Shukri J. Souri, Ph.D.
`
`Professional Profile
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`Dr. Shukri Souri is a Corporate Vice President, Director of Exponent’s Electrical Engineering
`and Computer Science practice, and Director of Exponent’s New York office. Dr. Souri’s
`expertise is in microelectronics and computing systems. His professional activities involve
`advising industrial and legal clients as well as government entities on science and technology
`matters addressing issues related to intellectual property, product reliability, and failure analysis.
`He has led complex investigations involving electronics, computer communications, and
`software controls for safety-critical applications in the medical device, automotive, aviation and
`process controls industries.
`
`Dr. Souri’s experience in the area of microelectronics systems includes technical investigations
`into computer memories, device physics, integrated circuit (IC) fabrication processes, and
`esoteric semiconductor material systems for solid-state lighting. He also has broad experience
`with power electronic devices, circuit protection, IC packaging, and printed circuit board
`assemblies and display technologies as used in various industries including consumer appliances.
`
`In computing systems, Dr. Souri has worked extensively with embedded controls systems for
`automotive applications, computer hard disk drives and for drug delivery and implantable
`devices. He also has expertise in telephony, secure mobile and Internet communications,
`microprocessor architectures particularly for mobile computing and has analyzed
`audio/video/image processing software and developed digital asset delivery technologies.
`
`Dr. Souri received his Ph.D. in Electrical Engineering at Stanford University on 3-Dimensional
`integration of ICs and has taught several courses on IC fabrication, optical fiber communications,
`TCP/IP networking, and communications protocols and implementation of systems on 3-D chips.
`He also read Engineering Science at Balliol College, Oxford, where he specialized in
`photoreflectance microscopy of semiconductor materials. His current research interests include:
`cloud computing, information security and privacy; financial portfolio optimization, and trading
`algorithms and software.
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`Academic Credentials and Professional Honors
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`Ph.D., Electrical Engineering, Stanford University, 2003
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`M.S., Electrical Engineering, Stanford University, 1994
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`M.A., Oxford University, U.K, 2007
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`B.A., Engineering Science, Oxford University, U.K. (honors), 1992
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`Spansion Exhibit 2006
`Macronix et al v. Spansion
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`Patents
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`Patent 6,188,556: Two-Terminal Transistor PTC Circuit Protection Devices, WO0024126, 2001
`(with C. McCoy, H. Duffy, A. Cogan, and R. Bommakant).
`
`Patent 6,181,541: Transistor-PTC Circuit Protection Devices, WO0024105, 2001 (with H.Duffy,
`A. Cogan, M. Munch, and N. Nickols).
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`Patent 6,153,948: Electronic Circuits with Wide Dynamic Range of On/Off Delay Time,
`WO001249, 2000 (with A. Cogan).
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`Patent 5,569,495: Method of Making Varistor Chip with Etching to Remove Damaged Surfaces,
`CA2220931, EP0826225, WO963978, JP11505375T, 1996 (with A. Evans, T.Tsukada, and R.
`Dupon).
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`Publications
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`D’Andrade B, Kattamis AZ, Murphy PF, McNulty J, Souri S. Arcing enabled by tin whiskers.
`IEEE: Reliability Society 2010 Annual Technical Report, 2010.
`
`Fu J, Souri S, Harris J. Temperature and humidity dependent reliability analysis of RGB LED
`chip. Proceedings, ISTFA 2006: Discretes, Passives, MEMS, and Optoelectronics, pp. 137–141,
`2006.
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`Saraswat K, Kapur P, Souri S. Performance limitations of metal interconnects and possible
`alternatives. 203rd Meeting of the Electrochemical Society, Paris, France, April 2003.
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`Saraswat K, Kapur P, Chandra G, Chiang T-Y, Souri S. Scaling induced performance
`limitations of metal interconnects. IEEE ISSCC Microprocessor Design Workshop, San
`Francisco, CA, February 2002.
`
`Chiang T, Souri S, Chui C, Saraswat K. Thermal analysis of heterogeneous 3-D ICs with
`various integration scenarios. IEEE IEDM, December 2001.
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`Banerjee K, Souri S, Kapur P, Saraswat K. 3-D Heterogeneous ICs: A technology for the next
`decade and beyond. 5th IEEE Workshop on Signal Propagation on Interconnects, Venice, Italy,
`May 2001.
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`Banerjee K, Souri S, Kapur P, Saraswat K. 3-D ICs: A novel chip design for improving deep-
`submicrometer interconnect performance and systems-on-chip integration. Proceedings, IEEE:
`Special Issue on Interconnections, Vol. 89, No. 5, pp. 602–633, May 2001.
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`Davis J, Venkatesan R, Kaloyeros A, Bylansky M, Souri S, Banerjee K, Saraswat K, Rahman A,
`Reif R, Meindl J. Integration limits on Gigascale Integration (GSI) in the 21st Century.
`Proceedings, IEEE: Special Issue of Limits to Semiconductor Technology, Vol. 89, No. 3, pp.3-
`05–324, March 2001.
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`Saraswat K, Banerjee K, Joshi A, Kalvade P, Kapur P, Souri S. 3-D ICs: Motivation,
`performance analysis and technology. Proceedings, 26th European Solid-State Circuits
`Conference (ESSCIRC), Stockholm, Sweden, September 19–21, 2000.
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`Souri S, Banerjee K, Mehrotra A, Saraswat KC. Multiple Si layer ICs: Motivation, performance
`analysis, and design implications. 37th ACM Design Automation Conference (DAC), pp. 213–
`220, Los Angeles, CA, June 5–9, 2000.
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`Saraswat K, Banerjee K, Joshi A, Kalavade P, Souri S, Subramanian V. 3-D ICs with multiple
`Si Layers: Performance analysis, and technology. 5th International Symposium on Low and
`High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, 197th
`Meeting of the Electrochemical Society, Toronto, Canada, May 14–19, 2000.
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`Saraswat K, Souri S, Subramanian V, Joshi A, Wang A. Novel 3-D structures. Proceedings,
`IEEE International SOI Conference, pp. 54–55, 1999.
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`Subramanian V, Toita M, Ibrahim N, Souri S, Saraswat K. Low-leakage germanium-seeded
`laterally-crystallized single-grain 100nm TFTs for vertical integration applications. IEEE
`Electron Device Letters, Vol. 20, pp. 341–343, 1999.
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`Souri S, Saraswat K. Interconnect performance modeling for 3D integrated circuits with
`multiple Si layers. IEEE International Interconnect Technology Conference, pp. 24–26, 1999.
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`Haskell B, Souri S, Helfand M. Varistor behavior at twin boundaries in ZnO. Journal of the
`American Ceramic Society, Vol. 82, No. 8, August 1999.
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`Chu A, Souri S, Melfand M, Kinsman K, Dupon R. Superior electrical performance of Raychem
`ZnO Varistor through advanced processing. Proceedings, 1st Asian Meeting on Ferroelectricty,
`Xian, China, October 5–8, 1995.
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`Book Chapters
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`Souri S, Chiang T, Kapur P, Banerjee K, Saraswat KC. 3-D ICs deep submicron interconnect
`performance modeling and analysis. In: Interconnect Technology and Design for Gigascale
`Integration. Davis J and Meindl J (eds), Kluwer Academic Publishers, October 2003.
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`Speaker Engagements
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`Souri S. 3-Dimensional ICs interconnect architecture, technology and performance analysis.
`Oral Defense, Stanford University, 2003.
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`Souri S. 3-D ICs with multiple Si Layers: performance analysis and technology. Solid State
`Technology and Devices Seminar, Microlab, UC Berkeley, 2001.
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`Souri S. 3D ICs: Performance, analysis and technology. Integrated Circuits and Technology
`Seminar, Stanford University, 2001.
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`Souri S. Photoreflectance microscopy of semiconductor materials. Raychem Corporation,
`CR&D, Menlo Park, CA, 1994.
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`Prior Experience
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`Founder, Merenga Inc., 2000–2002
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`Co-Founder and Engineering Manager, arcadiaOne, Inc., 1999–2000
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`Research Engineer, Circuit Protection Division, Raychem, 1996–1997
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`Research Scientist, Corporate Research & Development, Raychem, 1994–1996
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`Professional Affiliations
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`Institution of Engineering and Technology—IET (member)
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`Institute of Electrical and Electronic Engineers (senior member)
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` Oxford University Society (life member)
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` Oxford Union (member)
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`Testimony Within The Past Decade
`
`In RE TFT-LCD (Flat Panel) Antitrust Litigation, Master File No. C07-1827 SI, MDL No. 1827
`in the United States District Court, Northern District of California, San Francisco Division.
`Depositions 2011, 2012 and 2014. Arbitration 2012. Trial 2013.
`
`Hennigan vs General Electric Company, in the United States District Court, Eastern District of
`Michigan, Civil Action No: 2:10-cv-14155-DPH-MKM. Deposition 2013.
`
`Boyle vs. Ford Motor Company, in the Superior Court of the State of Arizona, in and for the
`County of Pima, Case No. C20123751 (Consolidated). Deposition 2013. Trial 2013.
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`Alberto vs. Toyota Motor Corporation, et al., in the Circuit Court for the Country of Genesee,
`Michigan, Case No. 09-91973. Deposition 2013.
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`St. John vs. Toyota Motor Corporation, et al., in the United States District Court, Central
`District of California, Southern Division, Case No. 8:10-cv-01460. Deposition 2013.
`
`Guzik Technical Enterprises vs. Western Digital Corporation, in the United States District
`Court, Northern District of California, Case No. CV-11-03786. Deposition 2013.
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`City of Los Angeles, Sacramento Metropolitan Cable Television Commission, and City of El
`Segundo vs. Pacific Bell Telephone Company, in the Superior Court of The State of California,
`County of Los Angeles, Civil Action No. BC-414272. Deposition 2012.
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`In RE Toyota Motor Corp. Unintended Acceleration, Marketing Sales Practices, And Product
`Liability Litigation, in the United States District Court, Central District of California, Case No.
`8:10ML2151 and Van Alfen v. Toyota Motor Sales, U.S.A., Inc., et al. in the United States
`District Court, Central District of California, CV11-08120. Deposition 2012.
`
`Richard A. Williamson, On Behalf of And As Trustee For At Home Bondholders' Liquidating
`Trust v Citrix Online, LLC, et al., in the United States District Court, Central District of
`California, Western Division. Deposition 2012.
`
`Nemeth v Medtronic et al., Cause No. 042-01409, in the Twenty-Second Judicial Circuit, St.
`Louis City, Missouri Circuit Court. Deposition 2012.
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`Peter Romans vs. Texas Instruments Inc. et al. in the Court of Common Pleas, Madison County,
`Ohio, Case No. CVH20100126. Deposition 2012.
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`Spansion, LLC v Samsung Electronics Co., Ltd. et al., Civil Action No. 1:10-cv-881-LO-JFA in
`the United States District Court For The Eastern District of Virginia, Alexandria Division.
`Deposition 2011.
`
`In the Matter of Certain Flash Memory Chips and Products Containing the Same, Investigation
`No. 337-TA-735, before the United States International Trade Commission. Deposition 2011.
`
`United States House of Representatives Committee on Energy and Commerce
`investigation into complaints of sudden unintended acceleration in vehicles manufactured
`by Toyota Motor Corporation. Interview with Committee staff 2010.
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`Automated Transactions, LLC v IYG Holding Co. et al., Case No. 06-CV-43 in the United States
`District Court For The District Of Delaware. Deposition 2010.
`
`In the Matter of Certain Flash Memory Chips and Products Containing the Same, Investigation
`No. 337-TA-664, before the United States International Trade Commission. Depositions 2009,
`2010. Trial 2010.
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`Durfee v Sea Turtle Inn Case No. 312009CA011961 in the Circuit Court of the 19th Judicial Circuit
`In and For Indian River County, Florida. Deposition 2010.
`
`In the Matter of Certain Electronic Devices, Including Handheld Wireless
`Communications Devices,
`Investigation No. 337-TA-673 and 337-TA-667
`(Consolidated), before the United States International Trade Commission. Depositions
`2009. Trial 2009.
`
`In the Matter of Certain Semiconductor Integrated Circuits and Products Containing
`Same, Investigation No. 337-TA-665, before the United States International Trade
`Commission. Deposition 2009. Trial 2009.
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`In the Matter of Certain Semiconductor Integrated Circuits Using Tungsten
`Metallization and Products Containing Same, Investigation No. 337-TA-648, before the
`United States International Trade Commission. Deposition 2009.
`
`Convolve, Inc. and MIT v Compaq Computer Corp. and Seagate Technology, LLC. Case No. 00
`CIV. 5141 in the United States District Court, Southern District of New York. Deposition 2008.
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`Gertrude Neumark Rothschild v Cree, Inc. Case No. 05 CIV. 5939 in the United States District
`Court, Southern District of New York. Deposition 2008.
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`GTX Corporation v Kofax Image Products, Inc. et al. Case No. 6:06-cv-244 [LED] in the
`United States Eastern District of Texas, Tyler Division. Deposition 2008.
`
`Unicom Monitoring, LLC. v Cencom, Inc. Civil Action No. 3:06-CV-01166-MLC-JJH in the
`United States District Court, District of New Jersey. Deposition 2007.
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`Zykronix, Inc. v Coraccess Systems, LLC. Case No. 2004CV7764 in the District Court of the
`City and County of Denver in the State of Colorado. Deposition 2006.
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`Ericsson Wireless v Vicor Corporation. Case No. GIC829632 in the Superior Court in the State of
`California, County of San Diego. Deposition 2006.
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`Fujitsu Limited v Cirrus Logic, Inc. et al. Case No. CV808650 in the Superior Court in the State of
`California, County of Santa Clara. Deposition 2005.
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`Maxtor Corporation v Koninklijke Philips Electronics N.V. et al. Case No. CV808650 in the
`Superior Court in the State of California, County of Santa Clara. Deposition 2004. Trial 2004.
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