EXHIBIT 1005
`
`U.S. Patent Application Publication
`No. 2004/0262717 to Arndt et al.
`
`(“Arndt III”)
`
`

`
`(19) United States
`(12) Patent Application Publication (10) Pub. No.: US 2004/0262717 A1
`(43) Pub. Date:
`Dec. 30, 2004
`Arndt et al.
`
`US 20040262717A1
`
`(54) CONDUCTOR FRAME AND HOUSING FOR
`A RADIATION-EMITTING COMPONENT,
`RADIATION-EMITTING COMPONENT AND
`DISPLAY AND/OR ILLUMINATION SYSTEM
`USING RADIATION-EMITTING
`COMPONENTS
`
`(76) Inventors: Karlheinz Arndt, Regensburg (DE);
`Georg Bogner, Lappersdorf (DE);
`Gunter Wait], Regensburg (DE)
`
`Correspondence Address:
`COHEN, PONTANI, LIEBERMAN & PAVANE
`551 FIFTH AVENUE
`SUITE 1210
`NEW YORK, NY 10176 (US)
`
`(21) Appl. No.:
`
`10/487,576
`
`(22) PCT Filed:
`
`Aug. 2, 2002
`
`(86) PCT No.:
`
`PCT/DE02/02866
`
`(30)
`
`Foreign Application Priority Data
`
`Aug. 21, 2001 (DE) ................................... .. 101 40 831.5
`Nov. 26, 2001 (DE) ................................... .. 101 57 909.8
`
`Publication Classi?cation
`
`(51) Int. Cl? ................................................ .. H01L 23/495
`(52) Us. 01. ............................................................ ..257/666
`
`(57)
`
`ABSTRACT
`
`Leadframe and housing for a radiation-emitting component,
`radiation-emitting component and display and/or illumina
`tion arrangement With radiation-emitting components
`
`The invention describes a leadframe for a surface-mountable
`radiation-emitting component, preferably a light-emitting
`diode component, having at least one chip connection region
`and at least one external connection strip, the leadframe
`being formed in planar fashion and a deformation element,
`preferably a spring element, being arranged betWeen the
`chip connection region and the external connection strip,
`said element enabling an elastic or plastic deformation of the
`leadframe in the plane of the leadframe. A housing, a
`surface-mountable component and an arrangement having a
`plurality of such components are furthermore speci?ed.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 1
`
`

`
`Patent Application Publication Dec. 30, 2004 Sheet 1 0f 5
`
`US 2004/0262717 A1
`
`FIG 1
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 2
`
`

`
`Patent Application Publication Dec. 30, 2004 Sheet 2 0f 5
`
`US 2004/0262717 A1
`
`FIG 2
`
`2a
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 3
`
`

`
`Patent Application Publication Dec. 30, 2004 Sheet 3 0f 5
`
`US 2004/0262717 A1
`
`FIG 3A
`
`80
`
`3a
`
`_\2b
`
`2a\_ FIG 3B
`
`{30
`
`Q
`
`"
`
`i 10b
`
`100
`
`3a
`
`2a 15%
`
`7 2b
`
`FIG 3C
`
`28/ 10a
`
`33
`10c
`
`3b
`
`2b
`10b f
`
`8
`
`@4-
`
`1i
`
`18
`
`12
`
`80
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 4
`
`

`
`Patent Application Publication Dec. 30, 2004 Sheet 4 0f 5
`
`US 2004/0262717 A1
`
`FIG 7 Prior Art
`
`35
`
`34
`
`35
`
`32
`
`31
`
`33
`
`35
`‘ 35
`
`34
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 5
`
`

`
`Patent Application Publication Dec. 30, 2004 Sheet 5 0f 5
`
`US 2004/0262717 A1
`
`mm gm 8 mm 2 8
`
`. ON ON
`/ f f f _ . /
`
`5. £4 & vN/? R
`
`V
`
`mm 8 mm mm ow S S cm mm DN 2 mm
`
`a; ON Q2, a mm 2&7 a a4 ON a
`
`w/////////////4 . 2
`
`.:..~.\..._\.\.H:..JW\.NN
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 6
`
`

`
`US 2004/0262717 A1
`
`Dec. 30, 2004
`
`CONDUCTOR FRAME AND HOUSING FOR A
`RADIATION-EMITTING COMPONENT,
`RADIATION-EMITTING COMPONENT AND
`DISPLAY AND/OR ILLUMINATION SYSTEM
`USING RADIATION-EMITTING COMPONENTS
`
`[0001] The invention relates to a leadframe according to
`the preamble of patent claim 1, a housing according to the
`preamble of patent claim 15, a radiation-emitting component
`according to the preamble of patent claim 26, and to a
`display and/or illumination arrangement With radiation
`emitting components according to the preamble of patent
`claim 31.
`
`[0002] A radiation-emitting component of the type men
`tioned is illustrated diagrammatically in FIG. 7 and
`described for example in EP 0 400 176 A1. The component
`has a housing base body 31 With a mounting area 32, in
`Which a leadframe 33 is embedded. Parts of the leadframe 33
`are formed as connection strips Which project from the
`housing base body 31 and, as they proceed further, are bent
`such that their connection areas 34 lie in one plane With the
`mounting area 32, Which de?nes the mounting plane of the
`component. The bends 35 in the connection strips impart
`certain elastic properties to the connection strips, so that, on
`the one hand, a stable, tilting-free bearing of the component,
`for example on a printed circuit board, is ensured and, on the
`other hand, mechanical stresses Which may arise in particu
`lar When the component is soldered in are elastically
`absorbed. Since changes in temperature are generally
`unavoidable When the component is soldered in and also
`during operation or avoiding them at least requires a high
`outlay, a certain elasticity of the component, in particular a
`?exibility of the connection strips, cannot be dispensed With.
`
`[0003] Furthermore, the connection strips have to be
`formed such that components Which are packed as bulk
`material do not interlock in one another. Finally, a suf?
`ciently stable ?xing of the component has to be ensured by
`the connection strips.
`
`[0004] HoWever, the knoWn bent embodiment of the con
`nection strips increases the space requirement for such a
`component both vertically and horiZontally. In the horiZontal
`direction, a certain minimum distance betWeen the connec
`tion areas 34 and the housing base body 31 is prescribed by
`the stretched S-shaped bends 35. Reducing said minimum
`distance would require a higher degree of bending of the
`leadframe 33 and thus increase the risk of components
`interlocking in one another. Moreover, the bend 35 of the
`leadframe 33 toWard the mounting area 32 of the component
`increases the volume taken up by the component and de?nes
`the minimum height of the component in its mounted state.
`
`[0005] The space requirement is to be kept as small as
`possible in the case of very small structural forms Which, for
`example, are intended to enable a high packing density
`and/or planar design and/or a mounting in round conductor
`track holes, that is to say holes.
`
`[0006] It is an object of the present invention to specify a
`leadframe and a housing for a radiation-emitting surface
`mountable component and a radiation-emitting surface
`mountable component and also a display and/or illumination
`arrangement having radiation-emitting surface-mountable
`components With a small space requirement in each case. In
`particular, it is an object of the invention to provide a
`
`leadframe Which additionally has a suf?cient elasticity in
`conjunction With sufficient mechanical stability.
`[0007] This object is achieved by means of the subject
`matter of patent claims 1, 15, 26 and 31. The dependent
`claims relate to advantageous developments of the inven
`tion.
`
`[0008] The invention is based on the idea of forming the
`leadframe for a radiation-emitting component in planar
`fashion to the greatest possible extent in particular in the
`region outside a housing, and in the process forming it so as
`to elastically or plastically absorb strains resulting from
`deformation in the plane of the leadframe. In this case, parts
`of the leadframe at the same time form the bearing area of
`the component.
`[0009] The invention provides, in particular, for forming a
`leadframe for a surface-mountable radiation-emitting com
`ponent, for example of a light-emitting diode, Which has at
`least one chip connection region and at least one external
`connection strip, the leadframe being formed in planar
`fashion and a deformation element being arranged betWeen
`the chip connection region and the external connection strip,
`said deformation element enabling an elastic or plastic
`deformation of the leadframe in the plane of the leadframe.
`The deformation element is preferably embodied as a spring
`element.
`
`[0010] In an advantageous re?nement of the invention, the
`leadframe has tWo or more connection strips, a deformation
`element or spring element in each case being arranged
`betWeen connection strip and the chip connection region.
`[0011] The planar embodiment of the leadframe advanta
`geously makes it possible to form a component Which has,
`perpendicular to the leadframe plane, only very small hous
`ing extents and only very small space requirements. Fur
`thermore, the external connection area of the component can
`be arranged near to the component housing since the hori
`Zontal space requirement is very small on account of the
`planar embodiment. In this case, the deformation or spring
`elements ensure a suf?cient ?exibility relative to strains and
`deformations as may arise for example during the soldering
`in process or on account of thermal loading during operation
`of the component.
`
`[0012] The invention’s embodiment of the leadframe,
`housing and component advantageously makes it possible to
`avoid having to bend leadframe parts only after production
`of a component housing. This is of importance particularly
`in the case of housing bodies produced by encapsulation by
`molding or encapsulation by injection-molding. The risk of
`delamination of housing and leadframe is thereby reduced,
`the advantage afforded by this being intensi?ed particularly
`in the case of greatly miniaturiZed housings.
`
`[0013] In an advantageous development of the invention,
`the deformation element is formed as a spring strip Which is
`suf?ciently narroW to ensure the required ?exibility of the
`leadframe. Said deformation element is preferably made
`narroWer than the adjoining connection strip and runs trans
`versely With respect to the main direction of extent of the
`leadframe. What is achieved by this course of the spring strip
`is that mechanical stresses in the plane of the leadframe can
`be Well cushioned largely independently of their direction.
`Furthermore, this embodiment enables the leadframe to be
`produced simply and cost-effectively by stamping out the
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 7
`
`

`
`US 2004/0262717 A1
`
`Dec. 30, 2004
`
`leadframe from a metal sheet or a foil. Connection strips and
`adjoining deformation elements and also parts of the chip
`connection region are formed in one piece in this case and
`can be stamped from a metal sheet or a ?lm in one Work step.
`
`[0014] In an advantageous development of the invention,
`the connection strip has a projection and/or a housing body
`has a projection or a groove Which enables the connection
`strip to project into the housing body. This reduces the risk
`of bending of the leadframe or of the connection strips
`perpendicularly to the leadframe plane.
`[0015] The chip connection region is preferably embodied
`in tWo parts With a chip connection part and a Wire connec
`tion part, the chip connection part being provided for mount
`ing a radiation-emitting chip. Further contact is made With
`the chip by means of a Wire connection to the Wire connec
`tion part.
`
`[0016] BetWeen the deformation or spring element and the
`chip connection region, the leadframe preferably has at least
`one holding element for ?xing the chip connection region in
`a component housing. This serves in particular for strain
`relief of the chip connection region. Such a holding element
`is realiZed for example by means of a cutout or a hole in the
`leadframe, into Which the component housing engages.
`[0017] In an advantageous re?nement of the invention, the
`leadframe is partly embedded in a housing, the deformation
`or spring elements With the adjoining connection strips
`being led out of the housing. Furthermore, the housing may
`have a radiation exit WindoW in the form of a suitably
`formed recess in Which the chip connection region of the
`leadframe is arranged. The side areas of the radiation exit
`WindoW are preferably formed as a radiation re?ector. As an
`alternative, the housing may also comprise a radiation
`transmissive material and completely enclose the radiation
`emitting chip.
`[0018] Apreferred development of a housing according to
`the invention has peripheral projections Which, in plan vieW,
`partly overlap the deformation or spring elements of the
`leadframe. This advantageously reduces the risk of bending
`of the connection strips or of the deformation or spring
`elements perpendicularly to the leadframe plane.
`
`[0019] In addition or as an alternative, it is possible to
`form projections at the connection strips, as already
`described, Which project into the housing body.
`[0020] In a particularly preferred embodiment, the hous
`ing body has an essentially circular or oval cross-sectional
`form parallel to the plane of the soldering connection strip.
`
`silicone resins or a mixture of these resins are suitable, in
`particular, as the encapsulation.
`[0023] Further features, advantages and expediencies of
`the invention are explained in more detail beloW using ?ve
`exemplary embodiments.
`[0024]
`In the ?gures
`[0025] FIG. 1 shoWs a diagrammatic plan vieW of an
`exemplary embodiment of a leadframe according to the
`invention,
`[0026] FIG. 2 shoWs a diagrammatic plan vieW of a ?rst
`exemplary embodiment of a housing according to the inven
`tion,
`[0027] FIGS. 3a, 3b and 3c shoW a diagrammatic plan
`vieW, side vieW and bottom vieW of a second exemplary
`embodiment of a housing according to the invention,
`
`[0028] FIG. 4 shoWs a diagrammatic perspective vieW of
`an exemplary embodiment of a component according to the
`invention,
`[0029] FIG. 5 shoWs a diagrammatic sectional vieW of a
`?rst exemplary embodiment of a multiple arrangement of
`radiation-emitting components according to the invention,
`
`[0030] FIG. 6 shoWs a diagrammatic sectional vieW of a
`second exemplary embodiment of a multiple arrangement of
`radiation-emitting components according to the invention,
`and
`
`[0031] FIG. 7 shoWs a surface-mountable component
`according to the prior art.
`
`[0032] Identical or identically acting elements are pro
`vided With the same reference symbols in the ?gures.
`
`[0033] The leadframe 1 illustrated in FIG. 1 is embodied
`in planar fashion and in tWo parts. The tWo leadframe parts
`1a and 1b each have a connection strip 2a, 2b joined by a
`deformation element 3a, 3b. The deformation element is
`preferably embodied as a spring element.
`
`[0034] From the deformation elements 3a, 3b the tWo
`leadframe parts 1a, 1b extend to a chip connection region 4.
`In this case, by Way of example, one of the tWo leadframe
`parts 1a projecting into the chip connection region 4 may be
`provided as chip connection part 14 With a mounting area for
`a chip, preferably a radiation-emitting semiconductor chip.
`The other leadframe part 1b may correspondingly be formed
`as a Wire connection part 13 and have a Wire connection area
`Which serves for making the electrical contact With the chip.
`
`[0021] In a radiation-emitting component according to the
`invention, a radiation-emitting chip, for example a semicon
`ductor chip, is ?xed on the chip connection region or the
`chip connection part of the leadframe. The semiconductor
`chip and parts of the leadframe are surrounded by a housing
`of the type described.
`
`[0035] The deformation elements or spring elements 3a,
`3b are embodied in the form of narroW strips, the Width of
`Which is narroWer than the Width of the adjoining connection
`strips 2a, 2b. These spring strips run perpendicular to the
`longitudinal axis 5 of the leadframe 1, Which coincides With
`the main direction of extent of the leadframe.
`
`[0022] If the chip is arranged Within a radiation exit
`WindoW, then the latter may advantageously be ?lled With a
`transparent compound Which encapsulates the chip, prefer
`ably a plastics compound. This encapsulation serves to
`protect the chip and additionally makes it possible to form
`an optical element arranged doWnstream of the radiation
`emitting chip, for example in the form of a lens surface.
`Reaction resins such as epoxy resins, acrylic resins or
`
`[0036] The shaping described imparts a ?exibility to the
`planar leadframe 1, so that strains in the leadframe plane, for
`example due to tension in the directions 7a, 7b shoWn, as
`may occur during or after the soldering-in process on
`account of different thermal expansion coef?cients, are
`absorbed by means of the deformation elements 3a, 3b. This
`prevents, in particular, a transfer of the stresses to parts of a
`housing body 80 (indicated by the dashed contour in FIG.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 8
`
`

`
`US 2004/0262717 A1
`
`Dec. 30, 2004
`
`1) in Which such a leadframe is embedded, Which stresses
`can lead to cracks or other kinds of damage of the housing.
`
`[0037] Circular holes 6a, 6b are furthermore formed in the
`leadframe 1, Which holes improve the retention of the
`leadframe in a housing. Correspondingly formed pins of a
`housing body 80 can be passed through said holes 6a, 6b,
`and prevent a displacement of the leadframe Within the
`housing to the greatest possible extent. If the housing body
`80 is formed for example at least partly by the leadframe 1
`being encapsulated With a molding compound, for example
`by means of an injection-molding or transfer-molding
`method, then the molding compound ?lls the holes, thereby
`forming the above-mentioned pins, Which, in the solid state,
`provide for the additional retention of the leadframe in the
`housing.
`[0038] Furthermore, the connection strip 2b has a projec
`tion 9, Which enables the leadframe to be additionally
`projected into the housing body 80 and, in particular, serves
`to prevent bending of the connection strip 2b and/or the
`adjoining deformation element 3b out of the leadframe
`plane. In addition or as an alternative, a projection 10 at a
`housing may also serve for this purpose, as Will be described
`in more detail beloW, said projection likeWise preventing
`such bending.
`
`[0039] FIG. 2 shoWs a diagrammatic plan vieW of an
`exemplary embodiment of a housing according to the inven
`tion for a radiation-emitting component.
`
`[0040] In this case, a housing body 80 comprises a housing
`base body 8 Which is largely rotationally symmetrical con
`cerning the outer contour and has a circular contour in the
`illustration, in Which a leadframe 1 is partly embedded. The
`leadframe 1, as in the previous exemplary embodiment, is
`formed in planar fashion and in tWo parts, the tWo leadframe
`parts each having an external connection strip 2a, 2b and an
`adjoining deformation element 3a, 3b and also a chip
`connection part 14 or respectively a Wire connection part 13.
`Chip connection part 14 and Wire connection part 13 are
`arranged at a distance from one another in a common chip
`connection region 4 in the housing.
`
`[0041] Furthermore, a projection 9a, 9b is in each case
`formed at the connection strips 2a, 2b, Which projection
`projects into the housing base body 8 and thus prevents
`bending of the leadframe 1 perpendicularly to the leadframe
`plane.
`[0042] The housing base body 8 preferably comprises a
`molding compound and is produced by the leadframe 1
`being encapsulated With said molding compound, for
`example by means of an injection-molding or transfer
`molding method. In this case, the molding compound also
`?lls the holes 6a, 6b and 6c in the leadframe 1, thereby
`ensuring a mechanically stable anchoring of the leadframe 1
`in the housing base body 8.
`
`[0043] The housing base body 8 furthermore has a radia
`tion exit WindoW 12 in the form of a truncated-cone-like
`recess Which extends in the direction of the main emission
`direction and into Which the chip connection part 14 and the
`Wire connection part 13 of the leadframe project, that is to
`say adjoin at least the internal space of the recess With a
`surface, and in particular form at least a part of the bottom
`area of the radiation exit WindoW 12. For this purpose, a
`separate cutout 18 is formed in the radiation exit WindoW 12,
`
`the base area of Which cutout forms the chip connection
`region 4 and de?nes the mounting plane for a chip or a Wire
`connection.
`
`[0044] The side Wall of the radiation exit WindoW, Which
`connects the bottom area of the recess to the outer area of the
`housing base body 8, is embodied in such a Way that it acts
`as a re?ector area for an electromagnetic radiation emitted
`by the chip 16. It may be planar or concave depending on the
`desired emission behavior.
`
`[0045] The side Wall is preferably embodied in such a Way
`that the chip 16 is arranged centrally in the re?ector Well
`formed by it, and that it is particularly preferably led
`essentially as far as the mounting region for the chip on the
`leadframe 1. This last means that only this mounting region
`alone essentially represents the entire bottom area of the
`truncated-cone-like recess. In other Words, the bottom area
`is preferably only as large as is necessary for the chip
`mounting. In order to achieve this to the greatest possible
`extent, a cutout 18 for a Wire connection 17 from the Wire
`connection part 13 to the chip 16 is provided in the side Wall
`(see FIG. 4).
`
`[0046] FIG. 3 shoWs a further exemplary embodiment of
`a housing according to the invention. FIG. 3a illustrates the
`bottom vieW, FIG. 3b the side vieW and FIG. 3c the plan
`vieW of the housing.
`
`[0047] In contrast to the previously described exemplary
`embodiments, projections 10a, 10b and 10c are arranged
`peripherally at the housing, and prevent bending of the
`leadframe 1 perpendicular to the leadframe plane (see FIGS.
`3b and 3c). The housing is provided in particular for an LED
`component. For the marking of the cathode connection of
`the leadframe 1, the housing has, on one side, a bevel 15 and
`also tWo separate housing projections 10a, 10c, While a
`single Wider projection 10b is integrally formed opposite.
`
`[0048] In this case, the projections 10a, 10b and 10c are
`arranged in such a Way that, in the plan vieW and in the
`bottom vieW, they overlap the deformation or spring ele
`ments 3a, 3b and thus prevent vertical bending of the
`deformation elements.
`
`[0049] FIG. 4 perspectively illustrates an exemplary
`embodiment of a radiation-emitting component according to
`the invention. The housing of the component corresponds to
`the previous exemplary embodiment. A radiation-emitting
`chip 16, for example a semiconductor chip such as a
`semiconductor LED or a semiconductor laser, is ?xed, for
`example soldered or adhesively bonded by means of an
`electrically conductive adhesive, on that region of the base
`area of the radiation exit WindoW 12 Which is formed by the
`chip connection part 14.
`
`[0050] On the front side remote from the leadframe 1, the
`semiconductor chip 16 has a contact area from Which a Wire
`connection 17 is led to the Wire connection part 13. The
`oblique side area 11 of the radiation exit WindoW 12 serves
`as a re?ector for a radiation emitted by the semiconductor
`chip 16 toWard the side.
`
`[0051] FIG. 5 shoWs a multiple arrangement of compo
`nents according to the invention. Aplurality of holes 20 are
`formed in a carrier 19, for example a circuit board. Further
`more, the carrier has an emission side 21.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 9
`
`

`
`US 2004/0262717 A1
`
`Dec. 30, 2004
`
`[0052] A plurality of radiation-emitting components
`according to the invention are ?xed on the side of the carrier
`opposite to the emission side, in each case a part of the
`housing body 80 of a radiation-emitting component in
`accordance With FIG. 4 projecting into one of the holes 20
`and the emission direction 24 running through the holes 20.
`[0053] The connection strips 2a, 2b of the respective
`leadframes of the components lie on the surface of the
`carrier 19 opposite to the emission side 21. Adhesive bond
`ing connections or soldering connections may serve for
`?xing the components. On account of the leadframe Which
`is formed in planar fashion and, in particular, has no bends,
`the space requirement horiZontally and vertically is signi?
`cantly smaller than in the case of components according to
`the prior art. In particular, the invention enables a partly
`recessed mounting of the components.
`
`[0054] On account of the deformation elements 3a, 3b
`formed for example as spring strips in the leadframe, the
`leadframe is suf?ciently ?exible to absorb strains and defor
`mations elastically or plastically Without harmful strains
`being transmitted to the housing or a radiation-emitting chip
`situated therein. This mounting arrangement is suitable in
`particular for densely packed ?at display modules.
`[0055] Preferably, the carrier or at least the emission-side
`surface is embodied such that it is radiation-absorbent, for
`example blackened, thereby increasing the contrast of the
`individual radiation-emitting components With respect to the
`surroundings. This is advantageous particularly in the case
`of multiple arrangements Which are provided as a display
`apparatus.
`[0056] FIG. 6 shoWs a further multiple arrangement of
`components according to the invention. In contrast to the
`preceding multiple arrangement, the multiple arrangement
`shoWn in FIG. 6 is suitable in particular as background
`illumination, for example for a liquid crystal display.
`[0057] As in the previous exemplary embodiment, radia
`tion-emitting components according to the invention are
`mounted in partly recessed fashion on a carrier 19. On the
`emission side, a diffusing plate 22 is arranged doWnstream
`of the carrier or the components. Furthermore, the carrier 19
`or at least the emission-side surface of the carrier 19 is
`preferably embodied such that it is uniformly diffusely
`re?ective, for example White. This enables a largely homo
`geneous backlighting in an extremely ?at design. Arranged
`doWnstream of the diffusing plate is, for example, an LCD
`display 23 to be illuminated.
`
`[0058] The carrier may be formed both, as described
`above, rigidly and ?exibly, for example in the form of a
`plastic or a ceramic ?lm, so that a backlighting or display
`module can be adapted in a simple manner to different forms
`and advantageously even be mounted at changing areas.
`
`[0059] It goes Without saying that the explanation of the
`invention on the basis of the exemplary embodiments shoWn
`is not be understood as a restriction of the invention.
`HoWever, for example, the chip may be mounted, for
`example adhesively bonded, directly on a chip mounting
`area of the housing base body 8 and the chip may be
`electrically connected to the leadframe exclusively by means
`of Wire connections. The chip may equally be mounted on a
`separate thermal connection embedded in the housing body,
`and again be electrically connected to the leadframe by
`
`means of Wire connections. All these embodiments do not
`depart from the fundamental concept of the present inven
`tion.
`
`1. A leadframe (1) for a surface-mountable radiation
`emitting component having at least one chip connection
`region (4) and at least one external soldering connection
`strip (2a, 2b) electrically connected to the latter, character
`iZed in that a deformation element (3a, 3b) is formed
`betWeen the chip connection region (4) and the soldering
`connection strip (2a, 2b), Which deformation element runs
`completely in one and the same plane of the leadframe (1)
`as the soldering connection strip (2a, 2b) and in a direction
`parallel to a mounting plane of a component housing (8)
`enables a movement of the soldering connection strip rela
`tive to the chip connection region
`2. The leadframe as claimed in claim 1, characteriZed in
`that the deformation element (3a, 3b) is a spring element.
`3. The leadframe as claimed in claim 1 or 2, characteriZed
`in that a holding element (6a, 6b) for ?xing the chip
`connection region (4) in the component housing (8) is
`provided betWeen the deformation element (3a, 3b) and the
`chip connection region
`4. The leadframe as claimed in one of claims 1 to 3,
`characteriZed in that a further holding element (6c) is
`arranged betWeen the chip connection region (4) and the
`holding element (6a, 6b).
`5. The leadframe as claimed in claim 3 or 4, characteriZed
`in that the holding element or at least one of the holding
`elements (6a, 6b) is a hole or a cutout in the region betWeen
`the deformation element (3a, 3b) and the chip connection
`region (4a, 4b) into Which the component housing (8)
`engages.
`6. The leadframe as claimed in at least one of the
`preceding claims, characteriZed in that the deformation
`element (3a, 3b) or the soldering connection strip (2a, 2b)
`has a guide part (9, 9a, 9b), in particular a lug (9a, 9b), Which
`is supported, in particular by the component housing (8), in
`such a Way that it acts against a bending of the soldering
`connection strip (2a, 2b), in particular toWard the front side
`of the housing.
`7. The leadframe as claimed in at least one of the
`preceding claims, characteriZed in that the leadframe (1) is
`formed in planar fashion.
`8. The leadframe as claimed in at least one of the
`preceding claims, characteriZed in that the leadframe (1) has
`tWo external connection strips (2a, 2b).
`9. The leadframe as claimed in claim 8, characteriZed in
`that a deformation element (3a, 3b) is arranged betWeen
`each of the external connection strips (2a, 2b) and the
`associated chip connection region
`10. The leadframe as claimed in one of the preceding
`claims, characteriZed in that the deformation element (3a,
`3b) comprises a spring strip, Whose strip Width is less than
`the Width of the adjoining connection strip (2a, 2b).
`11. The leadframe as claimed in claim 10, characteriZed in
`that the spring strip runs transversely With respect to the
`main direction of extent of the leadframe
`12. The leadframe as claimed in one of the preceding
`claims, characteriZed in that the chip connection region (4)
`comprises a chip mounting part (14) and a Wire connection
`part (13) arranged at a distance therefrom.
`13. The leadframe as claimed in one of the preceding
`claims, characteriZed in that the connection strip (2a, 2b),
`the deformation element (3a, 3b) and a partial region—
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 10
`
`

`
`US 2004/0262717 A1
`
`Dec. 30, 2004
`
`assigned thereto—of the chip connection region (4) of the
`leadframe (1) are formed in one piece.
`14. The leadframe as claimed in one of the preceding
`claims, characterized in that the leadframe (1) is provided
`With a surface coating Which improves the soldering or
`bonding properties.
`15. A housing for a radiation-emitting surface-mountable
`component, characteriZed in that it contains at least one
`leadframe (1) as claimed in one of claims 1 to 14.
`16. The housing as claimed in claim 15, characteriZed in
`that the leadframe (1) is embedded in a housing body (80)
`in such a Way that the external connection strip (2a, 2b) and
`at least partly the deformation element (3a, 3b) project from
`it.
`
`17. The housing as claimed in claim 15 or 16, directly or
`indirectly referred back to claim 6, characteriZed in that at
`least one guide element, in particular a guide projection
`(10a, 10b, 10c) or a guide groove, is provided at the housing
`body (80) and cooperates With the guide part (9, 9a, 9b) of
`the leadframe.
`18. The housing as claimed in one of claims 15 to 17,
`characteriZed in that the housing body (80) has a housing
`base body (8) in Which the leadframe (1) is embedded in
`such a Way that the external connection strip (2a, 2b) and at
`least partly the deformation element (3a, 3b) project from
`the housing base body
`19. The housing as claimed in claim 18, characteriZed in
`that the housing base body (8) has an essentially circular or
`oval cross-sectional form parallel to the plane of the solder
`ing connection strip (2a, 2b).
`20. The housing as claimed in one of claims 17 or 18, or
`as claimed in claims 17, 18 and 19, c