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`EXHIBIT
`DSS-2012
`
`DSS—2012
`
`EXHIBIT
`
`

`

`Chris A. Mack
`1605 Watchhill Road, Austin, Texas 78703
`Voice: 512-814-6225, email: chris@lithoguru.com
`
`EDUCATION
`
`University of Texas, Austin, TX
`Doctorate in Chemical Engineering
`Thesis Title: “Modeling Solvent Effects in Optical Lithography”
`
`University of Maryland, College Park, MD
`Master of Science in Electrical Engineering
`
`Rose-Hulman Institute of Technology, Terre Haute, IN
`Bachelor of Science degrees in Physics, Electrical
`Engineering, Chemistry, and Chemical Engineering
`
`December 1998
`
`December 1989
`
`May 1982
`
`EXPERIENCE
`
`Lithoguru.com, Austin, TX
`11/05 – present
`
`Gentleman Scientist
`● Pursuing intellectual interests, research, writing, and teaching, as reflected on the
`website www.lithoguru.com.
`● Current major research interest: developing an approximate analytical stochastic
`model of lithography line-edge roughness.
`● Consulting in the fields of optics and semiconductor lithography, including legal
`expert witness services and business consultation.
`
`University of Texas at Austin, Austin, TX
`8/91 – present
`
`Adjunct Faculty (part time)
`● Teaching graduate and undergraduate courses in the Electrical Engineering and
`Chemical Engineering departments. Graduate courses include Semiconductor
`Microlithography, Chemical Processes for Microelectronics, Fourier Optics, and
`Statistics. Undergraduate courses include Electronic Circuits, Solid State
`Electronics, and Modern Optics. Served on the committees of numerous PhD
`dissertations.
`● Teaching loads have varied but have averaged 1 – 2 courses per semester.
`
`University of Canterbury, Christchurch, NZ
`6/11 – 8/11
`
`Erskine Visiting Fellow
`● Taught undergraduate course in the Electrical Engineering department:
`Semiconductor Microlithography. Participated in research on evanescent
`interferometric lithography.
`
`

`

`University of Notre Dame, South Bend, IN
`8/06 – 12/06
`
`Melchor Visiting Chair Professor
`● Taught two graduate courses in the Electrical Engineering department:
`Semiconductor Microlithography, and Data Analysis and Modeling in the Real
`World.
`
`KLA-Tencor, Austin, TX
`2/00 – 11/05
`
`Vice President of Lithography Technology
`● Provided strategic vision in all lithography related products for KLA-Tencor, a $2B
`Fortune 500 supplier of equipment to the semiconductor industry.
`● Directed research efforts for four product divisions across two continents, including
`lithography simulation, optical and SEM critical dimension metrology, and optical
`overlay metrology. Obtained funding and managed resource allocation and strategic
`planning for critical long-term projects.
`● Provided and oversaw successful turn-around strategies for two failing product lines.
`● Provided internal consulting services in lithography to other KLA-Tencor divisions.
`● Oversaw the acquisition of FINLE Technologies by KLA-Tencor and its transition to
`a successful product division.
`
`FINLE Technologies, Austin, TX
`2/90 – 2/00
`CEO, President and Chief Technical Officer
`● Founded company in 1990, pursuing it full time by the end of 1991.
`● Responsible for overall corporate management, vision, strategic planning, technical
`direction, budgeting, new product development, and lithography research. Grew the
`company from one person and $60,000 in revenue in 1990 to 25 people and $2.5M in
`revenue in 2000.
`● Developed the industry standard PROLITH Toolkit of lithography simulation
`software and the ProDATA suite of data analysis software.
`● Provided consulting services to the semiconductor industry.
`● Taught numerous short courses on optical lithography.
`
`SEMATECH, Austin, TX
`
`8/90 – 12/91
`
`Lithography Engineer
`● As an assignee of the department of defense to SEMATECH, provided lithography
`expertise to SEMATECH on a variety of different projects, including modeling and
`process development for deep-UV resist systems, processes optimization of the i-line
`production process, advanced development activities in phase-shifting mask
`technologies, and lithographic lens design.
`● Taught short-term and long-term courses on lithography to SEMATECH staff and
`assignees.
`
`National Security Agency, Fort Meade, MD
`
`11/82 – 8/90
`
`Senior Engineer - Lithography
`● As a member of the Microelectronics Research Laboratory (MRL), was tasked with
`performing research for present and future agency needs in the area of
`microlithography for semiconductor processing. This work provided a unique blend
`of theoretical research (e.g., a mechanism for the development reaction, diffraction
`
`

`

`theory for proximity printing and aerial imaging) and experimental work
`(measurement of resist properties, model verification). Performed numerous
`practical and theoretical studies, e.g., resist coating uniformity on wafer tracks, mask
`bias effects for step-and-repeat printing, exposure optimization, image reversal
`techniques, and focus effects for submicron lithography. The results of this work
`have been published in numerous journals and presented at technical conferences,
`including invited papers at international conferences in Japan and Europe.
`
`
`
`EXPERT WITNESS EXPERIENCE
`
`November, 2013 – present
`Expert witness, Winston & Strawn for Macronix
`Case: ITC Inv. No. 337-TA-893, Certain Flash Memory Chips and Products Containing the Same
`Testimony: none to date
`
`March, 2008 – present
`Expert witness and expert consultant, Stadheim & Grear for the University of New Mexico.
`Case: Pursue licensing of University of New Mexico patents, Patent litigation, infringement action
`against Intel.
`Testimony: expert report on claim construction, provided deposition testimony.
`
`
`March, 2007 – July, 2013
`Expert witness, Morrison & Foerster for Nikon Corporation.
`Case: Patent litigation, infringement action against Nikon.
`Testimony: Markman hearing (March 2010), wrote expert report and rebuttal report, provided
`deposition testimony.
`
`
`February, 2013 – May 2013
`Expert witness, McKool Smith for Ericsson.
`Case: ITC court case involving patent infringement action by Samsung.
`Testimony: none.
`
`
`January, 2011 – June 2011
`Expert witness, Fish and Richardson for Samsung.
`Case: ITC court case involving patent infringement action against Samsung.
`Testimony: wrote expert report and rebuttal report, provided deposition testimony.
`
`
`August, 2006 – February, 2008
`Expert witness, Milbank, Tweed, Hadley & McCloy LLP for Renesas.
`Case: ITC court case involving patent infringement action against Samsung.
`Testimony: expert reports and expert rebuttal reports, gave two deposition testimonies, and testified
`at trial.
`
`
`June, 2006 – July, 2007
`Expert witness, WilmerHale for an Asia-based semiconductor manufacturer.
`
`

`

`Case: Contract dispute between a US-based semiconductor manufacturer and an Asia-based
`semiconductor manufacturing concerning the transfer of manufacturing technology. Settled under
`arbitration in Hong Kong.
`Testimony: wrote expert report and expert rebuttal report. Prepared fully for trial testimony – case
`settled the day before trial.
`
`
`COURSES TAUGHT AT THE UNIVERSITY OF TEXAS AT AUSTIN
`
`
`Circuit Theory (undergraduate)
`EE 411
`Network Theory II (undergraduate)
`EE 323
`Electromagnetic Engineering (undergraduate)
`EE 325
`Electronic Circuits I (undergraduate)
`EE 338
`Solid State Electronics (undergraduate)
`EE 339
`Chemical Engineering for Micro- and Nanofabrication (undergrad)
`CHE 323
`Modern Optics (undergraduate)
`PHY 333/EE 347
`Statistics in Market Analysis (undergraduate)
`SSC306
`Fourier Optics (graduate)
`EE 383P
`EE 396K/CHE 385C Semiconductor Microlithography (graduate)
`CHE 395C
`Chemical Processes for Microelectronics (graduate)
`SSC380D
`Statistical Methods II (graduate)
`
`COURSES TAUGHT AT THE UNIVERSITY OF NOTRE DAME
`
`
`EE 60598
`EE 60596
`
`Semiconductor Microlithography (graduate)
`Data Analysis and Modeling in the Real World (graduate)
`
`AWARDS
`
`
`SPIE Frits Zernike Award for Microlithography, for contributions in lithography modeling and
`education, 2009
`
`
`SEMI Award for North America, for contributions in lithography modeling and education, 2003
`
`Best Paper Award, 18th Annual BACUS Symposium on Photomask Technology and
`Management, 1998.
`
`INDUSTRIAL AND PROFESSIONAL SOCIETIES
`
`
`Member of the Board of Trustees, Rose-Hulman Institute of Technology, 2008 – present
`
`Member of the Board of Advisors to the Physics Department, Rose-Hulman Institute of
`Technology, 2000 – 2008
`
`Member of the Board of Advisors to the Chemistry Department, Rose-Hulman Institute of
`Technology, 2003 – 2008
`
`

`

`Member of the Board of Advisors to the MEMS Laboratory, Rose-Hulman Institute of
`Technology, 2004 – 2008
`
`Fellow of SPIE, 2006
`
`Fellow of IEEE, 2010
`
`Senior Member of the Optical Society of America
`
`Chairman of the Lithography Technical Working Group of the Optical Society of America, 1992
`– 1996.
`
`Conference Chair, Microlithographic Techniques in IC Fabrication, SPIE Conference, 1997 and
`2000, Singapore
`
`Conference Chair, Lithography for Semiconductor Manufacturing, SPIE Conference, 1999 and
`2001, Edinburgh, Scotland
`
`Conference Chair, Advanced Microlithography Technology, SPIE Conference, 2007, Beijing,
`China
`
`Plenary Speaker, SPIE 2003 Symposium on Microlithography.
`
`Member of the Board of Advisors to Semiconductor International magazine, 1993 – 2004
`
`Member of the Board of Advisors to Microlithography World magazine, 2003 – 2008
`
`Contributing Columnist for Microlithography World magazine, 1993 – 2008
`Associate Editor, Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), 2002 – 2011
`Editor-in-Chief, Journal of Micro/Nanolithography, MEMS, and MOEMS (JM3), 2012 – present
`
`OTHER PROFESSIONAL EXPERIENCE
`
`Expert witness consulting in the field of lithography and semiconductor design and
`manufacturing.
`
`PUBLICATIONS
`
`Books
`
`Chris A. Mack, Fundamental Principles of Optical Lithography: The Science of Microfabrication,
`John Wiley & Sons (November, 2007)
`
`Chris A. Mack, Field Guide to Optical Lithography, SPIE Field Guide Series Vol. FG06,
`(Bellingham, WA: 2006). Also available in Japanese.
`
`C. A. Mack, Inside PROLITH: A Comprehensive Guide to Optical Lithography Simulation,
`FINLE Technologies (Austin, TX: 1997). – Out of Print.
`
`Book Chapters
`
`
`

`

`C.A. Mack, “Microlithography”, Chapter 9, Semiconductor Manufacturing Handbook, Hwaiyu
`Geng, Ed., McGraw Hill (New York: 2005).
`
`Contributed “Microlithography” entry for the McGraw Hill Encyclopedia of Science &
`Technology, 9th Edition (2005).
`
`Contributed lithography terms for: Comprehensive Dictionary of Electrical Engineering, Phillip
`A. Laplante, Ed., (CRC Press and IEEE Press, 1999).
`
`C.A. Mack, “Optical Lithography Modeling,” Chapter 2, Microlithography Science and
`Technology, J. R. Sheats and B. W. Smith, editors, Marcel Dekker (New York: 1998) pp. 109-
`170.
`
`C.A. Mack and A. R. Neureuther, “Optical Lithography Modeling,” Chapter 7, Handbook of
`Microlithography, Micromachining, and Microfabrication, Volume 1: Microlithography, P. Rai-
`Choudhury, editor, SPIE Press (Bellingham, WA: 1997) pp. 597-680.
`
`R. Hershel and C. A. Mack, “Lumped Parameter Model for Optical Lithography,” Chapter 2,
`Lithography for VLSI, VLSI Electronics - Microstructure Science Volume 16, R. K. Watts and N.
`G. Einspruch, eds., Academic Press (New York:1987) pp. 19-55.
`
`Conference Chair/Proceedings Editor
`
`Quantum Optics, Optical Data Storage, and Advanced Microlithography, Proceedings of SPIE
`Volume 6827 (2007)
`Editors: Guangcan Guo; Songhao Liu; Guofan Jin; Kees A. Schouhamer Immink; Keiji Shono;
`Chris A. Mack; Jinfeng Kang; Jun-en Yao
`
`Lithography for Semiconductor Manufacturing II, Proceedings of SPIE Volume 4404 (2001)
`Editors: Chris A. Mack; Tom Stevenson
`
`Microlithographic Techniques in Integrated Circuit Fabrication II, Proceedings of SPIE Volume
`4226 (2000)
`Editors: Chris A. Mack; XiaoCong Yuan
`
`Lithography for Semiconductor Manufacturing, Proceedings of SPIE Volume 3741 (1999)
`Editors: Chris A. Mack; Tom Stevenson
`
`Microlithographic Techniques in IC Fabrication, Proceedings of SPIE Volume 3183 (1997)
`Editors: Soon Fatt Yoon; Raymond Yu; Chris A. Mack
`
`Patents
`
`U.S. Patent 5,363,171, Photolithography exposure tool and method for in situ photoresist
`measurements and exposure control, November 8, 1994
`
`U.S. Patent 6,968,253, Computer-implemented method and carrier medium configured to
`generate a set of process parameters for a lithography process, November 22, 2005
`
`U.S. Patent 7,075,639, Method and Mark for Metrology of Phase Errors on Phase Shift Masks,
`
`

`

`July 11, 2006
`
`U.S. Patent 7,142,941, Computer-implemented Method and Carrier Medium Configures to
`Generate a Set of Process Parameters and/or a List of Potential Causes of Deviations for a
`Lithography Process, November 28, 2006.
`
`U.S. Patent 7,297,453, Systems and Methods for Mitigating Variances on a Patterned Wafer
`Using a Prediction Model, November 20, 2007.
`
`U.S. Patent 7,300,725, Method for Determining and Correcting Reticle Variations, November
`27, 2007.
`
`U.S. Patent 7,300,729, Method for Monitoring a Reticle, November 27, 2007.
`
`U.S. Patent 7,303,842, Systems and Methods for Modifying a Reticle’s Optical Properties,
`December 4, 2007.
`
`U.S. Patent 7,352,453, Method for Process Optimization and Control by Comparison Between 2
`or More Measured Scatterometry Signals, April 1, 2008.
`
`U.S. Patent 7,368,208, Measuring Phase Errors on Phase Shift Masks, May 6, 2008.
`
`U.S. Patent 7,382,447, Method for Determining Lithographic Focus and Exposure, June 3,
`2008.
`
`U.S. Patent 7,528,953, Target Acquisition and Overlay Metrology Based on Two Diffracted
`Orders Imaging, May 5, 2009.
`
`U.S. Patent 7,566,517, Feature Printability Optimization by Optical Tool, July 28, 2009.
`
`U.S. Patent 7,804,994, Overlay Metrology and Control Method, September 28, 2010.
`
`Refereed Papers
`1. C. A. Mack, “Analytical Expression for the Standing Wave Intensity in Photoresist”,
`Applied Optics, Vol. 25, No. 12 (15 June 1986) pp. 1958-1961.
`2. C. A. Mack, “Development of Positive Photoresists,” Journal of the Electrochemical
`Society, Vol. 134, No. 1 (Jan. 1987) pp. 148-152.
`3. C. A. Mack, “Contrast Enhancement Techniques for Submicron Optical Lithography,”
`Journal of Vacuum Science & Technology, Vol. A5, No. 4 (Jul./Aug. 1987) pp. 1428-1431.
`4. C. A. Mack, “Dispelling the Myths about Dyed Photoresist,” Solid State Technology, Vol.
`31, No. 1 (Jan. 1988) pp. 125-130.
`5. C. A. Mack, “Absorption and Exposure in Positive Photoresist,” Applied Optics, Vol. 27,
`No. 23 (1 Dec. 1988) pp. 4913-4919.
`6. C. A. Mack and P. M. Kaufman, “Mask Bias in Submicron Optical Lithography,” Journal of
`Vacuum Science & Technology, Vol. B6, No. 6 (Nov./Dec. 1988) pp. 2213-2220.
`7. C. A. Mack, “Understanding Focus Effects in Submicron Optical Lithography”, Optical
`Engineering, Vol. 27, No. 12 (1 Dec 1988) pp. 1093-1100.
`
`

`

`8. C. A. Mack, “Lithographic Optimization Using Photoresist Contrast,” Microelectronics
`Manufacturing Technology, Vol. 14, No. 1 (Jan. 1991) pp. 36-42.
`9. D. H. Ziger and C. A. Mack, “Generalized Approach toward Modeling Resist
`Performance,” AICHE Journal, Vol. 37, No. 12 (Dec 1991) pp. 1863-1874.
`10. C. A. Mack, E. Capsuto, S. Sethi, and J. Witowski, “Modeling and Characterization of a
`0.5µm Deep Ultraviolet Process,” Journal of Vacuum Science & Technology, Vol. B 9, No.
`6 (Nov / Dec 1991) pp. 3143-3149.
`11. D. Ziger, C. A. Mack, and R. Distasio, “Generalized Characteristic Model for Lithography:
`Application to Negative Chemically Amplified Resists,” Optical Engineering, Vol. 31, No. 1
`(1 Jan 1992) pp.98-104.
`12. C. A. Mack and J. E. Connors, “Fundamental Differences Between Positive and Negative
`Tone Imaging,” Microlithography World, Vol. 1, No. 3 (Jul/Aug 1992) pp. 17-22.
`13. D. W. Johnson and C. A. Mack, Modeling the Continuing Realm of Optical Lithography”
`Semiconductor International, Vol. 15, No. 6 (June 1992) pp. 134-139.
`14. C. A. Mack, “New Kinetic Model for Resist Dissolution,” Journal of the Electrochemical
`Society, Vol. 139, No. 4 (Apr. 1992) pp. L35-L37.
`15. C. A. Mack, “Understanding Focus Effects in Submicrometer Optical Lithography: a
`Review,” Optical Engineering, Vol. 32, No. 10 (Oct. 1993) pp. 2350-2362.
`16. E. W. Charrier, C. J. Progler and C. A. Mack, “Comparison of Simulated and Experimental
`CD-Limited Yield for a Submicron I-Line Process,” Solid State Technology, Vol. 38, No. 11
`(Nov. 1995) pp. 105-112.
`17. C. A. Mack, “Lithographic Effects of Acid Diffusion in Chemically Amplified Resists,”
`Microelectronics Technology: Polymers for Advanced Imaging and Packaging, ACS
`Symposium Series 614, E. Reichmanis, C. Ober, S. MacDonald, T. Iwayanagi, and T.
`Nishikubo, eds., ACS Press (Washington: 1995) pp. 56-68.
`18. C. A. Mack, “Evaluating Proximity Effects Using 3-D Optical Lithography Simulation,”
`Semiconductor International (July, 1996) pp. 237-242.
`19. C. A. Mack, “Trends in Optical Lithography,” Optics and Photonics News (April, 1996) pp.
`29-33.
`20. C. A. Mack, G. E. Flores, W. W. Flack, and E. Tai, “Lithographic Modeling Speeds Thin-
`Film-Head Development,” Data Storage (May/June, 1996) pp. 55-58.
`21. C. A. Mack, “Reducing Proximity Effects in Optical Lithography,” Japanese Journal of
`Applied Physics, Vol. 35 (1996) pp. 6379-6385.
`22. C. A. Mack and G. Arthur, “Notch Model for Photoresist Dissolution,” Electrochemical and
`Solid State Letters, Vol. 1, No. 2, (August, 1998) pp. 86-87.
`23. C. A. Mack, K. E. Mueller, A. B. Gardiner, J. P. Sagan, R. R. Dammel, and C. G. Willson
`“Modeling Solvent Diffusion in Photoresist,” Journal of Vacuum Science & Technology,
`Vol. B16, No. 6, (Nov., 1998) pp. 3779-3783.
`24. C. A. Mack, D. A. Legband, S. Jug, “Data Analysis for Photolithography” MicroElectronic
`Engineering, Vol. 46, Issues 1-4 (May 1999) pp. 65-68.
`25. C. A. Mack, “Electron Beam Lithography Simulation for Mask Making” MicroElectronic
`Engineering, Vol. 46, Issues 1-4 (May 1999) pp. 283-286.
`
`

`

`26. Sergey Babin, Igor Yu. Kuzmin and Chris A. Mack, “Comprehensive Simulation of
`Electron-beam Lithography Processes Using PROLITH 3/D and TEMPTATION Software
`Tools,” MicroElectronic Engineering, Volumes 57-58 (September 2001) pp. 343-348.
`27. J. Byers, C. Mack, R. Huang, S. Jug, “Automatic Calibration of Lithography Simulation
`Parameters Using Multiple Data Sets,” MicroElectronic Engineering, Volumes 61-62 (July
`2002) pp. 89-95.
`28. Chris A. Mack, “Charting the Future (and Remembering the Past) of Optical Lithography
`Simulation,” Journal of Vacuum Science & Technology, Vol. B 23, No. 6 (Nov / Dec 2005)
`pp. 2601-2606.
`29. C. A. Mack, "Accuracy, speed, new physical phenomena: The future of litho simulation,"
`Solid State Technology, February, 2006.
`30. C. A. Mack, “The Future of Semiconductor Lithography: After Optical, What Next?”,
`Future Fab International, Vol. 23 (7/9/2007).
`31. Chris A. Mack, “Fab Future”, SPIE Professional (Oct. 2008) pp. 10-11.
`32. Chris A. Mack, “Seeing Double”, IEEE Spectrum (Nov. 2008) pp. 46-51.
`33. C. Mack, “Stochastic approach to modeling photoresist development”, Journal of Vacuum
`Science & Technology, Vol. B27, No. 3 (May/Jun. 2009) pp. 1122-1128.
`34. C. A. Mack, “Stochastic Modeling in Lithography: Autocorrelation Behavior of Catalytic
`Reaction-Diffusion Systems,” Journal of Micro/Nanolithography, MEMS, and MOEMS,
`Vol. 8, No. 2 (Apr/May/Jun 2009) p. 029701.
`35. C. A. Mack, “Stochastic Modeling in Lithography: The Use of Dynamical Scaling in
`Photoresist Development,” Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol.
`8, No. 3 (Jul/Aug/Sep 2009) p. 033001.
`36. Chris Mack, “A Simple Model of Line-Edge Roughness”, Future Fab International, Vol. 34
`(July 14, 2010).
`37. C. A. Mack, “Stochastic modeling of photoresist development in two and three
`dimensions”, Journal of Micro/Nanolithography, MEMS, and MOEMS , Vol. 9, No. 4 (Oct-
`Dec, 2010) p. 041202.
`38. Chris A. Mack, “Fifty Years of Moore’s Law”, IEEE Transactions On Semiconductor
`Manufacturing, Vol. 24, No. 2 (May, 2011) pp. 202-207.
`39. C. A. Mack, James W. Thackeray, John J. Biafore, and Mark D. Smith, “Stochastic
`Exposure Kinetics of EUV Photoresists: A Simulation Study”, Journal of
`Micro/Nanolithography, MEMS, and MOEMS , Vol. 10, No. 3 (Jul-Sep, 2011) p. 033019.
`40. C. A. Mack, “Analytic form for the power spectral density in one, two, and three
`dimensions” Journal of Micro/Nanolithography, MEMS, and MOEMS , Vol. 10, No. 4 (Oct-
`Dec, 2011) p. 040501.
`41. C. A. Mack, “Reaction-diffusion power spectral density” Journal of Micro/Nanolithography,
`MEMS, and MOEMS, Vol. 11, No. 4 (Oct-Dec, 2012) p. 043007.
`42. C. A. Mack, "Generating random rough edges, surfaces, and volumes", Applied Optics,
`Vol. 52, No. 7 (1 March 2013) pp. 1472-1480.
`
`
`Invited Papers
`
`

`

`1. C. A. Mack, “Lithographic Simulation: A Review,” Lithographic and Micromachining
`Techniques for Optical Component Fabrication, Proc., SPIE Vol. 4440 (2001) pp. 59-72.
`2. Chris A. Mack, “The End of the Semiconductor Industry as We Know It,” Optical
`Microlithography XVI, Plenary Address, SPIE Vol. 5040 (2003) pp. xxi-xxxi.
`3. C. A. Mack, “The New, New Limits of Optical Lithography,” Emerging Lithographic
`Technologies VIII, Proc., SPIE Vol. 5374 (2004) pp. 1-8.
`4. Chris A. Mack, “Thirty Years of Lithography Simulation,” Optical Microlithography XVIII,
`Proc., SPIE Vol. 5754-1 (2005), pp. 1-12.
`5. C. A. Mack, “What's So Hard About Lithography?,” presented at the ICMTS (March, 2006),
`available at http://www.lithoguru.com/scientist/papers_recent.html.
`6. C. A. Mack, "Line-Edge Roughness and the Ultimate Limits of Lithography", presented at
`the SPIE Advanced Lithography Conference, February, 2012, available at
`http://www.lithoguru.com/scientist/papers_recent.html.
`7. C. A. Mack, “The future of lithography and its impact on design”, presented at the SPIE
`Advanced Lithography Conference, February 27, 2013, available at
`http://www.lithoguru.com/scientist/papers_recent.html.
`
`
`Contributed Papers
`1. C. A. Mack, “PROLITH: A Comprehensive Optical Lithography Model,” Optical
`Microlithography IV, Proc., SPIE Vol. 538 (1985) pp. 207-220.
`2. C. A. Mack and R. T. Carback, “Modeling the Effects of Prebake on Positive Resist
`Processing,” Kodak Microelectronics Seminar, Interface ’85, Proc., (1985) pp. 155-158.
`3. C. A. Mack, “Advanced Topics in Lithography Modeling,” Advances in Resist Technology
`and Processing III, Proc., SPIE Vol. 631 (1986) pp. 276-285.
`4. C. A. Mack, A. Stephanakis, R. Hershel, “Lumped Parameter Model of the
`Photolithographic Process,” Kodak Microelectronics Seminar, Interface ’86, Proc., (1986)
`pp. 228-238.
`5. C. A. Mack, “Photoresist Process Optimization,” KTI Microelectronics Seminar, Interface
`’87, Proc., (1987) pp. 153-167.
`6. T. Brown and C. A. Mack, “Comparison of Modeling and Experimental Results in Contrast
`Enhancement Lithography,” Advances in Resist Technology and Processing V, Proc., SPIE
`Vol. 920 (1988) pp. 390-403.
`7. C. A. Mack, “Understanding Focus Effects in Submicron Optical Lithography,”
`Optical/Laser Microlithography, Proc., SPIE Vol. 922 (1988) pp. 135-148.
`8. D. H. Ziger and C. A. Mack, “Lithographic Characterization of a Rapid Ammonia Catalyzed
`Image Reversal Process,” KTI Microelectronics Seminar, Interface ’88, Proc., (1988) pp.
`165-175.
`9. C. A. Mack and P. M. Kaufman, “Understanding Focus Effects in Submicron Optical
`Lithography, part 2: Photoresist effects,” Optical/Laser Microlithography II, Proc., SPIE Vol.
`1088 (1989) pp. 304-323.
`10. C. A. Mack and P. M. Kaufman, “Focus Effects in Submicron Optical Lithography, Optical
`and Photoresist Effects,” The International Congress on Optical Science & Engineering,
`Proc., Paris, France, SPIE Vol. 1138 (1989) pp. 88-105.
`
`

`

`11. C. A. Mack, “Optimum Stepper Performance Through Image Manipulation,” KTI
`Microelectronics Seminar, Interface ’89, Proc., (1989) pp. 209-215.
`12. C. A. Mack, “Algorithm for Optimizing Stepper Performance Through Image Manipulation,”
`Optical/Laser Microlithography III, Proc., SPIE Vol. 1264 (1990) pp. 71-82.
`13. C. A. Mack, “Lithographic Optimization Using Photoresist Contrast,” KTI Microlithography
`Seminar, Interface ’90, Proc., (1990) pp. 1-12.
`14. P. Trefonas and C. A. Mack, “Exposure Dose Optimization for a Positive Resist Containing
`Poly-functional Photoactive Compound,” Advances in Resist Technology and Processing
`VIII, Proc., SPIE Vol. 1466 (1991) pp. 117-131.
`15. D. Ziger, C. A. Mack, and R. Distasio, “The Generalized Characteristic Model for
`Lithography: Application to Negative Chemically Amplified Resists,” Advances in Resist
`Technology and Processing VIII, Proc., SPIE Vol. 1466 (1991) pp. 270-282.
`16. C. A. Mack, “Fundamental Issues in Phase-Shifting Mask Technology,” KTI
`Microlithography Seminar, Interface ’91, Proc., (1991) pp. 23-35.
`17. M. A. Toukhy, S. G. Hansen, R. J. Hurditch, and C. A. Mack, “Experimental Investigation of
`a Novel Dissolution Model,” Advances in Resist Technology and Processing IX, Proc.,
`SPIE Vol. 1672 (1992) pp. 286-296.
`18. C. A. Mack, “Understanding Focus Effects in Submicron Optical Lithography, part 3:
`Methods for Depth-of-Focus Improvement,” Optical/Laser Microlithography V, Proc., SPIE
`Vol. 1674 (1992) pp. 272-284.
`19. C. A. Mack and J. E. Connors, “Fundamental Differences Between Positive and Negative
`Tone Imaging,” Optical/Laser Microlithography V, Proc., SPIE Vol. 1674 (1992) pp. 328-
`338.
`20. D. W. Johnson and C. A. Mack, “I-line, DUV, VUV, or X-Ray?” Optical/Laser
`Microlithography V, Proc., SPIE Vol. 1674 (1992) pp. 486-498.
`21. C. A. Mack, “Simple Method for Rim Shifter Design: The Biased Self-Aligned Rim Shifter,”
`12th Annual BACUS Symposium, Proc., SPIE Vol. 1809 (1992) pp. 229-236.
`22. N. Thane, C. A. Mack, and S. Sethi, “Lithographic Effects of Metal Reflectivity Variations,”
`Integrated Circuit Metrology, Inspection, and Process Control VII, Proc., SPIE Vol. 1926
`(1993) pp. 483-494.
`23. C. A. Mack, “Phase Contrast Lithography,” Optical/Laser Microlithography VI, Proc., SPIE
`Vol. 1927 (1993) pp. 512-520.
`24. C. A. Mack, “Optimization of the Spatial Properties of Illumination,” Optical/Laser
`Microlithography VI, Proc., SPIE Vol. 1927 (1993) pp. 125-136.
`25. P. M. Mahoney and C. A. Mack, “Cost Analysis of Lithographic Characterization: An
`Overview,” Optical/Laser Microlithography VI, Proc., SPIE Vol.1927 (1993) pp. 827-832.
`26. C. A. Mack, “Designing the Ultimate Photoresist,” OCG Microlithography Seminar,
`Interface ’93, Proc., (1993) pp. 175-191.
`27. G. E. Flores, W. W. Flack, E. Tai, and C. A. Mack, “Lithographic Performance in Thick
`Photoresist Applications,” OCG Microlithography Seminar, Interface ’93, Proc., (1993) pp.
`41-60.
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`

`28. C. A. Mack, D. P. DeWitt, B. K. Tsai, and G. Yetter, “Modeling of Solvent Evaporation
`Effects for Hot Plate Baking of Photoresist,” Advances in Resist Technology and
`Processing XI, Proc., SPIE Vol. 2195 (1994) pp. 584-595.
`29. D. P. DeWitt, T. C. Niemoeller, C. A. Mack, and G. Yetter, “Thermal Design Methodology
`of Hot and Chill Plates for Photolithography,” Integrated Circuit Metrology, Inspection, and
`Process Control VIII, Proc., SPIE Vol. 2196 (1994) pp. 432-448.
`30. C. A. Mack, “Enhanced Lumped Parameter Model for Photolithography,” Optical/Laser
`Microlithography VII, Proc., SPIE Vol. 2197 (1994) pp. 501-510.
`31. C. A. Mack and E. W. Charrier, “Yield Modeling for Photolithography,” OCG
`Microlithography Seminar, Interface ’94, Proc., (1994) pp. 171-182.
`32. J. S. Petersen, C. A. Mack, J. W. Thackeray, R. Sinta, T. H. Fedynyshyn, J. M. Mori, J. D.
`Myers and D. A. Miller, “Characterization and Modeling of a Positive Acting Chemically
`Amplified Resist,” Advances in Resist Technology and Processing XII, Proc., SPIE Vol.
`2438 (1995) pp. 153-166.
`33. J. S. Petersen, C. A. Mack, J. Sturtevant, J. D. Byers and D. A. Miller, “Non-constant
`Diffusion Coefficients: Short Description of Modeling and Comparison to Experimental
`Results,” Advances in Resist Technology and Processing XII, Proc., SPIE Vol. 2438 (1995)
`pp. 167-180.
`34. E. W. Charrier and C. A. Mack, “Yield Modeling and Enhancement for Optical Lithography,”
`Optical/Laser Microlithography VIII, Proc., SPIE Vol. 2440 (1995) pp. 435-447.
`35. C. A. Mack, “Focus Effects in Submicron Optical Lithography, Part 4: Metrics for Depth of
`Focus,” Optical/Laser Microlithography VIII, Proc., SPIE Vol. 2440 (1995) pp. 458-471.
`36. C. A. Mack and C-B. Juang, “Comparison of Scalar and Vector Modeling of Image
`Formation in Photoresist,” Optical/Laser Microlithography VIII, Proc., SPIE Vol. 2440
`(1995) pp. 381-394.
`37. E. W. Charrier, C. J. Progler and C. A. Mack, “Comparison of Simulated and Experimental
`CD-Limited Yield for a Submicron I-Line Process,” Microelectronic Manufacturing Yield,
`Reliability, and Failure Analysis, Proc., SPIE Vol. 2635 (1995) pp. 84-94.
`38. C. A. Mack, “Lithographic Effects of Acid Diffusion in Chemically Amplified Resists,” OCG
`Microlithography Seminar Interface ‘95, Proc., (1995) pp. 217-228.
`39. C. A. Mack, T. Matsuzawa, A. Sekiguchi, Y. Minami, “Resist Metrology for Lithography
`Simulation, Part 1: Exposure Parameter Measurements,” Metrology, Inspection, and
`Process Control for Microlithography X, Proc., SPIE Vol. 2725 (1996) pp. 34-48.
`40. A. Sekiguchi, C. A. Mack, Y. Minami, T. Matsuzawa, “Resist Metrology for Lithography
`Simulation, Part 2: Development Parameter Measurements,” Metrology, Inspection, and
`Process Control for Microlithography X, Proc., SPIE Vol. 2725 (1996) pp. 49-63.
`41. S. H. Thornton and C. A. Mack, “Lithography Model Tuning: Matching Simulation to
`Experiment,” Optical Microlithography IX, Proc., SPIE Vol. 2726 (1996) pp. 223-235.
`42. C. A. Mack, “Evaluation of Proximity Effects Using Three-Dimensional Optical Lithography
`Simulation,” Optical Microlithography IX, Proc., SPIE Vol. 2726 (1996) pp. 634-639.
`43. C. A. Mack, “Reducing Proximity Effects in Optical Lithography,” Olin Microlithography
`Seminar Interface ‘96, Proc., (1996) pp. 325-336.
`
`

`

`44. C. A. Mack, “Three-Dimensional Electron Beam Lithography Simulation,” Emerging
`Lithographic Technologies, Proc., SPIE Vol. 3048 (1997) pp. 76-88.
`45. G. Arthur, C. A. Mack, B. Martin, “Enhancing the Development Rate Model For Optimum
`Simulation Capability in the Sub-Half-Micron Regime,” Advances in Resist Technology and
`Processing XIV, Proc., SPIE Vol. 3049 (1997) pp. 189-200.
`46. C.A. Mack, K.E. Mueller, A.B. Gardiner, A. Qiu, R.R. Dammel, W.G. Koros, C.G. Willson,
`“Diffusivity Measurements in Polymers, Part 1: Lithographic Modeling Results,” Advances
`in Resist Technology and Processing XIV, Proc., SPIE Vol. 3049 (1997) pp. 355-362.
`47. Allen B. Gardiner, Anwei Qin, Clifford L. Henderson, William J. Koros, C. Grant Willson,
`Ralph R. Dammel, Chris Mack, William D. Hinsberg, “Diffusivity Measurements in
`Polymers, Part 2: Residual Casting Solvent Measurement by Liquid Scintillation Counting,”
`Advances in Resist Technology and Processing XIV, Proc., SPIE Vol. 3049 (1997) pp. 850-
`860.
`48. Katherine E. Mueller, William J. Koros, Chris A. Mack, C.G. Willson, “Diffusivity
`Measurements in Polymers, Part 4: Acid Diffusion in Chemically Amplified Resists,”
`Advances in Resist Technology and Processing XIV, Proc., SPIE Vol. 3049 (1997) pp. 706-
`711.
`49. Edward Charrier, Chris A. Mack, Q. Zuo, M. Maslow, “Methodology for Utilizing CD
`Distributions for Optimization of Lithographic Processes,” Optical Microlithography X, Proc.,
`SPIE Vol. 3051 (1997) pp. 541-551.
`50. Mark E. Mason, Robert A. Soper, R. Mark Terry, and C. A. Mack, “Process-Specific Tuning
`Of Lithography Simulation Tools,” Optical Microlithography X, Proc., SPIE Vol. 3051 (1997)
`pp. 491-498.
`51. C. A. Mack, “Resolution and Depth of Focus in Optical Lithography,” Microlithographic
`Techniques in IC Fabrication, Proc., SPIE Vol. 3183 (1997) pp. 14-27.
`52. C. A. Mack, “Electron Beam Lithography Simulation for Mask Making, Part I,” 17th Annual
`BACUS Symposium on Photomask Technology and Management, Proc., SPIE Vol. 3236
`(1997) pp. 216-227.
`53. C. Sauer, D. Alexander and C. A. Mack, “Electron Beam Lithography Simulation for Mask
`Making, Part II: Comparison of the Lithographic Performance of PBS and EBR900-M1,”
`17th Annual BACUS Symposium on Photomask Technology and Management, Proc.,
`SPIE Vol. 3236 (1997) pp. 413-423.
`54. R. F. Hollman and C. A. Mack, “Accuracy of 3-D Optical Lithography Simulat