`571-272-7822
`
`
`
`Paper 26
`
`Entered: November 14, 2014
`
`
`
`UNITED STATES PATENT AND TRADEMARK OFFICE
`____________
`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`____________
`
`TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,
`TSMC NORTH AMERICA CORPORATION, FUJITSU
`SEMICONDUCTOR LIMITED, FUJITSU SEMICONDUCTOR
`AMERICA, INC., THE GILLETTE COMPANY, ADVANCED MICRO
`DEVICES, INC., RENESAS ELECTRONICS CORPORATION,
`RENESAS ELECTRONICS AMERICA, INC., GLOBAL FOUNDRIES
`U.S., INC., GLOBALFOUNDRIES DRESDEN MODULE ONE LLC &
`CO. KG, GLOBALFOUNDRIES DRESDEN MODULE TWO LLC & CO.
`KG, TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC.,
`TOSHIBA AMERICA INC., TOSHIBA AMERICA INFORMATION
`SYSTEMS, INC., and TOSHIBA CORPORATION,
`Petitioners,
`
`v.
`
`ZOND, LLC,
`Patent Owner.
`____________
`
`Case IPR2014-00799
`Patent 7,808,184 B21
`____________
`
`
`Before JONI Y. CHANG, Administrative Patent Judge.
`
`DECISION
`
`
`
`1 This Decision addresses the same issue in the inter partes reviews listed in
`the Appendix. Therefore, we issue one Decision to be filed in all of the
`cases. The parties, however, are not authorized to use this style of filing in
`subsequent papers.
`
`
`
`
`IPR2014-00799
`Patent 7,808,184 B2
`
`
`Motions to Expunge
`37 C.F.R. § 42.7
`
`Patent Owner Zond, LLC (“Zond”) filed a Motion to Expunge
`
`(Paper 252) draft versions of Motions for Pro Hac Vice Admission and
`
`supporting evidence (Papers 19–22) in each of the proceedings identified in
`
`the Appendix. The Motions to Expunge are unopposed. Paper 25, 2.
`
`Zond subsequently filed the final versions of the Motions for Pro Hac
`
`Vice Admission (Papers 23, 24) and supporting evidence (Exs. 2005, 2006),
`
`which will be decided in due course. For clarity of the record, Zond’s
`
`Motions to Expunge the draft versions are hereby granted.
`
`Accordingly, it is
`
`ORDERED that the following papers will be expunged upon the entry
`
`of the instant Decision: IPR2014-00477, Papers 19–22; IPR2014-00479,
`
`Papers 16–19; IPR2014-00578, Papers 18–21; IPR2014-00604, Papers 13–
`
`16; IPR2014-00799, Papers 19–22; and IPR2014-00803, Papers 18–21.
`
`
`
`
`
`
`
`
`
`2 For the purpose of clarity and expediency, we treat IPR2014-00799 as
`representative, and all citations are to IPR2014-00799 unless otherwise
`noted.
`
`2
`
`
`
`IPR2014-00799
`Patent 7,808,184 B2
`
`
`APPENDIX
`
`
`
`U.S. Patent Numbers
`
`Inter Partes Reviews
`
`6,896,775 B2
`
`7,808,184 B2
`
`8,125,155 B2
`
`
`
`
`
`IPR2014-00578
`IPR2014-00604
`
`IPR2014-00799
`IPR2014-00803
`
`IPR2014-00477
`IPR2014-00479
`
`
`
`3
`
`
`
`IPR2014-00799
`Patent 7,808,184 B2
`
`
`For PATENT OWNER:
`
`Gregory J. Gonsalves
`gonsalves@gonsalveslawfirm.com
`
`Bruce J. Barker
`bbarker@chsblaw.com
`
`
`For PETITIONERS:
`
`TSMC and Fujitsu:
`
`David M O’Dell
`david.odell.ipr@haynesboone.com
`
`David L. McCombs
`david.mccombs.ipr@haynesboone.com
`
`Richard C. Kim
`rckim@duanemorris.com
`
`Anthony J. Fitzpatrick
`AJFitzpatrick@duanemorris.com
`
`Donald D. Jackson
`Donald.jackson@haynesboone.com
`
`Gillette:
`
`Michael A. Diener
`michael.diener@wilmerhale.com
`
`Larissa B. Park
`larissa.park@wilmerhale.com
`
`
`
`GlobalFoundries:
`
`David Tennant
`dtennant@whitecase.com
`
`4
`
`
`
`IPR2014-00799
`Patent 7,808,184 B2
`
`
`Dohm Chankong
`dohm.chankong@whitecase.com
`
`
`AMD:
`
`David M. Tennant
`dtennant@whitecase.com
`
`Brian M. Berliner
`bberliner@omm.com
`
`Byan K. Yagura
`ryagura@omm.com
`
`Xin-Yi Zhou
`vzhou@omm.com
`
`
`
`5
`
`
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