460 Antlers Drive / Rochester, New York 14618
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`585-802-1532(M) / 585-256-1336(H) / mguidash@rmguidash-consulting.com
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`R. Michael Guidash
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`Brief Biography: Mr. Guidash received a BS in Electrical Engineering from the University of
`Delaware in 1981, and an MS in Electrical Engineering from Rochester Institute of Technology in 1991.
`Michael joined Kodak in 1981 as a Product Engineer for Photometer ASIC’s for Kodak film cameras. In
`1986, he transferred to the Kodak Research Laboratories and CCD wafer fabrication facility. From 1986 –
`1989, he developed 2um and 1um CMOS processes, and a 30V 4um BiCMOS process. These processes
`were used for gate arrays for many Kodak products, and output drivers for all of Kodak’s copiers. From
`1989 – 1996, Mr. Guidash managed the Smart Sensor Group which developed BiCMOS-CCD processes to
`provide fully integrated CCD systems on a chip. From 1993 – 1996, he also served as product engineer and
`yield enhancement engineer for Kodak’s high volume CCD’s. In 1996 Michael started the CMOS image
`sensor program at Kodak. From 1996 to 2009, he managed the R&D and product development of CMOS
`Image Sensor program. Kodak closed the CMOS Image Sensor business in August of 2009. From August
`of 2009 through April of 2012, Mr. Guidash worked as intellectual property technologist and coordinator.
`This included managing remaining image sensor patent applications and office actions, managing broad
`electronic components patent applications and office actions, and technical support for IP sales and licensing
`teams. Mr. Guidash left Kodak in May of 2012 is to start a technology consulting company in the field of
`CMOS Image Sensors. He has authored or co-authored 14 papers in the fields of integrated circuits and
`image sensors. He has 64 issued and >20 pending patents in the field of Image Sensors.
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`Career Highlights:
` Chief Technologist and Innovator: Initiated and led development efforts in CIS at Kodak in pixel and
`process design. Inventor of many key patents in the field of CMOS Image sensors including Pinned
`Photodiode Pixels, Camera-on-a-Chip architecture, and shared amplifier pixel architectures. Continued
`to innovate and invent to drive CIS cost reduction, features and performance. Applies strategic thinking
`to align business goals with short and long term technology and product development plans. Known as
`a creative thinker and innovator, providing vision and leadership to bring ideas and concepts to the
`marketplace.
` Technology Development Management: Provided vision, roadmap and direction for a broad set of
`elements in circuit design, pixel architecture, process integration, and sensor/camera systems. Possesses
`technical and interpersonal skills to assemble, manage and motivate diverse cross-functional teams, that
`efficiently and successfully deliver to schedule.
` Product Development: Provided technical voice to market attack and business plans. Guided ideas and
`concepts from invention phase through R&D and through commercialization.
` Technical Due Diligence: Provided technical guidance and analysis for development partner selection,
`technology and resource acquisitions, and litigations.
` Partner Management: Negotiated, coordinated and directed 3rd party technology providers and external
`development partners, including foundries. Directed integration of CIS processes into 6 foundries.
` Technical Skills: CCD and CIS operation, design, device integration and fabrication technologies.
`Image sensor and integrated circuit yield enhancement; Tiger team management of complex crises. A
`rigorous and methodical problem solver, capable of efficiently finding root causes of, and solutions for
`complex multi-variable crises and problems.
` Patents & Publications: 65 issued US patents; >20 patents pending; 14 publications.
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`Professional Experience:
`R.M. Guidash Consulting LLC: President UU, (May 2012 - Present)
`Technical consulting services for CMOS Image Sensors:
` Broad technology consulitng services for CMOS image sensors: Process, pixels, circuits, sensor
`architectures and systems. General and customized tutorials and advisement. Short and long term
`projects and problem solving.
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`Kyocera Ex. 1010
`p. 1
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`R. Michael Guidash
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`Eastman Kodak: Scientist and IP Specialist; Office of the CTO UU, (2010 - April 2012)
`Post closure of Kodak CIS Business - Patent generation; patent app. management; technical support for
`patent attorneys; technical support for IP sales and licensing teams.
` Continued patent generation for digital capture; technical support for pending patent applications;
`technical support for IP sales & licensing teams; Key member of team that sold CIS patents.
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`page 2
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`Eastman Kodak: Chief Technologist & Manager – CIS R&D; Image Sensor Division UU, (2001 - 2009)
`Managed group of 25 people in R&D of CIS technology elements, including pixel and process development,
`chip level architectures, analog readout architectures, and module/camera systems.
` Developed/demonstrated new technologies including Kodak panchromatic CFA patterns and processing,
`pMOS hole detector pixel, and low read noise analog circuits.
` Led team to file over 100 patent applications. Filed patents on and led development of novel BSI CIS
`architecture, (US application #20080083939). This led to demonstration of very high performance, low
`dark current BSI prototype sensors with pixel sizes ranging from 0.9um to 5.0um.
`Initiated and led a cross-functional camera R&D team directed at CIS and other Kodak technologies for
`novel co-optimized cameras and camera sub-systems.
` Provided technical guidance and analysis for selection and initiation of foundry and R&D partners.
` Managed directed technical interface with external partners in design, process and pixel development
`(IBM, TSMC, and others).
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`Eastman Kodak: Chief Technologist & Mgr. - CIS R&D/Prod. Dev; Image Sensor Division,(’95 - ‘01)
`Managed and directed group of 10-15 people in all elements of CIS R&D and product development.
` Pioneered and championed CIS initiatives at Kodak.
`
`Inventor and co-inventor of many key patents in the field of CMOS Image sensors including Pinned
`Photodiode Pixels, Camera-on-a-Chip architecture, and shared amplifier pixel architectures.
` Led the development teams to key achievements; World’s 1st pinned photodiode CIS, Megapixel CIS
`device, and Shared amplifier CIS pixel product.
` Led transfer of world’s first ½” optical format 1.3 megapixel sensor into mass production, providing
`successful delivery to several compact digital camera products.
` Managed and directed technical interface with external partners in design, process and pixel
`development, (JPL, Photobit, Motorola, Intel, Tower Semiconductor).
`Initiated and directed a cross-functional team including resources from Motorola and other Kodak
`organizations to develop a small, low cost image module for cell phone applications. This effort won
`the 1997 Team Achievement Award at Kodak through development of a CIS cell phone module.
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`
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`Eastman Kodak: Development Engineer – Smart Sensors; Image Sensor Division,(1989 – 1995)
` Led product delivery and technology development of all ASIC and smart sensor products. Performed all
`device modeling, device and process integration.
` Developed and demonstrated Interline CCD integrated with 2um CMOS on the same chip
` Led team to design and demonstrate world’s 1st pinned PD Active Pixel CMOS Sensor, and linear CCD
`image sensor with on-chip timing and control.
` Led/coordinated world’s 1st commercial megapixel CCD yield enhancement team at commercialization
`ramp up of DC40 digital camera. Brought yield from 0% to 60% in ~3 months assisting on-time launch
`of DC40 camera.
` Led/coordinated CCD yield enhancement team at commercialization ramp up of world’s 1st USB
`peripheral, Kodak TCAM1. Brought yield from 0% to 50% in ~3 months.
` Led & directed CCD dark current and point defect reduction team.
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`Kyocera Ex. 1010
`p. 2
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`page 3
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`R. Michael Guidash
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`Eastman Kodak: Product Engineer; Integrated Circuits Fabrication, Elmgrove Plant, (1984 – 1988)
`Product Engineer for all Kodak Copier Output Driver IC’s, DISC camera IC’s, and Instant Camera IC’s.
`Delivering ~6M devices per year. Responsible for all aspects of IC test, delivery, yield and cost.
` Developed software for device and statistical yield modeling
` Led and delivered on development of Smart Integrated Chemically Sensitive Field Effect Transistors for
`Kodak Harrow.
` Awarded Special Opportunity Graduate Program to get MSEE degree. (RIT)
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`Eastman Kodak: Product Engineer; Integrated Circuits Fabrication, Elmgrove Plant, (1981 -1983)
` Product Engineer for all Kodak Instant Camera IC’s: brought yield of 5 new devices from 0% to 45% in
`~4 months. Reached final yields of ~85%. Responsible for all aspects of IC test, packaging, delivery,
`customer interface and failure analysis, yield and cost.
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`Education:
` M.S. (Electrical Engineering), Rochester Institute of Technology, 1991
` B.S. (Electrical Engineering), University of Delaware, 1981
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`Publications and Presentations:
`L. D’Luna, W. Cook, M, Guidash, G. Brown, T. Tredwell, J. Fischer, T. Tarn; “An 8x8 discrete
`cosine transform chip with pixel rate clocks” IEEE ASIC Seminar; Sept. 1990
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`G. Ting, R.M. Guidash, P. Lee, C. Anagnostopoulos; “A Low Cost Smart-Power BiCMOS Driver
`Chip for Medium Power Applications”; IEEE ASIC Conference Proceedings; p. 466-469 [1994]
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`L. D’Luna, K. Parulski, D. Maslyn, M. Hadley, T. Kenney, R. Hibbard, M. Guidash, P. Lee, C.
`Anagnostopoulos; “A digital video signal post-processor for color image sensors”; IEEE ASIC
`Conference [1994]
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`P. Lee, R. Gee, M. Guidash, T. Lee, E. Fossum; “An active pixel sensor fabricated using
`CMOS/CCD process technology; 1995 IEEE Workshop on CCD’s and Advanced Image Sensors.
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`M. Guidash, P. Lee, J. Andrus, A. Ciccarelli, H. Erhardt, J. Fischer, E. Meizenzahl; “A modular,
`high performance, 2um CCD-BiCMOS process technology for application-specific image sensors
`and image sensor systems on a chip; Proc. SPIE Vol. 2415, p. 256-264, April 1995
`
`M. Guidash, P. Lee, J. Andrus, A. Ciccarelli, H. Erhardt, J. Fischer, E. Meizenzahl; “A modular,
`high performance, 2um CCD-BiCMOS process technology for application-specific image sensors
`and image sensor systems on a chip; CCD & Advanced Image Sensor Workshop, 1995
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`M. Guidash, T. Lee, P. Lee, et. al., “A 0.6um CMOS pinned photodiode color imager technology”;
`IEDM Tech. Digest 1997 p. 927-929
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`M. Guidash, K. Parulski, “Digital Capture – not all pixels are created equal”, Industrial and Applied
`Physics Symposium, Rochester NY, October 2001
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`M. Guidash, et. Al., “A High-Performance, 6 m 1.3 Megapixel, Pinned Photodiode CMOS Image
`Sensor”; SPIE Opto Northeast Conference; September 2001
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`Kyocera Ex. 1010
`p. 3
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`page 4
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`R. Michael Guidash
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`Publications and Presentations (continued):
`M. Guidash, M. Mattern; “High-performance CMOS image sensor design, a combination of
`disciplines”, New York Microelectronics Design Conference, Rochester NY, Sept 2003
`
`J. Zhang, S. Cooper, A. LaPietra, M. Mattern, M. Guidash, E. Friedman; “A low power thyristor-
`based CMOS programmable delay element. ISCAS (1) 2004; p. 769-772
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`D. McGrath, H. Fujita, M. Guidash, T. Kenney & W. Xu; “Shared pixels for CMOS imaging
`arrays”, CCD & Advanced Image Sensor Workshop, Kurizawa, Japan, 2005
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`F. Chu, M. Guidash, J. Compton, S. Coppola, W. Hintz; “Improving low-light CMOS performance
`with four-transistor four-shared architecture and charge domain binning; SPIE proceedings Vol
`6069; pp. 25-33; 2006
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`R. Daniel McGrath, John T. Compton, R. Michael Guidash, Edward T. Nelson, Christopher Parks,
`Joseph R. Summa, “A 1.4 um pixel front-side-illuminated image sensor for mobile phones”, IEEE
`Advanced Image Sensor Workshop, Trondheim Norway, June 2009
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`
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`US Patents: (66 issued; > 20 pending)
`8,339,494 8,253,214 8,194,178 8,178,938 8,164,682 8,158,453 8,101,450
`8,076,749 8,049,256 8,018,016 7,973,876 7,969,469 7,859,581 7,858,915
`7,830,435
` 7,705,900 7,675,097 7,674,648 7,443,431 7,361,877 7,342,213
`7,238,926 7,092,017 6,730,899 6,730,897 6,721,008 6,714,239 6,710,804
`6,680,498 6,657,665 6,624,850 6,587,146 6,552,323 6,504,195 6,486,504
`6,466,266 6,423,994 6,365,926 6,352,869 6,323,476 6,307,195 6,297,070
`6,259,124 6,218,692 6,218,656 6,184,928 6,160,281 6,127,697 6,107,655
`6,100,556 6,100,551 6,069,377 6,051,447 6,027,955 5,986,257
` 5,949,061
`5,904,493 5,903,021 5,881,184 5,872,371 5,841,159 5,625,210 5,621,230
`5,591,997 5,387,536 5,338,946
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`Kyocera Ex. 1010
`p. 4
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