EXHIBIT 1007
`
`Japanese Patent Application
`No. JP 2001-301230 to Uemura et al.
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`(“Uemura”)
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`

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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 1
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`

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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 2
`
`

`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 3
`
`

`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 4
`
`

`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 5
`
`

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`(19) Japan Patent Office (JP)
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`(12) Unexamined Patent Application Publication (A)
`(11) Pat. Application Pub. No.
`Unexamined Patent Application Publication No. 2001-301230
`(P2001-301230A)
`(43) Publication Date: October 30, 2001 (2001.10.30)
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`ID No.
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`Theme codes (reference)
`(51) Int.Cl.7
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`841J
`2/44
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`H01L
`33/00
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`2C162
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`5CO51
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`1/036
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`5F041
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`Continues on the last page
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`(Total 5 pages)
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`Request for examination: Not filed yet. Number of claims: 6
`(21) Application No.: Patent Application 2000-124578 (P2000-124578)
`(71) Applicant: 000005049
`
` Sharp Corporation
`(22) Application Date: April 25, 2000 (2000.4.25)
` Nagaike-cho 22-22, Abeno-ku, Osaka-shi, Osaka-fu
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`(72) Inventor: Taisuke Uemura
` c/o Sharp Corporation
` Nagaike-cho 22-22, Abeno-ku, Osaka-shi, Osaka-fu
`(72) Inventor: Katsumi Adachi
` c/o Sharp Corporation
` Nagaike-cho 22-22, Abeno-ku, Osaka-shi, Osaka-fu
`(74) Agent 100075502
` Yoshiro Kurauchi, Patent Attorney
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`Continues on the last page
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`(54) [Title of the Invention] EXPOSURE APPARATUS
`
`(57)[Abstract]
`[Problems To Be Solved] To provide a structure that is small,
`has consistent optical properties, and enables easy
`manufacture of optical lenses without the use of molds.
`[Solution] To constitute an exposure apparatus with multiple
`light emitting devices (surface emitting LEDs) placed in a
`staggered arrangement 11...11 and microlenses 3 formed
`above each of the light emitting devices 11, etc., and form the
`microlenses 3 above each of the light emitting devices 11
`using the ink jet method, for example, by surface tension of
`ultraviolet curing resin discharged on a light emitting device
`chip 1 in a non-contacting state.
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 6
`
`

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`[Claim 1] An exposure apparatus to be used in
`electrophotographic devices such as printers and copiers,
`characterized by being equipped with multiple light emitting
`devices in a staggered arrangement and microlenses formed
`above each of the light emitting devices, and each of the
`microlenses being formed by surface tension of ultraviolet curing
`resin discharged towards each of the light emitting devices in a
`non-contacting state.
`[Claim 2] An exposure apparatus described in Claim 1
`characterized by the light emitting device being a surface
`emitting LED.
`[Claim 3] An exposure apparatus described in Claim 1
`characterized by an optical path length adjustment layer being
`formed between the light emitting devices and microlenses.
`[Claim 4] An exposure apparatus described in Claim 1
`characterized by the microlenses being formed on a surface
`tension adjustment layer.
`[Claim 5] An exposure apparatus described in Claim 1
`characterized by the light emitted from the light emitting device
`being focused so that it becomes near-parallel after passing
`through the microlens.
`[Claim 6] An exposure apparatus described in Claim 1
`characterized by the wetting angle of the ultraviolet curing resin
`which forms the microlens being 12 degrees or larger.
`[Detailed Description of the Invention]
`[0001]
`[Field of the Invention] The present invention relates to an
`exposure apparatus used in electrophotographic devices such as
`printers and copiers.
`[0002]
`[Prior Art] An example of an electrophotographic device is shown
`in Figure 5.
`[0003] The electrophotographic device in Figure 5 mainly
`consists of a photoreceptor drum 101 as an image carrier, a
`charging device 102 facing the photoreceptor drum 101, an
`exposure apparatus 103 which forms electrostatic latent images
`on the surface of the photoreceptor drum 101 based on the
`original image data, a developing device 104 which develops
`electrostatic latent images on the surface of the photoreceptor
`drum 101 exposed by the exposure apparatus 103 as visible
`images by use of a toner, a transfer roller which transfers toner
`images on the photoreceptor drum 101 onto paper P, a fixing
`roller 106 which fixes toner images on paper P with heat, and a
`cleaner 107 which removes the residual toner from the
`photoreceptor drum 101, among others.
`[0004] What has been generally used as an exposure apparatus
`in such electrophotographic devices is, as shown in Figures 6 and
`7, one that consists of an LED array 201 consisting of multiple
`LED chips 211...211 arranged on a substrate 210 and a SELFOC
`lens 202 placed above the LED chips 211...211, and is configured
`to focus the light outputted by each LED chip 211 with the
`SELFOC lens 202 into linear (parallel) light and irradiate the light
`onto the photoreceptor drum 101 (see Figure 5).
`[0005] As another exposure apparatus, Unexamined Patent
`Application Publication H8-156320 discloses an apparatus in
`which the optical system--which directs the light outputted by
`the light source LED array to the photoreceptor drum--consists of
`a waveguide and a microlens, and said microlens is formed with
`
`(2) 001-301230 (P2001-301230A)
`
`ultraviolet curing resin (LED printer head). In the exposure
`apparatus described in this publication, the microlens made of
`ultraviolet curing resin is integrally formed with the LED chip
`using a transparent mold made of transparent resin such as
`urethane acrylate based resin or glass.
`[0006]
`[Problems To Be Solved by the Invention] Now, with the
`exposure apparatus using SELFOC lenses, LED chips and SELFOC
`lenses need to be aligned with high precision, which gives rise to
`productivity and cost issues. Also, there is a problem of
`deteriorating print quality due to cyclical light variations caused
`by the position of the SELFOC lenses.
`[0007] On the other hand, with the exposure apparatus
`described in Unexamined Patent Application Publication H8-
`156320, the transparent mold needs to contact the surface of
`the LED chip when microlenses are formed, and may damage
`electrode wiring patterns. Also, to avoid the breakage of bonding
`wire, the LED chip needs to be cut out after microlenses are
`formed on the wafer. Furthermore, transparent mold made of
`transparent resin such as urethane acrylate based resin or glass
`has a short lifetime which is a problem.
`[0008] The present invention was made in light of these
`circumstances, and its purpose is to provide an exposure
`apparatus that is small and has consistent optical properties, and
`enables easy manufacture of optical lenses without the use of
`molds.
`[0009]
`[Means for Solving the Problems] The exposure apparatus under
`the present invention is an exposure apparatus to be used in
`electrophotographic devices such as printers and copiers, which
`is characterized by being equipped with multiple light emitting
`devices in a staggered arrangement and microlenses formed
`above each of the light emitting devices, and each of the
`microlenses being formed by surface tension of ultraviolet curing
`resin discharged towards each of the light emitting devices in a
`non-contacting state.
`[0010] In the exposure apparatus under the present invention,
`the microlens is integrally formed with the light emitting device
`chip by discharging ultraviolet curing resin onto the light emitting
`device chip in a non-contacting state using an ink jet or similar
`method. Therefore, unlike the SELFOC lens, it does not have
`problems caused by the precision of assembly. Also, since molds
`are not used, there is no risk of electrode wiring patterns, etc.,
`being damaged.
`[0011] Furthermore, since the shape of the lens is obtained by
`surface tension of ultraviolet curing resin, the microlens can be
`formed while bumps and dents of electrode wiring patterns, etc.
`are absorbed. Also, since the light emitting devices are placed in
`a staggered arrangement, it is possible to make the lens
`diameter larger than the dot pitch.
`[0012] In the exposure apparatus under the present invention,
`surface emitting LEDs are used as the light emitting devices. A
`surface emitting LED has advantages over an end plane light
`emitting type in that the device is easier to manufacture and
`formation of microlenses onto the device is also easier.
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 7
`
`

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`[0013] In the exposure apparatus under the present invention, if
`an optical path length adjustment layer is formed between light
`emitting devices and microlenses, the microlenses can be placed
`in suitable optical positions, in other words positions where they
`can focus the light coming from the junction region of the light
`emitting devices (depth of approximately 5 Å) into near-parallel
`light.
`[0014] In the exposure apparatus under the present invention, if
`microlenses are formed on a surface tension adjustment layer, it
`becomes possible to adjust the wetting angle of the ultraviolet
`curing resin and to manufacture microlenses with desired lens
`properties. The function of this surface tension adjustment layer
`can be fulfilled by the previously mentioned optical path length
`adjustment layer.
`[0015] In the exposure apparatus under the present invention,
`the preferred wetting angle of the ultraviolet curing resin is 12
`degrees or larger, and more preferably 40 degrees or larger.
`When the wetting angle of the ultraviolet curing resin is set to 12
`degrees or larger, variations in optical properties due to
`variations in the wetting angle are reduced.
`[0016]
`[Embodiment of the Invention] We will describe below an
`embodiment of the present invention based on the figures.
`[0017] Figure 1 is a plan view schematic showing the structures
`of main parts of an embodiment of the present invention. Figure
`2 is an A-A cross section diagram of Figure 1.
`[0018] In this example, an LED array chip 1 is used as the light
`source for the exposure apparatus. On the LED array chip 1,
`multiple surface emitting LEDs 11...11 are formed in a two-row
`staggered arrangement. The junction region of each surface
`emitting LED 11 is formed at a depth of approximately 5 Å
`below the surface of the substrate 10. An electrode wiring
`pattern 12 is connected to each surface emitting LED 11.
`[0019] An optical path length adjustment layer made of silicone
`based resin is laminated on the surface of the LED array chip 1
`(the forming face of the surface emitting LED 11). On the optical
`path length adjustment layer 2, microlenses 3 are formed in
`positions that are directly above each of the surface emitting
`LEDs 11. The optical axis of each microlens 3 is aligned with the
`center (optical axis) of the corresponding surface emitting LED 11.
`[0020] Next, we will describe the method of forming the
`microlens 3 while referring to Figure 3.
`[0021] First, a prescribed amount of ultraviolet curing resin is
`discharged from an ink jet nozzle N and attaches onto the
`surface of an optical path length adjustment layer 2 on top of an
`LED array chip 1. At this time, the outer surface of the ultraviolet
`curing resin R attached onto the surface of the optical path
`length adjustment layer 2 takes the shape of a lens due to
`surface tension. A series of this lens-shaped ultraviolet curing
`resin R is formed in a staggered arrangement as shown in Figure
`1. Then, all pieces of the ultraviolet curing resin R on the optical
`path length adjustment layer 2 are hardened by ultraviolet light
`irradiated by an ultraviolet lamp or a similar source (not shown)
`to obtain microlenses 3 with a shape shown in Figure 2.
`[0022] Here, the preferred wetting angle of the ultraviolet curing
`resin which constitutes microlenses 3 is 12 degrees or larger.
`
`(3) 001-301230 (P2001-301230A)
`
`When the wetting angle of the ultraviolet curing resin is 12
`degrees or larger, the focal distance f does not change much
`even if the wetting angle θ changes, as shown in Figure 4 (a chart
`showing the relationship between the wetting angle and the
`focal distance), and thus variations in optical properties due to
`variations in the wetting angle can be reduced.
`[0023] Also, as clearly shown in Figure 4, when the wetting angle
`θ is 40 degrees or larger the value of the focal distance f
`becomes nearly constant. Therefore, it is preferable to set the
`wetting angle of the ultraviolet curing resin at 40 degrees or
`larger in order to obtain more consistent optical properties.
`[0024] In the embodiment described above, since the surface
`emitting LEDs 11 are placed in a two-row staggered arrangement,
`the lens diameter D of the microlens 3 may be larger than the
`dot pitch (D=dot pitch PX√2 十α).
`[0025] Also, since an optical path length adjustment layer 2 is
`formed underneath the microlenses 3, potential variations in the
`wetting angle caused by different materials such as electrode
`wiring patterns 12 can be absorbed, and microlenses 3 with
`consistent optical properties can be obtained all the time.
`[0026] Furthermore, providing the optical path length
`adjustment layer 2 makes it possible to place the microlenses 3
`in optically suitable positions in relation to the surface emitting
`LEDs 11. Since the junction region of the surface emitting LED 11
`is formed at a depth of approximately 5 Å below the surface of
`the substrate 10, if microlenses 3 are formed directly on the
`surface of the LED array chip 1, it would be difficult to focus the
`light from the surface emitting LEDs 11 into a suitable shape.
`However, if, as shown in Figure 2, an optical path length
`adjustment layer 2 is formed on the surface of the LED array chip
`1 to provide a distance between the surface emitting LEDs 11
`and the microlenses 3, it becomes possible to focus the light
`from the surface emitting LEDs 11 into near-parallel light.
`[0027] In addition, if a surface tension adjustment layer made of
`fluororesin, etc., is coated on the surface of the optical path
`length adjustment layer 2, it becomes possible to adjust the
`wetting angle of the ultraviolet curing resin, and therefore to
`form microlenses 3 with desired lens properties. Also, the
`function of this surface tension adjustment layer can be fulfilled
`by the optical path length adjustment layer.
`[0028]
`[Embodiment] In the embodiment shown in Figures 1 and 2, the
`dimensions and materials of the LED array chip 1, the optical
`path length adjustment layer 2 and the microlens 3 are specified
`as follows:
`・ LED array chip 1
`Dot pitch: 1200 dpi (21.2 μm)
`・Optical path length adjustment layer 2
`Silicone based resin (refractive index 1.5)
`Thickness: 75 μm
`・Microlens 3
`Ultraviolet curing resin (refractive index 1.5)
`Wetting angle: 50 degrees
`Lens diameter: D=35 μm
`
`
`
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 8
`
`

`
`(4) 001-301230 (P2001-301230A)
`
`
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`[Figure 4] A chart showing the relationship between the wetting
`angle of the ultraviolet curing resin which constitutes
`microlenses and the focal distance.
`[Figure 5] A diagram showing an example of an
`electrophotographic device.
`[Figure 6] A cross section schematic showing the structures of
`main parts of a conventional exposure apparatus.
`[Figure 7] An B-B cross section diagram of Figure 6.
`[Explanations of Symbols]
`1: LED array chip
`10: substrate
`11: surface emitting LED
`12: electrode wiring pattern
`2: optical path length adjustment layer
`3: microlens
`101: photoreceptor drum
`102: charging device
`103: exposure apparatus
`104: developing device
`105 transfer roller
`106 fixing roller
`107 cleaner
`
`
`
`Lens focal distance: F=30 μm (n=1.5)
`[0029]
`[Effects of the Invention] As described above, the present
`invention makes it possible to focus the light outputted by light
`emitting devices into a suitable shape without using a SELFOC
`lens which is problematic in terms of variations in the amount of
`light and precision of assembly, etc., because microlenses are
`integrally formed above the light emitting devices which are
`placed in a staggered arrangement. It also makes it possible to
`reduce the size of the apparatus relative to an apparatus with
`the SELFOC lens.
`[0030] Furthermore, since microlenses are formed by surface
`tension of ultraviolet curing resin discharged onto the light
`emitting device chip in a non-contacting state, there is no risk of
`electrode wiring patterns, etc., being damaged. Also, the
`productivity is improved because it allows the microlenses to be
`manufactured easily without the use of transparent molds, etc.
`[Brief Description of the Figures]
`[Figure 1] A plan view schematic showing the structures of main
`parts of an embodiment of the present invention.
`[Figure 2] An A-A cross section diagram of Figure 1.
`[Figure 3] A diagram describing the method of forming
`microlenses.
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`[Figure 1]
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`[Figure 2]
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`[Figure 6]
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`[Figure 3]
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`[Figure 4]
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`Lens diameter
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`Wetting angle θ (degrees)
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`Focal distance
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 9
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`[Figure 5]
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`[Figure 7]
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`(5) 001-301230 (P2001-301230A)
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`ID No.
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`Continued from the front page
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`(51)Int.CI.7
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`H04N
`
`(72) Inventor: Kiyoshi Toizumi
` c/o Sharp Corporation
` Nagaike-cho 22-22, Abeno-ku, Osaka-shi, Osaka-fu
`(72) Inventor: Tadashi Iwamatsu
` c/o Sharp Corporation
` Nagaike-cho 22-22, Abeno-ku, Osaka-shi, Osaka-fu
`
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`(Reference)
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`F terms (reference) 2C162 AE28 AE47 FA04 FA17 FA44
` 5C051 AA02 CA08 DA04 DB02 DB22
` DC02 DC07 DDOO
` 5F041 AA47 CA12 CB22 DA45 DA46
` DA55 DA57 DA91 EE17 FF13
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`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 10
`
`

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`CERTIFICATION OF TRANSLATION
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`International Litigation Services, a company specializing in international cases and foreign language
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`document processing, certifies the following:
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`International Litigation Services has retained professional translators for the attached Japanese
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`into English document. The document is referred to as:
`
`"JP 2001301230A_eng"
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`translation in English of the corresponding Japanese document.
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`Executed on this 6th day of January 2015, in Aliso Viejo, California.
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`Managing Director
`International Litigation Services, Inc.
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1007 Page 11