causes the computer 36 in the
`operator module to send control signals to the tester 22
`which direct it to measure and record the resistivity of
`a semiconductor wafer at a specified number of separate
`position coordinates on the wafer. Another process
`control program, called Diameter Scan, generates con-
`trol commands which direct the tester 22 to measure
`and record the resistivity of a semiconductor wafer at a
`specified number of separate test sites along a diameter
`line. A third, called Quick Check, measures the resistiv-
`ity a