UNITED STATES PATENT AND TRADEMARK OFFICE
`
`____________________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`
`____________________
`
`MICRON TECHNOLOGY, INC., AND MICRON MEMORY JAPAN, INC.,
`Petitioners
`
`v.
`
`MASSACHUSETTS INSTITUTE OF TECHNOLOGY,
`Patent Owner
`____________________
`
`Case: IPR2015-01087
`U.S. Patent No. 6,057,221
`____________________
`
`
`
`PETITIONERS’ CORRECTED UPDATED EXHIBIT LIST
` (AS OF DECEMBER 7, 2015)
`
`
`
`____________________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`
`____________________
`
`MICRON TECHNOLOGY, INC., AND MICRON MEMORY JAPAN, INC.,
`Petitioners
`
`v.
`
`MASSACHUSETTS INSTITUTE OF TECHNOLOGY,
`Patent Owner
`____________________
`
`Case: IPR2015-01087
`U.S. Patent No. 6,057,221
`____________________
`
`
`
`PETITIONERS’ CORRECTED UPDATED EXHIBIT LIST
` (AS OF DECEMBER 7, 2015)
`
`
`
`Paper No 18
`
`
`
`
`
`
`Case No. IPR2015-01087
` Filed December 7, 2015
`
`
`
`
`
`U.S. Patent No. 6,057,221
`Pursuant to 37 C.F.R. § 42.63(e) and § 42.64(b)(2), Petitioners Micron
`
`Technology, Inc. (“Micron”) and Micron Memory Japan, Inc. (“Micron Memory
`
`Japan” or “MMJ”) (collectively “Petitioners”) submit the following corrected and
`
`updated Exhibit List identifying the exhibit number and a brief description of
`
`each exhibit filed in connection with the above captioned IPR2015-01087.
`
`CORRECTED UPDATED EXHIBIT LIST
`
`Exhibit #
`
`Exhibit Description
`
`1001
`
`1002
`
`1003
`
`1004
`
`1005
`
`1006
`
`1007
`
`Declaration of Dr. Michael Thomas
`
`Curriculum Vitae of Dr. Michael Thomas
`
`U.S. Patent No. 6,057,221
`
`File History for U.S. Patent No. 6,057,221
`
`The New IEEE Standard Dictionary of Electrical and Electronic
`Terms, Fifth Ed., Institute of Electrical and Electronics Engineers,
`Inc., New York (1993)
`
`Japan Pat. Appl. Publ. No. 8-213465 to Koyou (including English
`translation and supporting declaration)
`
`Japan Pat. Appl. Publ. No. 6-244285 to Wada, et al. (including
`English translation and supporting declaration)
`
`1008
`
`U.S. Patent No. 5,729,042 to Lou et al.
`
`1009
`
`U.S. Patent Application No. 514,800 filed August 14, 1995 (to which
`U.S. Pat. No. 5,729,042 claims priority)
`
`1010
`
`U.S. Patent No. 5,025,300 to Billig et al.
`
`1011
`
`Ex Parte Reexamination Application No. 90/011,607, Request for Ex
`Parte Reexamination filed March 30, 2011
`
`
`
`1
`
`
`
`Paper No 18
`
`
`
`
`
`
`Case No. IPR2015-01087
` Filed December 7, 2015
`
`
`
`
`
`U.S. Patent No. 6,057,221
`Ex Parte Reexamination Application No. 90/011,607, Corrected Pre-
`amendment under 35 C.F.R. 1.530 filed April 14, 2011
`
`1012
`
`1013
`
`1014
`
`1015
`
`1016
`
`1017
`
`1018
`
`1019
`
`1020
`
`1021
`
`1022
`
`1023
`
`1024
`
`1025
`
`1026
`
`Ex Parte Reexamination Application No. 90/011,607, Order Granting
`Request for Ex Parte Reexamination filed June 23, 2011
`
`Ex Parte Reexamination Application No. 90/011,607, Non-Final
`Office Action of January 26, 2012
`
`Ex Parte Reexamination Application No. 90/011,607, Request for
`Reconsideration filed March 26, 2012
`
`Ex Parte Reexamination Application No. 90/011,607, Declaration of
`Dr. Bernstein filed March 26, 2012
`
`Ex Parte Reexamination Application No. 90/011,607, Notice of Intent
`to Issue Ex Parte Reexamination Certificate of July 11, 2012
`
`“Thermal Conductivity of Metals,” The Engineering
`ToolBox, http://www.engineeringtoolbox.com/thermal-conductivity-
`metals-d_858.html (last visited April 1, 2015)
`
`Pierson, Handbook of Refractory Carbides and Nitrides:
`Properties, Characteristics, Processing, and Applications, Noyes
`Publications (1996) (excerpt including p. 193)
`
`U.S. Patent No. 5,872,389 to Nishimura et al.
`
`U.S. Patent No. 5,675,174 to Nakajima
`
`U.S. Patent No. 5,538,924 to Chen
`
`U.S. Patent No. 5,300,461 to Ting
`
`U.S. Patent No. 5,729,041 to Yoo
`
`U.S. Patent No. 5,747,869 to Prall
`
`Wilson et al., Handbook of Multilevel Metallization For Integrated
`Circuits: Materials, Technology, and Applications, Noyes
`Publications (1993)
`
`
`
`2
`
`
`
`Paper No 18
`
`
`
`
`
`
`Case No. IPR2015-01087
` Filed December 7, 2015
`
`
`
`
`
`U.S. Patent No. 6,057,221
`1027 Wolf, Silicon Processing for the VLSI ERA Volume 2: Process
`Integration, Lattice Press, Sunset CA (1990)
`
`1028
`
`1029
`
`1030
`
`1031
`
`1032
`
`1033
`
`1034
`
`1035
`
`Construction Analyses of the Samsung KM44C4000J-7 16 Megabit
`DRAM, published by Integrated Circuit Engineering, Scottsdale AZ,
`Report No. SCA 9311-3001 (available at
`http://smithsonianchips.si.edu/ice/cd/9311_300.pdf)
`
`Construction Analyses of the Lattice ispLSI2032-180L CPLD,
`published by Integrated Circuit Engineering, Scottsdale AZ, Report
`No. SCA 9712-573 (available at
`http://smithsonianchips.si.edu/ice/cd/9712_573.pdf)
`
`Construction Analysis of the Intel Pentium Processor w/MMX,
`published by Integrated Circuit Engineering, Scottsdale AZ, Report
`No. SCA 9706-540 (available at
`http://smithsonianchips.si.edu/ice/cd/9706_540.pdf)
`
`“Intel Introduces The Pentium® Processor With MMX™
`Technology,”
`http://www.intel.com/pressroom/archive/releases/1997/dp010897.htm
`(last visited April 14, 2015)
`
`“Intel Microprocessor Quick Reference Guide,”
`http://www.intel.com/pressroom/kits/quickreffam.htm#pentium (last
`visited April 26, 2015)
`
`Construction Analyses of the Motorola PC603R Microprocessor,
`published by Integrated Circuit Engineering, Scottsdale AZ, Report
`No. SCA 9709-551 (available at
`http://smithsonianchips.si.edu/ice/cd/9709_551.pdf)
`
`Construction Analyses of the Toshiba TC5165165AFT-50 64 Mbit
`DRAM, published by Integrated Circuit Engineering, Scottsdale AZ,
`Report No. SCA 9702-524 (available at
`http://smithsonianchips.si.edu/ice/cd/9702_524.pdf)
`
`“Material: Stainless steel, bulk,”
`https://www.memsnet.org/material/stainlesssteelbulk/ (last visited
`April 14, 2015)
`
`
`
`3
`
`
`
`
`
`
`
`
`Case No. IPR2015-01087
`
`
`
`
`
`U.S. Patent No. 6,057,221
`“Material: Silicon Dioxide (SiO2), bulk,”
`https://www.memsnet.org/material/silicondioxidesio2bulk/ (last
`visited April 14, 2015)
`
`Paper No 18
`
` Filed December 7, 2015
`
`1036
`
`1037
`
`1038
`
`1039
`
`1040
`
`1041
`
`1042
`
`1043
`
`1044
`
`1045
`
`1046
`
`1047
`
`Osaka, et al. “Development of new electrolytic and electroless gold
`plating processes for electronics applications,” Science and
`Technology of Advanced Materials, vol. 7 (2006), pp. 425-437.
`
`Uttecht et al., "A four-level-metal fully planarized interconnect
`technology for dense high performance logic and SRAM
`applications," VLSI Multilevel Interconnection Conference, 1991,
`Proceedings, Eighth International IEEE, June 11-12, 1991, pp. 20-26
`
`Ex Parte Reexamination Application No. 90/011,607, Patent Owner
`Statement filed August 12, 2011
`
`Seshan ed., Handbook of Thin-Film Deposition Processes and
`Techniques: Principles, Methods, Equipment and Applications,
`Second Ed., Noyes Publications, New York (2002)
`
`Vlassak, et al., “A new bulge test technique for the determination of
`Young’s modulus and Poisson’s ratio of thin films”, J. Mater. Res.,
`Vol. 7, No. 12, Dec 1992
`
`Ineos USA LLC v. Berry Plastics Corp., No 2014-1540, 2015 WL
`1727013, (Fed. Cir. Apr. 16, 2015) (precedential)
`
`Affidavit of Thomas R. Makin in Support of Motion for Pro Hac
`Vice Admission
`
`Affidavit of Rose Cordero Prey in Support of Motion for Pro Hac
`Vice Admission
`
`Pierson, Handbook of Refractory Carbides and Nitrides:
`Properties, Characteristics, Processing, and Applications, Noyes
`Publications (1996) (excerpt including pp. 181-208)
`
`Ex Parte Reexamination Application No. 90/011,607, Exhibit B to
`Declaration of Dr. Bernstein filed March 26, 2012
`
`Ex Parte Reexamination Application No. 90/011,607, Exhibit C to
`Declaration of Dr. Bernstein filed March 26, 2012
`
`
`
`4
`
`
`
`Paper No 18
`
`
`
`
`
`
`Case No. IPR2015-01087
` Filed December 7, 2015
`
`
`
`
`
`U.S. Patent No. 6,057,221
`ICANN query result for SI.EDU (available at
`http://whois.icann.org/en/lookup?name=smithsonianchips.si.edu)
`(printed 11/25/2015)
`
`1048
`
`1049
`
`1050
`
`1051
`
`Printout of “Smithsonian: The Chip Collection” webpage available at
`(http://smithsonianchips.si.edu/) (printed 11/25/2015)
`
`Printout of webpage at “ICE - Integrated Circuit Engineering
`Corporation” link on “Smithsonian: The Chip Collection” webpage
`available at (http://smithsonianchips.si.edu/) (printed 11/25/2015)
`
`Printout of webpage at “Series 4, Construction Analysis” link within
`webpage at “ICE - Integrated Circuit Engineering Corporation” link
`on “Smithsonian: The Chip Collection” webpage available at
`(http://smithsonianchips.si.edu/) (printed 11/25/2015)
`
`1052
`
`Declaration of David Cooperberg
`
`1053
`
`“Intel adds more muscles to its Pentium processor,” The Star-Ledger,
`Jan. 9, 1997
`
`1054
`
`Declaration of Timothy Butler
`
`
`
`Respectfully submitted,
`/Michael S. Turner/
`Michael S. Turner
`Reg. No. 60,314
`Lead Counsel for Petitioners
`
`
`Dated: December 7, 2015
`
`
`
`Michael S. Turner
`Rose Cordero Prey
`Kenyon & Kenyon LLP
`One Broadway
`New York, NY 10004
`Telephone: 212.425.7200
`Facsimile: 212.425.5288
`
`
`
`5
`
`
`
`
`
`
`
`Certificate of Service
`
`The undersigned hereby confirms that the foregoing PETITIONERS’
`
`CORRECTED UPDATED EXHIBIT LIST and exhibits 1045–1054 were
`
`served on Counsel for Patent Owner via e-mail as follows:
`
`Steven J. Pollinger
`MCKOOL SMITH, P.C.
`300 W. Sixth Street, Suite 1700
`Austin, Texas 78701
`T: (512) 692-8702
`F: (512) 692-8744
`spollinger@mckoolsmith.com
`
`Ramzi R. Khazen
`MCKOOL SMITH, P.C.
`300 W. Sixth Street, Suite 1700
`Austin, Texas 78701
`T: (512) 692-8743
`F: (512) 692-8744
`rkhazen@mckoolsmith.com
`
`01311-00004_IPR221@mckoolsmith.com
`
`/Michael S. Turner/
`Michael S. Turner
`Kenyon & Kenyon LLP
`One Broadway
`New York, NY 10004-1007
`Tel: 212-425-7200
`
`
`
`
`
`
`
`Dated: December 7, 2015
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