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`Liquid crystal flat panel displays : manufacturing science & technology /...
`
`Type of Work: Text
`Registration Number / Date: TX0003519462 / 1993-04-02
`Title: Liquid crystal flat panel displays : manufacturing science & technology / William C.
`O’Mara.
`Imprint: New York : VanNostrand Reinhold, c1993.
`Description: 223 p.
`Copyright Claimant: VanNostrand Reinhold, a division of Thomson Publishing Corporation
`Date of Creation: 1993
`Date of Publication: 1993-03-26
`Names: O’Mara, William C.
`VanNostrand Reinhold
`Thomson Publishing Corporation. VanNostrand Reinhold
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`http://cocatalog.loc.gov/cgi-bin/Pwebrecon.cgi?Search_Arg=liquid+crystal+flat+panel+displays&Search_Code=TALL&PID=2Dj6a2LpX0_cwJ99gKcmEv1j&SE… 1/1
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`IPR2015-00863
`Petition for Inter Partes Review of U.S. Patent 7,202,843 - EXHIBIT 1010_Page 1
`
`

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`
`
`Manufacturing Science 6': Technology
`
`Illiam C. O’Mara
`
`HEARvor CONGRESS
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`APR - 2 I995
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` \G?’
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`Copyright © 1993 by Van Nostrand Reinhold
`
`Library of Congress Catalog Card Number 92-43119
`ISBN 0-442-01428-7
`
`All rights reserved. No part of this work covered by the copyright
`hereon may be reproduced or used in any form or by any means—
`graphic. electronic. or mechanical. including photocopying. record-
`ing. taping, or information storage and retrieval systems—without
`the written permission of the publisher.
`
`I®P Van Noslrand Reinhold is a dwrston of International
`Thomson Publishing. ITP' logo is a trademark under license.
`
`Printed in the United States of America
`
`Van Nostrand Reinhold
`115 Fifth Avenue
`New York. NY 10003
`
`International Thomson Publishing
`Berkshire Houso
`163-173 High [-10le
`London WC1V 7AA. England
`
`Thomas Nelson Australia
`102 Dodds Streot
`South Melbourne 3205
`Victoria, Australia
`
`Nelson Canada
`1120 Birchmount Road
`Scarborough, Ontario
`MIK 564, Canada
`
`16151413121110987654321
`
`Library of Congress Cataloging In Publlcatlon Data
`
`D'Mara. William C.
`Liquid crystal flat panel displays: manufacturing soiece &.
`technology}I William C. O'Mara.
`p.
`cm.
`Includes index
`ISBN 0-442-01428-7
`
`1. Liquid crystal display. I. Title
`TK‘TE‘TZLSISME 1993
`621.38—dc20
`
`92-431 19
`C]?
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`Page 4
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`Page 4
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`Table of contents
`
`LARGE AREA LIQUID CRYSTAL DISPLAYS ..............1
`
`1.1 Camputer Displays .................................................................................... 3
`1.1.1 Desktop Computers .............................................................................. 3
`1.1.2 Portable Computers .............................................................................. 3
`1.1.3 Engineering Workstations....................................................... 7
`1.1.4 Computer Display Summary ................................................................ 7
`1.2 Television Displays .................................................................................... 9
`1.2.1 Portable TVs ......................................................................................... 9
`
`1.2.2 Projection Diaplays ............................................................................ 10
`1.2.3 High Definition TV ............................................................................ 11
`1.2.4 Video Camera Viewfinders ................................................................ 11
`
`......................... 11
`..............
`1.3 Automotive Applications
`1.4 Other Applications .................................................................................. 12
`1.5 Liquid Crystal Display Technology
`.............................. 13
`1.5.1 Types of Liquid Crystal Display ........................................................ 16
`1.5.2 Passive vs Active Addressing ............................................................ 21
`1.5.3 Wurkstation B/W DiSplay .................................................................. 23
`1.5.4 Polymer Dispersed Displays .............................................................. 24
`1.5.5 Automotive Display ........................................................................... 26
`1.6 Active Matrix Devices
`..............27
`
`1.6.1 Two Terminal Devices ....................................................................... 28
`
`1.6.2 Amorphous Silicon Transistors .......................................................... 31
`1.6.3 Polysilicon Transistors ....................................................................... 35
`1.6.4 Comparison of Device Performance .................................................. 39
`
`1.6.5 Perroelectric Polymer ......................................................................... 43
`1.6.6 Printed Transistors .............................................................................. 45
`
`1.7 Display Manufacturers47
`1.7.1 Japan ................................................................................................... 47
`Current Suppliers ..................................................................................... 48
`1.7.2 USA .................................................................................................... 48
`
`Xerox ....................................................................................................... 48
`
`Department of Defense Initiatives ........................................................... 48
`
`Page 5
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`IBM ......................................................................................................... 48
`
`Advanced Display Manufacturers ........................................................... 50
`Others ...................................................................................................... 51
`
`1.7.3 Rest Of World .................................................................................... 51
`
`Europe ..................................................................................................... 51
`Korea ....................................................................................................... 53
`
`Other Asian Firms ................................................................................... 53
`
`References
`
`.................................................................... 54
`
`FIGURES
`
`1—1 Portable and laptop computers. ................................................................... 3
`1-2 Active matrix liquid crystal display screen size in recent years ................. 5
`1-3 Pixel count versus display diagonal size for flat panels ............................. 6
`1-4 No. of pixels 8: display diagonal for high information content displays ....’7
`1-5 Basic liquid crystal polymer molecule ...................................................... 14
`1-6 Principle of operation of a twisted nematic liquid crystal display ............ 15
`1—7 Transmission versus voltage curves for TN and STN materials............... 18
`1-8 Schematic representation of passive and active matrix color LCD’s. ......22
`1-9 Polymer dispersed liquid crystal projection TV system ........................... 24
`l~10 Structure of the dispersed liquid crystal droplets .................................... 25
`1-11 Projection display using polysilicon thin film transistors ....................... 28
`1-12 Amorphous silicon PIN diode ................................................................. 29
`1-13 MfM diode structure ............................................................................... 30
`
`1-14 Double pixel design for MIM diode. ...................................................... 30
`1-15 Cross-section view of three TFT configurations .................................... 32
`1416 Aluminum gate a—Si TFT ........................................................................ 33
`1-17 Light leakage in TFT structure ............................................................... 33
`1- 18 Plan View of TFT structure with light shield. ......................................... 33
`1-19 Hitachi TFT array equivalent circuit ....................................................... 34
`1-20 Relative cost of silicon TFT processes ................................................... 42
`1-21 Data rate of driver circuits for complex TFT displays ............................ 43
`1‘22 Construction of ferroelectric matrix active device .................................. 44
`1-23 LCD panel structure with ferroelectric matrix device ............................ 44
`1-24 Comparison of photolithography and printing for imaging on FPD’s. ...46
`1-25 Photoresist application by offset printing ............................................... 46
`L26 Polysilicon transistors made by offset printing and photolithography ...47
`
`1—1 Classification of Portable Computers ......................................................... 4
`1-2 Japanese Large Flat Panel Diaplays ............................................................ 8
`
`TABLES
`
`iv
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`1-3 Japanese LCD TV and VCR Displays ...................................................... 10
`1-4 Calculation of S for various values of Nrnax. ........................................... 17
`
`1-5 Requirements for Vertical TN LCD Display ............................................ 19
`1-6 Types of Liquid Crystal Displays ............................................................. 20
`1-7 Processing and Relative Cost of Active and Passive Displays ................. 31
`1—8 TFT Array Process and Specifications ..................................................... 3]
`1—9 Resistivity of Metals ................................................................................. 35
`1—10 Comparison of a-Si and poly-Si TFTs .................................................... 37
`1-11 Polysilicon Fabrication Methods and TFT Properties ............................ 38
`1-12 Comparison of TFT, PIN Diode. and MIM Diode Displays .................. 40
`1— 13 CMOS poly-Si TF1" and a-Si:H TFT Comparison ................................. 4]
`1-14 AMLCD Drive Circuit Types ................................................................. 42
`1—15 Characteristics of Ferroelectric Liquid Crystal Display ......................... 45
`1-16 Liquid Crystal Display Status in Japan ................................................... 49
`1-17 Advanced Display Manufacturers Association Members ....................... 50
`1- 18 US Liquid Crystal Display Activity ........................................................ 51
`1-19 European LCD Activity. 52
`1 -20 Liquid Crystal Display StatusinKorea 53
`1- 21 LCD Manufacturing1n Asia ................................................................... 53
`
`DISPLAY MANUFACTURING PROCESS .............................................. 57
`
`...................... 58
`2.1 Color Filter Manufacturing ......................
`2.1.1 Glass Substrate Preparation ................................................................ 58
`Glass Fabrication ..................................................................................... 53
`
`Cutting, Beveling, Polishing ................................................................... 59
`Annealing ................................................................................................ 61
`Cleaning .................................................................................................. 63
`ITO Deposition ........................................................................................ 66
`2.1.2 Color Filter Process ............................................................................ 70
`
`Black Matrix Definition .......................................................................... 71
`
`Dye Method ............................................................................................. 71
`Pigment Method ...................................................................................... 71
`Electrodeposition ..................................................................................... 72
`Printing .................................................................................................... 73
`Overcoating ............................................................................................. 73
`ITO Deposition ........................................................................................ 73
`2.2 Active Matrix Display Manufacturing .....................74
`
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`2.2.1 Thin Film Transistor Manufacturing .................................................. 74
`Plasma CVD 8: Sputtering ...................................................................... 75
`Photolithography ..................................................................................... 77
`Etching .................................................................................................... 78
`Transistor Processes ................................................................................ 79
`
`2.2.2 In Process Testing .............................................................................. 84
`Optical Inspection ................................................................................... 34
`Electrical Inspection ................................................................................ 35
`Functional Inspection ............................................................................. 35
`2.2.3 Defect Repair ...................................................................................... 85
`2.3 Display Assambly ......................................... 36
`2.3.1 Orientation Film Deposition and Rubbing ......................................... 36
`2.3.2 Seal Printing ....................................................................................... 37
`2.3.3 Spacer Placement and Sealin g ............................................................ 90
`2.3.4 Liquid Crystal Injection ..................................................................... 90
`2.3.5 Inspection and Test ............................................................................. 91
`2.3.6 Polarizer Attach .................................................................................. 91
`
`2.3.7 Die Attach .......................................................................................... 94
`2.3.8 Backlight ............................................................................................ 97
`2.4 DISPLAY MANUFACTURING ......................................
`............ 98
`
`2.4.1 STN Display Manufacturing .............................................................. 98
`2.4.2 |Color Filter Manufacturing .............................................................. 100
`2.4.3 Equipment for Color Filter Manufacturing ...................................... 101
`2.5 AMLCD Factory
`....................................................
`101
`2.5.1 Throughput and Productivity ........................................................... 101
`2.5.2 Manufacturing Cost and Yield ................................................. ........ 103
`Yield vs ASP ......................................................................................... 103
`
`Manufacturing Cost Model ................................................................... 105
`Manufacturing Yield Model .................................................................. 106
`AMLCD Factory ...................................................... . ............................ 108
`
`FIGURES
`
`2—1 Schematic outline of the display manufacturing process. ......................... 57
`2-2 Fusion process fer glass sheet formation ................................................. 53
`2-3 Thermal expansion of Coming 7059 glass .............................................. 62
`2-4 Thermal shrinkage of NA 35 glass: heat treatment time & temperature .62
`2-5 Cleaning methods evaluated by contact angle measurement ................... 66
`2-6 Sputtering voltage. deposition temperature, and ITO film resistivity ...... 69
`2-7 Plasma-assisted electron beam evaporation equipment ............................ 70
`2-8 Color Filter Formation .............................................................................. 72
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`2-9 Active Device Formation .......................................................................... 76
`
`2-10 Phomnesist adhesion by side etch for various precoating processes. ...... 78
`2-11 Cross-section view of three TFT configurations .................................... 79
`2-12 Assembly, Packaging & Test .................................................................. 88
`2- 13 Automated flat panel assembly line ........................................................ 89
`2* l4 Variations in external pressure & spacer size lead to cell gap variations. ...91
`2—15 Active matrix liquid crystal display cross section. ................................. 93
`2-16 Packaging configurations in flat panel displays...................................... 94
`2-17 Number and pitch of leads for flat panel displays. ................................. 95
`2-18 Connection of TAB tape to flat panel leads w! anisotropic conductive paste. .96
`2—19 Schematic of backlight arrangement with light pipe. ............................. 97
`2120 Factory layout for passive matrix LCD manufacturing .......................... 98
`2-21 Simulated yield curves: defect densities in TFT manufacturing .......... 104
`2-22 Cost ccmpOnents of flat panel display production. 106
`2-23 NEC two story AMLCD fabrication facility layout ............................. 109
`
`TABLES
`
`2-1 Glass Substrates for Flat Panel Display Manufacturing ........................... 60
`2-2 Glass Substrate Specification for Active Matrix Display ......................... 63
`2-3 Proposed Substrate Standard Sizes for Flat Panel Displays ..................... 64
`2—4 Cleaning Processes for Flat Panel Displays .............................................. 65
`25 DI Water Quality and Substrate Particle Count ........................................ 66
`2-6 Types of Color Filters for LCDs ............................................................... 71
`2-7 Color Filter Process Comparison .............................................................. 74
`2—8 Process Flow Chart for Inverted-Staggered Back Channel Etched TFT .80
`2-9 Inverted-Staggered Trilayered TFT Process ............................................. 81
`2-10 Process Flow for Normal Staggered TFT ............................................... 82
`2-11 TFT Array Process and Specifications ................................................... 83
`2-12 Defects in LCD TFT Array Manufacturing ............................................ 84
`2-13 Causes of Defects in Assembled Flat Panel Displays ............................. 92
`2— 14 Clean room Conditions for STN Process Line ....................................... 99
`
`2-15 Production Lines for Large Liquid Crystal Displays in Japan ................ 99
`2-16 AMLCD Equipment Productivity and Price ......................................... 102
`2—17 AMLCD Production Equipment Categories ......................................... 102
`2- 18 Iii-Process Inspection and Repair Equipment List ................................ 103
`219 Assembly and Die Attach Equipment ................................................... 104
`2-20 TFT Array Yield Summary (No Repair) .............................................. 107
`
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`MATERIALS FOR FLAT PANEL DISPLAYS ..................113
`
`3.] Glass Substrates .....................
`
`...................................... 113
`
`............. 114
`3.2 ITO Sputtering ...........................................................
`3.2.1 ITO Powder and Thin Film Properties ............................................. 116
`3.3 Other Sputtering Materials
`......................................... 117
`3.4 Color Filters .................................................................
`................ 118
`
`3.4.1 Dye Method ...................................................................................... 119
`3.4.2 Pigment Dispersion .......................................................................... 121
`3.4.3 Electrodeposition .............................................................................. 124
`3.4.4 Electromist ....................................................................................... 125
`
`3.4.5 Overcoat ........................................................................................... 126
`
`3.4.6 Two Color Approach ....................................................................... 126
`3.5 Process Chemicals 8: Gases ................................................... m............126
`
`3.6 Photoresists ........................................................................................... . 129
`
`3.7 Photomasks .................................................
`
`............................ 129
`
`3.8 Orientation Films ..................................................................
`
`...... 130
`
`3.8.1 Polyimide Orientation Films ............................................................ 131
`3.9 Spacers ................................................................................
`135
`3.11] Sealing Materials ............................................................................
`13’]r
`3.11 Liquid Crystals .............................................
`........................ 138
`3.11.1 Other Liquid Crystal Materials ...................................................... 142
`3.11.2 Polymer Dispersed Displays .......................................................... 144
`3.11.3 Polymer Network Displays ........................................................... 146
`3.12 Polarizers/Compensation Films .......................................146
`3.13 Die Attacthonnector Materials ..........................................
`149
`
`.................. 152
`3.14 Display Backlighting ..............................................
`References ............................................
`...................................... 157
`
`FIGURES
`
`3-1 CIE Chromaticity Diagram for color filters ............................................ 121
`3-2 Resistance to fading of dyed and printed color filters ............................ 121
`3-3 Cemparison of spinvcoated and printed filter element ............................ 122
`344 Transmittance of green pigment material! function of particle size ..... 123
`3-5 Schematic of electrodeposition process for color filters ......................... 125
`3—6 Synthesis and structure of aliphatic soluble polyimide ........................... 132
`35-? Glass fiber spacer size distribution. ........................................................ 137
`3—8 Typical liquid Crystal ............................................................................. 138
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`3—9 Nematic phase ......................................................................................... 139
`3-10 Cholesteric phase .................................................................................. 139
`3-11 Smectic phase ........................................................................................ 139
`3-12 Structure & properties of difluorobenzene derivatives. ........................ 143
`3-13 Trans—4—n—pentylcyclohexyl (PCH—S) derivatives................................. 143
`3-14 Structure of polarizer film for LCD ...................................................... 147
`3- 15 Polarizer film structures ........................................................................ 147
`
`3-16 Transmittance vs polarization efficiency .............................................. 143
`3—17 Heat seal connector construction .......................................................... 151
`
`3-18 Usage ratio of TAB ICs ........................................................................ 151
`3-191C bonding methods in chip on glass packaging .................................. 153
`3-20 Construction of WedgeLightTM backlight ........................................... 154
`3-21 Spatial brightness uniformity of Wedgelight TM ................................. 155
`3-22 Flat fluorescent lamp structure. ............................................................. 156
`
`TABLES
`
`3~1 LCD Glass Supplier Matrix in Japan ...................................................... 114
`3-2 ITO Film Properties ................................................................................ 115
`3-3 Characteristics of ITO Targets ................................................................ 115
`3—4 Glass Substrates for Liquid Crystal Displays ......................................... l 1'?
`3-5 Specifications for High Density ITO Target ........................................... 1 18
`3-6 Properties of Color- Filters ....................................................................... 119
`3-7 Test Conditions for Color Filters ............................................................ 119
`
`3-8 Alternative Methods of Color Filter Fermaticrn ...................................... 123
`
`3-9 Solubility of Cleaning Chemicals ........................................................... 127
`3-10 Particles in Electronic Chemicals ......................................................... 127
`
`3-11 DI Water Quality ................................................................................... 123
`3-12 Measurement of Cleaning Efficiency ................................................... 128
`3,13 Alignment Film Material Requirements ............................................... 131
`3-14 Comparison of Polyimides for Orientation Film Applications ............. 134
`3-15 Plastic Spacer Size Variation ................................................................ 136
`3—16 Plastic Spacer Thermal Expansion Coefficient ..................................... 137
`3-17 Parameters Specified in Liquid Crystal Formulations .......................... 140
`3418 Relation Between UV Exposure and Turn On Voltage ........................ 145
`3-19 Polarizing Film Structures .................................................................... 143
`3-20 STN Display Cost ................................................................................. 155
`3-21 Comparison of Backlight Technologies ................................................ 156
`
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`CHAPTER FOUR
`
`MANUFACTURING EQUIPMENT........ ................................................. 159
`4.1 Substrate Cleaning ................................................................................ 159
`4.2 Photoresist Application/Baking
`.......................................... 160
`4.2.1 Spin Coating ..................................................................................... 160
`4.2.2 Roll Coating ..................................................................................... 160
`4.2.3 Conveyor Ovens ............................................................................... 161]
`4.3 Photolithography .........................................
`............................ 160
`4.3.1 Stoppers ............................................................................................ 161
`4.3.2 Mirror Projection .............................................................................. 162
`4.4 Etchinngtripping
`..........................................................
`........ 164
`4.4.1 Wet Etch Equipment ........................................................................ 164
`4.4.2 Plasma Etchinngshing .................................................................... 164
`4.5 Thin Film Deposition ..............................................
`............... 165
`4.5.1 Sputtering ......................................................................................... 165
`4.5.2 Chemical Vapor Deposition ............................................................. 167
`4.5.3 Plasma CVD ..................................................................................... 170
`4.5.4 LPCVD and APCVD ....................................................................... 173
`4.5.5 Thermal Processing .......................................................................... 174
`4.5.6 Ion Implant/Doping .......................................................................... 175
`Phased Linear Scanner .......................................................................... 176
`Ion Flux Doping .................................................................................... 177
`4.6 Test Equipment ..........
`......................................
`179
`4.6.1 Visual and Functioual Test ............................................................... 179
`4.6.2 Optical Imaging ................................................................................ 180
`Optical Image Processing Equipment ................................................... 182
`Digital Image Processing Equipment .................................................... 184
`4.6.3 Electrical Evaluation ........................................................................ 184
`Transfer Admittance .............................................................................. 185
`IBM Test Set ......................................................................................... 186
`4.6.4 Voltage Imaging ............................................................................... 189
`4.7 TFT Repair .............
`........................................................ 189
`4.7.1 Laser Cutting .................................................................................... 190
`4.7.2 Laser-Assisted Deposition ................................................................ 191
`4.8 Asaemhly
`..............................................
`................... 192
`4.8.1 Polymer Printing .............................................................................. 192
`4.8.2 Assembly/Final Test ......................................................................... 194
`4.8.3 Die/PCB Attach ................................................................................ 198
`References
`............................................
`............................ 199
`
`X
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`FIGURES
`
`4—] Mirror projection Schematic diagram ...................................................... 163
`4-2 Example of PECVD system for thin film deposition .............................. 170
`4-3 Deposition chamber cutaway schematic ................................................. 171
`4-4 Cross section of PEVD electrode ............................................................ 171
`
`4-5 Plan View of phased linear scanner showing two substrates ................... 177
`4-6 Cross-section view of linear scanner end station .................................... 177
`
`4-7 Ion bucket source and deposition chamber schematic ............................ 179
`4-3 Optical pattern filtering for defect imaging ............................................ 182
`4—9 Transfer admittance testing ..................................................................... 186
`4- 10 Schematic diagram of voltage imaging of 3. TFT array ........................ 189
`4-11 Laser connect and disconnect alternatives ............................................ 190
`
`4- 12 Laser connect and disconnect using polysilicon ................................... 190
`4—13 Polymer printing schematic .................................................................. 193
`
`TABLES
`
`4-1 Canon MFA-2000 Specifications ........................................................... 163
`4-2 Nextral NESSO RIE System Specifications ............................................ 165
`4-3 Dry Etch Systems ..................................................... . .............................. 166
`4-4 Ulvac SDT-VT In-line Sputtering Systems ............................................ 167
`4—5 CVD Systems and Suppliers ................................................................... 168
`4—6 Anelva In—Line Plasma CVD Systems .................................................... 171
`4-7 Amorphous Silicon Deposition ............................................................... 172
`4-8 Nextral ND 400 PECVD System Specifications .................................... 173
`4-9 LPCVD Silicon Films (Leybold LC350 Reactor) ..........