EXHIBIT 1004
`
`International Patent Application Publication
`No. WO 2004/027882 to Sorg
`
`(“Sorg”)
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 1
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 2
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 3
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 4
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 5
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 6
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 7
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 8
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 9
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 10
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 11
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 12
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 13
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 14
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 15
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 16
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 17
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 18
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 19
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 20
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 21
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 22
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 23
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 24
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 25
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 26
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 27
`
`

`

`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 28
`
`

`

`(12) INTERNATIONAL APPLICATION PUBLISHED UNDER
`THE PATENT COOPERATION TREATY (PCT)
`
`(19) World Intellectual Property Organization
`International Office
`
`(43) International Publication Date
`April 1, 2004
`
`PCT
`
`(10) International Publication Number
`WO 2004/027882 A2
`
`(51) International Patent Classification7:
`31/0203
`
`HOlL 33/00,
`
`(21) International Application Number: PCT/DE2003/002953
`
`(22) International Filing Date:
`September 5, 2003
`
`(25) Filing Language:
`
`(26) Publication language:
`
`(30) Information on priority:
`102 43 247.3
`September 17, 2002
`
`German
`
`German
`
`DE
`
`(71) Applicant (for all Designated States with the exception of
`the US): OSRAM OPTO SEMICONDUCTORS
`GMBH [DE/DE]; Wernerwerkstr. 2, 93049 Regensburg
`(DE).
`
`(72) Inventor; and
`(75) Inventor/Applicant (only for the US): SORG, Jorg,
`Erich [DE/DE]; Gozratstrasse 12, 93053 Regensburg
`(DE).
`(74) Agents: EPPING HERMANN FISCHER PATENT-
`ANWALTSGESELLSCHAFT MBH;
`P.O. Box
`200734, 80007 Munich (DE).
`(81) Designated states (national): CN, JP, US.
`(84) Designated states (regional): European patent (AT, BE,
`BG, CH, CY, CZ, DE, DK, EE, ES, Fl, FR, GB, GR, HU,
`IE, IT, LU, MC, NL, PT, RO, SE, SI, SK, TR).
`Published:
`without international search report and once again for
`publication upon receipt of the report
`For an explanation of the two-letter codes and the other
`abbreviations, reference is made to the explanations (“Guidance
`Notes on Codes and Abbreviations”) at the beginning of each
`regular edition of the PCT Gazette.
`
`(54) Title: [English in original:] LEADFRAME-BASED COMPONENT HOUSING, LEADFRAME STRIP, SURFACE-
`MOUNTED ELECTRONIC COMPONENT, AND PRODUCTION METHOD
`
`(54) Title: LEAD FRAME-BASED COMPONENT HOUSING, LEAD FRAME STRIP, SURFACE-MOUNTABLE ELECTRONIC
`COMPONENT, AND PRODUCTION METHOD
`
`..........
`
`(57) Abstract: [English in the original:] The invention relates to a leadframe-based housing for a surface-mounted component,
`particularly a radiation-emitting component. Said leadframe-based housing comprises electrical connector strips and at least one
`chip assembly area. One of the inventive connector strips is provided with a spray-on window allowing a leadframe-based housing
`having a reduced thickness to be produced in an injection molding process. Also disclosed is a method for producing such housings.
`
`[Continued on the next page]
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 29
`
`

`

`WO 2004/027882 A2
`
`(57) Abstract: The invention describes a lead frame-based housing for a surface-mountable component, in particular a radiation-
`emitting component, whereby the lead frame-based housing has electric connection strips and at least one chip assembly area and
`whereby an injection window is inventively provided in one of the connection strips which makes possible the production of a lead
`frame-based housing with a slight thickness in an injection-molding process. In addition, a production method of such a housing is
`provided.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 30
`
`

`

`
`
`WO 2004/027882
`
`Description
`
`PCT/DE2003/002953
`
`Lead frame-based component housing, lead frame strip, surface-
`mountable electronic component, and production method
`
`The invention concerns a lead frame-based component housing, a
`lead frame strip with a presprayed component housing, and a
`surface-mountable electronic component, in particular a
`component with a radiation-emitting or radiation-detecting chip,
`for example a light emitting diode, also known as an “LED”, as
`well as the production method of the lead frame-based component
`housing.
`
`The invention concerns in particular light emitting diode
`elements that are suitable for surface assembly on a circuit
`board, with which in a housing base body that has been produced
`in an injection process with electric connection strips that are
`partially embedded, a recess that has preferably been formulated
`as a reflector is provided with a radiation window that is
`oriented toward the front side of the component housing. The
`recess, in which a chip that emits electromagnetic radiation is
`located, is for example filled with an encapsulation compound
`which is transparent for the electromagnetic radiation that is
`emitted by the chip.
`
`Component housings of that type are also suitable for use with
`radiation-detecting chips – the radiation window must then be
`transparent for the radiation that is to be received by the
`chip.
`
`This present patent application claims the priority of the
`German patent application 10243247.3, the disclosed content of
`which is incorporated by means of the reference back to it.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 31
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`2
`
`The invention is suitable in particular for use with radiation-
`emitting components with which the chips are built into prehoused
`lead frames, so-called “premolded lead frames”. This means that
`the lead frames are each overmolded with a housing base body
`before the assembly of the chip.
`
`With the production of such a component housing, the connection
`strips are first of all partially stamped into a lead frame
`strip. After that, the lead frame strip is placed in a two-part
`injection mold which forms a cavity around the lead frame for the
`formulation of the housing base body.
`
`Subsequently, with the help of an injection molding nozzle, for
`example over the part of the injection mold that borders the back
`side of the lead frame – that is, in the part of the cavity that
`borders the back side of the lead frame – an injection molding
`compound such as a white plastic is filled in, and the entire
`cavity of the injection mold is filled.
`
`After the at least partial hardening of the injection molding
`compound, the injection mold is opened. With the removal of the
`lead frame from the mold, the injection molding compound that is
`located in the injection molding nozzle is broken away from the
`injection molding compound that is located in the cavity.
`Furthermore, the chip in the recess that is provided for it is
`preferably arranged on one of the connection strips, is
`connected in an electrically conductive manner with the
`connection strips, and is provided with the encapsulation
`compound. The components that are connected by means of the
`lead frame strip may subsequently be separated from one another
`and consequently may be separated from this grouping.
`
`A radiation-emitting component of the type mentioned is
`described, for example, in EP 0 400 176 A1. The component has a
`housing base body with a support area in which a lead frame
`(conductor frame) is partially embedded. Parts of the lead
`frames are formulated as connection strips which protrude from
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 32
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`3
`
`the housing base body and in their further course are curved in
`such a way that their connecting surfaces lie in a plane with
`the support area which determines the assembly plane of the
`component.
`
`The total height of the components that are produced in this way
`can only be reduced to less than approximately 1 mm with a great
`technical expenditure, if at all. Within that context, the
`minimum height of the front part of the housing base body
`amounts to approximately 0.5 mm; the back wall of the housing
`base body, approximately 0.3 mm; and the thickness of the
`connection strips, approximately 0.1 mm.
`
`The reason for this is that the thickness of the layer of the
`injection molding compound that is located in the cavity between
`the lead frame and the breaking away point at the injection
`molding nozzle has to be sufficiently large to prevent to the
`greatest possible extent a delamination between the back side of
`the lead frame and the injection molding compound. Such a
`delamination would drastically increase the risk of damage to
`the component during the further processing or else later on in
`operation. According to the current level of knowledge, the
`aforementioned thickness of the layer of the injection molding
`compound must be so large that the mechanical tensile stresses
`that occur with the breaking away from the injection molding
`nozzle are reduced to such an extent that the forces that are
`applied at the border with the lead frame are not sufficient to
`break the injection molding compound away from the lead frame.
`
`For example, in order to make possible a low construction
`height on circuit boards and/or a complete sinking into round
`strip conductor openings (drilled holes) in particular, though,
`the height of the component is to be kept as low as possible,
`and there is an urgent need to reduce the construction height
`significantly below the aforementioned critical height of
`approximately 1 mm. With some applications, in particular in
`the end devices of mobile communications, the radiation-
`emitting components are to have a significantly smaller height.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 33
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`4
`
`The possibility of reducing the component height by means of the
`reduction of the height of the housing base body on the side of
`the chip is greatly limited because of a finite height of the
`radiation-emitting chip. The possibility of achieving the
`indicated goal through a simple reduction in the thickness of
`the housing base body on the back side of the lead frame is also
`greatly restricted since, as has already been explained above,
`with a layer that is too thin of the injection molding compound
`which realizes the back side of the housing, this is easily
`broken off with the injection molding nozzle in the injection
`process for the production of the housing, whereby the
`hermiticity of the component is destroyed and thus the
`functioning of the component can be disturbed.
`
`It is therefore the problem of this present invention to
`provide a lead frame-based housing for an electronic component,
`in particular for a radiation-emitting, surface-mountable
`component with a low height, to provide such an electronic
`component, to provide a lead frame strip, and to provide a
`production method for the manufacture of a corresponding lead
`frame-based housing.
`
`This problem is solved by means of a lead frame-based housing
`with the features of Patent Claim 1, by means of a lead frame
`strip with the features of Patent Claim 6, by means of an
`electronic component with the features of Patent Claim 7, and by
`means of a method with the features of Patent Claim 13.
`Advantageous embodiments of the invention are the subject matter
`of the dependent claims.
`
`A lead frame-based housing according to the invention for a
`surface-mountable electronic component has the following
`essential parts:
`(cid:16) a lead frame that has a front side and a back side which
`comprises at least two electrical connection strips,
`(cid:16) a housing base body that is produced in an injection process,
`preferably injection molded or injection pressed, made from an
`electrically insulating injection molding compound,
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 34
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`5
`
`(cid:16) a front section that is arranged on the front side of the lead
`frame and a back wall of the housing base body that is
`arranged on the back side of the lead frame,
`(cid:16) at least one injection window in the lead frame for the
`placing or introduction of an injection molding nozzle
`through which the injection molding compound is injected from
`a back side of the lead frame to the lead frame.
`The injecting of the injection molding compound consequently
`takes place from the back side of the lead frames through the
`injection window into the part of the cavity of the injection
`mold, which generates the front part of the housing base body on
`the front side of the lead frame. With the injecting, the
`injection molding nozzle is led to the injection window of the
`lead frame through the part of the cavity which generates the
`back wall part of the housing base body on the back side of the
`lead frame. In this way, it is achieved that a comparatively
`large volume of injection molding compound with a comparatively
`large cross section adjoins the injection molding nozzle and
`thus the breaking off area of the injection molding compound at
`the cavity-side end of the injection molding nozzle. With this
`type of housing, the risk of a delamination is reduced.
`
`The injection window is preferably arranged in one of the
`electrical connection strips. The back wall – that is, the
`plastic wall between the back side of the lead frame and the
`back side of the housing base body – advantageously has a
`thickness of 0.3 mm or less, preferably of 0.25 mm or less,
`especially preferably 0.2 mm or less, whereby it is understood
`that the thickness in any case is greater than 0 mm.
`
`In an especially preferable manner, the invention is suitable
`for use with components with which in the front part of the
`housing base body, at least one recess is provided for the
`accommodation of a chip, in particular a radiation-emitting or
`radiation-detecting semiconductor chip, for example a light
`emitting diode.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 35
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`6
`
`Within that context, the injection window is especially
`preferably arranged in the area of a wall of the front part
`that borders the recess. A large volume of injection molding
`compound is already advantageously available there as
`required by the design.
`
`In the recess, a chip assembly surface is provided which is
`preferably located on one of the two connection strips but can
`also be arranged on the housing base part. Such a chip
`assembly surface may, however, also only be provided later,
`for example, in the form of a small support plate that is
`subsequently to be used in the recess. It is also conceivable
`that in the housing base body, a thermal connection base is
`used which preferably reaches from the floor of the recess
`through the housing base body to this back side.
`
`Depending upon the arrangement of its contact surfaces, the
`chip may, for example, be:
`- electrically connected with the electrical connection
`strips by means of two bonding wires,
`- attached with a contact surface on one of the two
`connection strips by means of an electrical connection means
`and connected by means of one bonding wire with the two
`connection strips, or
`- directly set on the strips in a flip chip assembly with
`its contact surfaces.
`It goes without saying that yet other electrical connection
`variants are also possible which the person skilled in the
`art will select depending upon the design of his chip.
`
`With radiation-emitting components with which this present
`invention finds especially preferred use, the recess has a
`radiation exit window. Within that context, the inner
`surfaces of the recess are preferably formulated as a
`radiation reflector.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 36
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`7
`
`Alternatively, the entire housing may also consist of a
`radiation-transparent material and may completely envelope the
`radiation-emitting chip.
`
`The injection molding compound preferably contains a plastic, in
`particular a temperature-resistant plastic filled with a white
`filler. The plastic is preferably a thermoplastic material, and
`the filler is preferably titanium dioxide and/or barium sulfate.
`
`Suitable materials for the enveloping of the chip in the recess
`– for example, reactive resins such as epoxy resins, acrylic
`resins, silicone resins, and polyurethane resins – are known to
`the person skilled in the art and therefore shall not be
`explained in greater detail here.
`
`The analogous situation holds true for the injection molding
`compound of the housing base body. Likewise, methods for the
`assembly and for the electrical bonding of chips that are known
`and used conventionally can be advantageously applied here.
`
`The inventive method comprises in particular the following
`steps:
`(cid:16) the prestructuring of the connection strips and the
`injection window in a lead frame strip, for example by means
`of stamping, etching, or laser cutting, whereby in the lead
`frame strip, preferably a plurality of adjacently
`(periodically) arranged component areas are formulated which
`are each later provided with a housing base body.
`(cid:16) the applying of an injection mold, which may be in two or
`more parts, to the lead frame,
`(cid:16) the injecting of the injection molding compound into the
`injection mold through the injection window, whereby the
`injection molding nozzle of the automatic injector is placed
`on the injection window or is introduced into the injection
`window.
`(cid:16) at least the partial hardening of the injection molding
`compound, and
`(cid:16) the opening of the injection mold and the removal of the
`injection molding nozzle.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 37
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`8
`
`With a housing base body with a recess for the chip, the
`inventive injection window is especially preferably located
`below a solid wall of the housing base body that surrounds the
`recess at least in part.
`
`The particular advantage of the inventive manufacturing method
`consists of the fact that the total height of a component
`housing that is to be produced in that way can be substantially
`reduced by means of the back wall of the component housing
`being formulated particularly thin, in particular with respect
`to the radiation-emitting components that have been known thus
`far, which are produced by means of prehoused lead frames.
`
`The term “lead frame” refers here in particular to metallic
`conductor frames as they are conventionally put to use in
`semiconductor optoelectronics, for example for light emitting
`diode housings. Also falling within the term “lead frame” here
`are all other conductor frames that are suitable for the
`inventive housing technology, which do not compulsorily have to
`be completely metallic and, for example, may comprise a
`combination of electrically insulating materials and electrical
`conductor frames that are applied to them. Within that context,
`a lead frame is not inevitably to be understood as a continuous
`strip that is suitable for a reel to reel technology. Rather,
`the lead frame can also be present, for example, in the form of
`stripes or arrays.
`
`Additional features, advantages, and further embodiments result
`from the embodiments that are explained below in connection
`with Figures 1 to 4.
`
`Their contents are as follows:
`
`depicts a schematic perspective view of a radiation-
`Figure 1
`emitting component that is produced in a premold technique
`according to the state of the art.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 38
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`9
`
`depicts a schematic top view of a lead frame strip
`Figure 2a
`according to the invention,
`
`depicts an enlarged schematic top view of two
`Figure 2b
`connection strips of the lead frame from Figure 2a that belong
`together,
`
`depicts a schematic top view of a lead frame strip
`Figure 2c
`according to Figure 2a with inventive housing base bodies that
`are formulated in the injection process,
`
`depicts a schematic representation of the top view
`Figure 3a
`of another embodiment of the connection strips of an inventive
`component,
`
`depicts a schematic representation of the
`Figure 3b
`perspective bottom view of an inventive housing base body with a
`lead frame according to Figure 3a,
`
`depicts a schematic representation of the
`Figure 3c
`perspective view from above of a housing base body according
`to Figure 3b,
`
`each depict schematic representations of a
`Figures 4a and 4b
`cross section through a housing base body of a component
`according to the state of the art (4a) and of an inventive
`component (4b) during the injecting of the housing base body,
`
`each depict schematic representations of a
`Figures 5a and 5b
`cross section through a housing base body of a component
`according to the state of the art (5a) and of an additional
`embodiment of an inventive component (5b) during the injecting
`of the housing base body.
`
`The same elements or elements with the same effect are provided
`with the same reference numbers in the figures.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 39
`
`

`

`
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`WO 2004/027882
`
`PCT/DE2003/002953
`
`10
`
`Figure 1 depicts a perspective representation of a surface-
`mountable component with a housing according to the state of
`the art.
`
`The housing base body 100 that is depicted in Figure 1 and
`that is rectangular in outline has a front section 8a and a
`back wall 8b, whereby in the front section 8a a reflector
`recess is provided with a radiation exit window 12. A first
`connection strip 2a and a second connection strip 2b are
`partially embedded in the housing base body and are connected
`with a radiation-emitting chip that is not depicted here
`(hidden in the interior of the housing base body). The
`protruding parts of the connection strips (external contacts)
`serve for the contacting of the component, for example, to an
`external circuit board. It is possible that the external
`contacts run vertically to the corresponding side wall of the
`housing or, as is indicated with the broken line in Figure 1,
`are curved around the housing base body.
`
`The lead frame strip 1 according to the embodiment of Figures
`2a and 2b is, for example, prestructured through stamping and
`has in particular a plurality of first connection strips 2a
`and a plurality of second connection strips 2b which are
`separated in a later step of the process from the lead frame
`strip along the lines 3a and 3b, respectively.
`
`The connection strips 2a and 2b are provided as cathode and
`anode connections, respectively, of the components that are to
`be produced. In addition, other structures (such as strips
`that conduct heat away) may be formulated on the lead frame
`strip. In this embodiment, a chip assembly surface 14 for a
`chip is provided on the connection strip 2a and a wire
`connection surface 13 is provided on connection strip 2b for a
`bonding wire. An injection window 24 is inventively provided
`on the first connection strip 2a into which an injection
`molding nozzle can be introduced with the formulation of a
`housing base body in the injection process.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 40
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`11
`
`Alternatively, the injection window can be provided in the
`second connection strip 2b. It is advisable for the injection
`windows to each be provided below a side wall of the housing
`base body that is to be formulated later.
`
`In the finished housing base body, the chip assembly surface 14
`and the wire connection surface 13 of the lead frame strip
`extend into a reflector recess that is provided or else they
`adjoin with one surface at least with the interior space of the
`recess and then form at least one part of the bottom surface of
`the recess. With regard to a further reduction of the housing
`base body, a separate recessing can be additionally formed in
`the reflector recess which leads to the wire connection area.
`These aspects are to be recognized in Figure 3c.
`
`Furthermore, in the lead frame strip 1, circular openings 6a and
`6b are formed through which the lead frame strip can be run and
`transported.
`
`In addition, the connection strips 2a and 2b preferably have
`rectangularly formulated holes 21 which are suitable for the
`relief of the load on the component housing with the bending of
`the connection strips (see Figure 1) or for the bracing of the
`connection strips in the component housing.
`
`Figure 2c depicts the lead frame strip with housing base bodies
`100 that have been inventively produced by means of an injection
`process, each with a chip assembly surface 14 and each with a
`recess that leads to this chip assembly surface.
`
`The embodiment that is depicted in Figure 3a for a lead frame
`of an inventive housing or component with an essentially
`circular outline has connection strips that are formulated in a
`sickle shape, which on one hand serves the better bracing of
`the connection strips in the housing base body and, on the
`other hand, serves for the elastic strain relief with the
`bending of the connection strips.
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 41
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`12
`
`This lead frame also has an injection window 24 that is arranged
`next to a chip assembly surface 14 into or onto which an
`injection molding nozzle can be introduced or led from the back
`side of the lead frame for the production of the housing base
`body.
`
`Figure 3b depicts an inventive housing base body 100 with an
`essentially circular outline in a perspective view from below.
`Within that context, the injection window 24 is to be recognized
`through which injection is carried out through the housing base
`body 100 into the cavity of a corresponding injection mold into
`the part of the cavity that adjoins the front side of the lead
`frame. Incidentally, the front part of the housing base body
`100 is formulated, for example, as is depicted in Figure 3c.
`This type of housing is particularly suitable for the production
`of surface-mountable radiation-emitting and/or radiation-
`detecting components with light emitting diodes and/or
`photodiode chips which can be at least partially sunk into
`circular holes of circuit boards or similar devices.
`
`The component that is depicted in Figure 3b is depicted in
`Figure 3c in perspective top view. A radiation-emitting chip 16
`– for example, a light emitting diode chip – is attached in a
`reflector opening, for example on the connection strip 2a. As
`connection means, metallic solder or a conductive adhesive, for
`example, is used. A second contact of the light emitting diode
`chip is electrically connected with the connection strip 2b, for
`example by means of a bonding wire 17a. The side wall 11 of a
`recess which connects the bottom surface of the recess with the
`exterior surface of the housing base body 100 is executed in
`such a way that it functions as a reflector surface for
`electromagnetic radiation that is emitted from the chip 16.
`Depending upon the desired emission behavior, it can advisably
`be formed as flat, concave, or other. The projections 10a, 10b,
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1004 Page 42
`
`

`

`
`
`WO 2004/027882
`
`PCT/DE2003/002953
`
`13
`
`and 10c of the housing base body that are apparent in Figure 3c
`serve for the leading of the connection strips that are located
`outside of the housing base body. In addition, they can also
`serve as lead-in chamfers for leading the housing into the
`holes in the circuit board.
`
`On the front side that faces away from the connection strips,
`the chip 16 has a contact surface out of which an electrical
`connection line 17 (for example, a wire connection) leads to
`the wire connection part 13.
`
`The particular advantage of the invention is immediately
`apparent from the comparison of the state of the art and the
`invention that is depicted in Figures 4a and 4b.
`
`The f