`
`page 1
`
`Submission
`
`4. Scope statement – ‘To define standardized modifications to the 802.11 MAC and PHY layers that achieve a minimum increase
`
`throughput for current applications and to enable new applications and market segments’ - was developed for the PAR
`5. Purpose statement developed – ‘To improve the 802.11 wireless LAN user experience by providing significantly higher
`
`6. Jon’s meeting Doc. is 11-02/532r0
`
`Attendance List:
`
`
`
`of at least xxx in throughput as measured at the MAC data SAP’ - was developed for the PAR
`
`through 13, 2002.
`Minutes of the High Throughput Study Group meetings held during the IEEE 802.11/15 Interim meeting in Monterey from Sept 09
`
`
`
`Executive Summary:
`
`
`
`1. Inaugural meeting of the High Throughput Study Group was held on Wednesday 9-11-02, 3:30 to 5:30 PM; attendance was
`
`3. Straw polls indicated that the scope should include:
`2. Garth Hillman was affirmed as secretary.
`excellent (>100) indicating high interest
`
`b. Throughput improvement expected should be quantified
`a. Enhancements to both existing and planned 802.11 extensions
`
`Abstract
`
`5204 East Ben White Blvd, Austin, TX 78741
`
`Advanced Micro Devices
`
`Garth Hillman
`
`e-Mail: garth.hillman@amd.com
`
`Fax: (512) 602-5051
`Phone: (512) 602-7869
`
`Mail Stop - PCS4
`
`Author:
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`doc.: IEEE 802.11-02/607r0
`
`
`
`September 2002
`
`September 11,13, 2002
`
`Date:
`
`Minutes of High Throughput Study Group Meetings
`
`Wireless LANs
` IEEE P802.11
`
`HUAWEI EXHIBIT 1005
`HUAWEI VS. SPH
`
`000001
`
`
`
`Garth Hillman, AMD
`
`page 2
`
`Submission
`
`mgahler@nextcomm.com
`weishifeng@yahoo.com
`pkelly@bandspeed.com
`cfarlow@calamp.com
`Lars.p.falk@telia.se
`Christoph.euscher@siemens.com
`verceg@zyraywireless.com
`dengwer@nortelnetworks.com
`notaraje@attli.com
`pedwards@bermai.com
`Jon.edney@qosine.co.uk
`petere@cisco.com
`Donald.Eastlake@motorola.com
`Eryk.dutkiewicz@motorola.com
`gdooley@intersil.com
`dahl@agere.com
`scrowley@attglobal.net
`coffey@ti.com
`Terry.cole@amd.com
`Aik.chindapol@icm.siemens.com
`pcarson@tdktca.com
`Kiran.challapali@philips.com
`Alistair.buttar@motorola.com
`janboer@agere.com
`Simon.black@qosine.co.uk
`tomerb@metalink.co.il
`dsbaum@nan.ee.ethz.ch
`Farooq.bari@attws.com
`Boyd.r.bangerter@intel.com
`Rashmi.bajaj@rd.francetelecom.com
`David.bagby@ieee.org
`audeh@trpz.com
`Takashi.aramaki@yrp.mci.mei.co.jp
`aramaki@research.panasonic.com
`aokihid@nttdocomo.co.jp
`candren@intersil.com
`akahane@wcs.sony.co.jp
`jyahn@etri.re.ky
`Tomo.adachi@toshiba.co..jp
`
`Email Address
`
`
`
`NextComm
`Marvell Semiconductor
`Bandspeed
`California Amplifier
`Telia
`Siemens
`Zyray Wireless
`Telia
`Communication Solution
`Bermai
`Qosine
`CISCO
`Motorola
`Motorola
`Intersil
`Agere Systems
`NTT DoCoMo
`TI
`AMD
`Siemens
`TDK
`Philips
`Motorola
`Agere
`Qosine
`Metalink
`ETH Zurich
`AT&T Wireless
`Intel
`France Telecom R&D
`Calypso Consulting
`Trapeze Networks
`Panasonic
`Panasonic
`NTT DoCoMo
`Intersil
`Sony
`ETRI
`Toshiba
`
`Affiliation
`
`
`
`Marcus Gahler
`Weishi Feng
`Pat Kelly
`Chuck Farlow
`Lars Falk
`Christoph Euscher
`Vinko Erceg
`Darwin Engwer
`Nataraj Ekombeuem
`Paul Edwards
`Jon Edney
`Peter Ecclesine
`Donald Eastlake
`Eryk Dutkiewicz
`Jerry Dooley
`Peter Dahl
`Steve Crowley
`Sean Coffey
`Terry Cole
`Aik Chindapol
`Pat Carson
`Kiran Challapali
`Alistair Buttar
`Jan Boer
`Simon Black
`Tomer Bentzion
`Daniel Baum
`Farooq Bari
`Boyd Bangerter
`Rashmi Bajaj
`David Bagby
`Malik Audeh
`Takashi Aramaki
`Mishimasa Aramaki
`Hidenori Aoki
`Carl Andren
`Masa Akahane
`Jaeyoung Ahn
`Tomoko Adachi
`
`Name
`
`
`
`
`
`doc.: IEEE 802.11-02/607r0
`
`
`
`September 2002
`
`HUAWEI EXHIBIT 1005
`HUAWEI VS. SPH
`
`000002
`
`
`
`Garth Hillman, AMD
`
`page 3
`
`komiyad@research.panasonic.com
`Guenter.kleindl@siemens.com
`eking@rfmd.com
`Pat.Kinney@ieee.org
`joonsuk@broadcom.com
`Dkim1@agere.com
`donq@samsung.com
`macsbug@research.att.com
`Stuart.kerry@philips.com
`pkelly@bandspeed.com
`Mika.kasslin@nokia.com
`murat@cts.com
`bobby@ieee.org
`vkjones@woodsidenet.com
`Jari.jokela@nokia.com
`Walter.Johnson@motorola.com
`Eric.a.Jacobsen@intel.com
`Ishii.yoshikazu@jp.panasonic.com
`yinoue@ansl.ntt.co.jp
`Daichi.Imamura@yrp.mci.mei.co.jp
`hunter@timefactor.com
`hosur@ti.com
`Kieth.holt@intel.com
`Allen.Hollister@plantronics.com
`Emh002@nttdocomo.co.jp
`Jun.hirano@yrp.mci.mei.co.jp
`Chinsz@sj.symbol.com
`Garth.Hillman@amd.com
`Juha.heiskala@nokia.com
`bheile@ieee.org
`Thomas.haslestad@telenor.com
`chansen@broadcom.com
`shalford@intersil.com
`Patrick.green@amd.com
`sgummadi@ti.com
`jimg@engim.com
`ugohda@sharplabs.com
`mgochi@speednet.co.jp
`gilbertj@atheros.com
`vafa@cadence.com
`agarrett@intersil.com
`
`Panasonic
`Siemens
`RF Micro Devices
`Consulting
`Broadcom
`Agere
`Samsung Electronics
`AT&T Labs
`Philips
`Bandspeed
`Nokia
`Ellipsis Digital
`Vivato
`Airgo
`Nokia
`Motorola
`Intel
`Panasonic
`NTT
`Panasonic
`Vetronix
`TI
`Intel
`Plantronics
`Motorola
`Panasonic; Matsushita Communication
`Symbol Technologies
`AMD
`Nokia
`Appairent
`Telenor
`Broadcom
`Intersil
`AMD
`TI
`Engim Canada Inc.
`Sharp Labs of America
`SpeedNet Inc.
`Atheros
`Cadence Design
`Intersil
`
`Submission
`
`Daisaku Komiya
`Gunter Kleindl
`Eric King
`Pat Kinney
`Joonsuk Kim
`Dukhyun Kim
`Dongkyu Kim
`Byoung-Jo “J” Kim
`Stuart Kerry
`Pat Kelly
`Mika Kasslin
`Murat Karsi
`Bobby Jose
`V K Jones
`Jari Jokela
`Walter Johnson
`Eric Jacobsen
`Yoshikazu Ishii
`Yasuhiko Inoue
`Daichi Imamura
`David Hunter
`Srinath Hosur
`Kieth Holt
`Allen Hollister
`Michael Hoghooghi
`Jun Hirano
`Chris Hinsz
`Garth Hillman
`Juha Heiskala
`Bob Heile
`Thomas Haslestad
`Chris Hansen
`Steve Halford
`Patrick Green
`Srikanth Gummadi
`Jim Goodman
`Wataru Gohda
`Motohiro Gochi
`Jeff Gilbert
`Vafa Ghazi
`Al Gerrett
`
`
`
`doc.: IEEE 802.11-02/607r0
`
`
`
`September 2002
`
`HUAWEI EXHIBIT 1005
`HUAWEI VS. SPH
`
`000003
`
`
`
`Garth Hillman, AMD
`
`page 4
`
`pytan@psl.com.sg
`Qvp003@email.mot.com
`Samfer.pareek@intel.com
`eperahia@cisco.com
`Richard.h.paine@boeing.com
`Odagiri634@oki.com
`k.obara@crl.go.jp
`hnomura@speednet.co.jp
`Chiu.ngo@philips.com
`Erwin.noble@philips.com
`Gunnar.nitsche@systemonic.de
`Kevin@proxim.com
`vannee@airgonetworks.com
`sathya@research.panasonic.com
`ravin@marvell.com
`murakami@docomolabs.usa.com
`Mueller@ti.com
`Oliver.muelhens@philips.com
`monteban@agere.com
`pmolnar@rfmd.com
`molisch@merl.com
`Rishi_mohindra@maximhq.com
`david@mitton.com
`mirfakhr@pctel.com
`Klaus.meyer@amd.com
`Mehul.mehla@synad.com
`wjmtampaus@yahoo.com
`Stephen.mccann@roke.co.uk
`sudheermatta@yahoo.com
`Akira.maehi@hal.hitachi.com
`ycmaa@inprocomm.com
`Lombardo@DNPG.com
`Titus.lo@ieee.org
`wllim@psl.com.sg
`jliang@ieee.org
`Uriel.lemberger@intel.com
`djthekid@samsung.co.kr
`clanzl@aware.com
`dlandeta@intersil.com
`joekwak@mindspring.com
`bkraemer@intersil.com
`
`
`
`doc.: IEEE 802.11-02/607r0
`
`
`
`Panasonic
`Motorola
`Intel USA
`Cisco
`Boeing
`OKI Electric
`Siemens
`Speed Net
`Philips
`Philips
`Systemonic
`Proxim
`Airgo Networks
`Panasonic
`Marvell Semiconductor
`DoCoMo USA Labs
`TI
`Philips
`Agere
`RF Micro Devices
`Mitsubishi
`Maxim
`Circular Logic
`PCTel
`AMD
`Synad Technologies
`Fortress Technologies
`Siemens Roke Manor
`Cirrus Logic
`Hitachi America Ltd
`InProComm
`Digital Networks
`NextComm
`Panasonic
`TI
`Intel
`Samsung
`Aware
`Intersil
`Interdigital Comm
`Intersil
`
`Submission
`
`Tan Pek-Yew
`Vijay Patel
`Samfer Pareek
`Eldad Perahia
`Richard Paine
`Hideaki Odagiri
`Kei Obara
`Hiroshi Nomura
`Chiu Ngo
`Erwin Noble
`Gunnar Nitsche
`Kevin Negus
`Richard van Nee
`Sathya Narayenan
`Ravi Narasimhan
`Kaori Murakami
`Joe Mueller
`Oliver Muelhens
`Leo Monteban
`Peter Molnar
`Andy Molisch
`Rishi Mohindra
`Dave Mitton
`Khashayar Mirfakhrael
`Klaus Meyer
`Mehul Mehla
`Bill McIntosh
`Stephen McCann
`Sudheer Matta
`Akira Maeki
`Yeong-chang Maa
`Ralph Lombardo
`Titus Lo
`Lim Wei Liy
`Jie Liang
`Uriel Lemberger
`Dongjun Lee
`Colin Lanzl
`David Landeta
`Joe Kwak
`Bruce Kraemer
`
`September 2002
`
`HUAWEI EXHIBIT 1005
`HUAWEI VS. SPH
`
`000004
`
`
`
`Garth Hillman, AMD
`
`page 5
`
`Richard@ti.com
`Weselch_Michael@edg.mea.com
`mwebster@intersil.com
`Andrew.watts@synad.com
`fwatanabe@ieee.org
`Chris.ware@motorola.com
`bwallace@vixs.com
`Tim_wakeley@hp.com
`toanv@symbol.com
`nancivogtli@pulseeng.com
`madan@athenasemi.com
`Chih.c.tsien@intel.com
`Ernest.tsui@intel.com
`jtomcik@qualcomm.com
`John.terry@nokia.com
`Roger.Teague@synad.com
`Tk.tan@philips.com
`takagi@csl.rdc.toshiba.co.jp
`michaelsu@viatech.com
`Adrian.p.stephens@intel.com
`carlstevenson@agere.com
`yoram@ti.com
`keltypack@networld.com
`dons@cisco.com
`skellern@cisco.com
`shoemake@ti.com
`Erik.schylander@philips.com
`Satou.m@tepco.co.jp
`Ads07416@nitty.com
`Sumeet.sandhu@intel.com
`Ali.s.sadri@intel.com
`jrosdahl@ieee.org
`Dave.ribner@analog.com
`brhyne@rfmd.com
`Tony.reid@nokia.com
`jregnier@tantivy.com
`chakr@pacbell.net
`Ravindra.ranaSinghe@cirrus.com
`Jim.raab@lincom.com
`spp@ti.com
`apetrick@icefyre.com
`
`TI
`Mitsubishi
`Intersil
`Synad Technologies
`DoCoMo USA Labs
`Motorola Labs
`Vixs Systems
`HP
`Symbol Technologies
`Pulse Engineering
`Athena Semiconductor
`Intel
`Intel
`Qualcomm
`Nokia
`Synad Technologies
`Philips
`Toshiba
`Via Technologies
`Intel Corporation
`Agere Systems
`Texas Instruments
`Micro Linear
`Cisco
`CICSO
`Shoemake
`Philips
`Tokyo Electric Power
`MMAC
`Intel
`Intel
`Micro Linear
`Analog Devices
`RF Micro Devices
`Nokia Research Center
`Tantivy
`Communication Solution
`Cirrus Logic
`LinCom Wireless
`TI
`Ice Fyre Semiconductor
`
`Submission
`
`Richard Williams
`Michael Weselch
`Mark Webster
`Andrew Watts
`Fujio Watanabe
`Chris Ware
`Brad Wallace
`Tim Wakeley
`Toan Vu
`Nanci Vogtli
`Madan Venugopal
`Chih Tsien
`Ernest Tsui
`Jim Tomcik
`John Terry
`Roger Teague
`T K Tan
`Masahiro Takagi
`Michael Su
`Adrian Stephens
`Carl R. Stevenson
`Yoram Solomon
`Kevin Smart
`Don Sloan
`David Skellern
`Matthew
`Erik Schylander
`Masatoshi Sato
`Hideaki Sato
`Sumeet Sandhu
`Ali Sadri
`Jon Rosdahl
`Dave Ribner
`Bill Rhyne
`Anthony Reid
`John Regnier
`Chakradher Reddy
`Ravindra RanaSinghe
`Jim Raab
`Steve Pope
`Al Petrick
`
`
`
`doc.: IEEE 802.11-02/607r0
`
`
`
`September 2002
`
`HUAWEI EXHIBIT 1005
`HUAWEI VS. SPH
`
`000005
`
`
`
`Garth Hillman, AMD
`
`page 6
`
`Submission
`
`f. Enhancement (Evolution) or Next Generation (Revolution)?
`e. Strawman Completion date – July 2004 based on an aggressive but POSSIBLE timeline which Jon reviewed
`d. Strawman Title - Enhancements for Higher Effective Throughput
`c. Noted our ONLY two tasks as a study group are to generate a PAR and a Criteria document
`b. Want solutions not just technology when technical presentations are made
`a. Chairman and Secretary are here to facilitate progress towards generating a PAR and Criteria
`
`11. Discussion on this SG activity from the floor:
`10. Why are we here – customers get half of what they pay for; they pay for 11 mbps but get 5.5 mbps
`9. Jon presented two scope statements which he had received over the past week
`
`a. What is scope; need discussion
`
`8. Comments:
`
`7. Jon’s comments
`
`c. Passed unanimously
`b. Second – Bobby Jose
`a. Motion to adopt agenda – Adrian Stephens
`
`6. Agenda was proposed by Jon
`5. Jon reviewed the rules and noted that as a SG non-voting members are allowed to vote
`4. Garth Hillman was affirmed as secretary
`3. Opening Remarks by Jon on participation expectations
`2. Meeting was called to order by Jon at 3:35
`Develop a plan for future SG work
`Discuss/Revise PAR and 5 Criteria
`Set/Review Objectives
`APPROVE/MODIFY AGENDA
`REVIEW IEEE/802 & 802.11 POLICIES and RULES
`Elect/Confirm Secretary
`Meeting Call to Order
`
`heejung@etri.re.kr
`wu@docomolabs.usa.com
`hworstell@att.com
`jkwong@nortelnetworks.com
`
`ETRI
`NTT DoCoMo
`AT&T
`Nortel Networks
`
`Heejung Yu
`Gang Wu
`Harry Worstell
`Jin Kue Wong
`
`
`
`Total – 165 inclusive of both meetings
`
`
`
`:
`Wednesday Sept 11, 3:30-5:30 Inaugural Meeting
`
`1. Jon Rosdahl strawman (doc. 11-02- 532r0) agenda for the week was:
`
`
`
`doc.: IEEE 802.11-02/607r0
`
`
`
`September 2002
`
`HUAWEI EXHIBIT 1005
`HUAWEI VS. SPH
`
`000006
`
`
`
`Garth Hillman, AMD
`
`page 7
`
`Submission
`
`p. Why is existing performance is what it is; we need to clearly understand this before making new proposals; i.e., define
`o. Scope – don’t be too narrow just to avoid conflicting with existing and developing standards
`n. On the other hand Burst ACK – would be good for ALL PHYs
`m. Does not have to apply to 2.4 AND 5 GHz; example – FEC at 5 GHz only
`l. Enhancing existing MAC and PHY layers OK but which layers?
`k. Coupling of MAC/PHY needs to be a major part of this activity
`j. Backward compatibility (a?, b/g?) requirement needs to be reflected
`i. Quantitative SCOPE not qualitative
`h. Higher Data Rate is subset of Higher Throughput
`g. Scope – closely coupled MAC and PHY to get optimal solution
`f. Try not to be too abstract in scope statement; don’t get too broad
`e. Keep options open to include things that might not be immediate; i.e. revolutionary
`d. Enhancements that can be achieved in 18 months
`c. High Throughput versus Higher data rates but would include higher data rates per se
`b. Q - Evolution or revolution? A – do evolutionary enhancements now, new standard in another TG
`a. Agnostic to changes to MAC or PHY layers
`
`w. Higher layer protocols (e.g., TCP) can have a significant effect on system throughput
`v. RRM is discovering that the traditional layer 1 and 2 (MAC/PHY) scope of 802.11 is limiting
`u. Upper layer stack coupling to MAC is just as important as MAC/PHY coupling
`t. Backward compatibility should not limit us and is not mandatory; i.e., revolutionary
`s. Define “Throughput” then we can define what we want to achieve
`r. Coupling – MAC and PHY are viewed as decoupled today; should they be?
`q. Timing – make it worth our while; don’t think too small just to get done quickly
`
`the problem
`
`f. Straw Poll – Should enhancement of 802.11a throughput be included? (96,0,4)
`e. Straw Poll – Should enhancement of 802.11b throughput be included? (34 for,23 against,27 abstain) -> (34,23,27)
`d. Higher throughput and data rate for OFDM modulations only?
`c. What is history of proposed scope statement
`b. What is meant by and not meant by the proposed scope statement
`a. Does everyone understand “Throughput” – (majority, 0, <10)
`
`17. Discussion specifically on scope
`16. Jon – proposed a strawman scope
`15. Jon – “If we answer what we hope to accomplish we will be led to a scope statement”
`14. Jon – “If we answer why we are here we will be led to a purpose statement”
`13. Jon listed the Criteria as they exist today
`12. How to capture these ideas and use them? What will be our process?
`
`
`
`doc.: IEEE 802.11-02/607r0
`
`
`
`September 2002
`
`HUAWEI EXHIBIT 1005
`HUAWEI VS. SPH
`
`000007
`
`
`
`Garth Hillman, AMD
`
`page 8
`
`Submission
`
`p. New scope statement - To define standardized modifications to the .11 MAC and PHY layers that achieve a minimum
`o. Straw Poll – remove OFDM from Adrian’s scope statement passed (66, 25, 6)
`n. Definition of throughput again?
`m. What are the conditions under which we would measure this throughput – e.g., without sacrificing range etc.
`l. Straw Poll – Should we quantify minimum increase in throughput at SAP interface? (55,29,15)
`
`increase of at least xxx in throughput as measured at the MAC data SAP
`
`18. Recessed until 7 PM Thursday evening
`
`q. Don’t get too broad
`
`data SAP” (67,8,25)
`modifications to the .11 MAC and OFDM PHY layers that achieve an increase in throughput measured at the MAC
`
`k. Straw Poll – replace strawman scope with Adrian’s but with (existing?) removed – “To define standardized
`
`i. Adrian Stephens proposed a new scope statement – “To define standardized modifications to the (existing?) .11 MAC
`
`Management frames such as Beacons)? OR ????
`Rate minus overhead introduced by the MAC (actual header and trailer bits AND back-off idle periods AND
`minus overhead introduced by the MAC (actual header and trailer bits AND back-off idle periods)? Or Air Interface
`
`h. Throughput – data rate as measured at the MAC data SAP (versus the air interface bit rate)? Or Air Interface Rate
`g. Straw Poll – Should enhancement of 802.11g throughput be included? (72,8,14)
`
`and OFDM PHY layers that achieve an increase in throughput measured at the MAC data SAP”
`
`j. Straw poll - Should we consider only existing 802.11 standards (i.e., excluding .11g and .11e) as the baseline from
`
`which this group operates? (6,62,10)
`
`
`
`Existing queue – Jim, Terry
`
`9. Discussion of why (Purpose):
`8. Answer Why first and then What was requested by membership
`7. Answer What and Why before establishing a timeline was requested by membership
`6. Timing – PAR must be delivered 30 days before Plenary session; this will make July 2004 strawman target difficult to achieve
`5. Jon reviewed the Criteria we will need to meet
`4. Jon reviewed current scope statement developed in first meeting
`3. Agenda for the evening - Discuss and revise the PAR and Criteria and establish a process for going forward
`2. Jon recalled that our broad goal is to answer What and Why
`1. Meeting was called to order by Jon at 7:15 PM
`
`b. Good Technology with a Balance of Wow and Value
`a. What usage scenarios are we trying to address
`
`
`
`Thursday 9-12-02 7:00 – 9:30 PM
`
`
`
`
`
`doc.: IEEE 802.11-02/607r0
`
`
`
`September 2002
`
`HUAWEI EXHIBIT 1005
`HUAWEI VS. SPH
`
`000008
`
`
`
`Garth Hillman, AMD
`
`page 9
`
`Submission
`
`g. Evolutionary (shorter time frame) or revolutionary (longer time frame); don’t let timeline drive us down one path or the
`f. Will it be the wired infrastructure that drives us to wireless – natural evolution
`e. Each of three areas have different infrastructures; how do we deal with this
`d. Are we going to try to address everything
`c. Spectrum efficiency improvement implies lower power, higher range
`b. Enhance Range x Throughput product for WLAN applications (versus WPANs)
`a. Extended range conflicts with extended throughput
`
`Improved spectrum efficiency
`Increase the market size via standardized leading edge “wow” solutions
`
`g. High speed applications
`f. Scalable solutions which can take advantage of faster PHYs
`e. Unified MAC+PHY, end-to-end solution
`d. Higher data rates for Corp, > 200 mbps
`
`iii. Corporate LAN Deployment improvement
`ii. Hot Spot deployment (range, # users)
`i. Home (multimedia distribution)
`
`c. Market spaces
`
`iii. File distribution
`ii. Photo
`i. Video
`
`o. Transition technology for current standards to the next generation
`n. Keep bounds on range vs. rate trade-offs
`m. Understand the user’s experiences
`l. Provide Value to the end user
`k. Extended range
`j.
`i.
`h. High speed delivery of advanced services to Handheld devices
`
`10. Comments:
`
`i. Question to be answered at some point - What do you think the right combination of enhancements to MAC/PHY that
`h. Answer – how much weight do you want timeline to have in the time vs. resources equation
`
`k. Let’s be realistic, this will take three years realistically and therefore we need to set the bar high to get the most bang
`
`l. Wireless multimedia in the home.
`
`for our buck
`
`production
`
`j. We don’t want to miss Moore’s law and by not acting proprietary solutions will emerge which will dilute volume
`
`allow for a fast track completion?
`
`other
`
`
`
`doc.: IEEE 802.11-02/607r0
`
`
`
`September 2002
`
`HUAWEI EXHIBIT 1005
`HUAWEI VS. SPH
`
`000009
`
`
`
`Garth Hillman, AMD
`
`page 10
`
`Submission
`
`c. Higher Throughput to improve the End-User experience in Market Spaces including but not limited to (65,1,1):
`b. bits/sec/Hz/user – move these attributes to area 16 (other items) on PAR (majority)
`a. Make our current system better
`
`11. Purpose Summary (Why)
`
`
`
`doc.: IEEE 802.11-02/607r0
`
`
`
`September 2002
`
`3. Corporate LAN Deployment
`2. Hot Spot Deployment
`1. Wireless LANs in the Home
`
`e. Adrian’s strawman – To improve the 802.11 wireless LAN user experience by providing significantly higher
`d. We must include timeline because it is part of the PAR
`
`significantly higher throughput for current applications and to enable new applications and market segments. (39,26,3)
`
`Note: (xx,yy,zz) are the results of straw polls where xx=for, yy=against, and zz=abstain.
`
`
`
`13. Meeting was adjourned at 9:35 PM
`
`a. bits/sec/Hz/user
`12. Area 16 Other Details
`
`f. Replace Adrian’s statement as follows - To improve the 802.11 wireless LAN user experience by providing
`
`throughput for applications including but not limited to those in the Home, Hot-spots and Enterprise Markets. (65,0,8)
`
`HUAWEI EXHIBIT 1005
`HUAWEI VS. SPH
`
`000010
`
`