throbber
...
`
`"n"rr"~<f(~
`
`EXPRESS MAIL LABEL NO. EV 175412039US
`DATE OF DEPOSIT: APRIL 11, 2002
`
`IN THE UNITED STATES PATENT AND TRADEMARK OFFICE
`
`182590
`DLS:cmw 04/ll/03
`~¢.ey's Matter No. 6500-65696
`~= j•~NT
`---~0
`~
`~~c
`2
`
`~
`,
`
`---
`
`!
`
`.
`?>
`"1:1
`. SOX PROVISIONAL PATENT APPLICATION
`COMMISSIONER FOR PATENTS
`WASHINGTON, D.C. 20231
`
`1111111111111111111111111111111111
`24197
`
`PROVISIONAL APPLICATION COVER SHEET
`
`This is a request for filing a PROVISIONAL APPLICATION FOR PATENT under 3 7
`C.F.R. § 1.53(c).
`
`TITLE: LANDING PAD F:OR IMMERSION LITHOGRAPHY
`
`Inventor( s )/Applicant( s):
`
`·'
`I
`
`'r
`
`[gJ
`
`[gJ
`
`[gJ
`
`[gJ
`
`[gJ
`
`[gJ
`
`Belmont, CA
`City, State or Foreign Country and City
`
`City, State or Foreign Country and City
`
`City, State or Foreign Country and City
`
`Binnard
`Last
`
`Michael
`First
`
`Last
`
`Last
`
`First
`
`First
`
`B.
`MI
`
`MI
`
`MI
`
`J pages of specification are enclosed.
`
`1 sheet( s). of drawings are enclosed.
`
`Provisional Filing Fee Amount:
`[gJ
`$160, large entity
`
`A check in the amount of$160.00 to cover the filing fee is enclosed.
`
`The Director is hereby authorized to charge any additional fees which may be required in
`connection with the filing of this provisional application and recording any assignment
`filed herewith, or credit over-payment, to Account No. 02-4550. A copy of" this sheet is
`enclosed.
`
`Please return the enclosed postcard to confirm that the items listed above have been
`received.
`
`TRANSMITTAL Page I of 2
`
`Nikon Exhibit 1019 Page 1
`
`

`

`-~.
`
`- •
`
`·•"••· •• "'
`
`-''
`
`,...,...,_
`
`" -u
`
`....... ~. ~•~"-
`
`·-~::~ -!L:;~ '.H~'~"·!t::!~- TI:::~ :H,,~,;!~:::~ ·H::~~
`
`. ....
`::: ·=JtJ~ u_ .. y .. ~JL -~~;L .. ll.J~ ..,.::~~:
`
`..._
`
`~·-•· .• . . - .
`
`'""
`
`182590
`04/11/03
`DLS:cmw
`Attorney's Matter No. 6500-65696
`PATENT
`
`EXPRESS MAIL LABEL NO. EV175412039US
`DATE OF DEPOSIT: APRIL 11, 2002
`
`[gl
`
`[gl
`
`Address all telephone calls to Donald L. Stephens Jr. at telephone number
`(503) 226-7391.
`
`Address all correspondence to:
`
`KLARQUIST SPARKMAN, LLP
`One World Trade Center, Suite 1600
`. 121 S.W. Salmon Street
`Portland, OR 97204
`
`Respectfully submitted,
`
`KLARQUIST SPARKMAN, LLP
`
`By
`
`Donald L. Stephens Jr.
`Registration No. 34,022
`
`One World Trade Center, Suite 1600
`121 S.W. Salmon Street
`Portland, Oregon 97204
`Telephone: (503) 226-7391
`Facsimile: (503) 228-9446
`
`cc:
`
`Docketing
`
`TRANSMITTAL Page 2 of 2
`
`Nikon Exhibit 1019 Page 2
`
`

`

`Disclosure of Invention
`Page I ·
`'
`
`Disclosure of Invention
`
`........ ~...-.. ....
`. ~~J~ ::~~~~
`
`1. TITLE OF INVENTION:
`
`Landing Pad for Immersion Lithography
`
`2. SUMMARY OF THE INVENTION:
`
`a) Description of invention.
`
`In an immersion lithography system, there is a controlled liquid-filled environment
`between the projection lens and the wafer table. In F2 lithography systems, the space
`between the lens and wafer is filled with a gas such as nitrogen. In both cases, it is
`desirable to keep the conditions of the fluid (liquid or gas) as constant as possible.
`
`Prior disclosures contemplate a wafer table with a flat upper surface to maintain a
`constant volume for the fluid-filled space. This invention extends this concept one step
`further by providing a "landing pad" that is also coplanar with the wafer surface that can
`be positioned under the lens when the wafer table moves away from the lens.
`
`This disclosure describes three embodiments for the landing pad:
`1. big wafer table
`landing pad on coarse stage (most appropriate for circulating table)
`2.
`3. separate landing pad stage (most appropriate for single-stage machine)
`4. detachable landing pad on wafer table
`
`Embodiment 1 provides a larger wafer table with a continuous flat upper surface. The
`wafer table is large enough that during all of the loading, unloading, alignment and other
`operations, there is always part of the wafer table under the lens, and the fluid volume is
`kept constant. This embodiment is not preferred, because it requires a large wafer table
`which increases the size, mass, and difficulty of control for the machine.
`
`Embodiment 2 provides a landing pad surface on the coarse stage which is coplanar with
`the nominal position of the wafer surface. Before the wafer table is moved out from
`under the projection lens, the wafer table vertical position and tilt is adjusted so the wafer
`surface is coplanar with the landing pad. Then the stage moves to position the landing
`pad under the lens. In this position the wafer can be loaded, unloaded, or aligned. In a
`circulating table system, the wafer table can be loaded and unloaded while the lens is
`positioned over the coarse stage landing pad.
`
`Nikon Exhibit 1019 Page 3
`
`

`

`Disclosure of l~vention
`Page 2·
`
`In embodiment 3, the landing pad is on a separate stage that can be positioned adjacent to
`the wafer table, and moved synchronously with it until the landing pad is under the lens.
`At this time, the landing pad stage is held in place (either mechanically or by servo
`control), and the coarse stage is free to move away from the lens. This embodiment is
`preferred for a single-body system because the wafer stage can move over the entire
`alignment area while the landing pad stage is parked under the lens.
`
`For any of the 3 embodiments, it is preferable to have the landing pad located on a side of
`the wafer table that does not have an interferometer mirror. This arrangement avoids any
`interference with the interferometer operation.
`
`It is also possible to have the landing pad on a side with an interferometer mirror. In this
`case, there are two options. One is to allow the landing pad to block the interferometer
`beam, and to use another sensor to control the wafer stage during this time. The second
`option is to provide some holes in the landing pad structure that allow the interferometer
`beams to reach the mirror on the wafer table.
`
`For embodiments 2 and 3 some method, such as a controlled air pressure, is required to
`prevent fluid from spilling into the space between the landing pad and the wafer table.
`Embodiment 4 has a landing pad mounted on the wafer table that can be positioned under
`the lens. When the landing pad is under the lens, a mechanism on the lens body can grab
`the landing pad and hold it in place. The landing pad is released from the wafer table,
`and the table is free to move away from the lens. An advantage of this embodiment is
`that there is no gap between the ·wafer table and the landing pad.
`
`b) Purpose of the invention:
`
`This invention provides a method to keep the immersion liquid present under the
`projection lens at all times, thereby avoiding problems associated with filling and
`draining the liquid.
`
`c) Advantages of this invention:
`
`This inven~ion allows maintaining a constant fluid environment under the lens.
`
`It improves throughput by eliminating the time required to remove and refiH the
`immersion liquid.
`
`It prevents any disturbance to the immersion liquid or the projection lens by maintaining a
`constant volume of fluid at all times.
`
`Nikon Exhibit 1019 Page 4
`
`

`

`Disclosu~;"e of Invention
`Page3
`
`e) Disadvantages of prior art:
`
`Using a standard-size wafer table in an immersion lithography system requires removing
`and replacing the fluid under the projection lens once per wafer, because when the wafer
`is being aligned or when wafers are being loaded and unloaded, the table is not
`underneath the projection lens. Removing and replacing the fluid may cause deleterious
`effects on the lens or wafer table (e.g., from changes in pressure, temperature, or purity of
`the fluid) and decreases the throughput of the lithography machine (because it takes time
`to remove and replace the fluid).
`
`f) Novel features of this invention:
`
`This invention can be used in any system where a controlled environment exists between
`the wafer table and the projection lens, including liquid immersion, F2 lithography, or a
`system with a localized vacuum under the lens.
`
`This invention can be applied to a single-body or a circulating table type system.
`
`Nikon Exhibit 1019 Page 5
`
`

`

`(~ g:ald L. Stephens, Jr.
`Ex Ref. No. 6501l-65696
`
`~::::::~.:.';;';"AD";;~''~""'"'
`
`- - - - -
`..
`
`.~.--.-~·.·
`
`fj; ,,, .;;;;~;;.
`1
`
`Date of r(s): Binnard
`Deposit: 4111/03
`
`IMMERSION LITHOG
`RAPHY
`
`i
`
`- - - - - - _//
`
`::DA ::. Tt--4-ru-f~s o~·er­
`f'.A.S r r-o r
`
`VJ.;5 e5 + "b\0-._ \ ':>
`~''-'"'(=-
`Y"';>,- o+ r rlr 1 s
`
`..--
`
`€J'-."'~~ ""'- -r\AS
`'o~ :'\
`\)/'--~{?.5 ~ \~ .. ~
`
`Nikon Exhibit 1019 Page 6
`
`

`

`
`Donald L. Slcphens, Jr.
`Ochf No 6500-65695
`1.‘ :h
`
`ExpmssMailLabelNoEV1'35412039US “"‘
`'
`‘
`
`Fan LANDING PAD FOR [MMERSION LITHOGRAP
`Invenmfls): Blnnan!
`Data ofDcpusil. 4/] [10}
`
`~~s,i-6~~
`befwe-eJ--(cid:173)
`3mg \L S‘ayp bej‘mkeefi
`\~A\::1 '? dd
`
`Jada ”ads WAVE: P 3d
`
`
`Ce?Y~rL e;\-~.e_
`t-(\c\
`\u_,l.Z::!
`\~ \}~~ fN).JPc)~ol\.. \e."-.S..
`\)07&"" ~i> r
`'\-al.ok C:o.l'-.
`\/0'11..-'i"-<-r
`~e. ~+&\ e>;~te,6 "'
`
`8
`
`-
`
`Nikon
`
`Exhibit1019 Page7
`
`Nikon Exhibit 1019 Page 7
`
`

`

`
`Domld L. Stephens, Jr.
`Om Ref. No, 6500-63196
`
`Expms Mail Label No. EV] 75412039115
`‘
`For: LANDING PAD FOR [MMERSION LITHOGRAPHY
`;
`[mama-(s): Binnard
`s
`Date or Depnsil' 4/1 1/03
`
`
`
`
`
`v.3 gar
`
`%¥\€’
`
`“‘9'
`
`' @
`
`\-, •• ~:-~ t'l'~
`S<q>b' 0<:
`\.)..) ~5
`\J2>\....PJ ... -
`
`\ b-?
`
`
`
`~'l'.g_e.. fV\b~ ur~~e.r
`~+--b~ ..e_ " - if\At> ~-~ ?tt...u'Qi
`
`Nikon
`
`Exhibit1019 Page8
`
`Nikon Exhibit 1019 Page 8
`
`

`

`--------
`
`,
`\
`-~
`
`Donald L. Stephens, Jr.
`Our Ref. No. 6500-65696
`Express Mail Label No. EVJ75412039US
`For: LANDING PAD FOR IMMERSION LITHOGRAPHY
`Inventor(s): Binnard
`Date of Deposit: 4/11/03
`
`-w-~ •. li ·n
`··-·- .. , ....
`
`J lN~ -\a.lo{e.,
`
`\J UU/JA c\~p
`tor \.{va.~j p ~<l
`
`I
`
`-
`
`-
`
`- - - - -
`
`- - -
`
`Nikon Exhibit 1019 Page 9
`
`

This document is available on Docket Alarm but you must sign up to view it.


Or .

Accessing this document will incur an additional charge of $.

After purchase, you can access this document again without charge.

Accept $ Charge
throbber

Still Working On It

This document is taking longer than usual to download. This can happen if we need to contact the court directly to obtain the document and their servers are running slowly.

Give it another minute or two to complete, and then try the refresh button.

throbber

A few More Minutes ... Still Working

It can take up to 5 minutes for us to download a document if the court servers are running slowly.

Thank you for your continued patience.

This document could not be displayed.

We could not find this document within its docket. Please go back to the docket page and check the link. If that does not work, go back to the docket and refresh it to pull the newest information.

Your account does not support viewing this document.

You need a Paid Account to view this document. Click here to change your account type.

Your account does not support viewing this document.

Set your membership status to view this document.

With a Docket Alarm membership, you'll get a whole lot more, including:

  • Up-to-date information for this case.
  • Email alerts whenever there is an update.
  • Full text search for other cases.
  • Get email alerts whenever a new case matches your search.

Become a Member

One Moment Please

The filing “” is large (MB) and is being downloaded.

Please refresh this page in a few minutes to see if the filing has been downloaded. The filing will also be emailed to you when the download completes.

Your document is on its way!

If you do not receive the document in five minutes, contact support at support@docketalarm.com.

Sealed Document

We are unable to display this document, it may be under a court ordered seal.

If you have proper credentials to access the file, you may proceed directly to the court's system using your government issued username and password.


Access Government Site

We are redirecting you
to a mobile optimized page.





Document Unreadable or Corrupt

Refresh this Document
Go to the Docket

We are unable to display this document.

Refresh this Document
Go to the Docket