EXHIBIT 1009
`
`U.S. Patent Application Publication No.
`2005/0151231 to Yoshida
`
`(“Yoshida”)
`
`

`

`(19) United States
`(12) Patent Application Publication (10) Pub. No.: US 2005/0151231 A1
`(43) Pub. Date:
`Jul. 14, 2005
`Yoshida
`
`US 20050151231A1
`
`(54) SURFACE MOUNT TYPE SEMICONDUCTOR
`DEVICE AND LEAD FRAME STRUCTURE
`THEREOF
`
`(76) Inventor: KenichiYoshida, Tokyo (JP)
`
`Correspondence Address:
`CERMAK & KENEALY, LLP
`515 EAST BRADDOCK RD SUITE B
`Alexandria, VA 22314 (US)
`
`(21) Appl. No.:
`
`10/939,972
`
`(22) Filed:
`
`Sep. 14, 2004
`
`(30)
`
`Foreign Application Priority Data
`
`Jan. 5, 2004 (JP) .................................... .. 2004-000042
`
`Publication Classi?cation
`
`(51) Int. Cl? ................................................... .. H01L 27/15
`
`(52) US. Cl. ............................................................ .. 257/669
`
`(57)
`
`ABSTRACT
`
`A surface mount type semiconductor device can be con?g
`ured to include a pair of lead frames that are butted to each
`other With a spacing such that ends of the lead frames are
`opposite to each other. Abare chip can be mounted on a chip
`mount portion on one end side of one of the lead frames, and
`Wire-bonded to a connection portion on an end side of the
`other lead frame. A housing can be insert-molded to an end
`side of both of the lead frames, and the lead frames can be
`shaped such that they extend along the side and bottom
`surfaces of the housing and form surface mounting terminal
`portions. The lead frames are preferably formed to be thin at
`least at the regions that are to be bent, and other regions
`thereof are preferably formed to be thick to improve heat
`radiating effect.
`
`10
`
`14a
`
`12
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 1
`
`

`

`Patent Application Publication Jul. 14, 2005 Sheet 1 0f 6
`Fig.1
`
`US 2005/0151231 A1
`
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`12b
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 2
`
`

`

`Patent Application Publication Jul. 14, 2005 Sheet 2 0f 6
`
`US 2005/0151231 A1
`
`55
`
`I.
`
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`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 3
`
`

`

`Patent Application Publication Jul. 14, 2005 Sheet 3 0f 6
`
`US 2005/0151231 A1
`
`Fig. 3
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 4
`
`

`

`Patent Application Publication Jul. 14, 2005 Sheet 4 0f 6
`
`US 2005/0151231 A1
`
`Fig. 4 Conventional Art
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 5
`
`

`

`Patent Application Publication Jul. 14, 2005 Sheet 5 0f 6
`
`US 2005/0151231 A1
`
`Fig. 5 Conventional Art
`
`
`
`luv-ninja‘ I-IIIIII‘
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 6
`
`

`

`Patent Application Publication Jul. 14, 2005 Sheet 6 0f 6
`
`US 2005/0151231 A1
`
`Fig. 6 Conventional Art
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 7
`
`

`

`US 2005/0151231 A1
`
`Jul. 14, 2005
`
`SURFACE MOUNT TYPE SEMICONDUCTOR
`DEVICE AND LEAD FRAME STRUCTURE
`THEREOF
`
`[0001] This invention claims the bene?t of Japanese patent
`application No. 2004-000042, ?led on Jan. 5, 2004, Which is
`hereby incorporated by reference.
`
`1. FIELD OF THE INVENTION
`
`[0002] The present invention relates to a surface mount
`type semiconductor device. More speci?cally, this invention
`relates to a surface mount type semiconductor device that
`can include a bare chip mounted on a lead frame arranged on
`a substrate, and to a lead frame structure thereof.
`
`2. DESCRIPTION OF THE RELATED ART
`
`[0003] A surface mount type semiconductor device such
`as a surface mount type LED has conventionally been
`con?gured as shoWn in FIGS. 4 to 6. In FIGS. 4 and 5, a
`surface mount type LED 1 includes a pair of lead frames 2
`and 3, an LED chip 4 mounted on the lead frame 2, a holloW
`lamphouse 5 insert-molded to the lead frames 2 and 3 and a
`sealing resin 6 ?lled into a holloW portion 5a of the
`lamphouse 5.
`
`[0004] The lead frames 2 and 3, are each made of a
`conductive material such as iron- or copper-based metal, and
`are provided With surface mounting terminal portions 2a and
`3a that are exposed on the bottom and side surfaces of the
`lamphouse 5.
`[0005] The lead frame 2 is further provided With a chip
`mount portion 2b exposed inside the holloW portion 5a at the
`center region of the lamphouse 5, Whereas the lead frame 3
`is provided With a connection portion 3b adjacent to the chip
`mount portion 2b and exposed inside the holloW portion 5a
`of the lamphouse 5.
`
`[0006] It is to be noted that the chip mount portion 2b and
`the connection portion 3b of the lead frames 2 and 3 are
`adjacent to each other such that they are opposite to each
`other With a spacing, for example, of approximately 0.2 mm
`or less. The terminal portions 2a and 3a are respectively
`formed continuously from the chip mount portion 2b and the
`connection portion 3b.
`
`[0007] The LED chip 4 has its bottom surface die-bonded
`to the chip mount portion 2b of the lead frame 2 and its front
`surface (top surface in FIG. 4) Wire-bonded to the connec
`tion portion 3b of the adjacent lead frame 3 via a gold Wire
`4a.
`
`[0008] The lamphouse 5 is insert-molded to the lead
`frames 2 and 3 by, for example, resin, and is provided With
`the holloW portion 5a that is open upWard. This alloWs the
`inner surface of the holloW portion 5a of the lamphouse 5 to
`constitute a re?ecting frame for the LED chip 4.
`[0009] Within the holloW portion 5a, the chip mount
`portion 2b of the lead frame 2 and the connection portion 3b
`of the lead frame 3 are exposed. The sealing resin 6, made
`of a silicon-based thermosetting resin, etc., is ?lled into the
`holloW portion 5a of the lamphouse 5 and hardened.
`
`[0010] It is to be noted that the lead frames 2 and 3 are
`subjected to forming after the sealing resin 6 is ?lled and
`hardened, thus forming the terminal portions 2a and 3a.
`
`[0011] The lead frames 2 and 3 have complex shapes as
`shoWn in FIG. 5 partly to take as many of the lead frames
`2 and 3 as possible from a ?at plate material in the
`manufacture of the chip LED 1 thus con?gured. For this
`reason, the individual lead frames 2 and 3 are not set in a
`mold for insert-molding of the lamphouse 5. Instead, the
`mutually and integrally molded lead frames 2 and 3 are set
`in a mold for insert-molding of the lamphouse 5.
`[0012] This eliminates the need to accurately position each
`of the lead frames 2 and 3 Within the mold. In addition,
`positioning the integral lead frames 2 and 3 Within the mold
`alloWs accurate positioning of the lead frames 2 and 3
`relative to each other.
`
`[0013] According to the chip LED 1 thus manufactured,
`When a drive voltage is applied to the LED chip 4 from the
`terminal portions 2a and 3a of the lead frames 2 and 3, the
`LED chip 4 emits light. This light is re?ected by the inner
`surface of the holloW portion 5a of the lamphouse 5 and is
`simultaneously emitted externally through the sealing resin
`6, thus being radiated upWard.
`[0014] For the chip LED 1 having such a con?guration,
`incidentally, after the product siZe is determined, the areas of
`the lead frames 2 and 3 can be roughly determined, and it is
`preferred that the areas of the lead frames 2 and 3 be as small
`as possible in consideration of adhesion betWeen the sealing
`resin 6 and the lamphouse 5.
`
`[0015] To improve the heat radiating property of the lead
`frames 2 and 3, therefore, the volumes of the lead frames 2
`and 3 could be increased by increasing their thicknesses as
`shoWn in FIG. 6 Without increasing their areas.
`
`[0016] HoWever, increasing the thicknesses of the lead
`frames 2 and 3 leads to a relatively large stress acting on the
`lamphouse 5 during forming of the lead frames 2 and 3,
`Which can possibly crack or otherWise damage the lamp
`house 5 under certain circumstances.
`
`[0017] In addition, the spacing betWeen the mutually
`opposing end surfaces of the lead frames 2 and 3 must be
`Wider than the thicknesses of the lead frames 2 and 3 for lead
`frame manufacturing reasons, resulting in a large-siZed
`package for the LED 1.
`
`[0018] Such problems are not limited to the aforemen
`tioned surface mount type LED. The same problems are
`apparent in other surface mount type semiconductor devices
`such as devices that generate heat during operation, namely,
`semiconductor laser devices, various ICs, etc.
`
`SUMMARY OF THE INVENTION
`
`[0019] In accordance With one of several aspects of the
`present invention, a simple con?guration is provided for a
`surface mount type semiconductor device and lead frame
`structure thereof for, among other reasons, improving the
`heat radiating property of the lead frames and reducing
`stress during forming of the lead frames. The surface mount
`type semiconductor device can include a pair of lead frames
`that are butted to each other With a spacing such that one end
`of the lead frames are opposite to each other. Abare chip can
`be mounted on a chip mount portion on one end side of one
`of the lead frames and Wire-bonded to a connection portion
`on one end side of the other lead frame. A housing is
`preferably insert-molded to one end sides of both of the lead
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 8
`
`

`

`US 2005/0151231 A1
`
`Jul. 14, 2005
`
`frames. The lead frames can be shaped by forming so as to
`extend along the side and bottom surfaces of the housing and
`to form surface mounting terminal portions. The lead frames
`are also preferably formed such that they are thin at least at
`the regions to be bent during forming, With other regions
`thereof formed to be thick to improve heat radiating effect.
`
`[0020] In the surface mount type semiconductor device of
`the present invention it is preferred that the lead frames be
`thinly formed at the regions of the mutually-opposing end
`surfaces on the rear surface side. In addition, the lead frames
`are preferably provided With stepped portions at the regions
`of the mutually-opposing end surfaces on the rear surface
`side. Further, the lead frames are preferably provided With
`sloped portions at the regions of the mutually-opposing end
`surfaces on the rear surface side.
`
`[0021] According to another aspect of the present inven
`tion a lead frame structure of a surface mount type semi
`conductor device can include a pair of lead frames that are
`butted to each other With a spacing such that one end of the
`lead frames are opposite to each other. A bare chip can be
`mounted on a chip mount portion on one end side of one of
`the lead frames and Wire-bonded to a connection portion on
`one end side of the other lead frame. A housing can be
`insert-molded to one end side of both of the lead frames,
`Wherein the lead frames can be shaped by forming so as to
`extend along the side and bottom surfaces of the housing and
`to form surface mounting terminal portions. The lead frames
`are preferably formed such that they are thin at least at the
`regions to be bent during forming, With other regions thereof
`formed such that they are thick to improve heat radiating
`effect.
`
`[0022] It is preferred that the lead frames be thinly formed
`at the regions of the mutually-opposing end surfaces on the
`rear surface side. The lead frames are preferably provided
`With stepped portions at the regions of the mutually-oppos
`ing end surfaces on the rear surface side. The lead frames are
`also preferably provided With sloped portions at the regions
`of the mutually-opposing end surfaces on the rear surface
`side.
`
`[0023] The exposed portions on the side and bottom
`surfaces of the housing of the lead frames can be connected
`to the connection land on the mount substrate by surface
`mounting the semiconductor device. The bare chip can be
`poWered from both lead frames, thus putting the bare chip
`into operation.
`
`[0024] In this case, the individual lead frames can be
`formed to be thick as a Whole, thus boosting their volumes.
`This can secure a suf?cient volume for the individual lead
`frames even if the semiconductor package is small in siZe,
`and therefore the lead frames can be relatively small in area.
`This can lead to improvements in heat radiating effect of the
`lead frames, thus ef?ciently radiating heat generated during
`the operation of the bare chip mounted on the chip mount
`portion of one of the lead frames.
`
`[0025] The lead frames can be thinly formed at the regions
`that are to be bent during forming, keeping stress that occurs
`during forming relatively small and considerably reducing
`the likelihood of cracking or otherWise damaging the hous
`ing that is molded to the lead frames.
`
`[0026] If the lead frames are thinly formed at the regions
`of the mutually-opposing end surfaces on the rear surface
`
`side and, more speci?cally, if the lead frames are provided
`With stepped or sloped portions at the regions of the mutu
`ally-opposing end surfaces on the rear surface, the butt
`thickness of the lead frames at the mutually-opposing end
`surfaces Will diminish. Thus, it is possible, even When a
`spacing that is Wider than the butt thickness is secured, to
`reduce the spacing betWeen the mutually-opposing end
`surfaces of the lead frames and further doWnsiZe the package
`of the surface mount type semiconductor device. Thus, the
`lead frames can be formed to be thick as a Whole, boosting
`the volumes of the lead frames and improving their heat
`radiating property.
`[0027] According to another aspect of the invention, A
`surface mount type semiconductor device can include a pair
`of lead frames having a ?rst end and a second end that are
`spaced from each other and that are butted opposite to each
`other, the ?rst end having a chip mount portion and the
`second end having a connection portion. A chip can be
`mounted on the chip mount portion and Wire-bonded to the
`connection portion. A housing is preferably molded to the
`lead frames, Wherein the lead frames are shaped such that
`they extend along a bottom surface of the housing and form
`surface mounting terminal portions. The lead frames can be
`thinner at least at regions that are bent, and are relatively
`thicker at other regions.
`
`[0028] According to yet another aspect of the invention, a
`lead frame structure can include a pair of lead frames that
`have a ?rst end and a second end and that are butted to each
`other With a spacing such that the ?rst and second ends of the
`lead frames are located opposite to each other. The lead
`frames can include a chip mount portion located at the ?rst
`end of the lead frames, and a connection portion located at
`the second end of the lead frames. Achip can be mounted on
`the chip mount portion and Wire-bonded to the connection
`portion. A housing can be located adjacent to the lead
`frames, Wherein the lead frames include bent regions such
`that the lead frames extend along a bottom surface of the
`housing and include surface mounting terminal portions.
`The lead frames can be thinner at least at the bent regions of
`the lead frames and can be relatively thicker at other regions
`of the lead frames.
`
`[0029] Additional features, advantages, and embodiments
`of the invention may be set forth or apparent from consid
`eration of the folloWing detailed description, draWings, and
`claims. Moreover, it is to be understood that both the
`foregoing summary of the invention and the folloWing
`detailed description are exemplary and intended to provide
`further explanation Without limiting the scope of the inven
`tion as claimed.
`
`DESCRIPTION OF THE DRAWINGS
`
`[0030] The above and other aspects, features and advan
`tages of the present invention Will become more apparent
`from the folloWing detailed description When taken in con
`junction With the accompanying draWings, in Which:
`
`[0031] FIG. 1 is a sectional vieW shoWing a con?guration
`of an embodiment of a surface mount type LED made in
`accordance With the principles of the present invention;
`
`[0032] FIG. 2 is a sectional vieW shoWing a con?guration
`of another embodiment of a surface mount type LED made
`in accordance With the principles of the present invention;
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 9
`
`

`

`US 2005/0151231 A1
`
`Jul. 14, 2005
`
`[0033] FIG. 3 is a sectional vieW showing a con?guration
`of another embodiment of a surface mount type LED made
`in accordance With the principles of the present invention;
`[0034] FIG. 4 is a sectional vieW shoWing the con?gura
`tion of an example of a conventional surface mount type
`LED;
`[0035] FIG. 5 is a plan vieW of the surface mount type
`LED of FIG. 4; and
`
`[0036] FIG. 6 is a sectional vieW shoWing the con?gura
`tion of another example of a conventional surface mount
`type LED.
`
`DESCRIPTION OF PREFERRED
`EMBODIMENTS
`
`[0037] Preferred embodiments of the present invention
`Will be described beloW in detail With reference to FIGS. 1
`to 3.
`
`[0038] It is to be noted that While the embodiments
`described beloW are preferred speci?c examples of the
`present invention and therefore have various technically
`preferred features, the present invention is not limited
`thereto.
`
`[0039] FIGS. 1 to 3 shoW the con?guration of various
`embodiments of a surface mount type LED made in accor
`dance With the principle of the present invention.
`
`[0040] In FIG. 1, a surface mount type LED 10 can
`include a pair of lead frames 11 and 12, an LED chip 13
`mounted on the lead frame 11, a holloW lamphouse 14
`con?gured as a housing that is preferably insert-molded to
`the lead frames 11 and 12. A sealing resin 15 can be ?lled
`into a holloW portion 14a of the lamphouse 14.
`
`[0041] The lead frames 11 and 12, can each be made of a
`conductive material such as iron- or copper-based metal, and
`can be provided With surface mounting terminal portions
`11a and 12a that can be exposed on the bottom and side
`surfaces of the lamphouse 14.
`
`[0042] The lead frame 11 is preferably provided With a
`chip mount portion 11b that is exposed inside the holloW
`portion 14a at the center region of the lamphouse 14. The
`lead frame 12 is preferably provided With a connection
`portion 12b that is adjacent to the chip mount portion 11b
`and exposed inside the holloW portion 14a of the lamphouse
`14. The terminal portions 11a and 12a can be formed
`respectively from the chip mount portion 11b and the
`connection portion 12b.
`
`[0043] The LED chip 13 can have its bottom surface
`die-bonded to the chip mount portion 11b of the lead frame
`11 and its front surface (top surface in FIG. 1) Wire-bonded
`to the connection portion 12b of the adjacent other lead
`frame 12 via a gold Wire 13a.
`
`[0044] The lamphouse 14 can be insert-molded to the lead
`frames 11 and 12, for example, by resin, and can be provided
`With a holloW portion 14a that is open upWard. This alloWs
`the inner surface of the holloW portion 14a of the lamphouse
`14 to constitute a re?ecting frame for the LED chip 13.
`
`sealing resin 15, preferably made of a silicon-based ther
`mosetting resin, etc., is ?lled into the holloW portion 14a of
`the lamphouse 14 and hardened. The lead frames 11 and 12
`are preferably subjected to forming after ?lling and hard
`ening of the sealing resin 15, thus forming the terminal
`portions 11a and 12a.
`
`[0046] The surface mount type LED 10 according to the
`above described embodiment of the invention includes lead
`frames 11 and 12 that can be made thicker as a Whole as
`compared to conventional lead frames (except for the
`regions to be bent during forming).
`[0047] When a drive voltage is applied to the LED chip 13
`from the terminal portions 11a and 12a of the lead frames 11
`and 12, the LED chip 13 emits light. This light can be
`re?ected by the inner surface of the holloW portion 14a of
`the lamphouse 14 and simultaneously emitted externally
`through the sealing resin 15, thus being radiated upWard.
`
`[0048] The individual lead frames 11 and 12 can be
`formed thick as a Whole, thus boosting their volumes. This
`secures a suf?cient volume for the individual lead frames 11
`and 12 even if the semiconductor package of the surface
`mount type LED 10 is small in siZe (and therefore the lead
`frames 11 and 12 are relatively small in area).
`
`[0049] The above-described structures can in some
`instances lead to improved heat radiating effect for the lead
`frames 11 and 12. Ef?cient radiation of heat generated
`during the operation of the LED chip 13 mounted on the chip
`mount portion 11b of the lead frame 11 can also be achieved.
`
`[0050] The lead frames 11 and 12 can be thinly formed at
`the regions that are to be bent during the forming process,
`thus keeping stress that occurs during forming relatively
`small and considerably reducing the likelihood of cracking
`or otherWise damaging the lamphouse 14 that is molded to
`the lead frames 11 and 12.
`
`[0051] FIG. 2 shoWs a con?guration of another embodi
`ment of a surface mount type LED made in accordance With
`the principles of the present invention. In FIG. 2, the surface
`mount type LED 20 is similar in con?guration to the surface
`mount type LED 10 shoWn in FIG. 1 in some aspects, and
`accordingly the same elements are assigned the same sym
`bols, and explanation of similar or identical elements Will be
`omitted.
`
`[0052] The surface mount type LED 20 can include lead
`frames 11 and 12 that are provided With stepped portions 11c
`and 12c at the regions of the mutually-opposing end surfaces
`and on the rear surface of the mutually-opposing end sur
`faces. The stepped portions alloW these regions to be further
`thinned.
`
`[0053] The surface mount type LED 20 thus con?gured
`can function in approximately the same manner as the
`surface mount type LED 10 shoWn in FIG. 1. The lead
`frames 11 and 12 can be formed thinner at the mutually
`opposing end surfaces due to the stepped portions 11c and
`12c, thus possibly reducing the spacing therebetWeen close
`to the thin thickness of the stepped portions 11c and 12c.
`This makes it possible to further doWnsiZe the overall
`package of the surface mount type LED 20.
`
`[0045] Within the holloW portion 14a, the chip mount
`portion 11b of the lead frame 11 and the connection portion
`12b of the lead frame 12 can be partially exposed. The
`
`[0054] FIG. 3 shoWs the con?guration of yet another
`embodiment of a surface mount type LED made in accor
`dance With the principles of the present invention. In FIG.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 10
`
`

`

`US 2005/0151231 A1
`
`Jul. 14, 2005
`
`3, the surface mount type LED 30 is similar to the surface
`mount type LED 20 shown in FIG. 2 in some aspects, and
`accordingly the same elements are assigned the same sym
`bols, and explanation of the same or similar elements Will be
`omitted.
`
`[0055] The surface mount type LED 30 can include lead
`frames 11 and 12 that are provided With sloped portions 11d
`and 12d instead of the stepped portions 11c and 12c at the
`regions of the mutually-opposing end surfaces and on the
`rear surface of the mutually-opposing end surfaces. Thus,
`these regions can be formed to be thin. The surface mount
`type LED 30 thus con?gured can function in the same
`manner as the surface mount type LED 10 shoWn in FIG. 1,
`and the lead frames 11 and 12 can be formed such that they
`are thin at the mutually-opposing end surfaces due to the
`sloped portions 11d and 12d, possibly reducing the spacing
`therebetWeen. This makes it possible to further doWnsiZe the
`overall package of the surface mount type LED 30.
`
`[0056] While the above description relates to embodi
`ments in Which the present invention is applied to the surface
`mount type LEDs 10, 20 and 30, the present invention is not
`limited thereto. It should be apparent that the present inven
`tion is applicable to other semiconductor devices such as ICs
`and other devices, especially devices that generate heat
`during operation.
`[0057] Improved heat radiating effect can be achieved in a
`semiconductor device even as its volume is increased by
`forming the lead frames thick except for the regions to be
`bent during forming procedures, even if the area remains
`unchanged. The lead frames can be formed to be thin at the
`regions that are to be bent during the forming procedure,
`thus reducing stress occurring during forming, and prevent
`ing damage such as cracking to the housing that is molded
`to the lead frames. The invention is applicable to various
`semiconductor devices, including those that incorporate
`elements such as IC’s, lasers, diodes or bare chips and other
`devices that generate heat during operation.
`[0058] While illustrative and presently preferred embodi
`ments of the present invention have been described in detail
`herein, it is to be understood that the inventive concepts may
`be otherWise variously embodied and employed and that the
`appended claims are intended to be construed to include
`such variations except insofar as limited by the prior art. For
`example, the stepped portion and the sloped portion can be
`differently con?gured to provide a narroWing or thinner
`portion at the lead frame ends. Speci?cally, other shapes,
`such as a curved or Zig-Zag shapes can be used to effect the
`narroWing of either the ends of the lead frames or the
`generally thinner portions. In addition, different methods of
`manufacture can be used to make the device and frame
`structure, such as insert molding, resin molding, and other
`processes. In addition, the ends of the lead frames do not
`have to be butted exactly in orientation With each other, but
`can be butted opposite to each other such that there is some
`play in alignment, provided the alignment does not disturb
`manufacturability of the device.
`
`What is claimed is:
`1. A surface mount type semiconductor device compris
`ing:
`a pair of lead frames having a ?rst end and a second end
`that are spaced from each other and that are butted
`
`opposite to each other, the ?rst end having a chip mount
`portion and the second end having a connection por
`tion;
`a chip that is mounted on the chip mount portion and
`Wire-bonded to the connection portion; and
`
`a housing that is molded to the lead frames, Wherein
`
`the lead frames are shaped such that they extend along a
`bottom surface of the housing and form surface mount
`ing terminal portions, and
`
`the lead frames are thinner at least at regions that are bent,
`and are relatively thicker at other regions.
`2. The surface mount type semiconductor device accord
`ing to claim 1, Wherein the ?rst end of the lead frames has
`a ?rst end rear surface located opposite the chip mount
`portion, and the second end of the lead frames has a second
`end rear surface located opposite the connection portion, and
`at least one of the ?rst end rear surface and second end rear
`surface includes a thinner portion that is thinner than the
`thicker other regions of the lead frames.
`3. The surface mount type semiconductor device accord
`ing to claim 2, Wherein the lead frames include a stepped
`portion at at least one of the rear surfaces.
`4. The surface mount type semiconductor device accord
`ing to claim 2, Wherein the lead frames include a sloped
`portion at at least one of the rear surfaces.
`5. A lead frame structure comprising:
`
`a pair of lead frames that include a ?rst end and a second
`end and that are butted to each other With a spacing
`such that the ?rst and second ends of the lead frames
`are located opposite to each other, the lead frames
`including a chip mount portion located at the ?rst end
`of the lead frames, and a connection portion located at
`the second end of the lead frames;
`
`a chip mounted on the chip mount portion and Wire
`bonded to the connection portion; and
`
`a housing adjacent to the lead frames, Wherein the lead
`frames include bent regions such that the lead frames
`extend along a bottom surface of the housing and
`include surface mounting terminal portions, and
`
`the lead frames are thinner at least at the bent regions of
`the lead frames and are relatively thicker at other
`regions of the lead frames.
`6. The lead frame structure according to claim 5, Wherein
`the lead frames include a ?rst end rear surface located
`opposite the chip mount portion, and a second end rear
`surface located opposite the connection portion, and at least
`one of the ?rst end rear surface and second end rear surface
`includes a thinner portion that is thinner than the thicker
`other regions of the lead frames.
`7. The lead frame structure according to claim 6, Wherein
`the lead frames include a stepped portion at one of the rear
`surfaces.
`8. The lead frame structure according to claim 6, Wherein
`the lead frames include a sloped portion at one of the rear
`surfaces.
`9. The lead frame structure according to claim 5, Wherein
`the housing is insert molded to the lead frames.
`10. The surface mount type semiconductor device accord
`ing to claim 1, Wherein the housing is insert molded to the
`lead frames.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 11
`
`

`

`US 2005/0151231 A1
`
`Jul. 14, 2005
`
`11. The lead frame structure according to claim 5, wherein
`the thicker other regions of the lead frames improves a heat
`radiating effect of the lead frames.
`12. The surface mount type semiconductor device accord
`ing to claim 1, Wherein the thicker other regions of the lead
`frames improves a heat radiating effect of the lead frames.
`13. The lead frame structure according to claim 5, Wherein
`the chip is a bare chip mounted to the chip mount portion.
`14. The surface mount type semiconductor device accord
`ing to claim 1, Wherein the chip is a bare chip mounted to
`the chip mount portion.
`15. The lead frame structure according to claim 7, Wherein
`the stepped portion is located on both rear surfaces.
`16. The surface mount type semiconductor device accord
`ing to claim 3, Wherein the stepped portion is located on both
`rear surfaces.
`17. The lead frame structure according to claim 8, Wherein
`the sloped portion is located on both rear surfaces.
`18. The surface mount type semiconductor device accord
`ing to claim 4, Wherein the sloped portion is located on both
`rear surfaces.
`
`19. The lead frame structure according to claim 5, Wherein
`the lead frames eXtend along a side surface of the housing.
`
`20. The surface mount type semiconductor device accord
`ing to claim 1, Wherein the lead frames eXtend along a side
`surface of the housing.
`
`21. The lead frame structure according to claim 5, Wherein
`a space exists betWeen the ?rst end and the second end, and
`the ?rst end is thinner at a location adjacent the space and
`becomes relatively thicker at a location further from the
`space.
`
`22. The surface mount type semiconductor device accord
`ing to claim 1, Wherein a space eXists betWeen the ?rst end
`and the second end, and the ?rst end is thinner at a location
`adjacent the space and becomes relatively thicker at a
`location further from the space.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1009 Page 12
`
`