`
`Claim 13
`Claim 11
`Claim 1
`13. A method of fabricat ing a
`11. A method of fabricating a
`1. A method of fabricating a
`microelectronic device, comprising microelectronic device, comprising microelect ronic device, comprising
`the steps of:
`t he steps of:
`the steps of:
`furnishing a first substrate having
`furnishing a first substrate having
`furnishing a first substrate having a
`an etchable layer, an etch-stop
`an etchable layer, an et ch-stop
`silicon etchable layer, a si licon
`layer overlying the et chable layer,
`dioxide et ch-stop layer overlying
`layer overlying the etchable layer,
`and a wafer overlying t he etch-st op and a wafer overlying the etch-stop
`the silicon layer, and a single-cryst al
`silicon wafer overlying the etch-
`layer;
`layer;
`stop layer, the wafer having a front
`surface not contacting the si licon
`dioxide layer;
`forming a microelect ronic circuit
`element in t he front surf ace of the
`single-crysta l silicon wafer;
`
`forming a microelect ronic circuit
`element in t he exposed side of t he
`wafer of the first substrate
`opposite t he side overlying the
`et ch-stop layer;
`at taching the front surf ace of the
`attaching the wafer of the first
`substrate to a second substrate, the single-crysta l silicon wafer to a first
`second substrate having a second
`side of a second substrate; and
`microelectronic circuit element
`t herein;
`making an electrical contact from
`t he microelectronic circuit element
`
`forming a microelectronic circuit
`element in the exposed side of the
`wafer of t he first substrate
`opposite to t he side overlying the
`etch-stop layer;
`att aching the wafer of t he first
`substrate to a second substrate;
`and
`
`001
`
`SONY 1020
`
`
`
`in the wafer of the first substrate to
`the second microelectronic circuit
`element on the second substrate;
`and
`etching away the etchable layer of
`the first substrate down to the
`etch-stop layer; and
`
`
`forming an electrical connection to
`the microelectronic circuit element
`in the wafer of the first substrate
`through the etch-stop layer.
`
`etching away the etchable layer of
`the first substrate down to the
`etch-stop layer.
`
`
`
`
`
`
`etching away the silicon etchable
`layer down to the silicon dioxide
`etch-stop layer
`using an etchant that attacks the
`silicon layer but not the silicon
`dioxide layer.
`
`
`002
Accessing this document will incur an additional charge of $.
After purchase, you can access this document again without charge.
Accept $ Charge
Still Working On It
This document is taking longer than usual to download. This can happen if we need to contact the court directly to obtain the document and their servers are running slowly.
Give it another minute or two to complete, and then try the refresh button.
A few More Minutes ... Still Working
It can take up to 5 minutes for us to download a document if the court servers are running slowly.
Thank you for your continued patience.
This document could not be displayed.
We could not find this document within its docket. Please go back to the docket page and check the link. If that does not work, go back to the docket and refresh it to pull the newest information.
Your account does not support viewing this document.
You need a Paid Account to view this document. Click here to change your account type.
Your account does not support viewing this document.
Set your membership
status to view this document.
With a Docket Alarm membership, you'll
get a whole lot more, including:
- Up-to-date information for this case.
- Email alerts whenever there is an update.
- Full text search for other cases.
- Get email alerts whenever a new case matches your search.
One Moment Please
The filing “” is large (MB) and is being downloaded.
Please refresh this page in a few minutes to see if the filing has been downloaded. The filing will also be emailed to you when the download completes.
Your document is on its way!
If you do not receive the document in five minutes, contact support at support@docketalarm.com.
Sealed Document
We are unable to display this document, it may be under a court ordered seal.
If you have proper credentials to access the file, you may proceed directly to the court's system using your government issued username and password.
Access Government Site
