`(12) Reissued Patent
`Flamm
`
`US RE40,264 E
`(10) Patent Number:
`(45) Date of Reissued Patent:
`Apr. 29, 2008
`
`USO0RE40264E
`
`(54) MULTI-TEMPERATURE PROCESSING
`
`5,700,734 A
`5,705,433 A *
`
`...................... .. 438/592
`12/1997 Ooishi
`1/1998 Olson et al.
`438/695
`
`
`
`
`
`(76)
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`(21) APP1, N01 10/439,245
`.
`Ffled:
`(22)
`May 14’ 2003
`
`Related U-S- Patent D°°“m°“tS
`
`Reissue 0ft
`(64) Patent No.:
`Issued:
`App]. N0;
`Filed;
`
`6,231,776
`May 15, 2001
`09/151,163
`sep_ 10, 1993
`
`(63) Continuation-in-part of application No. 08/567,224, filed on
`Dec. 4, 1995, now abandoned.
`Provisional application No. 60/058,650, filed on Sep. 11,
`1997.
`
`(60)
`
`438/719
`--------- --
`5/1998 1i_Z111<a
`5,756,401 A
`Inventor: Daniel L. Flamm, 476 Green View Dr.,
`1/132: 11------- 81.61::
`cw 252225222:
`1c er e
`.
`.
`,
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`7/1999 Rice et al.
`. . . . .
`. . . . .. 156/345
`5,925,212 A
`8/1999 Fong etal.
`.. 315/111.21
`5,939,831 A
`9/1999 G
`hart
`.................. .. 216/67
`5,948,283 A
`5,965,034 A * 10/1999 Virr(1):;radov et al.
`........ .. 216/68
`6,008,139 A
`12/1999 Pan et al.
`........... ..
`438/730
`6 033 478 A
`3/2000 Kholodenko
`118/500
`6,042,901 A
`3/2000 Denison et al.
`427/579
`6,048,798 A
`4/2000 Gadgil etal.
`............. .. 438/714
`6,068,784 A
`5/2000 Collins et al.
`.............. .. 216/68
`6,077,357 A
`6/2000 Rossman et al.
`.
`118/728
`6,087,264 A
`7/2000 Sh1n et al.
`...... ..
`438/706
`6,090,303 A
`7/2000 Collins et al.
`216/68
`2’122’§1i:t
`12/5233 6:14 AAAAAAAAAAAA~ 32/222
`’
`’
`0 ms e a ' """""" "
`6,167,834 B1
`1/2001 Wang et al.
`.............. .. 418/723
`6’391’148 B2
`5/2002 Marks et 31'
`6,486,069 B1
`11/2002 Marks et al.
`2001/0003676 A1
`6/2001 Marks et al.
`
`FOREIGN PATENT DOCUMENTS
`
`EP
`JP
`
`1236226 A2
`59076876 A *
`
`7/2001
`5/1984
`
`7/2001
`
`W0'°1/41189 A2
`W0
`* cited by examiner
`Primary Examiner—Anita Alanko
`(74) Attorney, Agent, or Firm—Daniel L. Flamm
`(57)
`ABSTRACT
`
`including a
`The present invention provides a technique,
`method and apparatus, for etching a substrate in the manu-
`facture of a device. The apparatus includes a chamber and a
`substrate holder disposed in the chamber. The substrate
`holder has a selected thermal mass to facilitate changing the
`temperature of ‘the substrate to be etched during etching
`processes. That 1s, the selected thermal mass ofthe substrate
`helder a110WS for a Change from 21 firet Ielnperature 10 8
`second temperature within a character1st1c t1me per1od to
`process a film. The present technique can, for example,
`provide different processing temperatures during an etching
`process or the like.
`
`59 Claims, 15 Drawing Sheets
`
`LAM Exh 1001-pg 1
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`(51)
`
`Int‘ Cl‘
`H05H 1/00
`H01L 21/302
`
`(2006.01)
`(2006.01)
`
`(52) U.s. Cl.
`
`........................... .. 216/59; 216/67; 216/68;
`216/74; 438/714; 438/715; 204/192.32;
`15634552; 156/34553
`(58) Field of Classification Search ............... .. 438/715,
`438/719, 721, 725, 737, 738; 216/41, 49,
`216/63—67, 75, 79; 156/345.27, 345.52, 345.53
`See application file for complete search history.
`
`(56)
`
`References Cited
`
`U~S~ PATENT DOCUMENTS
`5,179,264 A
`1/1993 Cuomo et al.
`....... N 219/121.43
`5,294,778 A
`3/1994 Carman et al.
`........... N 219/385
`5,320,982 A *
`6/1994 Tsubone et al.
`428/714
`5,556,204 A *
`9/1996 Tamum et al.
`374/161
`5,571,366 A
`11/1996 Ishii
`. . . . . . . . . . . .
`. . . .. 156/345
`5,609,720 A *
`3/ 1997 LeI1Z et 31,
`--
`433/715
`5,645,683 A
`7/1997 Miyamoto .... ..
`.. 156/643.1
`5,667,631 A
`9/1997 Holland et al.
`.
`..... .. 216/13
`5,695,564 A
`12/1997 Imahashi
`.................. .. 118/719
`
`
`
`..
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`LAM Exh 1001-pg 1
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`U.S. Patent
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`Apr. 29,2008
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`Apr. 29,2008
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`U.S. Patent
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`Apr. 29,2008
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`Sheet 3 of 15
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`US RE40,264 E
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`55
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`FIG. 26‘
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`57
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`Apr. 29,2008
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`Sheet 6 of 15
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`US RE40,264 E
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`151
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`(132
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`3 O
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`1530
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`M
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`Fig. 3
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`Apr. 29,2008
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`Sheet 7 of 15
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`l‘§‘CCCiC€.
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`=
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`"—
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`U.S. Patent
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`Apr. 29,2008
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`Sheet 8 of 15
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`US RE40,264 E
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`FIG.
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`.54
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