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`APPLE INC.
`EXHIBIT 1111 - PAGE 0001
`
`

`

`Designing with
`Flash Memory
`
`The definitive guide to
`designing flash memory
`hardware and software
`for components and
`PCMCIA cards
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0002
`
`

`

`APPLE INC.
`EXHIBIT 1111 - PAGE 0003
`
`

`

`Designing with
`Flash Memory
`
`Brian Dipert & Markus Levy
`
`The definitive guide to
`designing flash memory
`hardware and software
`for components and
`PCMCIA cards
`
`Annabooks
`San Diego
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0004
`
`

`

`Designing with Flash Memory
`BY
`BRIAN DIPERT & MARKUS LEVY
`
`PUBLISHED By
`
`Annabooks
`11848 Bernardo Plaza Ct., Suite 110
`San Diego, CA 92128
`USA
`
`619-673-0870
`
`Copyright © Annabooks 1993, 1994
`
`All rights reserved. No part of the contents of this book may be
`reproduced or transmitted in any form or by any means without the prior
`written permission of the publisher, except for the inclusion of brief
`quotations in a review.
`
`Printed in the United States of America
`
`ISBN 0-929392-17-5
`Second Printing April 1994
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0005
`
`

`

`Acknowledgements
`
`Both Brian and Markus would like to thank their colleagues at Intel
`Corporation. Knowingly (or unknowingly),
`their knowledge and
`expertise was a superb resource base for answers to questions we
`uncovered as we wrote. Special recognition goes out to Dave Cobb,
`Russ Eslick, Kurt Robinson, John Garney, Clark Thurlo, Peter Torelli,
`Steve Wells, Saul Zales, Greg Komoto, Larry Leszczynski, and John
`Williams; thanks, guys! Thanks also goes out to Wink Saville at Saville
`Associates, David Lawrence at Ventura Micro, and Amir Ban at M(cid:173)
`Systems.
`
`Several years of staffmg the customer and sales force support hotline at
`Intel have also taught us what not to do when designing with flash
`memory (and also given us some great ideas we hadn't considered
`ourselves). To the salespersons and design engineers we've worked with;
`thanks for an inexhaustible list of topics for this book. We hope we've
`included answers for at least most ofthe questions you've asked us!
`
`To our "partner in crime" Mary Ann Hooker (You Know), a big round
`of applause for the great graphics work and for putting up with us and
`our seemingly endless revisions. If it weren't for you, the figures would
`have looked like kindergarden crayon work!
`
`Markus: "Words cannot express the thanks and love that I give to
`Danielle for all her support and for all the times she patiently listened to
`me say 'It's almost done'. Well it's finally done. Thank you to Jacob
`(although you can't read this yet) for being a great kid while your Dad
`worked, worked and worked."
`
`Brian: "I give thanks to the Creator God, to my family back in Indiana
`(thanks for all your encouragement!) and to Lil, for patiently putting up
`with all those nights and weekends I spent looking at a computer
`monitor instead of at her. I hereby retire the notebook PC (at least for a
`while) and echo Markus' comment.. .... it's finally done!".
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0006
`
`

`

`Information provided in this publication is derived from various sources,
`standards, and analyses. Any errors or omissions shall not imply any liability for
`direct or indirect consequences arising from the use of this information. The
`publisher and authors make no warranty for the correctness or for the use of this
`information, and assume no liability for direct or indirect damages of any kind
`arising from technical interpretations or technical explanations in this book, for
`typographical or printing errors, or for any subsequent changes.
`
`The publisher and authors reserve the right to make changes in this publication
`without notice and without incurring any liability.
`
`The publisher and editor would like to extend his thanks to Marco Thompson
`and Gary Lorenc of Doctor Design, Inc. and to Ray Weiss of EDN who
`reviewed the book on a very tight schedule while it was still in three ring binder
`form. Thanks also to Rich Sjoberg who did the artwork for the cover.
`
`Cover design by John P. Choisser, Annabooks.
`
`Cover photo by Peter Menzel, Napa, California (707-255-3528). Peter caught
`this lightning bolt along with dozens of others one night in Tucson, Arizona.
`For more of Peter's work, see the National Geographic July 1993 issue. Peter
`has taken photos all over the world for Geo, Life, Forbes, Stern, Us. News &
`World Report, Smithsonian, The New York Times Magazine, and many others.
`The glow at the bottom of this bolt is probably not the flash memory at the
`University of Arizona being re-programmed all at once. It is more likely the
`stadium, which puts out a pretty healthy glow of its own, lighting or no.
`
`The following trademarks mentioned in this book are the property of the
`companies listed: ETOX, i386, i486, Pentium, FlashFile, and Boot Block are the
`property of Intel Corporation. Microsoft, MS-DOS, MS-FFS, and Windows are
`trademarks of Microsoft Corporation. Other trademarks are credited as they
`appear.
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0007
`
`

`

`Contents
`
`Chapter One: Introduction ........................................................................ 1
`Flash Memory Compared to Other Memories ............................. 3
`ROM (Read-Only-Memory) ........................................... 4
`RAM (Random-Access-Memory) ................................... 4
`EEPROM (Electrically-Eraseable-Programmable-Read-
`Only-Memory) ................................................................ 5
`Magnetic Mass Storage ................................................... 5
`An Emerging Alternative: Flash Memory ....................... 5
`A Preview of Chapters to Follow ................................................. 7
`Chapter Two: Flash Memory Applications ............................................. 11
`Data Accumulation .................................................................... 12
`Medical Instrumentation ............................................... 12
`Flight Recorders ............................................................ 13
`More Data Accumulation Examples ............................. 13
`Why Flash Memory for Data Acquisition? ................... 14
`DataILookup Table Storage ....................................................... 14
`PBX Switcher ................................................................ 14
`Laser Printers ................................................................ 15
`Why Flash Memory For DataILookup Table Storage?16
`Embedded Code Storage ............................................................ 16
`PC BIOS ........................................................................ 16
`Digital Cellular Phones ................................................. 18
`More Embedded Code Storage Applications ................ 18
`Why Flash Memory for Embedded Code Storage? ...... 18
`File Storage ................................................................................ 19
`Flash Memory Promotes Longer Battery Life .............. 19
`HDD Densities with FDD Interchange ......................... 20
`Summary .................................................................................... 21
`Chapter Three: Flash Memory Technologies ......................................... 23
`NOR Flash Memory ................................................................... 25
`Program ......................................................................... 27
`Erase .............................................................................. 28
`Negative Gate Erase ...................................................... 29
`Overerase ............................................................... : ...... 29
`NOR Flash Memory Specifications .............................. 30
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0008
`
`

`

`ii Designing with Flash Memory
`
`Flash EEPROM ......................................................................... 32
`Erase ............................................................................. 33
`Programming ................................................................ 34
`Flash EEPROM Memory Specifications ...................... 35
`NAND Flash Memory ............................................................... 36
`Program and Erase ........................................................ 36
`NAND Flash Memory Specifications .......................... 36
`What's All This Cycling Stuff, Anyway? .................................. 38
`Failure Analysis ............................................................ 40
`Oxide Breakdown ......................................................... 40
`Electron Trapup ............................................................ 41
`Mean Time Before Failure ........................................... 41
`Extended Cycling-The Vendor's Options ..................... 42
`Extended Cycling-What Can You Do? ........................ 43
`Summary .................................................................................... 44
`Chapter Four: Packaging Options and Update Alternatives ................... 45
`Packaging Options ..................................................................... 46
`DIP (Dual In-Line Package) ......................................... 46
`LCC (LeadedlLeadless Chip Carrier) ........................... 49
`SOJ (Small-Outline J-Lead) ......................................... 52
`SOP (Small Outline Package) ...................................... 54
`TSOP (Thin Small Outline Package) ........................... 54
`SIMM (Single In-Line Leadless Memory Module) ..... 59
`PCMCIA Flash Memory Cards .................................... 62
`Flash Drives .................................................................. 66
`Update Options .......................................................................... 68
`Off-Board PROM Programming .................................. 68
`On-Board Update .......................................................... 69
`In-System Write ............................................................ 71
`Summary .................................................................................... 72
`Chapter Five: Hardware Interfacing to Flash Memory Components ..... 73
`Hardware Interfacing Fundamentals ......................................... 73
`Chip Enable .................................................................. 75
`Addresses ...................................................................... 75
`Data In/Out ................................................................... 76
`Output Enable ............................................................... 76
`Write Enable ................................................................. 77
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0009
`
`

`

`Contents
`
`iii
`
`WE-Less Flash Memories ............................................. 78
`The V pp ProgramJErase Voltage ................................................ 79
`Switching Vpp ................................................................ 80
`V pp Feedback ................................................................. 81
`Advanced Hardware Interfacing ................................................ 82
`The PWD Input ............................................................. 82
`RYIBY Output .............................................................. 84
`Interpreting Datasheet AC Parameters ....................................... 85
`General Observations .................................................... 90
`Naming Conventions ..................................................... 91
`Capacitive Loading and Effects .................................... 92
`AC Read Characteristics ............................................... 93
`Read Specification Clarifications ................................. 94
`AC Write Characteristics .............................................. 95
`Write Specification Clarifications ................................ 96
`Performance Enhancements ....................................................... 98
`Caching ......................................................................... 98
`Shadowing ..................................................................... 98
`Hardware Interleaving ................................................... 99
`Summary .................................................................................. 104
`Chapter Six: Power Requirements and Design Techniques ................. 105
`The V cc Operating Voltage ..................................................... 106
`Read Mode (ICCR) ........................................................ 108
`Standby Mode (Iccs) ................................................... 109
`Deep Powerdown Mode (Icco) .................................... 110
`Program Mode (IccwlIccp) ........................................... lll
`Erase Mode (ICCE) ....................................................... 112
`The V pp ProgramJErase Voltage .............................................. 113
`Read/Standby Mode (IPPR and Ipps) ............................. 114
`Deep Powerdown Mode (IPPD) .................................... 114
`Program Mode (IppwlIppp) ............................................ 115
`Erase Mode (IpPE) ........................................................ 115
`V PP Generation Techniques ...................................................... 117
`Directly from a 12V Regulated Supply ....................... 117
`Converting from 12V Unregulated ............................. 118
`Converting from a Lower Voltage .............................. 118
`Converting from a Higher Voltage ............................. 120
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0010
`
`

`

`iv Designing with Flash Memory
`
`General Characteristics of Voltage Converters .......... 121
`Totally Modular Solutions ......................................... 122
`Bypass and Decoupling Capacitive Filtering .......................... 122
`Decoupling Capacitors-Vee ........................................ 123
`Bypass Capacitors-Vee ............................................... 124
`Decoupling Capacitors-Vpp ........................................ 124
`Mixed-Voltage System Design ................................................ 125
`3.3 Volt to 5 Volt Interfaces ....................................... 125
`5V to 3.3V Interfaces ................................................. 127
`Bidirectional Bus Interface ......................................... 130
`Power Management Techniques .............................................. 130
`Summary ................................... ~ .............................................. 132
`Chapter Seven: Software Interfacing to Flash Memory ....................... 133
`Why Is Flash Memory Controlled By System Software? ....... 134
`EPROM Programming Algorithm .............................. 134
`Flash Memory Programming ...................................... 136
`The NOR Bulk-Erase Flash Memory Algorithms ................... 139
`The Program Algorithm .............................................. 140
`The Chip Erase Algorithm .......................................... 143
`Summary of First-Generation ProgramminglErase
`Characteristics ............................................................ 148
`The NOR Fully-Automated Flash Memory Algorithms ......... 149
`Intel Automated Program Algorithm .......................... 151
`Intel Automated Block Erase Algorithm .................... 156
`Intel Automated Erase Suspend/Resume Algorithm .. 160
`Alternative Automated Algorithms ............................ 162
`General Automated Algorithm Techniques-Multiple
`Block Erase ................................................................. 168
`General Automated Algorithm Techniques-Page
`Programming .............................................................. 168
`General Automated Algorithm Techniques-Aborting
`Internal Automation .................................................... 168
`General Automated Algorithm Techniques-The
`RYlEY Output. ........................................................... 169
`Software Polling or Hardware Interrupt: Which Should
`You Use? .................................................................... 169
`Update Routines ...................................................................... 170
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0011
`
`

`

`Contents V
`
`Flexible Design Techniques ........................................ 172
`System Boot Code Contents .................................................... 173
`Software Interface to Flash Cards, SIMMs and Multi-
`Component Arrays ................................................................... 174
`Parallel Program of Non-Automated Flash
`Memories .................................................................. ,'.176
`Parallel Erase of Non-Automated Flash Memories .... 179
`Parallel ProgramJErase of Automated Flash
`Memories .................................................................... 183
`Summary .................................................................................. 184
`Chapter Eight: Hardware Interfacing Considerations for Flash Cards 187
`A Flash Memory Array Within a Card .................................... 187
`PCMCIA Flash Memory Cards ................................................ 188
`PCMCIA 1.0 ............................................................... 188
`PCMCIA 2.0 ............................................................... 189
`PCMCIA Signal Definitions ....................................... 193
`Host System Implementations ..................................... 211
`Implementing PCMCIA 2.0 Hardware .................................... 220
`Proprietary or Commercial Interface Controllers ....... 220
`Supporting Hardware for PCMCIA-Interface
`Controllers ................................................................... 220
`Accessing Flash Memory Cards with PCMCIA-
`Interface Controllers ................................................... 222
`More On Buffering ..................................................... 222
`Summary .................................................................................. 225
`Chapter Nine: Flash Memory File Systems .......................................... 227
`Introduction .............................................................................. 227
`Flash Memory Solid-State Drive Form Factors .......... 227
`Flash Memory Solid-State Drives Require Special
`Drivers ......................................................................... 228
`Disk-Drive Basics .................................................................... 229
`DOS Data Structures ................................................... 231
`Device Drivers ............................................................ 233
`Flash File System Designs ....................................................... 238
`Measuring Drive Usage .............................................. 239
`The Disk-Drive Emulators .......................................... 239
`Flash Optimized File Systems ..................................... 240
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0012
`
`

`

`vi Designing with Flash Memory
`
`The Disk-Drive Emulators ....................................................... 241
`Primitive Flash File Systems ...................................... 242
`Full-Featured Disk-Drive Emulators .......................... 247
`Flash Optimized FSSD's .......................................................... 252
`Accessing the Flash-Optimized FSSD ....................... 253
`Microsoft's Flash File System Design Criteria ........... 253
`Functional Description ............................................... 256
`Flash File System Evaluation .................................................. 265
`Performance - File Transfer Rate ............................... 265
`Performance - Clean-Up Efficiency ........................... 267
`Performance - Hot and Cold File Management.. ........ 268
`Reliability - Cycle Leveling ....................................... 268
`Reliability - Failure Recovery Modes ........................ 269
`System Level Issues - File System Overhead ............. 270
`System Level Issues - Ease of Use ............................. 270
`Summary .................................................................................. 271
`Chapter Ten: PCMCIA Software ......................................................... 273
`Introduction ............................................................................. 273
`The Areas of Software Compatibility ..................................... 274
`The PCMCIA-ExCA Relationship .......................................... 277
`Flash File System Models ....................................................... 279
`The Original Flash File System Model ...................... 279
`What's Really Necessary? ........................................... 282
`Socket Services ........................................................................ 282
`Defining the Adapter Hardware ................................. 283
`Accessing Socket Services ......................................... 284
`Installing Socket Services ........................................... 286
`The Socket Services Functions ................................................ 287
`Non-Specific Functions .............................................. 289
`Adapter Functions ...................................................... 292
`Window Functions ..................................................... 304
`Fields In The I/O Window Characteristics Table ....... 317
`Window Size .............................................................. 318
`Detecting Card Insertion ............................................. 347
`Error Detection and Correction Functions ................. 347
`Socket Service Design Considerations and Benefits ............... 348
`The Card Information Structure .............................................. 349
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0013
`
`

`

`Contents vii
`
`Accessing the Card Information Structure ................. 350
`The Device Information Tuple ................................... 356
`Card Services ........................................................................... 363
`What is Card Services? .............................................. 364
`Do You Need Card Services? ..................................... 366
`Flash Card Memory Technology Drivers ............................... 366
`Why Support New Cards? .......................................... 367
`Flash Card Driver Functions ...................................... 367
`Interfacing to the Flash Card Driver .......................... 368
`Installing the Flash Card Drivers ............................... 368
`Summary ................................................................................. 371
`Appendix A: Flash Memory Component Vendors .............................. 373
`Appendix B: Flash Memory CardlDrive Vendors ............................... 375
`Appendix C: Flash Memory Component and Card Programmers ....... 379
`Appendix D: Component and Card Socket and Adapter Vendors ....... 383
`Appendix E: 12V Converters ............................................................... 387
`Appendix F: Flash Memory Card Readers and Writers ....................... 391
`Appendix G: Flash File Systems .......................................................... 395
`Appendix H: PCMCIA and Software Vendors .................................... 397
`Appendix I: PCMCIA Compliance Testing Facilities ......................... 399
`Appendix J: PCMCIA Card Types ....................................................... 401
`Appendix K: PCMCIA Controller Register Functions and Vendors ... 403
`Appendix L: INT 21H Standard Disk-Related Functions .................... 409
`Appendix M: Sample Flash File System Benchmarking Code ............ 411
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0014
`
`

`

`viii Designing with Flash Memory
`
`Figures
`
`1.1: The Exploding Flash Memory Market ............................................. 1
`1.2: Flash Memory Cell Simplicity Enables Cost-Effective
`Manufacturing ................................................................................... 2
`1.3: Average Selling Price for 1 Mbyte of Flash Memory Storage ......... 3
`1.4: . Flash Memory Satisfies Many Ideal Memory Attributes ................. 7
`2.1: BIOS Glues Common Software to Unique Hardware .................... 17
`2.2: Energy Consumed During Various Acitivties ................................ 20
`2.3: Elan Flash Memory Card ReaderIWriter ........................................ 21
`3.1: Dataquest 1992 Flash Memory Market Share (by company) ......... 24
`3.2: ETOXTM Flash Memory Cell Similarities Leverage EPROM
`Learning Curve ............................................................................... 25
`3.3: ETOXTM Flash Memory Cell Being Read ...................................... 26
`3.4: NOR Flash Memory Array Interconnect ........................................ 26
`3.5: ETOXTM Flash Memory Cell Being Programmed ......................... 27
`3.6: EPROM Cell Being UV Erased ..................................................... 28
`3.7: ETOXTM Flash Memory Cell Being Erased ................................... 28
`3.8: Negative Gate Erase ....................................................................... 30
`3.9: Iterative Basic Flash Memory Erase Algorithm ............................. 31
`3.10: EEPROM-Based Flash Memory Cell ........................................... 33
`3.11: EEPROM-Based Flash Memory Cell Being Erased .................... 34
`3.12: EEPROM-Based Flash Memory Cell Being Programmed ........... 35
`3.13: NAND Flash Memory Cell Being Read ....................................... 36
`3.14: NAND Flash Memory Array Interconnect.. ................................. 37
`3.15: NAND Flash Memory Cell Being Programmed .......................... 37
`3.16: NAND Flash Memory Cell Being Erased .................................... 38
`4.1: DIP (Dual In-Line) Package Dimensions ....................................... 47
`4.2: DIP / TSOP Package Comparison (Actual Size) ............................ 48
`4.3: LCC (Leaded Chip Carrier) Package Dimensions ......................... 50
`4.4: Trace Layout Comparison: PSOP vs. PLCC .................................. 51
`4.5: Small Outline J-Lead (SOJ) Package Dimensions ......................... 53
`4.6: Small Outline Package (SOP) Dimensions .................................... 55
`4.7: TSOP (Thin Small Outline Package) Dimensions ......................... 56
`4.8: Standard and Reverse TSOP Packages ........................................... 57
`4.9: TSOP Serpentine Package Layout.. ................................................ 58
`4.10: SIMM Package Dimensions ......................................................... 60
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0015
`
`

`

`Contents
`
`ix
`
`4.11: SCM Microsystems Flash Memory SIMM Pinout ...................... 61
`4.12: PCMCIA / JEIDA Type 1 PC Card Package Dimensions ........... 64
`4.13: PCMCIA / JEIDA Type 2 PC Card Package Dimensions ........... 64
`4.14: Mass Storage Architecture ........................................................... 66
`4.15: Flash Drive Architecture .............................................................. 66
`4.16: Design Considerations During On-Board Update ........................ 69
`4.17: Key Elements ofIn-System Update ............................................. 70
`5.1: ProcessorlFlash Memory Interface (separate address and data
`buses, distinct read and write, one flash memory) ......................... 74
`5.2: Processor / Flash Memory Interface (multiplexed address/data
`lines, multiplexed read/write, two x8 flash memories) .................. 74
`5.3: V pp Switch Circuit .......................................................................... 80
`5.4: Maxim MAX705, Used for Vee and Vpp Monitoring .................... 82
`5.5: Intel 28FOOIBX Boot Block Flash Memory Map .......................... 83
`5.6: Wired-OR RYlEY Implementation ............................................... 85
`5.7: Flash Memory Read Access Time Partitioning ............................. 86
`5.8: AC Input/Output Reference Waveform ......................................... 86
`5.9: AC Testing Load Circuit.. .............................................................. 87
`5.10: High Speed Input / Output Reference Waveform ........................ 87
`5.11: High Speed AC Testing Load Circuit.. ........................................ 87
`5.12: AC Waveforms for Read Operations ........................................... 88
`5.13: AC Waveforms for Write Operation ............................................ 89
`5.14: Example Ordering Information Table .......................................... 90
`5.15: Hardware Interleaving - Utilizes Common CE, Unique OE
`and WE ......................................................................................... 100
`5.16: Hardware Interleaving - State Transition Diagram .................... 103
`6.1 : Vee Current (Typical) - Read Mode ............................................ 109
`6.2: Vee Current (Typical) - Program Mode ....................................... 111
`6.3 : Vee Current (Typical) - Erase Mode ............................................ 112
`6.4: Vpp Current (Typical) - Program Mode ....................................... 114
`6.5: Vpp Current (Typical) - Erase Mode ............................................ 115
`6.6: Vpp Current (Typical) - Beginning of an Erase Pulse .................. 116
`6.7: Linear Technology LT1110 5V to 12V Converter ...................... 118
`6.8: Motorola MC34063A 5V to 12V Converter ................................ 119
`6.9: Maxim MAX732 3V to 12V Converter ....................................... 119
`6.10: Maxim MAX667 12V Linear Voltage Regulator ...................... 120
`6.11: Linear Technology LT1111 Voltage Step Down Switcher ........ 120
`
`APPLE INC.
`EXHIBIT 1111 - PAGE 0016
`
`

`

`x Designing with Flash Memory
`
`6.12: Interfacing a 3.3V Device to a 5V Device (TIL Inputs) .......... 126
`6.13: Interfacing a 3.3V Device to a 5V Device (CMOS Inputs) ...... 127
`6.14: Interfacing a 5V Device to a 3.3V Device ................................. 128
`6.15: 5V to 3.3V Direct Interface. Overbiasing the ESD Input Diode 128
`6.16: Interfacing a 5V Device to a 3.3V Device - Series Resistor
`Voltage Drop ................................................................................ 129
`6.17: Interfacing a 5V Device to a 3.3V Device.- ............................... 129
`7.1: EPROM Programming Algorithm (Simplified Form) .................. 135
`7.2: Intel First Generation Flash Memory Non-Automated Programming
`Algorithm ...................................................................................... 137
`7.3: Intel First Generation Flash Memory Non-Automated Erase
`Algorithm ......... , ............................. ~ .............................................. 144
`7.4: Intel Automated Flash Memory Program Algorithm ................... 152
`7.5: Intel Automated Flash Memory Status Register .......................... 155
`7.6: Intel Automated Flash Memory Block Erase Algorithm .............. 157
`7.7: Intel Automated Erase Suspend / Resume Algorithm .................. 161
`7.8: AMD 5V-Only Automated Program Algorithm ........................... 165
`7.9: AMD 5V-Only Automated Erase Algorithm ............................... 166
`7.10: AMD 5V-Only Automated Data Polling and Toggle Bit
`Algorithm ...................................................................................... 167
`7.11: Parallel Programming of Non-Automated Flash Memories ....... 177
`7.12: Parallel Erase of Non-Automated Flash Memories .................... 180
`7.13: Parallel Program / Erase of Automated Flash Memories ........... 184
`8.1: PCMCIA 1.0 Flash Memory Card ................................................ 190
`8.2: Intel Series 2 Flash Memory Card ................................................ 191
`8.3: PCMCIA Electrical Interface Categories ..................................... 193
`8.4: PCMCIA Read Timing Waveform ............................................... 195
`8.5: Aliasing Caused by Inadequate Address Line Decoding ............. 195
`8.6: Internal Component Arrangement Dictated by Flash Memory
`Architecture .......................