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`1. A process for fabricating a product using a plasma
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`source, said process comprising the steps of subjecting a
`substrate to entities, at least one of said entities emanating
`from a gaseous discharge excited by a high frequency field
`from an inductive coupling structure in which a phase
`portion and an anti -phase portion of capacitive currents
`coupled from the inductive coupling structure are selectively
`balanced;
` wherein said inductive coupling structure is adjusted
`using a wave adjustment circuit, said wave adjustment
`circuit adjusting the phase portion and the anti -phase
`portion of the capacitively coupled currents.
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`LAM Ex 1029-p. 1
`LAM v FLAMM
`IPR2015-01767
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`Figure 2A Of The ’221 Patent
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`LAM Ex 1029-p. 2
`LAM v FLAMM
`IPR2015-01767
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`Figure 4 Of The ’221 Patent
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`LAM Ex 1029-p. 3
`LAM v FLAMM
`IPR2015-01767
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`W
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`LAM EX 1029—p. 4
`LAM V FLAMM
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`|PR2015—01767
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`LAM Ex 1029-p. 4
`LAM v FLAMM
`IPR2015-01767
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`LAM Ex1029—p. 5
`LAM v FLAMM
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`|PR2015-01767
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`LAM Ex 1029-p. 5
`LAM v FLAMM
`IPR2015-01767