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`NVIDIA Corp.
`Exhibit 1113
`Page 001
`
`NVIDIA Corp.
`Exhibit 1113
`Page 001
`
`

`

`11
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`NVIDIA Corp.
`Exhlblt 1113
`Page 002
`
`NVIDIA Corp.
`Exhibit 1113
`Page 002
`
`

`

` Electronic Packaging and Interconnection Series
`
`Charles Harper, Series Advisor
`
`R P
`
`ublished Books
`
`HARPER . Electronic Packaging and Interconnection Handbook Related Books of Interest
`
`CLASSON - Surface Mount Technology for Concurrent Engineering
`and Manufacturing
`'
`
`BENSON . Audio Engineering Handbook
`BENSON AND WHITAKER . Television Engineering Handbook
`BOSWELL - Subcontracting Electronics
`BOSWELL AND WICKAM . Surface Mount Guidelines for Process
`Control, Quality, and Reliability
`BYERS - Printed Circuit Board Design with Microcomputers
`CAPILLO - Surface Mount Technology
`CHEN . Computer Engineering Handbook
`COOMBS - Printed Circuits Handbook
`DI GIACOMO - Digital Bus Handbook
`DI GIACOMO - VLSI Handbook
`
`FINK AND CHRISTIANSEN - Electronics Engineers’ Handbook
`GINSBERG . Printed Circuit Board Design
`JOHNSON - Antenna Engineering Handbook
`JURAN AND GnYNA - Juran’s Quality Control Handbook
`KAUFMAN AND SEIDMAN - Handbook ofElectronics Calculations
`LENK . McGraw-Hill Electronic Testing Handbook
`LENK - McGraw-Hill Circuit Encyclopedia and Troubleshooting
`Guide
`
`LENK - Lenk’s Digital Handbook
`PERRY - VHDL
`
`RAO - Multilevel Interconnection Technology
`SZE . VLSI Technology
`TUMA . Engineering Mathematics Handbook
`VAN ZANT . Microchip Fabrication
`WAYNANT . Electra-Optics Handbook
`
`To order or receive additional information on
`these or any other McGraw-Hill titles, in the United
`States please call 1800-8212-8158. In other countries,
`please contact your local McGraw-Hill representative
`
`MH92
`
`
`
`NVIDIACoip.
`Exhibit 1113
`Page 003
`
`NVIDIA Corp.
`Exhibit 1113
`Page 003
`
`

`

`Library of Congress Cataloging-in-Publication Data
`
`92-40712
`CIP
`
`Copyright © 1993 by McGraw-Hill, Inc. All rights reserved. Printed in
`the United States of America. Except as permitted under the United
`States Copyright Act of 1976, no part of this publication may be repro»
`duced or distributed in any form or by any means, or stored in a data
`base or retrieval system, without the prior written permission of the
`publisher.
`
`1234567890 DOC/DOC 99876543
`
`Harper, Charles A.
`Electronic packaging, microelectronics, and interconnection
`dictionary / Charles A. Harper, Martin B. Miller.
`p.
`cm. — (Electronic packaging and interconnection series)
`Includes index.
`ISBN 0-07-026688-3
`2. Microelectronic
`1. Electronic packaging—Dictionaries.
`packaging—Dictionaries.
`3. Electronic apparatus and appliances—
`Design and construction—Dictionaries.
`I. Miller, Martin B.
`(Martin Boniface).
`II. Title.
`II]. Series.
`TK7804.H34
`1993
`621.381’046’3—dc20
`
`
`
`ISBN EI-D?-DEI:I=&E--3
`
`The sponsoring editor for this book was Daniel A. Gonneau, the editing
`supervisor was Kimberly A Goff and the production supervisor was
`Donald F. Schmidt.
`
`Printed and bound by R. R. Donnelley & Sons Company.
`
`, TmT§7_fi'—‘T".’
`
`‘M‘F’t.
`
`NVIDIA Corp.
`Exhibit 11 13
`Page 004
`
`NVIDIA Corp.
`Exhibit 1113
`Page 004
`
`

`

`Screened resistors and
`Dry Print
`conductors that have been proc—
`essed through the drying cycle,
`removing the solvents from the
`thick—film paste, but not yet fired.
`
`
`
`Dry Strength The strength of an
`adhesive joint determined immedi—
`ately after drying under specified
`conditions or after a period of con—
`ditioning in the standard laboratory
`atmosphere.
`See
`also Wet
`Strength.
`
`Dual in-Line Package (DIP) An elec-
`tronic package containing an inte-
`grated circuit chip which is con-
`nected to terminals or
`leads that
`are positioned in two straight rows
`on the sides of the package, and
`have standard spacings between
`the leads and between the rows of
`leads. These leads are oriented
`perpendicular to the seating plane
`for
`inserting into interconnecting
`holes in a substrate. See Fig. 3.
`
`/\\
`
`ii
`
`(“it
`,
`in? W.)
`i,
`
`Figure 3: Dual in-Line
`
`A soldering
`Dual-Wave Soldering
`process that utilizes both a turbu—
`lent wave and a laminar wave. The
`turbulent wave gets into small,
`constricted areas to ensure good
`coverage, while the laminar wave
`
`
`
`
`dry print
`
`dye penetrantx
`
`
`
`
`
`
`
`removes solder projections.
`also Wave Soldering.
`
`See
`
`Ductility The ability of a material to
`deform plastically before fracturing.
`
`A part
`Dummy Connector Plug
`included in the total design of a
`connector to mate with a connector
`but not
`to perform an electrical
`function.
`
`A
`Dummy Connector Receptacle
`part included in the total design of
`a connector that mates with a plug
`connector but cannot be attached
`to a cable.
`It is used to seal out
`moisture.
`
`Dummying A process in which a
`metal plate having a large total area
`is placed in an electroplating solu-
`tion, attached to the cathode, and
`used for removing impurities from
`the solution.
`
`Durometer An instrument used to
`measure the hardness of a nonmet—
`al such as rubber or plastic. Avail-
`able in different types to cover the
`ranges of soft, medium, and hard
`materials.
`
`Duty Cycle The specified operating
`and nonoperating times of equip—
`ment.
`
`A liquid material
`Dye Penetrant
`containing
`fluorescent particles,
`usually red, and a carrier fluid that
`is used to detect cracks in solid
`parts or to locate a gross leak in a
`sealed electronic package.
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`NVIDIA Corp.
`Exhibit 1113
`Page 005
`
`NVIDIA Corp.
`Exhibit 1113
`Page 005
`
`