`
`SUMMARY
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`
`Microsystems Engineering, College of Engineering
`Rochester Institute of Technology
`168 Lomb Memorial Dr., Rochester, NY 14623
`(585) 475-2058 bwsemc@rit.edu
`
`Bruce Smith has over 30 years of research, academic, industry, and consulting engineering experience in integrated circuit
`processing, microelectronics, microlithography, and imaging systems. He is a professor of Microelectronic Engineering and
`the Director of the Ph.D. program in Microsystems Engineering at the Rochester Institute of Technology. His industry
`experience includes manufacturing and R&D and he has worked with companies in the US, Europe, and Asia. Professor
`Smith is a Fellow of the OSA, a Fellow of SPIE, a Senior Member of IEEE, and a member of AVS, ASEE, and SID. He is
`the recipient of RIT’s Trustees Scholarship Award, a SPIE Research Mentoring Award, RIT’s Creators Award, and the Rush
`Henrietta Outstanding Alumni Award, among others, and has been inducted into RIT’s Innovator Hall of Fame. Professor
`Smith has over 150 publications including technical papers, articles, textbooks, and textbook chapters. He holds 25 patents
`and has licensed his technology both nationally and internationally.
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`PROFESSIONAL EXPERIENCE
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`EDUCATION
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`Rochester Institute of Technology, Professor, Kate Gleason College of Engineering, 1988-present
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`Director, Microsystems Engineering Ph.D. Program, 2008-present
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`Intel Professor of Research and Technology, 2000-2007
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`Associate Dean of Graduate Programs, Kate Gleason College of Engineering, 2001-2004
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`Director, Center for Nanolithography Research, 2004-present
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`Professor, Microelectronic Engineering Department, 1988-2008
`IMEC at University of Leuven, Belgium, Visiting Professor, 2008
`Lithographic Technology Corp / Amphibian Systems, President, 1998-present
`IMEC at University of Leuven, Belgium, Visiting Professor, 2001
`International SEMATECH, Austin Texas, Visiting Scholar, 1997
`Rutherford Appleton Laboratories, Oxford, U.K., Visiting Scientist, 1995
`Digital Equipment Corp., Hudson, Mass., Advanced Development Center, 1986-1988
`Gould AMI Semiconductor, Santa Clara, Calif., Process Development Group, 1983-1986
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`B.S., M.S. Rochester Institute of Technology, Photographic and Imaging Science.
`Ph.D., Rochester Institute of Technology, Imaging Science.
`
`
`LITIGATION SUPPORT EXPERIENCE
`
`
`
`Date:
`2013-
`Ropes and Gray LLP
`
`Case:
`Spansion LLC v. Macronix America Co., Ltd. et al
`ITC patent infringement case – Testifying Expert
`Project:
`Flash memory chip method and processes
`Field:
`
`
`2013 –
`McKenna Long & Aldridge LLP
`Case:
`Eidos Display, LLC v. AU Optronics Corp. et al (AU, Chi Mei Innolux, Chunghwa,
`Hannstar, and Hannspree)
`
`Patent Infringement (USDC, E. Texas) – Testifying Expert
`Project:
`This film transistor (TFT) processing for LCDs
`Field:
`
`Mintz, Levin, Cohn, Ferris, Glovsky, and Pepeo PC
`Graphics Properties Holdings, Inc. v. Panasonic Corp. of North America et al (Toshiba,
`Barnes and Noble, Google, Hewlett-Packard, Lenova, and ZTE)
`Patent infringement (Delaware Federal District)
`Wide angle LCD display devices
`
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`Date:
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`Date:
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`2013-
`Case:
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`Project:
`Field:
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`SAMSUNG-1012.001
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`
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`Bunsow, DeMory, Smith, & Allison LLP
`NXP B.V. v. Research in Motion Ltd. et. al. (TriQuint, SanDisk, Hynix, and Qualcomm)
`Patent Infringement (USDC, FLA Middle District), IPR (USPTO) – Testifying Expert
`Dummy pattern fill for integrated circuit fabrication
`
`Mintz, Levin, Cohn, Ferris, Glovsky, and Pepeo PC
`Graphics Properties Holdings v. Respondents (RIM, HTC, LG, Apple, Samsung, and
`Sony)
`ITC Patent Infringement – Testifying Expert
`LCD stack configuration for display devices
`
`O’Melveny and Meyers
`Samsung Electronics Co. Ltd. v. AU Optronics Corp. et al (Acer, BenQ, and SANYO)
`ITC Patent infringement
`Flat panel display device manufacturing processes
`
`McDermott Will & Emery
`Spansion Inc. v. Samsung Electronics Co
`ITC patent infringement case – Testifying Expert
`Contact hole processes for flash memory chips
`
`Keker and Van Nest LLP
`STC UNM v. Intel Corp.
`Patent infringement (USDC, New Mexico) – Testifying Expert
`Lithography techniques and integrated circuit products
`
`Irell & Manella LLP
`Patent re-examination
`USPTO re-examination and hearing – Testifying Expert
`Flat panel display illumination devices
`
`Keker and Van Nest LLP
`STC UNM v. Taiwan Semiconductor Manufacturing Co.
`ITC patent infringement
`Lithography techniques and integrated circuit products
`
`McDermott Will & Emery
`Spansion LLC v. Samsung Electronics Co. (and counter-claim)
`Patent infringement case (USDC, E.D. Va. District) – Testifying Expert
`Flash memory device processes
`
`Irell & Manella LLP
`Chi Mei Innolux v. Sony Corporation
`ITC patent infringement case
`LCD flat panel patterned electrodes
`
`Ropes and Gray LLP
`Samsung Electronics Co. v. Spansion Japan Ltd.
`ITC patent infringement case
`Lithography and etch processing for flash memory products
`
`Sidley Austin LLP
`Agere Systems Inc. and LSI v. Xilinx, Inc.
`Patent infringement (S.D. N.Y.)
`Metallization of integrated circuits
`
`McDermott Will & Emery
`Samsung Electronics Co. v. Spansion LLC and Spansion Inc.
`
`2012 –
`Case:
`Project:
`Field:
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`2011 –2012
`Case:
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`Project:
`Field:
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`2011
`Case:
`Project:
`Field:
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`2010-2011
`Case:
`Project:
`Field:
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`2011-
`Case:
`Project:
`Field:
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`2010-
`Case:
`Project:
`Field:
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`2010
`Case:
`Project:
`Field:
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`2010-2011
`Case
`Project:
`Field:
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`2010-2011
`Case:
`Project:
`Field
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`2010-2011
`Case:
`Project:
`Field:
`
`2010
`Case:
`Project:
`Field:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`2010
`Case:
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`SAMSUNG-1012.002
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`Project:
`Field:
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`2010
`Case:
`Project:
`Field
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`2009-2011
`Case:
`Project:
`Field:
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`2009-10
`Case:
`Project:
`Field:
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`2009
`Case:
`Project:
`Field:
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`2009
`Case:
`Project:
`Field:
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`2008
`Case:
`Project:
`Field:
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`2006 –2012
`
`Case:
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`Project:
`Field:
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`2007-08
`Case:
`Project:
`Field:
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`2007-08
`Case:
`Project:
`Field:
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`2005-06
`Case:
`Project:
`Field:
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`2004-05
`Case:
`
`ITC patent infringement case
`Lithography and etch processing for flash memory products
`
`Standley Law Group LLP
`American Panel v. Vertex
`Patent infringement arbitration
`Flat panel display technology
`
`Irell & Manella LLP
`Apeldyn Corp. v. Chi Mei Optoelectronics Corp. et al (AU, Samsung, Sharp, and Sony)
`Patent infringement (USDC, Delaware) – Testifying Expert
`LCD flat panel response time
`
`Fish and Richardson P.C.
`Semiconductor Energy Laboratory Co. Ltd. v. Eastman Kodak
`Patent interference case (USPTO)
`Organic light emitting diode (OLED) display devices
`
`Steptoe and Johnson, LLP
`Qimonda AG v. Seagate Technology
`ITC patent infringement case - Testifying Expert
`Polysilicon and amorphous silicon technology; silicon-oxi-nitride anti-reflection coating
`deposition technology
`
`Fish and Richardson P.C.
`Sharp Corp. v. Samsung Electronics Co. Ltd.
`Patent infringement, (E.D. Tx.)
`Liquid crystal display polarizers and electro static discharge (ESD) technology
`
`Steptoe and Johnson, LLP
`Neumark-Rothschild v. Toshiba Corp.
`ITC patent infringement case
`Wide bandgap (II-VI and III-V) semiconductor materials processing for short-
`wavelength LEDs and laser diodes
`
`Wolf Block Schorr and Solis-Cohen, LLP
`Bernstein Litowitz Berger & Grossmann LLP
`Anvik Corp. v. Nikon Corp., et al (Toshiba, Samsung, LG Electronics, Sharp, LG, Chi
`Mei, AU, AFPD, Panasonic, IPS, and Hitachi, )
`Patent infringement (USDC, S. NY District) – Testifying Expert
`Lithography method for LCD flat panel manufacturing
`
`Ropes & Gray, LLP
`Akrion Inc., v. Solid State Equipment Corp.
`Patent infringement
`Silicon wafer cleaning and preparation
`
`Fish and Richardson P.C.
`Renesas Technology v. Samsung Electronics
`ITC patent infringement case – Testifying Expert
`Thin film and diffractive elements for photomask mask light blocking
`
`Vinson & Elkins, LLP
`Advanced Micro Devices v. Oki Electronics
`Patent infringement (USDC, N. CA District) – Testifying Expert
`Silicon wafer preparation and coating
`
`Irell & Manella, LLP
`Ultratech Stepper, Inc. v. ASM Lithography, Inc.
`
`
`
`Date:
`
`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`Date:
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`SAMSUNG-1012.003
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`
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`Patent infringement (USDC, N. CA District) – Testifying Expert
`Optical microlithography scanning
`
`Ward Norris Heller & Reidy, LLP – Testifying Expert
`IBM Fishkill, NY and Essex, VT, including Union Carbide Corp., Eastman Kodak, J. T.
`Baker Chemical, KTI, Shipley, Ashland Oil, E. I. DuPont de Nemours and Industri-
`Chem, suppliers of solvents for the IBM cleanroom operations
`Multi-state litigation, allegations regarding various chemicals used in the manufacturing
`of semiconductor devices
`
`Ward Norris Heller & Reidy, LLP – Testifying Expert
`Kasowitz Benson Torres & Friedman, LLP
`Steptoe & Johnson, LLP
`San Jose IBM Workers Litigation v. Shipley Company
`San Jose IBM Workers Litigation v. American Hoechst Corporation
`San Jose IBM Workers Litigation v. Ashland Chemical Company, Union Carbide
`Corporation, Fischer Scientific Company, and Eastman Kodak Company
`Rubio v. IBM et al.
`Allegations regarding various chemicals used in an manufacturing of semiconductor
`devices
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`Project:
`Field:
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`1997-03
`Case:
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`Field:
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`Date:
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`Date:
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`1997-03
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`Cases:
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`Field:
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`SERVICE
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`
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`Professional Associations
`Fellow, SPIE International Society for Optical Engineering
`Fellow, The Optical Society of America
`Senior Member, Institute of Electrical and Electronics Engineers
`Member, American Vacuum Society
`Member, American Society for Engineering Education
`Member, Society for Information Display
`
`External Service
`1997-2013 SPIE Optical Microlithography, Program Committee
`2010-2013 EIPBN Program Committee
`2003-2013 SPIE Zernike Award Committee
`2009-2010 Councilor, Optical Society of America (OSA), Rochester Section
`2008-2009 Program Chairman, International Symposium on Immersion Lithography Extensions
`2004-2005 Conference Chairman, SPIE Optical Microlithography Conference
`1997-2002 EIPBN Program Committee
`1997-1998 SPIE/ISMA Singapore Program Committee
`1995-1997 Chairman, OSA Lithography / Patterning Technical Working Group
`1990-1996 Faculty Advisor, SPIE Student Chapter
`
`Honors and Awards
`2011
`SPIE Research Mentor Award
`2008
`Visiting Professor, IMEC Micro and Nanoelectronics Research Center
`2007
`Trustees Excellence in Scholarship and Teaching Award, Rochester Institute of Technology
`2007
`Fellow, SPIE International Society for Optical Engineering
`2007
`Rush Henrietta Outstanding Alumni Award
`2005
`Million Dollar Principle Investigator Award, Rochester Institute of Technology
`2005
`Patenting Productivity Award, Rochester Institute of Technology
`2002
`Intellectual Property Productivity Award, Rochester Institute of Technology
`2001
`Visiting Professor, IMEC Micro and Nanoelectronics Research Center
`2000
`Intel Professor of Research and Technology, Intel Corp.
`1999
`RIT Creators Award, Rochester Institute of Technology
`1997
`Visiting Scholar, International Sematech
`1993
`Texas Instruments, Douglas Harvey Award
`
`SAMSUNG-1012.004
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`
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`1991
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`Texas Instruments, Douglas Harvey Award
`
`Editorial Review
`Editorial review of IEEE, JVAC, JM3, and SPIE, journals.
`
`
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`
`
`PATENTS
`
`
`
`1. 7,768,648 Method for aberration evaluation in a projection system
`2. 7,345,735 Apparatus for aberration detection and measurement
`3. 7,233,887 Method of photomask correction and its optimization using localized frequency analysis
`4. 7,170,588 Reduction Smith-Talbot interferometer prism for micropatterning
`5. 7,136,143 Method for aberration detection and measurement
`6. 7,092,073 Method of illuminating a photomask using chevron illumination
`7. 6,934,010 Optical proximity correction method utilizing gray bars as sub-resolution assist features
`8. 6,881,523 Optical proximity correction method utilizing ruled ladder bars as sub-resolution assist features
`9. 6,846,595 Method of improving photomask geometry
`10. 6,835,505 Mask for projection photolithography at or below about 160 nm and a method thereof
`11. 6,791,667 Illumination device for projection system and method for fabricating
`12. 6,788,388 Illumination device for projection system and method for fabricating
`13. 6,556,361 Projection imaging system with a non-circular aperture and a method thereof
`14. 6,541,750 Modification of a projection imaging system with a non-circular aperture and a method thereof
`15. 6,525,806 Apparatus and method of image enhancement through spatial filtering
`16. 6,480,263 Apparatus and method for phase shift photomasking
`17. 6,466,304 Illumination device for projection system and method for fabricating
`18. 6,395,433 Photomask for projection lithography at or below about 160 nm and a method thereof
`19. 6,388,736 Imaging method using phase boundary masking with modified illumination
`20. 6,368,755 Masks for use in optical lithography below 180 nm
`21. 6,309,780 Attenuated phase shift mask and a method for making the mask
`22. 5,939,227 Multi-layered attenuated phase shift mask and a method for making the mask
`23. JP2010079303 Method of improving photomask geometry
`24. JP2006079117 Optical proximity correction method utilizing gray bar as sub-resolution assist feature
`25. EP1240557 Imaging method using phase boundary masking with modified illumination
`
`
`
`SELECTED PUBLICATIONS
`
`1. "Extreme ultraviolet lithography resist-based aberration metrology," Germain L. Fenger; Lei Sun; Sudharshanan
`Raghunathan; Obert R. Wood; Bruce W. Smith, J. Micro/Nanolith. MEMS MOEMS. 12 (4), 2013.
`2. “The Impact of Pupil Plane Filtering on Mask Roughness Transfer,” Burak Baylav, Chris Maloney, Zac Levinson,
`Joost Bekaert, Alessandro Vaglio Pret, and Bruce W. Smith, J. Vac. Sci. Technol. B 31, 06F801, 2013.
`
`3.
`
` “Modeling the effects of pupil-manipulated spherical aberration in optical nanolithography”, M. K. Sears, B.W.
`Smith, J. Micro/Nanolith. MEMS MOEMS. 12(1), 2013.
`4. “Scanning interference evanescent wave lithography for sub-22-nm generations,” P. Xie, B. W. Smith, J.
`Micro/Nanolithography, MEMS, and MOEMS. 12(1), 2013.
`5. “Lens wavefront compensation for 3D photomask effects in subwavelength optical lithography,” M.K. Sears, J.
`Bekaert, B.W. Smith, Applied Optics 52 (3), 314-322, 2013.
`6. “Line edge roughness (LER) mitigation studies specific to interference-like lithography,: B Baylav, A Estroff, P Xie,
`BW Smith, Proc. SPIE 8683, Optical Microlithography XXVI, 86831Y, 2013
`7. “Pupil wavefront manipulation to compensate for mask topography effects in optical nanolithography,” MK Sears,
`BW Smith, Proc. SPIE 8683, Optical Microlithography XXVI, 86830G, 2013.
`8. “EUVL resist-based aberration metrology,” Germain L. Fenger ; Sudharshanan Raghunathan ; Lei Sun ; Obert R.
`Wood ; Bruce W. Smith, Proc. SPIE 8679, Extreme Ultraviolet (EUV) Lithography IV, 86790P, 2013.
`9. “Tuning Metamaterials for Applications at DUV Wavelengths,” A. Estroff, B.W. Smith, Intl. Journal of Optics,
`2012.
`
`SAMSUNG-1012.005
`
`
`
`10. “Aqueous developable dual switching photoresists for nanolithography”, L. Chen, Y.K. Goh, H.H. Cheng, B.W.
`Smith, P. Xie, W. Montgomery, A.K. Whittaker, I. Blakey, Journal of Polymer Science Part A: Polymer Chemistry
`1, 2012.
`11. “The saga of lambda: spectral influences throughout lithography generations,” B.W. Smith, Proc. SPIE 8325, 2012.
`12. “Pupil wavefront manipulation for optical nanolithography,” Monica Kempsell Sears, Joost Bekaert, and Bruce W.
`Smith, Proc. SPIE 8326, 2012.
`13. “Longer wavelength EUV lithography (LW-EUVL),” Christopher W. Maloney and Bruce W. Smith, Proc. SPIE
`8322, 2012.
`14. “Scanning interference evanescent wave lithography for sub-22 nm generations,” Peng Xie and Bruce W. Smith,
`Proc. SPIE 8326, 2012.
`15. “3D mask modeling for EUV lithography,” Julien Mailfert, Christian Zuniga, Vicky Philipsen, Konstantinos Adam,
`Michael Lam, James Word, Eric Hendrickx, Geert Vandenberghe, and Bruce Smith, Proc. SPIE 8322, 2012.
`16. “Aqueous Developable Dual Switching Photoresists for Nanolithography,” Lan Chen, Yong Keng Goh, Han Hao
`Cheng, Bruce W. Smith, Peng Xie, Warren Montgomery, Andrew K. Whittaker, Idriss Blakey, Journal of Polymer
`Science Part A: Polymer Chemistry, 2012.
`17. “Lithography beyond the IC”, B.W. Smith, Proc. SPIE, v 7973-01, 2011.
`18. “PAG-free chain scissioning resists fro 193-nm immersion lithography that can be developed by aqueous base,” I.
`Blakey, L. Chen, Y. K. Goh, A. Dorgelo, P. Xie, N. Lafferty, B. Smith, P. Zimmerman, M.W. Montgomery, A.
`Whittaker, Proc. SPIE, v 7972-86, 2011.
`19. “Development of an inorganic nanoparticle photoresist for EUV, e-beam, and 193-nm lithography,” M. Krysak, M.
`Trikeriotis, E. Schwarz, N. lafferty, P. Xie, B.W. Smith, P. Zimmerman, M.W. Montgomery, E. Giannelis, C. Ober,
`Proc. SPIE v 7972-48, 2011.
`20. “Extending SMO into the pupil plane,” M. Kempsell Sears, B.W. Smith, Proc. SPIE v 7973-46, 2011.
`21. “Projection lithography below lambda/7 through deep-ultraviolet evanescent optical imaging,” P. Xie and B. W.
`Smith, J. Vac. Sci. Technol. B 28, 2010.
`22. “Photo-patternable inorganic hardmask,” Alan Telecky, Peng Xie, Jason Stowers, Andrew Grenville, Bruce Smith,
`and Douglas A. Keszler, J. Vac. Sci. Technol. B 28, 2010.
`23. “Alternatives to Chemical Amplification for 193 nm Lithography,” Baylav, B.; Meng Zhao; Ran Yin; Peng Xie;
`Scholz, C.; Smith, B.; Smith, T.; Zimmerman, P. Source: Proceedings of the SPIE - The International Society for
`Optical Engineering, v 7639, 2010.
`24. “Non-chemically amplified resists for 193-nm immersion lithography: influence of absorbance on performance,”
`Lan Chen; Yong-Keng Goh; Lawrie, K.; Smith, B.; Montgomery, W.; Zimmerman, P.A.; Blakey, I.; Whittaker,
`A.K., Proceedings of the SPIE - The International Society for Optical Engineering, v 7639, 2010
`25. “Metamaterials for enhancement of DUV lithography,” Estroff, A.; Lafferty, N.V.; Peng Xie; Smith, B.W.,
`Proceedings of the SPIE - The International Society for Optical Engineering, v 7640, 2010.
`26. “Achieving Interferometric Double Patterning through Wafer Rotation,” Peng; Lafferty, N.V.; Smith, B.W. ,
`Proceedings of the SPIE - The International Society for Optical Engineering, v 7640, 2010.
`27. “Development of an inorganic photoresist for DUV, EUV, and electron beam imaging,” Trikeriotis, M.; Woo Jin
`Bae; Schwartz, E.; Krysak, M.; Lafferty, N.; Peng Xie; Smith, B.; Zimmerman, P.; Ober, C.K.; Giannelis, E.P.,
`Proceedings of the SPIE - The International Society for Optical Engineering, v 7639, 2010.
`28. “Analysis of higher order pitch division for sub-32 nm lithography,” Peng Xie; Smith, B.W. , Proceedings of the
`SPIE - The International Society for Optical Engineering, v 7274, 2009.
`29. “Alternative optical technologies: more than curiosities?,” Smith, B.W., Proceedings of the SPIE - The International
`Society for Optical Engineering, v 7274, 2009
`30. “Inverse lithography for 45-nm-node contact holes at 1.35 numerical aperture Kempsell, M.L.; Hendrickx, E.;
`Tritchkov, A.; Sakajiri, K.; Yasui, K.; Yoshitake, S.; Granik, Yu.; Vandenberghe, G.; Smith, B.W., Journal of
`Microlithography, Microfabrication, and Microsystems, v 8, n 4, Oct. 2009.
`
`SAMSUNG-1012.006
`
`
`
`31. “EUV resist requirements: absorbance and acid yield,” Gronheid, R.; Fonseca, C.; Leeson, M.J.; Adams, J.R.;
`Strahan, J.R.; Willson, C.G.; Smith, B.W., Proceedings of the SPIE - The International Society for Optical
`Engineering, v 7273, 2009
`32. “Design and analysis of a compact EUV interferometric lithography system,” B.W. Smith, J. Micro/Nanolith.
`MEMS MOEMS, Vol. 8, 021207, 2009.
`33. “Enhancement of hyper-NA imaging through selective TM polarization,” B.W. Smith, J. Zhou, P. Xie, J. Vac. Soc.
`B: Microelectronics and Nanometer Structures, Volume 26 (6) 2008.
`34. “Photomask image enhancement using grating generated surface waves,” N. Lafferty, A. Estroff, A. Bourov. B.W.
`Smith, J. Vac. Soc. B: Microelectronics and Nanometer Structures, Volume 26 (6) 2008.
`35. “Applications of TM polarized illumination,” Bruce Smith, Jianming Zhou, and Peng Xie, Proc. SPIE 6924, 2008.
`36. “Quantum state control interference lithography and trim double patterning for 32-16 nm nodes,” Robert D. Frankel,
`Bruce W. Smith, and Andrew Estroff , Proc. SPIE 6520, 2007.
`37. “Snell or Fresnel – The influence of material index on hyper NA lithography,” B. W. Smith, J. Zhou, Proc. SPIE
`6520, 2007.
`38. “Immersion Lithography with Numerical Apertures above 2.0 using High Index Optical Materials," J. Zhou, N.
`Lafferty, B. W. Smith, J. H. Burnett, Proc. SPIE 6520, 2007.
`39. “On the quality of measured optical aberration coefficients using phase wheel monitor,” L. Zavyalova, A. Robinson,
`A. Bourov, N. Lafferty, B. W. Smith, Proc. SPIE 6520, 2007.
`40. “Mask Enhancement Using and Evanescent Wave Effect,” N. Lafferty, J. Zhou, B. W. Smith, Proc. SPIE 6520,
`2007.
`41. “Evanescent wave imaging in optical lithography,” Bruce W Smith, Yongfa Fan, Jianming Zhou, Neal Lafferty,
`Andrew Estroff, Proc. SPIE Optical Microlithography XIX, 6154, 2006.
`42. “Effects of beam pointing instability on two-beam interferometric lithography,” Yongfa Fan, Anatoly Bourov,
`Michael Slocum, Bruce W Smith, Proc. SPIE Optical Microlithography XIX, 6154, 2006.
`43. “Resist process window characterization for the 45-nm node using an interferometric immersion microstepper,”
`Anatoly Bourov, Stewart A Robertson, Bruce W Smith, Michael A Slocum, Emil C Piscani, Proc. SPIE Advances in
`Resist Technology and Processing XXIII, 6153, 2006.
`44. “Comparison of immersion lithography from projection and interferometric exposure tools,” Stewart A Robertson,
`Joanne M Leonard, Bruce W Smith, Anatoly Bourov, Proc. Optical Microlithography XIX, 6154, 2006.
`45. “Three-dimensional imaging of 30-nm nanospheres using immersion interferometric lithography,” Jianming Zhou,
`Yongfa Fan, Bruce W Smith, Proc. Optical Microlithography XIX, 6154, 2006.
`46. “Experimental measurement of photoresist modulation curves, “Anatoly Bourov, Stewart A Robertson, Bruce W
`Smith, Michael Slocum, Emil C Piscani, Proc. Optical Microlithography XIX, 6154, 2006.
`47. “Practical approach to full-field wavefront aberration measurement using phase wheel targets,” Lena V Zavyalova,
`Bruce W Smith, Anatoly Bourov, Gary Zhang, Venugopal Vellanki, Patrick Reynolds, Donis G Flagello, Proc.
`Optical Microlithography XIX, 6154, 2006.
`48. “High NA 193nm Immersion Lithography for 32nm Half-Pitch Imaging’” J. Zhou, Y. Fan, A. Bourov, B.W. Smith,
`Appl. Opt., 2006.
`49. “25nm Immersion Lithography at a 193nm Wavelength,” B. W. Smith, Y. Fan, M. Slocum, L. Zavyalova, , Proc.
`SPIE Optical Microlithography, vol. 5754, 2005.
`50. “Amphibian XIS: An Immersion Lithography Microstepper Platform,” B. W. Smith, A. Bourov, Y. Fan, F.
`Cropanese, Proc. SPIE Optical Microlithography, vol. 5754, 2005.
`51. “ILSim - A compact simulation tool for interferometric lithography,” Y. Fan, A. Bourov, L. Zavyalova, J. Zhou, A.
`Estroff, N. Lafferty, B.W. Smith, , Proc. SPIE Optical Microlithography, vol. 5754, 2005.
`52. “Air bubble-induced light-scattering effect on image quality in 193 nm immersion lithography,” Yongfa Fan, Neal
`Lafferty, Anatoly Bourov, Lena Zavyalova, Bruce W. Smith , Appl. Opt., Vol. 44 Issue 19 , 3904, 2005.
`53. “Photoresist Modulation Curves,” A. Bourov, Y. Fan, F. C. Cropanese, B. W. Smith, Proc. SPIE Optical
`Microlithography, vol. 5754, 2005.
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`SAMSUNG-1012.007
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`54. “Automated Aberration Extraction using Phase Wheel Targets,” L. Zavyalova, A. Bourov, B.W. Smith, Proc. SPIE
`Optical Microlithography, vol. 5754, 2005.
`55. “Synthetic defocus in interferometric lithography,” Frank C. Cropanese, Anatoly Bourov, Yongfa Fan, Jianming
`Zhou, Lena Zavyalova, Bruce W. Smith, SPIE Optical Microlithography, vol. 5754, 2005.
`56. “Hyper NA water immersion lithography at 193 nm and 248 nm,” Bruce W. Smith, Yongfa Fan, Jianming Zhou,
`Anatoly Bourov, Lena Zavyalova, Neal Lafferty, Frank Cropanese, and Andrew Estroff, J. Vac. Sci. .Technol. B:
`Microelectronics and Nanometer Structures 22(6), 3439-3443, 2004.
`57. “Amplification of the index of refraction of aqueous immersion fluids by ionic surfactants,”Kwangjoo Lee, Joy
`Kunjappu, Steffen Jockusch, Nicholas J Turro, Tatjana Widerschpan, Jianming Zhou, Bruce W Smith, Paul
`Zimmerman, Will Conley, SPIE Advances in Resist Technology and Processing XXII, vol. 5373, 2005.
`58. “Mask-induced polarization effects at high NA,” Andrew Estroff, Yongfa Fan, Anatoly Bourov, Bruce Smith,
`Philippe Foubert, L. H. Leunissen, Vicky Philipsen, Yuri Aksenov, SPIE Optical Microlithography, vol. 5754, 2005.
`59. “Immersion lithography fluids for high NA 193 nm lithography”, Jianming Zhou, Yongfa Fan, Anatoly Bourov,
`Neal Lafferty, Frank Cropanese, Lena Zavyalova, Andrew Estroff, Bruce W. Smith, SPIE Optical
`Microlithography, vol. 5754, 2005.
`60. “Water immersion optical lithography at 193 nm,” Bruce W. Smith, Anatoly Bourov, Hoyoung Kang, Frank
`Cropanese, Yongfa Fan, Neal Lafferty, and Lena Zavyalova, J. Microlith., Microfab., and Microsys., 3(1), pp. 44-
`51, 2004.
`61. “Approaching the numerical aperture of water - immersion lithography at 193nm,” B.W. Smith, A. Bourov, Y. Fan,
`L. Zavyalova, N. Lafferty, F. Cropanese, Proc. SPIE 5377, 2004.
`62. “Study of Air Bubble Induced Light Scattering Effect On Image Quality in 193 nm Immersion Lithography,”Y.Fan,
`N. Lafferty, A. Bourov, L. Zavyalova, B.W. Smith, , Proc. SPIE 5377, 2004.
`63. “Immersion microlithography at 193nm with a Talbot prism interferometer,”A.Bourov, Y. Fan, F. Cropanese, N.
`Lafferty, L. Zavyalova, H. Kang, B.W. Smith, , Proc. SPIE 5377, 2004.
`64. “Mask Induced Polarization Effects at High NA,” A. Estroff, Y. Fan, A. Bourov, B.W. Smith, P. Foubert, L.H.A.
`Leunissen, Y. Aksenov, , Proc. SPIE 5754, 2005.
`65. “Benefiting from polarization - effects of high-NA on imaging,” B.W. Smith, L. Zavyalova, A. Estroff, , Proc. SPIE
`5377, 2004.
`66. “Mask induced polarization,” A. Estroff, Y. Fan, A. Bourov, F. Cropanese, N. Lafferty, L. Zavyalova, B.W. Smith,"
`Proc. SPIE 5377, 2004.
`67. “In-situ aberration monitoring using phase wheel targets,” L. Zavyalova, B.W. Smith, T. Suganaga, S. Matsuura, T.
`Itani, J. Cashmore, Proc. Proc. SPIE 5377, 2004.
`68. “Gray assist bar OPC,” N. Lafferty, G. Vandenberghe, B.W. Smith, M. Lassiter, P. Martin, Proc. SPIE 5377, 2004.
`69. “Synthesis of projection lithography for low k1 via interferometry,” F. Cropanese, A. Bourov, Y. Fan, A. Estroff, L.
`Zavyalova, B.W. Smith, Proc. SPIE 5377, 2004.
`70. “Forbidden Pitch or Duty-Free: Revealing the Causes of Across-Pitch Imaging Differences,” B.W. Smith, SPIE
`Optical Microlithography XV, Vol. 5040, 2003.
`71. “Water Immersion Optical Lithography for the 45nm Node,” B. W. Smith, H. Kang, F. Cropanese, Y. Fan, SPIE
`Optical Microlithography XV, Vol. 5040, 2003.
`72. “Optimizing vacuum ultraviolet attenuated phase shift masking materials,” B. W. Smith, A. Y. Bourov, and Y. Liu,
`J. Vac. Sci.Technol. B: Microelectronics and Nanometer Structures , 20(6) 6, 2578-2582. 2002.
`73. “OPC and image optimization using localized frequency analysis,” B. W. Smith, D. E. Ewbank, SPIE Optical
`Microlithography XV, Vol. 4691, 2002.
`74. “Challenges in High NA, Polarization, and Photoresists,” B. W. Smith, J. Cashmore , M. Gower, SPIE Optical
`Microlithography XV, Vol. 4691, 2002.
`75. “OPC and Image Optimization Using Localized Frequency Analysis,” B. W. Smith, J. Fung Chen, SPIE Optical
`Microlithography XV, Vol. 4691, 2002.
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`76. “Image Enhancement Through Square Illumination Shaping,” B. W. Smith, G. Vandenbergh, SPIE Optical
`Microlithography XV, Vol. 4691, 2002.
`77. “Mutually Optimizing resolution enhancement techniques,” B.W. Smith, J. Microlit., Microfab., Microsys., 1 (2), 7
`(2002).
`78. “Spatial filtering effects of the attenuated PSM and assist bar OPC,” B.W. Smith, SPIE Lithography for
`Semiconductor Manufacturing II, Vol. 4404, 2001.
`79. “Optical lithography at a 126nm wavelength,” B.W. Smith, H. Kang, SPIE Optical Microlithography XIV, Vol.
`4343, 2001.
`80. “Mutually Optimizing resolution enhancement techniques,” B.W. Smith, SPIE Optical Microlithography XIV, Vol.
`4343, 2001.
`81. “A study of obscuration in catadioptric lenses,” M. McCallum, B.W. Smith, SPIE Optical Microlithography XIV,
`Vol. 4343, 2001.
`82. “Investigation of the interplay between illumination, mask patterning, and aberrations from the lens perspective,” R.
`Schlief, B.W. Smith, SPIE Optical Microlithography XIV, Vol. 4343, 2001.
`83. “Frequency filtering in alternative pupil planes,” B.W. Smith, H. Kang, J. Vac. Soc. B 2000.
`84. “Aberration of steppers using phase shifting point diffraction interferometry,” P. Venkataraman, B.W. Smith, SPIE
`Optical Microlithography XIII, Vol. 4000, 2000.
`85. “Properties and potential of VUV lithographic thin film materials,” M. Cangemi, M. Lassiter, A. Bourov, B.W.
`Smith, SPIE Optical Microlithography XIII, Vol. 4000, 2000.
`86. “Spatial frequency filtering in the pellicle plane,” B.W. Smith, H. Kang, SPIE Optical Microlithography XIII, Vol.
`4000, 252, 2000.
`87. “Understanding lens aberration and influences to lithographic imaging,” B. W. Smith, SPIE Optical
`Microlithography XIII, Vol. 4000, 2000.
`88. “Fabrication of small contacts using practical pupil filtering,” H. Kang, B.W. Smith, SPIE Optical Microlithography
`XIII, Vol. 4000, 2000.
`89. "Variations to the influence of lens aberration invoked with PSM and OAI," B.W. Smith, Proc. SPIE Optical
`Microlithography XII, 1999.
`90. "Resolution and DOF improvement through the use of square shaped illumination," B.W. Smith, J.S. Petersen, Proc.
`SPIE Optical Microlithography XII, 1999.
`91. "Design and development of thin film materials for 157 nm and VUV wavelengths:
`92. APSM, binary masking, and optical coatings applications, "B.W. Smith, A. Bourov, L. Zavyalova, M. Cangemi,
`Proc. SPIE Emerging Lithographic Technologies III, 1999.
`93. "Influence of off-axis illumination on optical lens aberration," B. W. Smith and J. S. Petersen, J. Vac. Soc. B Vol.
`16, 6, 3398 1998.
`94. "Assessment of a hypothetical roadmap to extend optical lithography through the 70nm SIA technology node," J.S.
`Petersen, B.W. Smith, M. McCallum, N. Kachwala, R. Socha, J.F. Chen, T. Laidlaw, R. Gordon, C. Mack, SPIE
`BACUS Proceedings, 1998.
`95. "Illumination pupil filtering using modified quadrupole apertures," B.W. Smith, L. Zavyalova, J.S. Petersen, Proc.
`SPIE Optical Microlithography XI, 3334, 1998.
`96. "Revalidation of the Rayleigh resolution and DOF limits," B.W. Smith, Proc. SPIE Optical Microlithography XI,
`v3334, 1998.
`97. "Aberration evaluation and tolerancing of 193 nm lithographic objective lenses," B.W. Smith, J. Webb, J.S.
`Petersen, J. Meute, Proc. SPIE Optical Microlithography XI, v3334, 1998.
`98. "Resist design concepts for 193nm lithography: Opportunities for innovation and invention," E. Reichmanis, O.
`Nalamasu, T.I. Wallow, R. Cirelli, G. Dabbagh, R.S. Hutton, A.E. Novembre, B.W. Smith, J. Vac. Soc. Am. B, 15
`(6), 2528, 1997.
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`SAMSUNG-1012.009
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`99. "Investigation into excimer laser radiation damage of DUV optical phase masking films," B.W. Smith, L.
`Zavyalova, A. Bourov, S. Butt, C. Fonseca, J. Vac. Soc. Am. B, 15 (6), 2444, 1997.
`100. "Plasma reactive ion etching of 193nm attenuated phase shift mask materials," B.W. Smith, C. Fonseca, L.
`Zavyalova, Z. Alam, A. Bourov, J. Vac. Soc. Am. B, 15 (6), 2259, 1997.
`101. "A Negative Acting Single Layer Resist for 193 nm Lithography, P(SI-CMS)", B.W. Smith, A.E. Novembre, D.
`Mixon, Microelectronic Engineering 34(2), 137, 1997.
`102. "The effects of excimer laser radiation on attenuated phase-shift masking materials", B. Smith, L. Zavyalova, S.
`Butt, A. Bourov, N. Bergman, C. Fonseca, Z. Alam, Proc. SPIE 3051, 1997.
`103. "Development and characterization of nitride and oxide based composite materials for sub-0.18mm attenuated phase
`shift masking,", B.W. Smith, Z. Alam., S. Butt, S. Kurinec, R. Lane, G. Arthur, Microelectronic Engineering 35,
`201, 1997.
`104. “New Materials Families for 193 nm and DUV Attenuating Embedded Phase Shifter Photomasks”, R. H. French, P.
`F. Carcia, K. G. Sharp, J. S. Meth, B. W. Smith, R. M. Cannon, Annual Meeting, American Ceramic Society,
`Cincinnati