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`Patent No. 7,811,421
`IPR2014-00800
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`UNITED STATES PATENT AND TRADEMARK OFFICE
`_____________________
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`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`_____________________
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`
`TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD, AND
`TSMC NORTH AMERICA CORP.
`Petitioner
`
`v.
`
`ZOND, LLC
`Patent Owner
`
`U.S. Patent No. 7,811,421
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`_____________________
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`Inter Partes Review Case No. 2014-00800
`_____________________
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`PATENT OWNER’s PRELIMINARY RESPONSE
`UNDER 37 CFR § 42.107(a)
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`Patent No. 7,811,421
`IPR2014-00800
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`TABLE OF CONTENTS
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`I.
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`INTRODUCTION .................................................................................................................. 1
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`II. TECHNOLOGY BACKGROUND .................................................................................... 5
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`A. Overview of Sputtering Systems ..................................................................................... 5
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`B. The ‘421 Patent: Dr. Chistyakov Invents an Improved Sputtering Source. ................ 7
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`III. SUMMARY OF PETITIONER’S PROPOSED GROUNDS ........................................ 13
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`IV. CLAIM CONSTRUCTION UNDER 37 C.F.R. §§ 42.104(B)(3) .................................. 13
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`A. Construction of “Weakly Ionized Plasma” and “Strongly Ionized Plasma” ........... 13
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`V. PETITIONER HAS FAILED TO SHOW A REASONABLE LIKELIHOOD
`OF PREVAILING. .............................................................................................................. 15
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`A. All Grounds Rely on Claim Charts Submitted in Violation of Rules
`42.24(a)(i) and 42.6(a)(3) ..................................................................................... 15
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`B. Defects in Ground I: Petitioner Failed To Demonstrate That Claims 1, 2, 8,
`10 - 13, 15, 16, 34, 38, 39, 43, and 46 - 48 Are Anticipated by Mozgrin ............... 17
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`1. Overview of Mozgrin .......................................................................................... 18
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`2. Petitioner Fails to Show a Reasonable Likelihood that Mozgrin Expressly
`or Inherently Teaches Each and Every Aspect of the Challenged
`Claims. .................................................................................................................. 20
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`a. Mozgrin Does Not Teach a Sputtering Source Comprising a Cathode
`Assembly Having a Sputtering Target Positioned Adjacent to an
`Anode. ............................................................................................................. 20
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`b. Mozgrin Does Not Describe the Claimed Pulse for Creating a Weak
`Plasma and Then a Strongly-Ionized Plasma From the Weak. ................. 22
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`c. Mozgrin Does Not Teach The Claimed Generation of a Pulse whose
`Amplitude and Rise Time Are Chosen to Increase Ion Density
`Without Arcing .............................................................................................. 24
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`d. Conclusion: Petitioner Has Not Shown a Reasonable Likelihood of
`Success on Any Claim Challenged in Ground I. ........................................ 26
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`C. Defects In Ground II: Petitioner Failed To Demonstrate A Reasonable
`Likelihood That Claims 1, 2, 8, 10 - 13, 16, 17, 22-25, 33, 34, 39, 42, 43,
`and 46 - 48 Are Anticipated by Wang ...................................................................... 26
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`a. Wang Does Not Show the Claimed Pulse for Creating a Weak
`Plasma and Then a Strongly-Ionized Plasma From the Weak
`Without Arcing. ............................................................................................. 27
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`b. Wang Does Not Teach The Claimed Generation of a Pulse Whose
`Rise Time Is Chosen to Increase Ion Density Without Arcing. ................ 28
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`D. Petitioner’s Grounds Based Upon Obviousness. ........................................................ 29
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`1. Petition’s Grounds III and IV Fail to Follow the Proper Legal
`Framework For an Obviousness Analysis. ........................................................ 30
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`2. Defects In Ground III: Petitioner Failed To Demonstrate A Reasonable
`Likelihood That Independent Claim 17 and its Dependent Claims 22 – 25,
`27 – 30, 33 and 42 Are Obvious Over Mozgrin and Lantsman under 35
`U.S.C. § 103(a) ........................................................................................................... 31
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`3. Petitioner Fails to Show a Reasonable Likelihood of success on any
`Claim in Ground III for the Same Reasons Recited in Opposition to
`Ground I. .............................................................................................................. 31
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`4. Defects In Ground IV: Petitioner Failed To Demonstrate A Reasonable
`Likelihood That Dependent Claims 15, 27 and 38 Are Obvious Over
`Wang and Mozgrin under 35 U.S.C. § 103(a) ......................................................... 33
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`VI. CONCLUSION .................................................................................................................... 35
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`ii
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`I.
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`Introduction
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`The Petitioner has represented in a motion for joinder (paper no. 6) that
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`this petition “is identical to the Intel IPR [no. IPR2014-00468] in all
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`substantive respects, includes identical exhibits, and relies upon the same
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`expert declarant.” Accordingly, based upon that representation, the Patent
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`Owner opposes review on the same basis presented in opposition to Intel’s
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`request no. IPR2014-00468, which is repeated below:
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`The present petition for inter partes review of U.S. Patent No. 7,811,421
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`(“the ‘421 patent”) relies primarily on two prior art references, Mozgrin1 and
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`Wang2 that were already considered by the Patent Office3 and offers no
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`persuasive reasons why the Board should reach a different conclusion here.
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`The claims are directed to a sputtering source for sputtering material
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`from a sputter target, and a method for high deposition rate sputtering. The
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`claimed source and method generate a voltage pulse for creating the ions
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`needed for sputtering, wherein the pulse’s shape is chosen or adjusted to create
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`a weakly ionized plasma and then a strongly ionized plasma from the weak,
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`1 Ex. 1003, Mozgrin.
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`2 Ex. 1004, Wang patent No. 6,413,382 (“Wang”).
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`3 Ex. 1001, ‘421 Patent, list of cited references cited.
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`1
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`but without arcing. The Petition first argues that Mozgrin anticipates such
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`claims, even though it is a research paper that does not describe a sputter
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`source for sputtering material from a target, and never discloses any
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`experiments that teach the particular type of pulse technique claimed.
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`The Petition next cites to Wang. Wang at least describes sputtering from
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`a target, but as Petitioner acknowledges, “Wang teaches that arcing may occur
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`during ignition” of the plasma.4 This is blatantly at odds with the claimed
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`requirement that the generated pulse “create a weakly ionized plasma …
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`without an occurrence of arcing.” The Petition tries to diminish the
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`significance of this shortcoming by citing to Wang’s observation that “the
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`initial plasma ignition needs to be performed only once.”5 But this changes
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`nothing in an anticipation analysis.
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`Furthermore, when the Petition resorts to its backup obviousness
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`theories using these same references, it never cures the shortcomings of the
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`references. In fact, it does not address these shortcoming or any differences
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`between the claims and the art, as required by the Supreme Court for a proper
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`4 Petition at 36.
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`5 Petition at page 36, quoting Ex. 1004, Wang.
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`2
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`obviousness analysis. It also relies upon several claim charts filed in violation
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`of rules §42.24(a)(i) and §42.6.6
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`Lastly, the Petitioner tries to convince the Board that Zond
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`misrepresented Mozgrin’s teachings during prosecution of Zond’s U.S. patent
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`number 7,147,759 (“the ‘759 Patent”).7 A mere glance at the record reveals to
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`the contrary: In the alleged misrepresentation, Zond argued that Mozgrin does
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`not teach a process in which “ground state atoms” are excited to form “excited
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`atoms,” and then the excited atoms are “ionizing without forming an arc.”8
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`On the basis of this assertion, the Petitioner accuses Zond of wrongly asserting
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`that “Mozgrin does not teach ‘without forming an arc.’”9 The Patent Owner
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`(i.e., the Applicant at that time), never argued, as alleged by the Petitioner, that
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`the claims were allowable solely because of the “without forming an arc”
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`6 Graham v. John Deere Co., 383 U.S. 1, 17-18, 148 USPQ 459, 467 (1966); KSR
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`Int’l Co. v. Teleflex Inc., 550 U.S. 398, 399 (2007) (“[T]he [Graham] factors
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`define the controlling inquiry”); Liberty Mutual v. Progressive Casualty, CMB-
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`2012-00003, paper 7 at 2 – 3.
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`7 Petition at p. 18., Ex. 1007, ‘759 Patent.
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`8 Ex. 1021, Response of May 2, p. 13 – 16.
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`9 Petition at p. 18.
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`3
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`limitation; it instead argued, inter alia, that “there is no description in Mozgrin
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`of a multi-step ionization process that first excites ground state atoms to
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`generate excited atoms, and then ionizes the excited atoms without forming an
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`arc discharge.”10 That is, the Patent Owner argued that Mozgrin did not teach
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`avoidance of an arc discharge during a particular process that was the subject
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`of the ‘759 patent: a multi-step ionization process. In other words, the
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`Petitioner mischaracterized the Patent Owner’s argument to the Examiner by
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`truncating it and quoting only a small portion of it in the Petition.
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` In short, the Petition does not precisely state the relief requested11 and
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`fails to demonstrate a reasonable likelihood that any challenged claim is
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`unpatentable.12 On the basis of the record presented in the present Petition,
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`review should be denied.
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`10 Exhibit 1313, Response to Office Action, May 2, 2006, p. 13 (emphasis
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`omitted).
`11 37 C.F.R. § 42.104(b).
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`12 37 C.F.R. § 42.108(c).
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`4
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`II. Technology Background
`A. Overview of Sputtering Systems
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`Sputtering is a known technique for depositing a thin film of material on
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`a substrate. Sputtering systems include a cathode assembly 114 that includes a
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`sputtering target 116 made of a material that is desired for the thin film:
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`Fig. 2
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`Fig. 3
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`The sputtering source bombards the target surface 156 with ions to dislodge
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`atoms, causing them to deposit on the substrate in a thin film.13 Positive ions
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`154 are driven into the surface 156 of the sputtering target 116 by an electric
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`field at an angle of incidence and with sufficient energy to knock atoms 160,
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`170 from the target.14 The dislodged atoms “flow to a substrate where they
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`deposit as a film of target material.”15
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`13 Ex. 1001, ‘421 patent, col 1, lines 15 – 22.
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`14 Ex. 1001, ‘421 patent, col. 5, lines 20 - 30.
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`15 Ex. 1001, ‘421 patent, col. 1, lines 20 – 21.
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`To create ions for sputtering, a voltage source applies an electric field to
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`a gas that frees some electrons from their gas molecules to form a gaseous
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`mixture of electrons, positively charged molecules and neutral gas molecules,
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`i.e., a “plasma.” The density of ions produced depends, inter alia, upon the
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`strength of the applied electric field.
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`The rate at which material sputters from the target increases with the
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`density of ions in the plasma.16 One known way to increase the plasma density
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`is to strengthen the ionizing electric field. But this can induce high currents
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`that generate undesirable heating and damage to the target, as well as electrical
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`arcing that “corrupts the sputtering process.”17 One known solution to this
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`problem is to apply the strong electric field in short bursts that temporarily
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`provide the desired field strength, but at a lower average power to reduce the
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`undesirable effects.18 However, such high power pulses “can still result in
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`undesirable electric discharges and undesirable target heating.”19 The ‘421
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`16 Ex. 1001, ‘421 patent, col 3, lines 3 – 7.
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`17 Ex. 1001, ‘421 patent, col 3, lines 20 – 29.
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`18 Ex. 1001, ‘421 patent, col 3,lines 30 - 35.
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`19 Ex. 1001, ‘421 patent, col 3, lines 36 - 38.
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`patent describes an improved pulsed system for generating a strongly ionized
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`plasma for use in sputtering material from a sputter target, but without arcing.
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`B. The ‘421 Patent: Dr. Chistyakov Invents an Improved
`Sputtering Source.
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`To overcome the problems of the prior art, Dr. Chistyakov invented a
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`magnetically enhanced sputtering source having a particular structure of an
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`anode, cathode, ionization source, magnet and power supply generating a
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`particular type of voltage pulse to perform a multi-step ionization process
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`without forming an arc discharge as illustrated in Fig. 4 of the ‘421 patent,
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`reproduced below:
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`As illustrated by Fig. 4, Dr. Chistyakov’s magnetically enhanced sputtering
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`source includes an anode 238 and a cathode assembly 216 having a sputtering
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`target 220 made of the material to be sputtered that is positioned inside the
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`cathode 218.20 The anode 238 is positioned adjacent to the cathode assembly
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`“so as to form a gap 244 between the anode 238 and the cathode assembly 216
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`that is sufficient to allow current to flow through a region 245 between the
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`anode 238 and the cathode assembly 216.”21 The gap 244 and the total volume
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`of region 245 are parameters in the ionization process.”22 The “cathode
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`assembly 216 includes a cathode 218 and a sputtering target 220 composed of
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`target material.”23
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`“[T]he pulsed power supply 234 is a component in an ionization source
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`that generates the weakly-ionized plasma.”24 “The pulsed power supply
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`applies a voltage pulse between the cathode assembly 216 and the anode
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`20 Ex. 1001, ‘421 patent, col. 6, line 46 – col. 7, line 6.
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`21 Ex. 1001, ‘421 patent, col. 7, lines 30 - 31.
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`22 Ex. 1001, ‘421 patent, col. 7, lines 35 - 38.
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`23 Ex. 1001, ‘421 patent, col. 6, lines 47 - 49.
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`24 Ex. 1001, ‘421 patent, col. 8, lines 13 - 15.
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`238.”25 “The amplitude and shape of the voltage pulse are such that a weakly-
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`ionized plasma is generated in the region 246 between the anode 238 and the
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`cathode assembly 216.”26 “The peak plasma density of the pre-ionized plasma
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`depends on the properties of the specific plasma processing system.”27
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`The ‘421 patent describes techniques for controlling a voltage pulse to
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`form a strongly ionized plasma that yields the desired sputtering from a
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`sputtering target, but without arcing. The ‘421 patent proposes that if the
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`shape of a pulse is chosen correctly, the density of ions generated by the pulse
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`can be increased to a desired level but in a controlled manner that avoids
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`arcing.28
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`The patent describes several systems. In one, a shaped pulse creates a
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`weakly ionized plasma and then transitions it into a strongly ionized
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`condition.29 In the other system, a continuous DC power source generates and
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`25 Ex. 1001, ‘421 patent, col. 8, lines 16 - 17.
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`26 Ex. 1001, ‘421 patent, col. 8, lines 18 - 21.
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`27 Ex. 1001, ‘421 patent, col. 8, lines 27 - 29.
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`28 Ex. 1001, ‘421 patent, col. 8, lines 18 – 21; col. 16, lines 60 – 64.
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`29 Ex. 1001, ‘421 patent, col.8, lines 13 – 37.
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`maintains a weakly ionized plasma,30 and a shaped pulse is superimposed to
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`transition the existing weak plasma into a strongly ionized state.
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`The first version is described in connection with the pulsed power supply
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`234 shown in fig. 4. The pulsed supply 234 generates a pulse for creating a
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`weakly ionized plasma:
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`In one embodiment, the pulsed power supply 234 is a component
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`of an ionization source that generates the weakly-ionized plasma.
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`The pulsed power supply applies a voltage pulse between the
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`cathode assembly 216 and the anode 238. In one embodiment, the
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`pulsed power supply 234 applies a negative voltage pulse to the
`cathode assembly 216. The amplitude and shape of the voltage
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`pulse are such that a weakly-ionized plasma is generated in the
`region 246 between the anode 238 and the cathode assembly 216.31
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`After the weakly–ionized plasma is formed, the pulsed power supply 234
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`increases power to transition the weakly ionized plasma to a strongly-ionized
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`plasma:
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`Once the weakly-ionized plasma is formed, high-power pulses are
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`then generated between the cathode assembly 216 and the anode
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`238. In one embodiment, the pulsed power supply 234 generates
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`the high-power pulses. The desired power level of the high-power
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`30 Ex. 1001, ‘421 patent, col. 8, lines 45 – 48.
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`31 Ex. 1001, ‘421 patent, col. 8, lines 13 – 22.
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`pulse depends on several factors including the desired deposition
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`rate, the density of the pre-ionized plasma, and the volume of the
`plasma, for example.32
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`The patent explains that “the shape and duration of the leading edge 356 and
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`the trailing edge 358 of the high-power pulse 354 is chosen so as to sustain the
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`weakly-ionized plasma 262 while controlling the rate of ionization of the
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`strongly-ionized plasma 268.33
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`With regard to the second version referred to above, the ‘421 patent
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`mentions that the weakly ionized plasma can instead be generated with a
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`“direct current (DC) power supply” not shown in the patent’s figures:
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`In one embodiment, a direct current (DC) power supply (not
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`shown) is used to generate and maintain the weakly-ionized or
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`pre-ionized plasma. In this embodiment, the DC power supply is
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`adapted to generate a voltage that is large enough to ignite the pre-
`ionized plasma.34
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`However, the claims of the ‘421 patent are directed to the technique wherein a
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`pulse first ignites a weakly ionized plasma without arcing, and then increases
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`the ion density into a strongly ionized plasma. The amplitude, rise time and
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`32 Ex. 1001, ‘421 patent, col. 9, lines 29 – 36.
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`33 Ex. 1001, col. 16, lines 60 – 64.
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`34 Ex. 1001, col. 8, lines 45 – 48.
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`duration of the pulse are chosen to create a weakly ionized plasma and then
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`transition it into a strongly-ionized plasma without arcing.35
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`35 Ex. 1001, col. 8, lines 18 – 21; col. 9, lines 16 – 19; col. 16, lines 60 – 64.
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`III. Summary of Petitioner’s Proposed Grounds
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`For the Board’s convenience, here is a summary of the Petition’s proposed
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`claim rejections:
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`Ground
`I
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`II
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`III
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`IV
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`Alleged Basis
`102(b)
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`Art
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`Mozgrin
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`Claims
`1, 2, 8, 10 – 13, 15, 16, 34,
`38, 39, 43, and 46 – 48.
`1, 2, 8, 10 – 13, 16, 17, 22
`– 25, 28 – 30, 33, 34. 39,
`42, 43 and 46 – 48.
`17, 22 – 25, 27 – 30, 33,
`and 42.
`15, 27 and 38
`103
`Wang and Mozgrin
`IV. Claim Construction Under 37 C.F.R. §§ 42.104(b)(3)
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`102(b)
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`Wang
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`103
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`Mozrin and Lantsman
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`Pursuant to Rule §42.104(b)(3), the Petitioner “must identify [] how the
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`claim is to be construed” for purposes of comparing the challenged claim the
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`cited art. The present Petition construes only the claimed phrases “strongly-
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`ionized plasma” and “weakly-ionized plasma.” For all other claim language it
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`offers no explicit construction, leaving the reader to infer the Petitioner’s
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`“interpretation” from its allegations that the claimed features are taught by the
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`prior art.
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`A. Construction of “Weakly Ionized Plasma” and “Strongly
`Ionized Plasma”
`The Petitioner’s proposed constructions of the claim terms “strongly
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`ionized plasma,” and “weakly ionized plasma” are wrong because they are not
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`the broadest reasonable constructions consistent with the specification. In
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`13
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`particular, the Petitioner’s proposed construction of “strongly ionized plasma”
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`as a “higher density plasma” is wrong because the proposed construction reads
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`the claim term “ionized” out of the claim. That is, the Petitioner’s proposed
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`construction of “strongly ionized plasma” is incomplete because it does not
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`specify what the term “density” refers to.
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`The proper construction of “strongly ionized plasma” is “a plasma with
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`a relatively high peak density of ions.” This proposed construction specifies
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`that the term “density” refers to ions and therefore, is consistent with the claim
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`language. Moreover, the proposed construction is also consistent with the
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`specification of the ‘421 patent which indicates that a strongly ionized plasma
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`is also referred to as a “high-density plasma.”36 In addition, the proposed
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`construction is consistent with the specification of the ‘759 patent that refers to
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`“strongly ionized plasma [as] having a large ion density.”37 The term
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`‘strongly-ionized plasma’ is defined herein to mean a plasma with a relatively
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`high peak density of ions.
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`For similar reasons, the proper construction of the claim term “weakly
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`ionized plasma” is “a plasma with a relatively low peak density of ions.” In
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`36 Ex. 1001, ‘421 patent, col. 12, lines 11 - 12.
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`37 Ex. 1007, ‘759 patent, col. 10, lines. 4-5.
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`particular, the specification of the ‘421 patent says that “a weakly ionized
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`plasma [has] a relatively low-level of ionization”38 Furthermore, the
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`specification of a related patent number 6,806,652 (“the ‘652 Patent”) states
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`that “[t]he term ‘weakly-ionized plasma’ is defined herein to mean a plasma
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`with a relatively low peak plasma density. The peak plasma density of the
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`weakly ionized plasma depends on the properties of the specific plasma
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`processing system.”
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`V.
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`Petitioner Has Failed to Show a Reasonable Likelihood of Prevailing.
`A. All Grounds Rely on Claim Charts Submitted in Violation of
`Rules 42.24(a)(i) and 42.6(a)(3)
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` The Petition attaches four sets of claim charts as exhibits 1017 – 1020,
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`thereby exceeding the page limits of rule 42.24(a)(i) by nearly 40 pages.
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`Petitioner incorporates each chart into its petition with a single sentence,
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`asserting that its expert witness, Dr. Kortshagen, “has reviewed the claim chart
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`and agrees with it.”39 But this technique violates rule 42.6(a)(3)’s prohibition
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`against incorporating documents by reference.
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`38 Ex. 1001, ‘421 patent, col. 9, lines 24 – 25.
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`39 Petition at 13, 32, 49, 55.
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`Petitioner mentions that these claim charts were served on the Patent
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`Owner in a related litigation, apparently in the hope that this will provide an
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`exception to the rule.40 The Patent Office Trial Guide advises:
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`Claim charts submitted as part of a petition … count towards
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`applicable page limits …. A claim chart from another proceeding
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`that is submitted as an exhibit however, will not count towards
`page limits. 41
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`However, the trial guide’s reference to claim charts from other proceedings
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`should not be construed to include charts exchanged between litigants. If
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`claim charts exchanged in a related litigation can be attached to a petition
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`without counting against page limits, then rules 42.24(a)(i) and 42.6(a)(3) will
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`be rendered meaningless when the challenged patent is in litigation: Under
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`this procedure, litigants would be allowed to supplement their IPR petitions
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`with any number of claims charts of any size, so long as they first serve them
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`on opposing counsel.
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`Accordingly, review should be denied on all grounds that rely upon
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`evidence and arguments presented in such claim charts submitted in violation
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`of rules 42.24(a)(i) and 42.6(a)(3).
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`40 Petition at 15, 34, 39, 41, and 43.
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`41 Trial Guide at 48764.
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`B. Defects in Ground I: Petitioner Failed To Demonstrate That
`Claims 1, 2, 8, 10 - 13, 15, 16, 34, 38, 39, 43, and 46 - 48 Are
`Anticipated by Mozgrin
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`The Petitioner alleges in ground I that a prior art reference by Mozgrin42
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`anticipates sixteen claims of the ‘421 patent.43 As mentioned before, Mozgrin
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`was already considered by the Examiner before he allowed the claims.44
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`Since Ground I is premised on a claim chart that was submitted in
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`violation of rules 42.24(a)(i) and 42.6(a)(3), review should be denied on that
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`basis alone. Furthermore, review should also be denied since the Petition fails
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`to show that Mozgrin teaches each an every element of the claims as required
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`for anticipation.
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`Anticipation is a highly technical defense that requires a single prior art
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`reference to “expressly or inherently describe each and every limitation set
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`forth in the patent claim.”45 If even one aspect of the claim is missing from
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`Mozgrin, there is no anticipation and review should be denied.
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`42 Ex. 1003, Mozgrin.
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`43 Petition at 13 citing Ex. 1017, Mozgrin.
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`44 Ex. 1001, ‘421 Patent, list of references cited.
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`45 Trintec Industries, Inc. v. TOP-USA Corp., 295 F.3d 1292, 294 (Fed. Cir. 2002).
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`1. Overview of Mozgrin
`Mozgrin summarizes a variety of experiments he made using two
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`different electrode structures that generated a plasma in the presence of a
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`magnetic field: 1) a planar electrode structure of Fig. 1(a) and 2) a bell shaped
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`electrode structure shown in Fig. 1(b).46 The experiments varied many
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`parameters, including 1) the material used to form the electrodes, 2) the types
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`of gas between the electrodes, 3) the gas pressure, and 4) the strength of the
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`magnetic field.
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`Mozgrin was experimenting to determine the effects of these parameters
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`and therefore did not describe a sputtering source for sputtering material from
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`a target. Although Mozgrin mentioned that his plasmas sometimes sputtered
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`material from his negative electrode,47 he did not conduct experiments with a
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`cathode assembly having a sputtering target.
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`Furthermore, in his exhaustive study, Mozgrin conspicuously neglects to
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`explore the technique described in the ‘421 patent of choosing certain
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`parameters of a voltage pulse so that the pulse can create a weak plasma and
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`then transition it to a strong plasma for purposes of sputtering material from a
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`sputtering target, but without an occurrence of arcing. Instead, Mozgrin used
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`46 Ex. 1003, Mozgrin, p. 401.
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`47 Ex. 1003, Mozgrin, page 403, right col., last par.
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`a non-pulsed source to generate a weakly-ionized plasma that he called a “pre-
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`ionization” state,48 and did not mention choosing the claimed pulse parameters
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`to achieve this result.
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`Mozgrin’s voltage power supply system, shown in Fig. 2 below, includes
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`a “Stationary Discharge Supply Unit” for “pre-ionization” and a pulsed
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`“High-Voltage Supply Unit.”49
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`The “Stationary Supply Unit” is a non-pulsed “direct current” source for
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`weakly ionizing the gas into a plasma that has an ion density of “between 107 –
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`109 cm-3 for argon.”50
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`The High-Voltage Unit generates “square voltage pulses” over the
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`output of the stationary unit: “[T]he supply unit was made providing square
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`voltage and current pulses.51
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`48 Ex. 1003, Mozgrin, Fig. 2; page 401, left col., pars. 5, 6.
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`49 Ex. 1003, Mozgrin, page 401, right col.
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`50 Ex. 1003, Mozgrin, p. 401, left col.
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`51 Ex. 1003, Mozgrin, p. 401, right col.
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`2.
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`Petitioner Fails to Show a Reasonable Likelihood that
`Mozgrin Expressly or Inherently Teaches Each and
`Every Aspect of the Challenged Claims.
`Mozgrin is missing at least the following features of the claims
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`challenged in Ground I.
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`a. Mozgrin Does Not Teach a Sputtering Source
`Comprising a Cathode Assembly Having a
`Sputtering Target Positioned Adjacent to an
`Anode.
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`All of the apparatus claims challenged in Ground I require a sputtering
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`source having a cathode assembly with a sputtering target that is positioned
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`adjacent to an anode. Similarly, all of the challenged method claims recite a
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`method for high deposition rate sputtering from a sputtering target within a
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`cathode assembly.
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`The excerpt from figure 4 of the ‘421 patent shows a sputtering target
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`220 made of material that is to be sputtered from the target for deposition on
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`substrate 211:
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`The Petition fails to show that Mozgrin has a sputtering target. This is
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`no surprise since Mozgrin was describing various experiments with high
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`current plasmas, but not for the purpose of sputtering material from a target for
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`deposition. Thus, as shown in the illustration of Mozgrin’s planar electrodes
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`1, 2, there is no “sputtering target” positioned adjacent to the anode 2:
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`Mozgrin mentions that some of his experiments sputtered material from the
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`cathode 1.52 But this does not render the cathode a “sputtering target” of a
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`“sputtering source” as claimed, or a sputtering target for purposes of high
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`deposition rate sputtering as claimed. The sputtering referred to in Mozgin is
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`undesirable sputtering that erodes and degrades the cathode. There is no
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`indication that the Mozgrin cathode includes a sputtering target made of a
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`material intend to be removed by sputtering in a deposition process. Mozgrin
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`therefore does not describe a sputtering source or method that includes a
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`sputtering target.
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`52 Ex. 1003, Mozgrin at 403, right col., last par.
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`As a matter of law, such a difference is fatal to the Petition’s anticipation
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`grounds: As the Federal Circuit has noted when assessing anticipation, “the
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`difference …. may be minimal and obvious to those of skill in this art.
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`Nevertheless obviousness is not inherent anticipation. Given the strict identity
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`required of the test for novelty, on this record no reasonable jury could
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`conclude that the” prior art expressly or inherently disclosed each claim
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`element.53
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`Since un-patentability based on anticipation requires Mozgrin to
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`describe “each and every limitation set forth in the patent claim,”54 review on
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`Ground I should be denied for least this reason.
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`b. Mozgrin Does Not Describe the Claimed Pulse
`for Creating a Weak Plasma and Then a
`Strongly-Ionized Plasma From the Weak.
`All claims challenged in Ground I also require generating a pulse that
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`“creates a weakly-ionized plasma and then a strongly-ionized plasma from
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`the weakly ionized plasma” without arcing. For the aspect of the claim that
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`requires a pulse that “creates a weakly-ionized plasma,” the Petitioner cites to
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`a non-pulsed source in Mozgrin that creates a “pre-ionized plasma.”
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`53 Trintec Industries, Inc. v. TOP-USA Corp., 295 F.3d 1292, 294 (Fed Cir. 2002).
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`54 Trintec Industries, Inc. v. TOP-USA Corp., 295 F.3d 1292, 294 (Fed Cir. 2002).
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`Mozgrin’s weak, “pre-ionized plasma,” is created by a “Stationary
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`Discharge Supply Unit.”55
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`The “Stationary Supply Unit” is a non-pulsed “direct current” source for
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`forming a plasma that has an ion density of “between 107 – 109 cm-3 for
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`argon.”56
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`The Petition says that the weakly ionized plasma is crea