EXHIBIT 1006
`
`International Patent Application Publication
`No. WO 2004/051757 to Arndt et al.
`
`(“Arndt IV”)
`
`
`
`International Patent Application Publication
`No. WO 2004/051757 to Arndt et al.
`
`(“Arndt IV”)
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 1
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 2
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 3
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 4
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 5
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 6
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 7
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 8
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 9
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 10
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 11
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 12
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 13
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 14
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 15
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 16
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 17
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 18
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 19
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 20
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 21
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`Patent Translate
`
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`
`
` Notice
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`This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
`complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
`financial decisions, should not be based on machine-translation output.
`
`
`DESCRIPTION WO2004051757
`
`
`Description Optoelectronic component The invention relates to an optoelectronic component
`having an optoelectronic chip and a chip carrier as well as with a housing.
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`Components of the type mentioned are known, for example from the document WO 99/07023.
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`In these devices, an optoelectronic chip is fixed on a chip carrier.
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`The chip and parts of the chip carrier are surrounded by a housing and embedded in this housing.
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`The housing may for example be made by injection molding.
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`The chip carrier has a region on which the opto-electronic chip is mounted.
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`In addition, the chip carrier terminals are led out of the chip-carrying area to the outside from the
`housing.
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`17-01-2015 1
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 22
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`There, the connections generally form solder pads, by means of which the component can be
`soldered to a circuit board.
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`Components of the type mentioned are used for example as LEDs are increasingly preferred as
`light sources in the industry, automotive, telecommunications, and also in other areas.
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`Thus, the demands on the mechanical strength and the reliability of the components increases
`markedly.
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`In particular, the mechanical demands on the thermo-mechanical load is high.
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`The reliability of such a component can be detected with a metric that has the unit parts per million
`(ppm).
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`This will determine how many components of one million pieces show a failure of publication.
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`There failure rates close to 0 ppm are required now.
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`The known components of the above-mentioned type have the disadvantage that the desired
`failure rate can not reach in terms of reliability.
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` A
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` characteristic weakness is that the connection between the optoelectronic chip and the chip
`carrier is too often damaged or completely tears open.
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`The reason for this may be that at a temperature stress on the component, such as, for example,
`occur when soldering the connections on a board the different thermo-mechanical properties of
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`17-01-2015 2
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 23
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`the materials used occur burdensome to light.
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`For example, it is common to use in the manufacture of the components materials with very
`different coefficients of thermal expansion.
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`In addition, the materials, for example of the chip carrier and the housing differ in their elastic
`modulus.
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`In a thermal stress due to these differences in material strong mechanical forces that deform the
`individual material components or move against each other or can shave arise.
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`This results in that the risk of failure of the components is increased after soldering, often being a
`solution of the electrical or mechanical connection between the chip carrier and the chip, can be
`identified as the cause.
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`It can even minor warming of the device to an open electrical contact between the chip and the
`chip carrier.
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`It is therefore an object of the present invention to provide a device of the type mentioned, whose
`reliability is increased.
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`This object is achieved by a component according to Patent Claim first
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`Advantageous embodiments of the device are described in the further claims.
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`17-01-2015 3
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 24
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`The invention is based on the idea that if possible symmetrical design of the device is intended to
`minimize the forces under temperature stress, especially the forces acting between the
`optoelectronic chip and the chip carrier.
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`In particular, this is attempted by a point-symmetrical design of the device.
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`Here, the effect is used that at any point of the body on which acts a thermo-mechanical force, one
`to mirror symmetry point of the same body are pers at a point-symmetric design of a body to which
`an amount of uniform, but acting in the opposite direction of force acts.
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`Accordingly, exists in the body is a point at which compensate for all the forces acting essentially
`mutually exclusive.
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`This is the point at which the body is point-symmetrical.
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`Preferably, then this symmetry point the component to be arranged.
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`The above considerations apply in particular to the body that surrounds the device.
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`With respect to the chip carrier, similar considerations have been displayed represents.
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`However, here is due to the web form, which run ports initially substantially to the longitudinal axes
`of the eighth to medium connections of the chip carrier.
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`The forces acting se between the chip carrier and the surrounding housing, namely act mainly
`along the longitudinal center telachsen the connections.
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`17-01-2015 4
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 25
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`It is noted that both can happen for example, that when soldering the connections they are
`exposed to a high temperature, which is also transmitted to the housing.
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`After soldering, the circuits of the chip carrier arrival cool much faster than the housing, which,
`inter alia, terbahnen to the better thermal conductivity of the connections and also to their thermal
`contact with conductor can be traced to a circuit board.
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`Thus, there arises a temperature difference, which results in a shear stress between the terminals
`and the surrounding body.
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`Such shear stress can be repre- sented by a force along the Längsmitte-
`
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`acts salmon of each port.
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`It is also important to pay attention so according to the invention that besides the housing also the
`longitudinal central axes of the terminals of the chip carrier having the necessary symmetry to
`obtain a compensation of forces.
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`There is provided an optoelectronic component, which contains an opto-electronic chip.
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`There, a chip carrier is also provided with a central portion on which the chip is mounted.
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`Moreover, the chip carrier to leads which extend outwardly, from the central region of the chip
`carrier.
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`The optoelectronic chip and parts of the chip carrier are encased in a body.
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`17-01-2015 5
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 26
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`The arrangement of the chip, the shape of the body and the forming of the chip carrier are now
`selected so that the projection of the body and the longitudinal central axes of the ports are on a
`plane of contact between the chip and chip carrier are each in substantially point-symmetrically to
`the projection of the center point of the chip.
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`Preference is given here extend the connections from the chip carrier of substantially in a plane to
`the outside.
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`The plane of contact between the chip and chip carrier may be provided for example by the
`mounting plane in which the chip is mounted on the chip carrier.
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`It should be noted that for simplicity in this text, the formulation is used "point-symmetric to the
`center" is synonymous to the term "point-symmetric to the projection of the center point".
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`The symmetrical design of the device can be achieved that occur thermo-mechanical forces
`cancel each other and thus can reduce the risk of failure of the component.
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`In one embodiment of the device the body may consist of a radiation-permeable material.
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`This has the advantage that the light generated in the chip can be coupled directly through the
`body.
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`17-01-2015 6
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 27
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`In another embodiment of the component of the body comprises a housing which is provided with
`a recess.
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`In the recess a radiation-transmissive envelope is arranged.
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`The chip is embedded in this envelope.
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`The projection of the envelope on the plane is advantageously substantially point symmetrically to
`the center of the chip.
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`This embodiment of the device has the advantage that the radiation-transmissive material is used
`only where it is also used, namely in the immediate vicinity of the chip.
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`The rest of the body may be formed as a housing, which need not necessarily be transparent to
`radiation and which consequently is a variety of suitable materials available which may be
`selected etc. For example, in terms of weight, mechanical strength, workability, thermal expansion.
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`In the event that the body consists of two different materials, both the housing and the sheath is
`particularly advantageously each formed substantially point-symmetrically to the center.
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`In particular, it is advantageous that the chip in the symmetry point of sheath and housing is
`arranged.
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`This can achieve that, for a thermally induced deformation of the sheath in the housing, a
`mechanical stress on the chips can be greatly reduced because the forces acting on the chip due
`to the deformation of the sheath, due to the point symmetry of the envelope or on the basis the
`point symmetry of the projection of the envelope can largely compensate the contact plane.
`
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`17-01-2015 7
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 28
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`With the design of the body is formed of two components at the bottom of the cavity, a contact
`surface between the casing and housing.
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`Depending on the type of the component this contact surface can be relatively large, namely,
`when a large part of the surface of the chip carrier has contact with the casing.
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`In this case, contact surfaces between the casing and housing arise wherever the bottom of the
`well is not covered by the chip carrier.
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`In another embodiment, where the technique of the so-called.
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`"Overmold" is applied, the chip carrier is embedded to a large part completely into the housing and
`the contact between the sheath and the bottom of the recess occurs over almost the entire surface
`of the bottom of the recess.
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`In both cases, it is advantageous if the projection of the contact areas between the casing and the
`bottom of the recess to the back contact plane substantially point-symmetrically to the center of
`the chip.
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`This makes it possible to ensure that the forces acting between the bottom of the well and the
`casing shear forces compensate each other as well as possible.
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`In another embodiment of the component, the chip carrier is designed so that not only the
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`17-01-2015 8
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 29
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`longitudinal central axes of the terminals but the entire chip carrier is designed such that its
`projection onto the plane is substantially point-symmetrically to the center of the chip.
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`This embodiment has the advantage that an even better compensation of the forces can be
`achieved.
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`In another embodiment of the device further, separate from the chip carrier terminals are provided,
`which serve for contacting the chip of the chip carrier opposite from the side.
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`Also, these connectors are advantageously designed so that their longitudinal central axes or
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`also the connectors even in the projection onto the plane of contact are considered substantially
`point-symmetrically to the center of the chip.
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`In another embodiment of the component means for anchoring of the chip carrier in the body are
`provided.
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`Such means for anchoring can be, for example, the chip carrier shaped barbs into the chip carrier
`shaped holes or, for example in the chip carrier shaped debossments.
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`The holes and the barbs ensure good penetration of the chip carrier with the body, as they may
`arise, for example with the body during encapsulation of the chip carrier.
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`This means for anchoring the chip carrier can be arranged asymmetrically within the meaning of
`the above considerations.
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`17-01-2015 9
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 30
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`That is., That the means for anchoring the chip carrier need not have point symmetry to the center
`point of the chip with respect to their positions.
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`However, it is advantageous according to another embodiment to arrange these means for
`anchoring the chip carrier substantially point-symmetrically to the center of the chip in the sense of
`the above embodiments.
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`According to another embodiment of the component, the means for anchoring the die carrier not
`symmetrical, but uniformly distributed over the chip carrier, in order to prevent that one half of the
`chip carrier is well anchored within the body, while the other half, such as the opposite half of
`Chipträgers'glatt in the body runs.
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`However, this would increase the risk of unbalanced shear forces between the body and the chip
`carrier occur.
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`In another embodiment of the device it is provided that each terminal has, on the back of the body
`a soldering surface.
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`This has the advantage that the component by surface mounting on a circuit board
`
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`can be mounted.
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`On the other hand this has the advantage that the symmetry of the chip carrier can be well utilized,
`since an optimum compensation of the forces acting thermomechanical just then takes place when
`the heating of the chip carrier in the assembly of all connectors is carried forth simultaneously
`sufficiently.
`
`17-01-2015 10
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 31
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`It will also not provided with an arrangement of the component, in which the solder pads of the
`chip carrier are soldered to the conductive surfaces of a circuit board.
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`In the following, the invention will be described with reference to exemplary embodiments and
`associated figures: Figure 1 shows an embodiment of an inventive device in a schematic cross-
`section.
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`Figure 2 shows a schematic representation of elements of a projection on to the plane of a
`housing, a chip and an enclosure of an embodiment of the construction.
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`Figure 3 shows for one embodiment the component is a schematic illustration of a projection of the
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`Chip carrier on the plane.
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`Figure 4 shows a schematic representation of a projection on a chip carrier on the level for a
`further
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`Embodiment.
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`Figure 5 shows a further schematic representation of a
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`17-01-2015 11
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 32
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`Projection of an exemplary chip carrier on the
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`Level.
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`With regard to the figures, it should be noted that like reference numerals denote elements similar
`to one another, or meet at least the same or similar functions.
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`Figure 1 shows a component with an optoelectronic chip 1 which is secured on a chip carrier 2.
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`The optoelectronic chip 1 may be, for example, a light emitting diode or a laser diode.
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`The optoelectronic chip 1 may radiate vertically or laterally.
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`In the second case, the housing 11 is formed so that the inner sides of the recess 12 form a
`reflector for the light emitted from the chip 1.
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`The chip carrier 2 can be made for example of a lead frame (lead frame).
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`This has the advantage that a large number of components can be easily and cheaply.
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`The chip carrier 2 consists in this case of a very thin conductive sheet metal from which a
`particular form has been punched out.
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`17-01-2015 12
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 33
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`For example, it is contemplated to use an iron-nickel alloy as the material for the chip carrier 2.
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`The chip 1 and the central part of the chip carrier 2 are enveloped by a body 5 which is composed
`of a housing 11 and a radiation-transparent envelope thirteenth
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`The radiation-permeable envelope 13 is made of a material which is permeable to the radiation
`emitted by the chip 1 radiation.
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`It is, for example, consider using a resin for coating 13.
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`The housing 11 is preferably used for the mechanical stabilization of the device.
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`It can for example consist of a thermoplastic.
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`As regards the manufacturing of the device according to figure 1, it can be provided according to
`the so-called.
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`"Premold" technique the chip carrier 2 to over mold in a first step to the housing 11.
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`Second step is to mount the chip 1 and a wire into an opening (cavity) of the housing 11.
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`In a third step, the envelope 13 is then filled into a recess 12 of the housing.
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`17-01-2015 13
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 34
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`The concrete embodiment shown in Figure 1 of the component provides the use of so-called.
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`"Overmold" technique from.
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`This means that the top side of the chip carrier 2 is 12 in the region of the depression not covered
`with material of the housing 11.
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`This has the result that a direct contact between the casing 13 and the bottom of the housing 11 is
`placed only at the free of chip carrier 2 digits of the housing bottom.
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`According to another possible embodiment, one would apply the "overmold" technique, where the
`top side of the chip carrier 2 on large areas of material of the housing 11 would be covered.
`
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`In this case would result in a greater contact surface between the casing 13 and the bottom of the
`recess 12 (see FIG.
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`Reference numeral no. 14 in Figures 3,4 and 5).
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`The components shown in the examples mentioned here are all shown as produced without the
`"overmold" technology components.
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`On the back of the housing 11 form terminals 41,42 of the chip carrier 2 solder pads 16 which are
`soldered to conductive surfaces 18 a printed circuit board 17.
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`17-01-2015 14
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 35
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`It should also be pointed out that the contact or the mounting surface between the chip 1 and the
`chip carrier 2, and the portions of the terminals 41,42, which are within the body 5, lie substantially
`in a single plane 9.
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`However, this is not mandatory, rather, it would be conceivable that the central area (see FIG.
`
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`Numeral 3 in Figures 3,4, 5) with respect to the running inside of the body 5 portion of the
`terminals 41,42 increased or intensified.
`
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`In any case, the reference plane, in terms of the criterion of point symmetry is fulfilled, the plane of
`contact between the chip 1 and the chip carrier 2nd
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`The attachment of the terminals 42,41 on conductive surfaces 18 of the circuit board 17 by means
`of a solder 20th
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`Figure 2 shows a projection of the body 5 on the contact plane between the chip 1 and chip carrier
`2nd
`
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`It can be seen that both the housing 11 and the radiation-transmissive envelope 13 are point-
`symmetrical with respect to their outer contours in plan view to the center of the chip 8 1st
`
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`The same applies to the projections of the body 5 and the cladding 13 on the contact plane
`between the chip 1 and chip carrier 2nd
`
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`In addition to meeting the housing elements 11 and 13 wrap-especially with regard to their
`projections onto the plane of contact between the chip 1 and chip carrier 2 still beyond symmetry
`conditions.
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`17-01-2015 15
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 36
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`Namely, they are symmetrical with respect to the two axes 101,102 that are mutually
`perpendicular.
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`Thereby, the symmetry of the housing 11 and casing 13 is further increased, which can reduce the
`possibility of failure of the device further.
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`Figure 3 shows a projection of the chip carrier 2 on the contact plane between the chip 1 and chip
`carrier 2nd
`
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`It is pointed out here that the terminals 41,42 are not bent at the edge of the housing 11 downward
`and on the bottom of the housing 11 inwardly, so as illustrated in Figure 1.
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`Rather, the terminals 41,42 in a straight line led out of the housing 11.
`
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`Figure 3 it can be seen that the longitudinal central axes 61,62 of the terminals 41,42 are point-
`symmetrical to the center 8 of the chip 1.
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`In addition, the entire chip carrier 2 is designed symmetrically to the center point 8.
`
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`Figure 3 can also be seen that the chip carrier has a central portion 3 on which the chip 1 is fixed.
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`The chip carrier 2 comprises in addition to terminals 41,42, which serve for the electrical
`contacting of the chip 1 and the starting extend from the central portion 3 to the outside
`substantially in a plane.
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`Figure 3 is shown further that even the chip carrier 2 still has more symmetries.
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`17-01-2015 16
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 37
`
`
`
`
`
`It is in particular symmetrically to the two orthogonal axes 101,102, the axes 101,102 are the same
`axes 101,102, in respect of which the housing 11 and the sheath 13 are symmetrical.
`
`
`
`
` 3
`
` shows the forces acting across the terminals 41,42 forces are represented by two thick black
`arrows further still, due for example to the object created by soldering the terminals 41,42 heat.
`
`
`It can be seen that the forces point in opposite directions in amount and are equal.
`
`
`Therefore, these forces compensate at least in the symmetry section 8.
`
`
`
`
`Figure 3 is also possible to infer the shape of the contact surfaces 14 between the casing 13 and
`the bottom of the recess 12.
`
`
`Because of the symmetrical design of the enclosure 13 and the housing 11 and the chip carrier 2
`as well as due to the fact that has been in the embodiment shown here, to dispense with the
`"overmold" technique, the symmetric property of the contact surfaces 14 results automatically,
`since they represented as complementary to the surface of the chip carrier 2, wherein the surface
`of the chip carrier 2 and the surface of the contact surfaces 14 together form the surface of the
`bottom of the recess 12, which again has the required symmetry for itself.
`
`
`
`
`In the case of "overmold" technique, where due to the partial cover of the chip carrier 2 no
`automatic symmetry more is set for the contact surfaces 14 with the material of the housing 11, yet
`would be ensured by suitable measures therefor.
`
`
`
`
`
`17-01-2015 17
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 38
`
`
`
`Figure 4 shows another embodiment for the design of the chip carrier 2nd
`
`
`The chip carrier 2 is formed in a way it reminds of a St. Andrew's cross.
`
`
`Are also here
`
`
`again satisfies all conditions of symmetry in Figure 3.
`
`
`
`
`The chip carrier 2 is both point-symmetrically to the center 8 and axially symmetrical to the axes
`101,102.
`
`
`The difference that distinguishes this figure 3, the chip carrier 2 instead of two terminals 41,42 four
`ports 41,42, 43,44 on.
`
`
`In addition, the course is still the central longitudinal axes 61,62, 63,64 shown.
`
`
`
`
`Figure 4 also shows the position of anchoring forward 15 which serve to anchor the chip carrier 2
`in the body 5.
`
`
`It is Figure 4 shows that the Veran- kerungsmittel 15 Although distributed carrier 2 somewhat
`uniformly over the chip, in particular, has been taken to ensure the that none of standing by the
`two orthogonal axes of symmetry 101,102 educated quadrant free of anchoring means 15.
`
`
`However, Figure 4 is also apparent that the position of the anchoring means 15 do not have the
`symmetry of the other components shown here ten.
`
`
`This is also not necessary to achieve the inventive purpose, so that the anchoring means 15 on
`
`17-01-2015 18
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 39
`
`
`
`any other present requirements can be arranged without taking into account a certain symmetry
`addressed only in nor out.
`
`
`
`
`It is also Figure 4 also shows that more connections are provided 48,49 which form the necessary
`counterpoint to the chip carrier 2 for contacting the chip 1.
`
`
`
`
`The connections 48,49 are again both punktsymme- symmetrical to the center axis 8 and
`symmetrical with respect to the axes 101,102.
`
`
`The arrangement of the terminals 41, 42, 43, 44,48, 49 such as to industry in addition to the
`Punktsymme- still have twice the axis of symmetry, has the ef- fect that the black again as thick
`arrows in Figure 4 le represented tensile forces which act between the chip carrier 2 and the body
`5, respectively between the terminals 48,49 and the body 5, compensate for each other in terms of
`translation and in terms of torque.
`
`
`
`
`This means that the location of the chip 1 in the load case is both largely free of translational
`forces and largely free of torque.
`
`
`
`
`It is also pointed out that the terminals 41,42, 43,44 the chip carrier may also run from such
`outward, that they leave the body approximately parallel to the symmetry axis 101.
`
`
`The terminals 41,42, 43,44 then pass on the part of the body 5 to the outside, which are free from
`the terminals 48,49.
`
`
`
`
`
`17-01-2015 19
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 40
`
`
`
`In contrast, Figure 5 shows a further example for an embodiment of the chip carrier 2, where,
`however, no duplicate axis of symmetry of the chip carrier 2 is given.
`
`
`Rather, it is provided according to FIG 5 so that the chip carrier 2, that is, a central portion 3 has
`only a point symmetry to the center point 8 together with the connections 41,42.
`
`
`Accordingly, herein, can indeed compensate for the forces acting along the longitudinal axes
`61,62 tensile forces, but it would be conceivable that, for example thermally softened at body 5, a
`torque acting on the chip 1.
`
`
`However, this is harmless to a certain extent, so that in this invention certainly also chip carrier to
`be allowed which do not have dual axis symmetry as in Figures 3 and 4.
`
`
`
`
`Figure 5 is also to be found yet that another port 48 may be provided for contacting the top of the
`chip 1, which does not satisfy the symmetry conditions listed.
`
`
`This is not to achieve the inventive purpose necessary, so that it is a full embodiment of the
`present invention in Figure 5.
`
`
`
`
`It is also pointed to the bonding wire 19 connecting the port 48 to the opposite side of the chip
`carrier 2 of the chip 1.
`
`
`
`
`The scope of the invention is not by the description of the invention with reference to the
`embodiments is limited.
`
`
`Rather, the invention encompasses any new feature and any combination of features, in particular
`any combination of features in the patent claims, even if this combination is not explicitly specified
`
`17-01-2015 20
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 41
`
`
`
`in the patent claims.
`
`
`
`
`This patent application claims the priority of German Patent Application DE 102 55 932.5 from the
`29th
`
`
`Nov. 2002, the entire disclosure of which is hereby incorporated by reference into this specification
`explicitly.
`
`
`
`17-01-2015 21
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1006 Page 42
`
`
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