UNITED STATES PATENT AND TRADEMARK OFFICE
`CERTIFICATE OF CORRECTION
`
`PATENT NO.
`APPLICATION NO.
`DATED
`INVENTOR(S)
`
`: 6,057,221 C1
`: 90/011607
`: September 11, 2012
`: Joseph B. Bernstein et al.
`
`Page 1 of 1
`
`It is certified that error appears in the above-identified patent and that said Letters Patent is hereby corrected as shown below:
`
`ON THE TITLE PAGE:
`
`After Item "(73) Assignee", change "United States Air Force, Washington, DC (US)" to
`--Massachusetts Institute of Technology, Cambridge, Mass.; University of Maryland,
`College Park, Md.--.
`
`Signed and Sealed this
`Sixteenth Day of October, 2012
`
`~JJ:·t__~
`
`David J. Kappos
`Director of the United States Patent and Trademark Office
`
`

`
`Atty. Docket No. MIT-7581L-RX1
`
`IN THE UNITED STATES PATENT & TRADEMARK OFFICE
`
`IN REAPPLICATION OF:
`
`JOSEPH B. BERNSTEIN et al.
`
`REEXAMINATION REQUEST NO:
`90/011,607
`
`FILED: March 30,2011
`
`FOR: LASER-INDUCED CUTTING OF
`METAL INTERCONNECT
`
`§
`§
`§
`§
`§
`§
`§ PATENT NO.: 6,057,221
`§
`§ ISSUED: May 2, 2000
`§
`§
`§
`§
`§
`
`I hereby certifY that this document is being transmitted to the USPTO or deposited with the United States Postal
`Service as first class mail in an envelope addressed to Commissioner for Patents, P.O. Box 1450, Alexandria, VA
`22313-1450, on September 13,2012.
`
`/Jennie Heaton/
`By: ________________________________ __
`Jennie Heaton
`
`REQUEST FOR A CERTIFICATE OF CORRECTION UNDER 37 CFR 1.322
`
`ATTENTION: Certificate of Correction Branch
`COMMISSIONER FOR PATENTS
`OFFICE OF PATENT PUBLICATION
`P.O. BOX 1450
`ALEXANDRIA, VA 22313-1450
`FAX: (571) 273-8300
`
`SIR:
`
`Assignees respectfully request a Certificate of Correction in the above-referenced patent.
`
`A Certificate of Correction form (Form PTO/SB/44) listing the requested correction is submitted
`
`herewith.
`
`

`
`Atty. Docket No. MIT-7581L-RX1
`Patent No: 6,057,221
`
`The facts are as follows:
`
`The present patent was originally issued to the Massachusetts Institute of Technology and
`
`the University of Maryland as the Assignees of record on May 2, 2000. Title of the present
`
`patent was assigned by the Inventors (Joseph B. Bernstein and Zhihui Duan) to the Assignees of
`
`record in Assignments 1 and 2, respectively (see the Abstract of Title for the present patent,
`
`taken from the "Assignments of the Web" database at the United States Patent Trademark
`
`[USPTO] website, attached hereto).
`
`Under 37 C.P.R. 3.81, an "application may issue in the name of the assignee consistent
`
`with the application's assignment where a request for such issuance is submitted with payment of
`
`the issue fee, provided the assignment has been previously recorded in the Office." The Issue
`
`Fee Transmittal form received by the USPTO on March 6, 2000 (attached hereto) lists the
`
`Massachusetts Institute of Technology and the University of Maryland as the Assignees of
`
`record to be printed on the present patent. Assignments 1 and 2 were both recorded on April 3,
`
`1997, before the present patent was issued on May 2, 2000 (see the Abstract of Title). Thus, the
`
`present application was properly issued to the Massachusetts Institute of Technology and the
`
`University of Maryland as the Assignees of record.
`
`An Ex Parte Reexamination Certificate was issued for the present patent on September
`
`11, 2012 after reexamination of the patent had concluded (Reexamination Request No.
`
`90/011,607). The Ex Parte Reexamination Certificate lists a different assignee (the United States
`
`Air Force) than the Assignees of record. However, the Assignees of record have not assigned
`
`any ownership interest in the above-identified patent to another party, nor have their undersigned
`
`representatives requested that a different assignee be listed on the Ex Parte Reexamination
`
`Certificate.
`
`It appears that the USPTO substituted the United States Air Force for the Assignees of
`
`record on the Ex Parte Reexamination Certificate based on the last listed document (Assignment
`
`3) in the Abstract of Title for the present patent. However, Assignment 3 relates to a
`
`"confirmatory license" naming the United States Air Force as the beneficiary. The confirmatory
`
`Page2
`
`

`
`Atty. Docket No. MIT-7581L-RX1
`Patent No: 6,057,221
`
`license does not grant title to or any ownership interest in the present patent to the United States
`
`Air Force (see the Abstract of Title).
`
`The Massachusetts Institute of Technology and the University of Maryland respectfully
`
`request issuance of a Certificate of Correction for the Ex Parte Reexamination Certificate to
`
`correct the USPTO's error by replacing the "United States Air Force" with the "Massachusetts
`
`Institute of Technology" and the "University of Maryland" as Assignees of record.
`
`No new matter or new issues requiring further examination are introduced by the
`
`requested corrections. Because the mistake in the above-identified patent was incurred entirely
`
`through the fault of the U.S. Patent and Trademark Office, as clearly disclosed by the records of
`
`the U.S. Patent and Trademark Office, no fee is due.
`
`The corrections requested are as follows:
`
`On the front page of the Ex Parte Reexamination Certificate, after "(73) Assignee",
`
`change "United States Air Force, Washington, DC (US)" to --Massachusetts Institute of
`
`Technology, Cambridge, Mass.; University of Maryland, College Park, Md.--.
`
`Any additional information and/or assistance with this Request may be obtained from the
`
`undersigned practitioner.
`
`Respectfully submitted,
`
`/Andrew D. Fortney/
`
`Andrew D. Fortney, Ph.D.
`Reg. No. 34,600
`
`THE LAW OFFICES OF ANDREW D. FORTNEY, PH.D., P.C.
`1725 N. Fine Ave., Suite 101
`Fresno, CA 93727
`(559) 432- 6847
`
`ADF:wkn
`
`Page 3
`
`

`
`USPTO Assignments on the Web
`
`Patent Assignment Abstract of Title
`
`Total Assignments: 3
`lssue Ot: O'.i/02/2000
`Patent #: ti1~~Z22.1.
`Inventors: JOSEPH B. BERNSTEI~J, ZHIHUI DUAf\1
`Title: LASER-INDUCED CUTTING OF tv1ETAL I~FERCONNECT
`Assignment: 1
`
`Application #: 0882'5808
`
`Filing Ot: 04/03/1997
`
`Conveyance: ASSIGNMENT OF .o\SSIGNORS Ir~TEREST (SEE DOCU~1Ef\JT FOR DET!\ILS).
`
`Recorded: 04/03/1997
`
`Pages:4
`
`Exec m:: 03/21/1997
`
`77 H.<\S9\CHUSETTS AVENUE
`
`G\~1BRIDGE, ~1ASSACHUSETTS 02139
`
`77 1v1ASSACHUSETIS AVENUE
`
`COLLEGE PARI<, 1v1ARYLAND 20742
`
`Correspondent: HAfv1ILTON, BROOK, Stv1ITH & REY~JOLDS, P.C.
`
`TWO MILITIA DRIVE
`
`LEXI~JGTor,;, H!\SS!\CHUSETTS 02173
`Assignment: 2
`
`Conveyance: ASSIGN~·1Ef-<T OF ASSIGNORS INTEREST (SEE DOCUIVlENT FOR DETAILS).
`
`Recorded: 04/03/1997
`
`Pages: J
`
`Exec Dt: 04/01/1997
`
`COLLEGE PARI<, 1v1ARYLAND 20742
`
`Correspondent: HAfv1ILTON, BROOK, Stv1ITH & REY~JOLDS, P.C.
`
`T\NO MILITIA DRIVE
`
`LEXI~JGTor,;, H!\ 02173
`Assignment: 3
`
`Conveyance: CONFIRf-1ATORY LICENSE (SEE DOCUf-1ENT FOR DETAILS).
`
`Recorded: 11/02/1998
`
`Pages: 3
`
`Exec Dt: 08/06/1 998
`
`1501 WJLSON BLVD., SUITE 614
`
`http://assignments.uspto.gov /assignments/q?db=pat&qt=pat&reel=&frame=&pat=605722l &pub=&asnr=&asnri=&asne=&asnei=&asns=[ 9/12/2012 4: ll :58 PM]
`
`

`
`USPTO Assignments on the Web
`
`ARUNGTON, VJRGHHA 2.22.09
`
`Correspondent: JOHr,; B. BROCKI
`
`1501 WILSON BLVD. #614
`
`ARL, VA 22209
`
`Search Results as of: 09!~ 212012 06:3~ PM
`;~-you have any ccmom:~nts o;-- qusstionB cor~cerning n~e d;_::rt;_1 diBplayed. contact PRD I /',Bsigr:rr:eni.B at 5l1-212<3350. v.2.3.2
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`i HOME i ~NOEX! SEARCH i eSUS!NESS ! CONTACT US i PRiVACY STATEMENT
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`
`

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`fi!lnganassigl'lfOOnt. 1} Massachuset.ts Institute of ·Technology
`(A)NAMEOF~i~EE. 2.) pnivers~t}" of -~ryland
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`2) College Park, MD
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`.0 ~
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`15
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`..
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`IJ~.tlieP.l:ij:lerWotk AOOUclilln Ad¢
`of ~wlm.it dis!pa&li<a•a-WJ!d•C~
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`

`
`PTOiSB/44 (09-07)
`/\pproved tor use through 0813!12013. OMB 0651-0033
`U.S Patent and Trademark Office; U.S DEPARTMENT OF COMMERCE
`Under the Paperwork Reduction Act of 1995. no persons are required to respond to a collection of information unless it displays a valid OM8 control number.
`(Also Form Pr0-1050\
`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`CERTIFICATE OF CORRECTION
`
`Page _____ __1 _______ of _____ __! _____ _
`
`PATENT NO.
`
`6,057,221
`
`APPLICATiON NO.: 08/825,808
`
`ISSUE DATE
`
`May 2, 2000
`
`INVENTOR(S)
`
`JOSEPH B. BERNSTEIN et al.
`
`It is certified that an error appears or errors appear in the above-identified patent and that said Letters Patent
`is hereby corrected as shown below:
`ON THE FRONT PAGE:
`
`After "(73) Assignee'', change "United States Air Force, Washington, DC (US)" to --Massachusetts Institute of
`Technology, Cambridge, Mass.; University of Maryland, College Park, Md.--.
`
`MAILING ADDRESS OF SENDER (Please do not use customer number below):
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`

`
`Electronic Acknowledgement Receipt
`
`EFSID:
`
`Application Number:
`
`13740784
`
`90011607
`
`International Application Number:
`
`Confirmation Number:
`
`3214
`
`Title of Invention:
`
`Laser-Induced Cutting of Metal Interconnect
`
`First Named Inventor/Applicant Name:
`
`6057221
`
`Customer Number:
`
`36872
`
`Filer:
`
`Andrew D. Fortney
`
`Filer Authorized By:
`
`Attorney Docket Number:
`
`MIT-7581 L-RX1
`
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`Filing Date:
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`13-SEP-2012
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`30-MAR-2011
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`1
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`Request for Certificate of Correction
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`orrection_13SEP2012_.pdf
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`426053
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`419a7 cf8995b8dee56228ed85087aa697be
`1ad5b
`
`no
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`6
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`Information:
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`

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`2
`
`Request for Certificate of Correction
`
`MIT-7581 L-
`RX1 - CertificateOfCorrection - 1
`3SEP2012_.pdf
`
`107003
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`336ca61811 c69c95d418b61fd0a2c64001 c
`dcc03
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`1
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`

`
`111111111111111111111111111111111111111111111111111111111111111111111111111
`US006057221 C 1
`c12) EX PARTE REEXAMINATION CERTIFICATE (9289th)
`United States Patent
`US 6,057,221 Cl
`c1o) Number:
`Bernstein et al.
`(45) Certificate Issued:
`Sep. 11, 2012
`
`(54) LASER-INDUCED CUTTING OF METAL
`INTERCONNECT
`
`(75)
`
`Inventors: Joseph B. Bernstein, Potomac, MD
`(US); Zhihui Duan, Erie, PA (US)
`
`(73) Assignee: United States Air Force, Washington,
`DC (US)
`
`Reexamination Request:
`No. 90/011,607, Mar. 30, 2011
`
`Reexamination Certificate for:
`6,057,221
`Patent No.:
`May 2, 2000
`Issued:
`08/825,808
`Appl. No.:
`Apr. 3, 1997
`Filed:
`
`(51)
`
`Int. Cl.
`HOJL 21144
`
`(2006.01)
`
`(52) U.S. Cl. ........................................ 438/601; 438/132
`(58) Field of Classification Search ........................ None
`See application file for complete search history.
`
`(56)
`
`References Cited
`
`To view the complete listing of prior art documents cited
`during the proceeding for Reexamination Control Number
`90/011,607, please refer to the USPTO's public Patent
`Application Information Retrieval (PAIR) system under the
`Display References tab.
`
`Primary Examiner-John Heyman
`
`(57)
`
`ABSTRACT
`
`An electrical interconnect includes a substrate having an
`insulating surface upon which is placed an electrically(cid:173)
`conductive cut-link pad and a pair of electrically-conductive
`lines. The lines are bonded to the cut-link pad and are sub(cid:173)
`stantially more resistant to heat flow per unit length than is
`the cut-link pad. In a preferred embodiment, the thermal
`resistance per unit length of the cut-link pad is lowered by
`designing the pad such that its width is greater than the width
`of either of the lines. A method for cutting a circuit includes
`directing a laser upon the cut-link pad of an interconnect, as
`described above. The laser is maintained upon the pad until
`the cut-link pad is ablated, severing the circuit.
`
`5:3
`
`54
`
`52
`
`54
`I
`
`

`
`US 6,057,221 Cl
`
`1
`EX PARTE
`REEXAMINATION CERTIFICATE
`ISSUED UNDER 35 U.S. C. 307
`THE PATENT IS HEREBY AMENDED AS
`INDICATED BELOW.
`
`Matter enclosed in heavy brackets [ ] appeared in the
`patent, but has been deleted and is no longer a part of the
`patent; matter printed in italics indicates additions made 10
`to the patent.
`
`AS A RESULT OF REEXAMINATION, IT HAS BEEN
`DETERMINED THAT:
`
`The patentability of claim 14 is confirmed.
`
`Claims 1, 2, 5, 9-12, 16, 19 and 20 are cancelled.
`
`15
`
`2
`conductive line and a second electrically-conductive
`line on a substrate, the cut-link pad having substan(cid:173)
`tially less thermal resistance per unit length than each
`of the first and second lines, wherein the width of the
`cut-link pad is at least ten percent greater than the
`width of each of the first and second electrically(cid:173)
`conductive lines; and
`maintaining the laser upon the cut-link pad until the laser
`infuses sufficient energy into the cut-link pad to break
`the conductive link across the cut-link pad between the
`pair of electrically-conductive lines, wherein a passiva-
`tive layer covers the cut-link pad, and the electrically(cid:173)
`conductive cut-link pad has an inner surface facing the
`substrate and an opposing outer surface facing away
`from the substrate, the first and second electrically(cid:173)
`conductive lines extending from the inner surface into
`the substrate.
`21. The method of claim 13, wherein the cut-link pad [is
`comprised of] comprises a material with greater thermal
`conductivity than the material comprising each of the first
`and second electrically-conductive lines.
`22. The method of claim 21, wherein the cut-linkpad com(cid:173)
`prises aluminum.
`23. The method of claim 3, wherein the cut-link pad has a
`25 greater cross-sectional area than the first and second
`electrically-conductive lines, wherein the cross-sectional
`area of the cut-link pad is the product of a width and a height
`of the cut-link pad, the first and second electrically(cid:173)
`conductive lines comprise vias, and the cross-sectional area
`30 of each of the first and second electrically-conductive lines is
`defined by a width of the corresponding via.
`2 4. The method of claim 13, wherein the passivative layer
`comprises silicon nitride.
`25. The method of claim 4, wherein the cut-link pad has a
`35 length of 2-3 microns, and the first and second electrically(cid:173)
`conductive lines each have a width of about 0.5 microns.
`26. A method for cutting a link between interconnected
`circuits comprising:
`directing a laser upon an electrically-conductive cut-link
`pad conductivity bonded between a first electrically(cid:173)
`conductive line and a second electrically-conductive
`line on a substrate, the cut-link pad having substan(cid:173)
`tially less thermal resistance per unit length than each
`of the first and second lines, wherein the cut-link pad is
`formed of a material that has greater thermal conduc(cid:173)
`tively than the material that forms each of the first and
`second electrically-conductive lines; and
`maintaining the laser upon the cut-link pad until the laser
`infuses sufficient energy into the cut-link pad to break
`the conductive link across the cut-link pad between the
`pair of electrically-conductive lines, wherein the
`electrically-conductive cut-link pad has an inner sur(cid:173)
`face facing the substrate and an opposing outer surface
`facing away from the substrate, the first and second
`electrically-conductive lines extending from the inner
`surface into the substrate.
`2 7. The method of claim 26, further comprising a passiva(cid:173)
`tive silicon nitride layer that covers the cut-link pad.
`28. The method of claim 26, wherein the cut-linkpad com-
`60 prises aluminum.
`29. The method of claim 14, wherein the width of the
`cut-link pad is at least fifty percent greater than the width of
`each of the first and second electrically-conductive lines.
`30. The method of claim 13, wherein the passivative layer
`65 is harder than the substrate.
`
`Claims 3, 6-8, 13, 15, 17 and 21 are determined to be 20
`patentable as amended.
`
`Claims 4 and 18, dependent on an amended claim, are
`determined to be patentable.
`
`New claims 22-29 and 30 are added and determined to be
`patentable.
`
`3. [The] A method [of claim 1]for cutting a link between
`interconnected circuits, comprising the following steps:
`directing a laser upon an electrically-conductive cutlink
`pad conductively bonded between a first electrically(cid:173)
`conductive line and a second electrically-conductive
`line on a substrate, the cut-link pad having substan(cid:173)
`tially less thermal resistance per unit length than each
`of the first and second lines, wherein the width of the
`cut-link pad is at least ten percent greater than the
`width of each of the first and second electrically(cid:173)
`conductive lines; and
`maintaining the laser upon the cut-link pad until the laser 40
`infuses sufficient energy into the cut-link pad to break
`the conductive link across the cut-link pad between the
`pair of electrically-conductive lines, wherein the
`electrically-conductive cut-link pad has an inner sur(cid:173)
`face facing the substrate and an opposing outer surface 45
`facing away from the substrate, the first and second
`electrically-conductive lines extending from the inner
`surface into the substrate.
`6. The method of claim [1] 3, wherein the width of the
`cut-link pad is at least twenty-five percent greater than the 50
`width of each of the first and second electrically-conductive
`lines.
`7. The method of claim [1] 3, wherein the width of the
`cut-link pad is at least fifty percent greater than the width of
`each of the first and second electrically-conductive lines.
`8. The method of claim 7, wherein the cut-link pad [is
`comprised of] comprises a composition substantially identi(cid:173)
`cal to the composition of the first and second electrically(cid:173)
`conductive lines.
`13. The method of claim [1] 3, wherein a passivative layer
`covers the cut-link pad.
`15. The method of claim 14, wherein the passivation layer
`[is] comprises [of] silicon nitride.
`17. [The] A method [of claim 1]for cutting a link between
`interconnected circuits, comprising the following steps:
`directing a laser upon an electrically-conductive cutlink
`pad conductively bonded between a first electrically-
`
`55
`
`* * * * *
`
`

`
`UNITED STATES pATENT AND TRADEMARK OFFICE
`
`APPLICATION NO.
`
`FILING DATE
`
`FIRST NAMED INVENTOR
`
`UNITED STATES DEPARTMENT OF COMMERCE
`United States Patent and Trademark Office
`Address: COMMISSIONER FOR PATENTS
`P.O. Box 1450
`Alexandria, Virginia 22313-1450
`www .uspto.gov
`
`I ATTORNEY DOCKET NO.
`
`CONFIRMATION NO.
`
`90/011,607
`
`03/30/2011
`
`6057221
`
`MIT-7581L-RXI
`
`3214
`
`36872
`7590
`071ll/20I2
`THE LAW OFFICES OF ANDREW D. FORTNEY, PH.D., P.C.
`215 W FALLBROOK AVE SUITE 203
`FRESNO, CA 93711
`
`EXAMINER
`
`ART UNIT
`
`PAPER NUMBER
`
`DATE MAILED: 07/11/2012
`
`Please find below and/or attached an Office communication concerning this application or proceeding.
`
`PT0-90C (Rev. 10/03)
`
`

`
`Notice of Intent to Issue
`Ex Parte Reexamination Certificate
`
`Control-No.
`
`90/011,607
`
`Examiner
`
`Patent Under Reexamination
`
`6057221
`
`Art Unit
`
`3992
`ANDREW J. FISCHER
`•• The MAILING DATE of this communication appears on the cover sheet with the correspondence address ••
`1. [gj Prosecution on the merits is (or remains) closed in this ex parte reexamination proceeding. This proceeding is
`subject to reopening at the initiative of the Office or upon petition. Cf. 37 CFR 1.313(a). A Certificate will be
`issued in view of
`(a) [gj Patent owner's communication(s) filed: 26 March 2012.
`(b) 0 Patent owner's late response filed: __ .
`(c) 0 Patent owner's failure to file an appropriate resP,onse to the Office action mailed: __ .
`(d) 0 Patent owner's failure to timely file an Appeal Brief (37 CFR 41.31).
`(e) 0 Other: __
`Status of Ex Parte Reexamination:
`(f) Change in the Specification: 0 Yes [gj No
`0 Yes [gj No
`(g) Change in the Drawing(s):
`(h) Status of the Claim(s):
`(1) Patent claim(s) confirmed: 4.14 and 18.
`(2) Patent claim(s) amended (including dependent on amended claim(s)): 3.6-8. 13. 15.17 and 21
`(3) Patent claim(s) canceled: 1. 2. 5. 9-12. 16. 19 and 20.
`(4) Newly presented claim(s) patentable: 22-30.
`(5) Newly presented canceled claims: __ .
`(6) Patent claim(s) 0 previously 0 currently disclaimed:
`.
`(7) Patent claim(s) not subject to reexamination: __ .
`
`- -
`
`2. [gj Note the attached statement of reasons for patentability and/or confirmation. Any comments considered
`necessary by patent owner regarding reasons for patentability and/or confirmation must be submitted promptly
`to avoid processing delays. Such submission(s) should be labeled: "Comments On Statement of Reasons for
`Patentability and/or Confirmation."
`3. 0 Note attached NOTICE OF REFERENCES CITED (PT0-892).
`4. 0 Note attached LIST OF REFERENCES CITED (PTO/SB/08 or PTO/SB/08 substitute).
`5. 0 The drawing correction request filed on __ is: 0 approved
`0 disapproved.
`6. 0 Acknowledgment is made of the priority claim under 35 U.S.C. § 119(aHd) or (f).
`a)O All b)O Some*
`c)O None
`of the certified copies have
`0 been received.
`0 not been received.
`0 been filed in Application No. __ .
`0 been filed in reexamination Control No.
`.
`0 been received by the International Bureau in PCT Application No. __ .
`*Certified copies not received: __ .
`7. 0 Note attached Examiner's Amendment.
`8. 0 Note attached Interview Summary (PT0-474).
`9. 0 Other: __ .
`
`cc: Requester (if third party requester)
`U.S. Patent and Trademark Office
`PTOL-469 (Rev. 05-10)
`Notice of Intent to Issue Ex Parte Reexamination Certificate
`
`Part of Paper No 20120628
`
`

`
`Application/Control Number: 90/011,607
`Art Unit: 3992
`
`Page 2
`
`Detailed Action
`
`Preliminary Matters
`
`The Declaration and affidavits filed with the Response on 03/26/2012 on behalf
`
`of the Patent Owner and others have been instrumental in a greater understanding of
`
`the intricacies of this case. As such, as noted hereinbelow, this Notice of Reexam
`
`Confirmation, (NIRC) is prepared. This Declaration and supporting documents/exhibits
`
`are incorporated herein by reference.
`
`At present, there are a total of 20 claims in the instant application: Independent
`
`Claim 3 with dependent Claims 4, 6, 7, 8, 13, 21, 22, 23, 24, 25 and 30; independent
`
`Claim 14 with dependent Claims 15 and 29; independent Claim 17 with dependent
`
`Claim 18; and independent Claim 26 with dependent Claims 27 and 28. Claims 1, 2, 5,
`
`9, 10, 11, 12, 16, 19 and 20 have been proposed to be canceled.
`
`Statement of Reasons for Patentability and/or Confirmation
`
`This Action is taken up in response to a Request for Reconsideration including
`
`amendments, arguments, a declaration and supporting documents filed on 03/26/2012.
`
`

`
`Application/Control Number: 90/011,607
`Art Unit: 3992
`
`Page 3
`
`Claim Rejections - 35 USC § 112
`
`In view of the Patent Owner's explanation of the term "via" as used in Claim 23
`
`on pages 3 and 4 of the Response, the rejection of this claim as indefinite has been
`
`overcome. Therefore, the rejection of this claim under 35 USC 112, second paragraph,
`
`is withdrawn.
`
`Claim Rejections- 35 USC§ 102
`
`The 35 USC 1 02(b) rejection of Claim 11 based upon Nishimura has been
`
`overcome with the amendment proposing cancellation of this claim.
`
`Claim Rejections - 35 USC§ 103
`
`Claims 3, 4, 6-8, 23, 25, 26 and 28 were rejected under 35 USC 1 03(a) as
`
`unpatentable over Koyou in view of Wada of record. It is agreed that Koyou discloses a
`
`vertical fuse, while Wada discloses a horizontal fuse. Therefore, as noted in
`
`paragraphs 34-38 of the Bernstein Declaration, a person of ordinary skill in the art would
`
`not combine the features from Wada with the fuse of Koyou, since inter alia, fuse
`
`dimensions in horizontal fuse structures are necessarily constant (Wada) while in
`
`vertical fuse structures (Koyou) they are not. Thus, the combination of Koyou with
`
`Wada to render obvious such a feature for a "cut-link pad" having a width "at least ten
`
`percent greater than the width of each of first and second electrically-conductive lines"
`
`as recited in Claim 3 is problematical as stated in paragraphs 36-37 of the Bernstein
`
`Declaration and evidenced by the Lattice Analysis and Samsung Analysis design rules.
`
`This along with other salient points asserted on pages 6-1 0 of the Response effectively
`
`

`
`Application/Control Number: 90/011,607
`Art Unit: 3992
`
`Page4
`
`overcome the rejection of these claims under 35 USC 103 based upon Koyou in view of
`
`Wad a.
`
`Moreover, it is agreed that the phrase, "cut-link pad having substantially less
`
`thermal resistance per unit length than each of the first and second lines" (Claims 3 and
`
`26) is no longer met by the combination of Koyou and Wada for at least the reason
`
`expressed Section B of the Response (incorporated herein by reference), and in
`
`paragraphs 20-27 and 40 of the Bernstein Declaration and Exhibit D.
`
`Therefore, based on the above reasons, the rejections of independent Claims 3
`
`and 26 along with dependent Claims 4, 6, 7, 8, 13, 21, 22, 23, 24, 25, 27, 28 and 30 as
`
`unpatentable over Koyou in view of Wada are withdrawn. These claims are deemed
`
`patentable over the combination of Koyou and Wada.
`
`Similarly, the rejections under 35 USC 103(a) of Claims 17 and 18 based upon
`
`the combination of Koyou, and Wada, and further in view of Lou are no longer valid.
`
`That is, Lou was cited to show the passivative layer feature in the fuse structure of the
`
`Koyou/Wada combination. Since the combination of the Koyou and Wada has been
`
`overcome as noted above, Lou is no longer relevant. Thus, the above rejection of these
`
`claims is withdrawn, and Claims 17 and 18 are therefore, patentable.
`
`Claims 14, 15 and 29 were held rejected as unpatentable overWada in view of
`
`Lou. In addition to the already determined patentable feature of the "cut-link pad having
`
`substantially less thermal resistance per unit length than each of the first and second
`
`lines" (Claim 14), Lou was cited to disclose that a passivative layer covering the
`
`substrate is harder than the substrate as recited. However, it is agreed that paragraphs
`
`

`
`Application/Control Number: 90/011,607
`Art Unit: 3992
`
`Page 5
`
`73-78 of the Bernstein Declaration along with Exhibits Land M clearly point out that this
`
`is not a "well known" feature as the rejection of 01/26/2012 maintained. That