EXHIBIT 1005
`
`U.S. Patent No. 6,610,563 to Waitl et al.
`
`(“Waitl”)
`
`

`
`(12) United States Patent
`Waitl et al.
`
`(10) Patent N0.:
`45 Date of Patent:
`
`US 6,610,563 B1
`Au . 26 2003
`a
`
`US006610563B1
`
`(54) SURFACE MOUNTING OPTOELECTRONIC
`COMPONENT AND METHOD FOR
`PRODUCING SAME
`
`7/1994 Orton
`5,331,512 A
`5,545,359 A * 8/1996 Axkley et al. ........... .. 264/1.24
`5,614,131 A * 3/1997 Mukerji et al. . . . . .
`. . . . .. 264/1.9
`
`5,686,172 A * 11/1997 Ohya et al. . . . . . . . . .
`
`. . . .. 428/210
`
`_
`
`..
`
`(75) Inventors‘ gusts l‘ivil?’BRgggésgmrhg (SEQ
`Hgrgert grfl’nngr Reg:1Sb(urg)(>DE)
`
`.
`
`_
`
`(73) Assignee: OSRAM Opto Semiconductors GmbH
`& Co. OHG, Regensburg (DE)
`
`( * ) Notice:
`
`Subject to any disclaimer, the term of this
`'
`d d or ad'usted under 35
`Patent 15 exten e
`1
`0 days.
`
`_
`(21) Appl' NO"
`
`09/581’585
`
`(22) PCT Filed:
`
`Dec. 15, 1998
`
`(86) PCT NO‘
`§ 371 (c)(1),
`(2), (4) Date:
`
`PCT/DE98/03676
`
`Oct. 5, 2000
`
`(87) PCT Pub. N0.: WO99/31737
`
`PCT Pub. Date: Jun. 24, 1999
`Foreign Application Priority Data
`
`(30)
`
`Dec. 15, 1997
`
`(DE) ....................................... .. 197 55 734
`
`(51) Int. Cl.7 .............................................. .. H01L 21/20
`(52) US. Cl. ...................... .. 438/166; 438/161; 438/780
`(58) Field of Search ............................... .. 438/780, 166,
`438/161, 162, 163, 164, 165; 264/1.9, 553,
`571, 272.15, 272.17, 1.1, 1.7, 385/74, 93,
`59,88, 129, 51, 49, 12, 94, 90, 428/30,
`156, 850
`
`(56)
`
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`4,727,457 A
`5,040,868 A
`
`2/1988 Thillays
`8/1991 Waitl 61 a1.
`
`6,052,500 A * 4/2000 Takano et al. . . . . . .
`
`6,103,398 A * 8/2000 Norton 6161. ............ .. 428/620
`6,440,877 B1 * 8/2002 Yamazaki 6161. ........ .. 438/780
`FOREIGN PATENT DOCUMENTS
`
`. . . . . .. 385/50
`
`EP
`EP
`EP
`JP
`JP
`JP
`W0
`W0
`
`0 230 336
`0 374 121
`0 400 176
`51085273
`60020587
`0210606
`WO 82/04500
`WO 83/00408
`
`7/1987
`6/1990
`12/1990
`5/1982
`2/1985
`* 7/1998
`12/1982
`2/1983
`
`OTHER PUBLICATIONS
`
`Fonstad 61 al, PCT, Jan. 2001*
`F. Moellmer, et al., "Siemens—SMT—TOP—LED—LEDs for
`Surface Mounting, Part I: Characteristics and special fea
`tures”, Siemens Components, Issue 26, No. 4/5, Oct. 1991,
`pp. 147—149 (German & English).
`
`* cited by examiner
`
`Primary Examiner—Carl Whitehead, Jr.
`Assistant Examiner—Laura M Schillinger
`(74) Attorney, Agent, or Firm—Schiff Hardin & Waite
`(57)
`ABSTRACT
`
`A method for producing a surface mounting optoelectronic
`component having comprises the folloWing steps: readying
`a base body With the optoelectronic transmitter and/or
`receiver arranged in a recess of the base body, ?lling the
`recess of the base body With a transparent, curable casting
`compound, and placing the optical device onto the base
`body, so Whereby the optical device comes into contact With
`the casting compound.
`
`19 Claims, 4 Drawing Sheets
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 1
`
`

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`U.S. Patent
`
`Aug. 26, 2003
`
`Sheet 1 0f4
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`US 6,610,563 B1
`
`Ill
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`Fig. 2B
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`Fig. 2C
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`6
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 2
`
`

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`U.S. Patent
`
`Aug. 26, 2003
`
`Sheet 2 0f4
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`US 6,610,563 B1
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`2
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`2
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`Fig. 5
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`21
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`Fig. 4
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`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 3
`
`

`
`U.S. Patent
`
`Aug. 26, 2003
`
`Sheet 3 0f4
`
`US 6,610,563 B1
`
`Fig. 5
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 4
`
`

`
`U.S. Patent
`
`Aug. 26, 2003
`
`Sheet 4 0f4
`
`US 6,610,563 B1
`
`Z5
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 5
`
`

`
`US 6,610,563 B1
`
`1
`SURFACE MOUNTING OPTOELECTRONIC
`COMPONENT AND METHOD FOR
`PRODUCING SAME
`
`2
`of optoelectronic SMT component With a Well de?nable
`emission characteristic and simultaneously loW component
`costs.
`This object is achieved in accordance With the present
`invention in a method for producing a surface mounting
`optoelectronic component having a base body, an optoelec
`tronic transmitter/receiver that is arranged in a recess of the
`base body, and an optical device that covers the recess, said
`method comprising the steps of: preparing the base body
`With the optoelectronic transmitter/receiver arranged in the
`recess; ?lling the recess of the prepared base body With a
`transparent hardenable casting compound; then placing the
`optical device onto the as yet uncured casting compound;
`and then curing the casting compound.
`In an embodiment, the step of preparing the base body
`comprises the steps of: coating a conductor strip With a
`thermoplast housing While simultaneously forming the
`recess of the base body into a top surface of the thermoplast
`housing, a portion of said conductor strip being situated
`inside the recess; mounting the optoelectronic transmitter/
`receiver on said portion of the conductor strip situated inside
`the recess; and ?lling the recess of the base body With a
`transparent curable casting compound having thermal char
`acteristics adapted to the thermoplast housing material.
`In an embodiment, the recess of the base body is ?lled
`With the casting compound to a level such that, during the
`subsequent placement of the optical device, essentially no
`casting compound runs over an edge of the recess.
`In an embodiment, the recess is ?lled With casting com
`pound essentially to the edge of the recess such that, after the
`recess is ?lled With casting compound, a ?llet develops
`oWing to the surface tension of the casting compound; and
`the optical device has a shape in a region contacting the
`casting compound that no casting compound runs over the
`edge of the recess When the optical device is subsequently
`placed onto the casting compound.
`In an embodiment, the optical device is placed from
`above, Without pressure, onto one of the base body or at least
`one seating element attached to said base body Within said
`recess.
`In an embodiment, the casting compound is cured by the
`in?uence of heat.
`In an embodiment, prior to ?lling the recess, an optical
`device is produced by one of casting, pressing, or injection
`processing; then the optical device is readied and transported
`as bulk material of optical devices; then a respective optical
`device is automatically picked from the bulk material; and
`then the picked optical device is automatically positioned
`over the base body.
`This object is also achieved in accordance With the
`present invention in a method for producing a surface
`mounting optoelectronic component having a base body, an
`optoelectronic transmitter/receiver that is arranged in a
`recess of the base body, and an optical device that covers the
`recess, said method comprising the steps of: preparing the
`base body With the optoelectronic transmitter/receiver
`arranged in the recess; then ?lling the recess of the prepared
`base body With a ?rst transparent hardenable casting com
`pound; then readying a casting mold half and ?lling the mold
`half With a second transparent hardenable casting com
`pound; then at least partially curing at least one of the ?rst
`casting compound in the recess of the base body and the
`second casting compound in the mold half; then casting the
`optical device onto the base body by joining the base body
`and the mold half properly positioned, such that second
`casting compound in the mold half comes into contact With
`
`The present invention relates to a method for producing
`a surface mounting optoelectronic component comprising a
`base body, an optoelectronic transmitter and/or receiver that
`is arranged in a recess of the base body, and an optical device
`that occludes the recess, as Well as to a surface mounting
`optoelectronic component.
`In recent years, surface mounting technology (SMT) has
`increasingly supplanted the equipping of conductor carriers
`With Wired components. The crucial advantage of SMT is an
`increase in packing density, Which cannot be achieved by
`conventional insertion methods.
`Due to the high packing density, Which is desirable in
`many optical applications, SMT is particularly important in
`the ?eld of optoelectronics. There are already knoWn opto
`electronic components Which are designed to be surface
`mounted in accordance With the SMT concept.
`European patent application No 230 336 therefor
`describes a surface mounting optoelectronic component that
`comprises an annular housing, the upper opening of Which
`is sealed by a ball lens, While the loWer opening of the ring
`stands on a printed circuit board. Inside the housing, a
`light-emitting semiconductor element is arranged betWeen
`the present circuit board and the bottom verteX of the ball
`lens. The interior space of the ring housing, Which is de?ned
`by the surface of the printed board and the ball lens, is ?lled
`With a transparent glue.
`Another surface mounting optoelectronic component is
`illustrated in EP 0 400 176. This component has a base body
`With a central depression in Which an optically active
`semiconductor element is arranged. Above the base body,
`there is a lens, Which is connected to the base body via a
`?xing mechanism such as a clamping peg.
`“Siemens SMT-TOPLED fiir die Ober?achenmontage”
`(Frank Mollmer and Giinter Waitl, Siemens Components 29
`(1991), Vol. 4:147—149) teaches a light emitting diode
`(LED) Which is provided for surface mounting. To produce
`this diode, a continuously stamped conductor strip is coated
`With a thermally stable thermoplast, forming the housing
`frame. In the inner region of the housing frame, an optically
`active element is mounted on the conductor strip and elec
`trically contacted to interconnects there. Next, the frame’s
`interior region for guarding the active element against
`environmental in?uences is cast using a casting resin. A lens
`or similar optical device is not provided in this component.
`The SMT opto-components described in the documents
`cited above have the unique attribute that ?rst the Whole
`component housing is produced by coating a conductor strip
`With a thermoplast material, and the opto-electronic trans
`mitter and/or receiver is inserted into the thermoplast hous
`ing only after this is produced. The advantages of this
`method of production are that a very economical mass
`production at the belt (conductor strip) is possible, and loW
`structural heights and standardiZed basic structural forms are
`easy to realiZe. Due to their loW costs, these prehoused SMT
`opto-components, as they are called, are used above all in
`display arrays and the like.
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`SUMMARY OF THE INVENTION
`It is the object of the present invention to set forth a
`method by Which the emission characteristic of opto
`electronic SMT components of the above type can be
`improved Without raising the component costs unacceptably.
`The present invention is also directed to designing this type
`
`65
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 6
`
`

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`US 6,610,563 B1
`
`3
`a surface of the ?rst casting compound in the recess of the
`base body; then curing at least one of the second and ?rst
`casting compound; and then removing the mold half from
`the base body With the cast-on optical device.
`In an embodiment, the method further comprises, prior to
`joining the base body and the mold half, Wetting the surface
`of the ?rst casting compound.
`In an embodiment, the step of Wetting the surface of the
`?rst casting compound comprises the steps of: turning the
`base body about a horizontal axis such that an opening of the
`recess is directed doWnWardly; and at least super?cially
`immersing the base body in liquid casting compound.
`In an embodiment, the at least partial curing of the ?rst
`casting compound is by heat treatment.
`In an embodiment, the at least partial curing of the second
`casting compound is by heat treatment.
`In an embodiment, the method further comprises the steps
`of: leading a number of base bodies on a ?rst strip; and
`leading a number of mold halves on a second strip, Wherein
`the ?rst strip and the second strip are led in parallel at least
`during the step of casting the optical device onto the base
`body.
`In an embodiment, the method further comprises the steps
`of: leading a number of base bodies on a ?rst strip; com
`bining a number of mold halves in a group; and connecting
`the group of mold halves, such that they can be detached, to
`a corresponding number of base bodies at least during the
`step of casting the optical device onto the base body.
`In an embodiment, the base body and the mold half are
`joined at a temperature of approximately 80° C.
`In an embodiment, the second casting compound is cured
`at a temperature of approximately 150° C.
`In an embodiment, the mold half is removed from the base
`body at a temperature of approximately 80° C.
`This object is also achieved in accordance With the
`present invention in a surface mounting optoelectronic com
`ponent comprising:
`a base body having a thermoplast injection housing and a
`coated conductor strip secured to the housing, said base
`body having a recess formed therein With a portion of
`the conductor strip situated inside the recess;
`an optoelectronic transmitter/receiver arranged in the a
`recess of the base body and mounted on the portion of
`the conductor strip situated inside the recess;
`a transparent hardenable casting compound provided in
`the recess, said casting compound having thermal char
`acteristics adapted to those of the thermoplast housing
`material; and
`an optical device covering the recess and cast onto the
`casting compound such that a seating surface of the
`optical device is in surface-Wide contact With the
`casting compound.
`In an embodiment, the recess comprises a ring channel
`surrounding the recess.
`In an embodiment, the base body comprises a number of
`seating elements for seating of the optical device, said
`seating elements being arranged at a margin side relative to
`the recess.
`FolloWing the production of the base body With the
`optoelectronic transmitter and/or receiver arranged in the
`recess, the recess of the base body is ?lled With a transparent
`hardenable casting compound, and the optical device is
`attached to the base body, said optical device being brought
`into contact With the casting compound in the region of the
`recess before the casting compound and/or the optical device
`(if this also comprises a casting compound) has completely
`hardened.
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`An essential aspect of the present invention is that the
`optical device is placed on the base body only after the
`recess is poured With casting compound. Because the optical
`device is placed onto the recess When the latter is already
`?lled With casting compound, the optical device can be
`positioned on the base body extremely precisely and
`reproducibly, and this positioning remains essentially unaf
`fected by subsequent steps such as curing or removal from
`the mold. This guarantees a high optical quality of the
`optoelectronic component With respect to the emission
`behavior or reception behavior, Which is very important for
`applications in Which an exact beam guidance and a high
`light yield are desirable. The present inventive optoelec
`tronic components are thus superior to components in Which
`the recess is ?lled from the reverse side given a previously
`mounted optical device.
`The present inventive method can be applied particularly
`advantageously in the production of What are knoWn as
`prehoused optoelectronic components. Here, the base body
`is produced ?rst by coating a conductor strip With a ther
`moplast While the housing With the recess is simultaneously
`formed, and then the optoelectronic transmitter and/or
`receiver is assembled on a section of the conductor strip that
`resides in the recess.
`In accordance With a ?rst, particularly advantageous
`embodiment of the present inventive method, the optical
`device is placed on the as yet unhardened casting compound,
`and the casting compound is then cured.
`In this case, the ?ll level of the casting compound can be
`selected such that casting compound does not escape over
`the edge of the recess When the optical device is placed on.
`It is then unnecessary to take measures to trap casting
`compound that may over?oW.
`It is also possible to exploit a ?llet formation of the
`casting compound, Which arises on the basis of its surface
`tension. In this case, an optical device is used Whose shape
`in its region that contacts the casting compound is selected
`such that, even When the recess is ?lled to the edge With
`casting compound, said casting compound does not over
`?oW the edge of the recess When the optical device is placed
`on.
`The base body can also be provided With a ring channel
`that surrounds the recess before the optical device is placed
`on. In this case, casting compound that may over?oW When
`the optical device is placed on is collected in the ring
`channel, thus preventing it from running doWn on the
`exterior of the base body and hardening there, Which Would
`impair the manipulability of the component.
`A particularly reproducible positioning of the optical
`device is achieved When, prior to the placement of the
`optical device, the base body is provided With seating
`elements that are arranged at the margin side relative to the
`recess. The seating elements can be formed integrated With
`the housing in the above described injection step for pro
`ducing the base body for a prehoused optoelectronic com
`ponent.
`Preferably, the optical device is placed from above onto
`the base body, or the seating elements that have been
`fashioned thereon, Without pressure. The placement of the
`optical device then occurs by means of gravity alone.
`In an embodiment, the optical device is ?rst produced by
`means of a casting, pressing or injection procedure before
`the optical device is placed on, and then it is transported in
`bulk and placed onto a base body by automatic picking from
`the bulk material and automatic positioning over said base
`body. The advantage of these measures is that the optical
`device is produced completely independently of the produc
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 7
`
`

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`US 6,610,563 B1
`
`5
`tion of the base body, opening up the possibility to control
`the quality of the optical device effectively and distinctly and
`to eliminate spoilage. This makes it possible to produce
`components of the highest quality.
`In a second particularly preferred embodiment of the
`inventive method, the optical device is formed in a casting
`process, and in the scope of this casting process it is placed
`onto the base body in the region of the recess and is cast out
`With the casting compound in the recess. Also, in this second
`embodiment of the inventive method, the recess of the base
`body is ?lled before the optical device is placed on in the
`scope of said pouring process, so that the advantages asso
`ciated With this procedure are also manifest in this embodi
`ment of the invention.
`In this second embodiment of the inventive present
`method for producing the optical device, one half of a
`casting mold is advantageously prepared ?rst, and this half
`is ?lled With an additional casting compound. On the other
`hand, When the recess of the base body has been ?lled With
`casting compound, the casting compound is ?rst hardened at
`least partially and is then Wetted With casting compound.
`Next, the base body and the half of the casting mold Which
`is ?lled With the additional casting compound are joined,
`under correct positioning, and in a folloWing step the addi
`tional casting compound in the casting mold half is cured,
`Whereby it is cast onto the casting compound in the recess
`of the base body. Last, the noW ?nished optoelectronic
`component is ejected by removing the half of the casting
`mold from the base body With the optical device that has
`been cast on.
`Wetting can be accomplished by turning the base body
`about a horiZontal axis and immersing it in casting com
`pound at least on the surface, for example. Because of the at
`least partial hardening of the casting compound, none of the
`compound escapes during the turning process.
`The Wetting of the surface of the casting compound
`prevents air bubbles from remaining in the casing compound
`in the subsequent casting on process.
`The advantage of the described second embodiment of the
`inventive method is that it is particularly easy to realiZe and
`has a high potential for automatiZation, enabling mass
`productions [sic] on an industrial scale.
`These and other features of the invention(s) Will become
`clearer With reference to the folloWing detailed description
`of the presently preferred embodiments and accompanied
`draWings.
`DESCRIPTION OF THE DRAWINGS
`FIG. 1 is a perspective vieW of a base body With housing
`and conductor strip as used in the present inventive method.
`FIGS. 2A, 2B and 2C the steps of preparing the base body,
`?lling the recess of the base body, and placing the optical
`device onto the base body in accordance With a ?rst embodi
`ment of the present invention using the example of the base
`body illustrated in FIG. 1.
`FIG. 3 is the optoelectronic component represented in
`FIG. 2C, as produced in accordance With the ?rst inventive
`embodiment, in a plan vieW.
`FIG. 4 is a schematic vieW explicating the production and
`transport of the optical device.
`FIG. 5 shoWs another optoelectronic component Which is
`produced in accordance With the ?rst embodiment of the
`inventive methods.
`FIG. 6 a plan vieW of the optoelectronic component
`illustrated in FIG. 5, and
`FIG. 7 is a schematic representation explicating a second
`embodiment of the inventive method.
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`DETAILED DESCRIPTION OF THE
`PRESENTLY PREFERRED EMBODIMENTS
`
`FIG. 1 shoWs a base body 1, Which is formed by coating
`a conductor strip 2 With a high-temperature thermoplast
`housing 3. The housing 3 advantageously has ?at exterior
`surfaces, guaranteeing easy insertion. At the surface, a recess
`4 is provided in the housing 3.
`FIG. 2A shoWs a sectional illustration of a base body 1
`that is constructed essentially in accordance With FIG. 1, the
`housing 3‘ differing from the housing 3‘ illustrated in FIG. 1
`only to the extent that the surface 5 of the housing 3‘ is
`provided With a ring groove 6 that surrounds the recess 4,
`Which Will be mentioned later. FIG. 2A shoWs that sections
`7,8 of the conductor strip 2 are surrounded by the thermo
`plast housing 3‘ and protrude With contact portions 9,10 into
`the recess 4 in the bottom region of said recess 4. A contact
`portion 9 is extended up to the central region of the recess
`4.
`The inner Wall surfaces 13 of the housing 3 are con
`structed as oblique surfaces and form a re?ector. By select
`ing a housing material With a high diffuse degree of re?ec
`tion of approximately 90% or more, a high re?ectivity of
`these surfaces 13 is generated.
`FolloWing the production of the conductor strip housing
`structure 2,3‘, a semiconductor chip 11 is mounted in the
`recess 4 of the housing 3‘. In the representation in FIG. 2A,
`this assembly step has already been performed. The semi
`conductor chip 11 is placed onto the extended contact
`portion 9 of the conductor strip 2 and electrically contacted
`to this. An additional electrical contacting occurs via a Wire
`12, Which is led from the semiconductor chip 11 to the
`opposite contact portion of the conductor strip 2. As semi
`conductor chip 11, a light-emitting diode or a photosensitive
`semiconductor element can be used, for example.
`FolloWing the assembly and contacting of the semicon
`ductor chip 11, the recess 4 is ?lled With a free-?oWing
`casting compound 14 in accordance With the illustration in
`FIG. 2B. The casting compound 14 can be a matter of an
`epoxy resin, for example. The casting compound 14 and the
`housing material are matched With respect to thermal prop
`erties in order to prevent thermal loads, such as may arise in
`the soldering of the component and in later use, from
`causing mechanical failures.
`Due to the surface tension of the casting compound, its
`surface 15 is fashioned in the shape of a ?llet; that is, it has
`a concave course.
`The ?ll level of the casting compound 14 depends on the
`dimension of the ?llet formation, the shape of the optical
`device that is placed onto the recess 4 in the next step (see
`FIG. 2C), and also on Whether measures have been taken at
`the housing 3‘ to trap casting compound 14 that may
`over?oW the edge, such as the surrounding ring groove 6
`that is illustrated here.
`FIG. 2C illustrates the subsequent placement of an optical
`device onto the recess 4. In the example illustrated in FIG.
`2C, the optical device is realiZed in the form of a plane
`convex convergent lens 16. On the side facing the recess 4,
`in the center region the convergent lens 16 has a ?at base
`surface 17, Which continues via a lead-in slope into a
`radially outlying annular seating surface 19. The base sur
`face 17 is coplanar With the seating surface 19.
`In the placing of the lens 16 onto the housing 3, Which has
`been ?lled With casting compound 14 in accordance With
`FIG. 2B, the lens 16 is ?rst positioned over the recess 4 and
`aligned With it axially. Next, the lens 16 is loWered onto the
`
`Kingbright Elec. Co. Ltd., Kingbright Corp., SunLED Corp.,
`Kingbright Co. LLC, SunLED Co. LLC and Sunscreen Co. Ltd.
`Exhibit - 1005 Page 8
`
`

`
`US 6,610,563 B1
`
`7
`thermoplast housing 3‘, whereby the lead-in slope 18 of the
`lens 16 and a top region of the inclined surface 13 of the
`inner Wall of the re?ector interact for self-centering. As a
`result, the achieved end position of the lens 16 relative to the
`housing 3‘ is largely independent of the preceding alignment
`step and is determined essentially by the dimensional sta
`bility of the lens 16 and housing 3‘ production in the
`corresponding regions of the slope 18 surface.
`The lens 16 is placed on the housing 3‘ as folloWs: First,
`the lens’s base surface 17 is brought into contact With the
`surface 15 of the casting compound 14. At this time, the
`seating surface 19 is not yet seated on the surface 5 of the
`housing 3‘. The subsequent loWering of the lens 16 into the
`?nal position can be effectuated by the in?uence of gravity
`alone. This entails a surface-Wide contact of the base surface
`17 of the lens With casting compound 14 and, depending on
`the ?ll level of the recess 4 (FIG. 2B), a displacing of casting
`compound 14 from the recess 4. Casting compound that
`over?oWs the edge of the housing 3‘ collects in the ring
`groove 6. The ring groove 6 thus prevents casting compound
`from ?oWing out doWn the housing’s 3‘ outer Wall, Which
`Would otherWise be possible. A certain over?oW of casting
`compound 14 into the ring groove 6 can thus be thoroughly
`desirable, since this favorably affects the closeness of the
`joint betWeen the lens 16 and the housing 3‘.
`In a ?nal step of production, the casting compound 14 is
`hardened in the component, for instance in the scope of a
`heat treatment.
`FIG. 3 shoWs a plan vieW of the optoelectronic component
`illustrated in FIG. 2C. The oblique surfaces 13 of the Wall of
`the recess 4 that form the re?ector, and the semiconductor
`chip 11, are located under the lens 16 and are represented by
`broken lines. The optional ring groove 6 is not included in
`the illustration for reasons of simplicity.
`The method detailed With the aid of FIGS. 2A to 2C can
`be carried out using lenses of various types and materials. It
`is essential, hoWever, that in this embodiment of the inven
`tive present method, the production of the lenses is already
`concluded before they are placed on the housing 3, 3‘.
`FIG. 4 details an eXample of the production of the
`plane-convex convergent lens 16 illustrated in FIG. 2C by a
`transfer molding process that is carried out in a press tool 20.
`In this process, clear pressing compound is ?rst pressed in
`the direction of the arroW 21 through a channel 22 of a
`heated half 23 of the tool into a mold Which is de?ned by a
`mold surface 24 of the ?rst half of the tool, a mold surface
`26 of a second half 25 of the tool, Which is situated adjacent
`the ?rst half 23, and to the face surface 27 of a ring ejector
`28 that has been displaceably accepted in the second tool
`half 25. The pressing compound is then formed by a pressing
`process into the lens 16, Which is then pushed out of the
`press tool 20 by means of the ring ejector 28 in the direction
`of the arroW 29 in a hot state With a stable form. The lens 16
`then drops into a lens collection containers 30 as bulk
`material. The lens collection container 30 is connected to
`transport mechanisms, such as a shaker conveyor, funnels,
`and so on (Which are not illustrated), via Which the lens 16
`is moved to an assembly unit (also not illustrated), by means
`of Which it is placed on the housing 3 of the optoelectronic
`component in the described manner (see FIG. 2C).
`In the lens production method described in accordance
`With FIG. 4, it has proven advantageous that only very loW
`tolerances arise. As a result, on one hand, the spoilage is
`minimiZed, and on the other hand, the dimensional stability
`of the lens 16 favorably affects both the optical character
`istics of the lens 16 and the reproducibility of the ?nal
`position of the lens 16 in the housing 3, 3‘.
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`55
`
`60
`
`65
`
`8
`A modi?cation of the optoelectronic component illus
`trated in FIG. 2C is shoWn in FIG. 5. The component in FIG.
`5 differs from that in FIG. 2C essentially in having a ball lens
`16‘ of diameter R instead of the plane-convex lens 16.
`The component illustrated in FIG. 5 is produced by a
`method analogous to the steps represented in FIG. 2A to
`FIG. 2C. The self-centering of the ball lens 16 during
`placement onto the housing 3‘ is effectuated by its surface
`curvature. During placement of the lens 16‘, the ball portion
`31 that protrudes into the recess 4 comes into contact With
`the casting compound 14. By selecting the ?ll level and/or
`the radius R of the lens 16‘ appropriately, a precise corre
`lation can be achieved betWeen the course of the surface of
`the ball portion 31 in its inserted state and the conveX course
`of the casting compound surface 15. In this case, in essence
`no casting compound is displaced during placement of the
`lens 16‘. An additional advantage of the rounded ball portion
`31 is that it guarantees that air bubbles cannot remain
`betWeen the casting compound surface 15 and the lens 16‘ in
`the assembly process.
`FIG. 6 shoWs a plan vieW of the component illustrated in
`FIG. 5 With ball lens 16‘. This FIG. 6 shoWs that radial ridges
`are fashioned on the oblique inner Wall surfaces 13 of the
`recess 4, Which serve as seating surfaces for the ball lens 16‘.
`On one hand, the radial ridges 32 bring about a de?nite
`and stable three-point seating of the ball lens 16‘, Which
`further enhances the reproducibility of the installation posi
`tion of the ball lens 16‘ relative to the housing 3‘. On the
`other hand, the radial ridges 32 create an annulus type free
`area betWeen the inner surface 13 of the recess 4 and the ball
`portion 31, Which area can serve as an accepting volume for
`displaced casting compound 14 so that the casting com
`pound 14 can be prevented from over?oWing the edge of the
`recess even in case of a marked displacement of casting
`compound 14.
`Radial ridges 32 or similar seating elements can also be
`provided given other lens shapes, and particularly given the
`plane-convex lens 16 used in accordance With FIG. 2C.
`FIG. 7 details a second embodiment of the inventive
`present method. The main difference betWeen the tWo
`embodiments is that in the second embodiment the optical
`device is attached to the component housing 3 in a casting
`process.
`Housings 3 that have been provided With an optical
`semiconductor chip 11 (see FIG. 1) are fed on a ?rst strip 33
`to a casting station 34, in Which the recess 4 of the compo
`nent housing 3