`IPR2014-00604
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`UNITED STATES PATENT AND TRADEMARK OFFICE
`_____________________
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`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`_____________________
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`The Gillette Company
`Petitioner
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`v.
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`ZOND, LLC
`Patent Owner
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`U.S. Patent No. 6,896,775
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`_____________________
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`Inter Partes Review Case No. 2014-00604
`_____________________
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`PATENT OWNER’s PRELIMINARY RESPONSE
`UNDER 37 CFR § 42.107(a)
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`Patent No. 6,896,775
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`TABLE OF CONTENTS
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`I.
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`INTRODUCTION ..................................................................................................................1
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`II. TECHNOLOGY BACKGROUND ....................................................................................4
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`A. Overview of Plasma Generation Systems ......................................................................4
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`B. The ‘775 Patent: Dr. Chistyakov Invents an Improved Plasma Source. .....................7
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`III. SUMMARY OF PETITIONER’S PROPOSED GROUNDS ........................................15
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`IV. CLAIM CONSTRUCTION UNDER 37 C.F.R. §§ 42.104(B)(3) ...................................15
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`A. “Means for exchanging the strongly-ionized plasma with a second volume of
`feed gas.” .....................................................................................................................15
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`B. “Means For Applying an Electric Field Across the Weakly ionized Plasma
`…”................................................................................................................................17
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`C. “Means for Ionizing a Feed Gas” (Claim 36) and “Means for Ionizing a
`Volume of Feed Gas” (Claim 37). ............................................................................18
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`V. PETITIONER HAS FAILED TO SHOW A REASONABLE LIKELIHOOD
`OF PREVAILING. ..............................................................................................................20
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`A. Defects in Ground 1: Petitioner Failed To Demonstrate That Claims 30, 37
`are Obvious In view of Mozgrin Combined with Mozgrin’s Thesis and
`Lantsman ....................................................................................................................20
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`1. Overview of Claims 30, 37. ................................................................................20
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`2. Legal Standards for Comparison of the Claim to the Prior Art. .....................23
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`3. Scope and Content of Prior Art. .............................................................................24
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`a.
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`b.
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`c.
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`Mozgrin’s Thesis Is Not Prior Art. .........................................................24
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`Overview of Mozgrin ...............................................................................26
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`Differences Between Mozgrin and the Claims ......................................27
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`4. Overview of Lantsman .......................................................................................29
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`5. Differences Between Lantsman and the Claims ...............................................32
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`6. Conclusion ...........................................................................................................34
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`B. Defects in Ground 2: Petitioner Failed To Demonstrate That Claim 35 is
`Obvious In view of Mozgrin Combined with Mozgrin’s Thesis, Lantsman
`and Kudryavtsev .........................................................................................................35
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`1. Overview of Claim 35. .........................................................................................35
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`2. Differences Between Claim 35 and the Prior Art. .................................................38
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`a.
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`b.
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`c.
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`d.
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`Differences Between Mozgrin and Claim 35 .........................................38
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`Petitioner Failed to Prove Inherency ......................................................39
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`Incompatibilities of Kudravtsev and Mozgrin .......................................41
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`Differences Between Claim 35 and Kudravtsev ....................................43
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`3. Conclusion ............................................................................................................43
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`C. Defect in Ground 3: Petitioner Failed To Demonstrate That Claims 36 is
`Obvious In view of Mozgrin Combined with Kudryavtsev ....................................44
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`D. Defect in Ground 4: Petitioner Failed To Demonstrate That Claims 30, 37
`are Obvious In view of Wang Combined with Mozgrin and Lantsman ...............45
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`1. Overview of Wang. .............................................................................................45
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`2. Differences Between Wang and the Claims. ....................................................48
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`3. Differences Between Lantsman and Claims 30, 37 ..........................................49
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`4. Conclusion: Petitioner Fails to Show a Reasonable Likelihood of
`Prevailing on Ground 4 Because They Fail to shown that Claims 30,
`37 are Obvious in View of Wang Combined With Mozgrin and
`Lantsman. .........................................................................................................51
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`E. Defect In Ground 5: Petitioner Failed To Demonstrate That Claim 35 is
`Obvious In view of Wang Combined with Mozgrin, Lantsman, and
`Kudryavtsev ................................................................................................................51
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`1. Review of the Claim Features at Issue ...................................................................51
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`2. Comparison to the Cited Art ...............................................................................52
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`3. Petition Fails to Prove Inherency. .....................................................................54
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`4.
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`Incompatibilities of Kudravtsev and Wang ......................................................56
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`5. Conclusion ............................................................................................................57
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`F. Defect In Ground 6: Petitioner Failed To Demonstrate That Claim 36 is
`Obvious In view of Wang Combined with Mozgrin ...............................................57
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`VI. CONCLUSION ....................................................................................................................59
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`I.
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`Introduction
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`Patent No. 6,896,775
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`The present petition for inter partes review of U.S. Patent No. 6,896,775
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`(“the ‘775 patent”) is the second of two petitions filed by the Gillette Company
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`challenging the ‘775 patent. This petition challenges three independent claims
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`30, 36, 37 and six dependent claims, nos. 31 – 35.
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`Claims 30 and 37 are directed to a magnetically enhanced plasma
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`processing method and apparatus for etching a substrate, wherein a substrate is
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`positioned in proximity to a cathode and wherein a bias voltage is applied to
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`the substrate to cause ions from a plasma to impact and etch the substrate’s
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`surface. To form ions for such etching, a feed gas is ionized into a strongly–
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`ionized plasma by an applied electrical pulse. The strongly ionized plasma
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`formed by the pulse is exchanged with a second volume of feed gas during the
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`pulse to thereby generate strongly-ionized plasma made of a second plurality of
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`ions. As explained in the patent, “transporting the strongly-ionized plasma
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`through the region 245 by a rapid volume exchange of the feed gas 264
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`increases the level and the duration of the power that can be applied to the
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`strongly-ionized plasma and, thus, generates a higher density strongly-ionized
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`plasma in the region 246.”1
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`1 Ex. 1101, ‘775 Patent, col. 10, lines 29 – 34.
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`The Petition cites to several prior art references that are primarily
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`directed to deposition, not etching, and therefore do not disclose the claimed
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`substrate proximate to a cathode and which is biased to cause ions to impact
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`and etch the substrate. Furthermore, with regard to the claimed gas exchange,
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`the Petition argues that any gas exchange in a plasma chamber, no matter how
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`slow and diffuse, and regardless of the location of the gas flux in the chamber
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`relative to the location where the strongly ionized plasma is formed, will
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`inherently perform the claimed exchange. But the Petition does not back this
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`assertion with any teaching in the printed literature.
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`Claim 36 is directed to a magnetically enhanced plasma processing
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`method for etching a substrate (such as described in claims 30, 37) that
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`includes a means for applying an electric field across a weakly-ionized plasma
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`to induce a type of multi-stage ionization that generates a strongly ionized
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`plasma for etching. Dr. Chistyakov teaches in his ‘775 patent that the
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`parameters of the electric field applied to the weakly ionized plasma, in
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`combination with the dimensions of the gap between the electrodes that
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`generated the field, can determine whether the gas atoms directly ionize from
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`the ground state, or first enter an excited state and then ionize from the exited
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`2
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`state.2 The claimed type of ionization (in which ions are first excited before
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`being ionized by electrons from the cathode), can be promoted by tailoring the
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`parameters of the electric pulse for the system’s electrode gap and other
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`operating conditions of the plasma.3
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`The Petitioners recognize that their primary references (Mozgrin and
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`Wang) do not teach the claimed type of multi-stage ionization for forming a
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`strongly-ionized plasma for etching. But they contend that Mozgrin and Wang
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`inherently perform such ionization, citing to Kudryavtsev. As explained in
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`detail below, Kudryavtsev describes a mathematical model of a tubular
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`electrode structure, wherein the model predicts that ionization from excited
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`ions may or may not occur in such a structure depending on a variety of
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`conditions, namely, the gas pressure p, the radius R of the tubular electrode
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`structure, the strength of the applied electric field E, and the density of ground
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`state argon atoms, n1.4 Furthermore, Kudyavtsev does not address the role of
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`electrons from the cathode in that process. Nor does Kudryavtsev’s model
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`consider the impact on the process of the relatively closely spaced electrodes in
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`2 Ex. 1101, ‘775 Patent, col. 8, line 52 – col. 9, line 22.
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`3 Ex. 1101, ‘775 Patent, col. 9, lines 14 – 50.
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`4 Ex. 1103, Kudryatsev, page 34.
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`Mozgrin and Wang or of the magnetic field in their systems: Both Mozgrin
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`and Wang use electrodes that are much more closely spaced than
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`Kudryavtsev’s electrodes, and which are immersed in a magnetic field that can
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`dramatically influence ion formation and ion density. Yet Kudryavtsev does
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`not consider such conditions in his mathematical model or in his experimental
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`set up. For at least these reasons, Kudryavtsev does not prove that Mozgrin’s
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`or Wang’s systems would inherently provide the claimed type of multi-stage
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`ionization.
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`For the above reasons and others provided below, the Petition should be
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`denied because it does not precisely state the relief requested5 and fails to
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`demonstrate a reasonable likelihood that any challenged claim is
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`unpatentable.6
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`II. Technology Background
`A. Overview of Plasma Generation Systems
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`The claims at issue in this petition are all directed to a method and
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`apparatus for etching material from a substrate with ions from a strongly-
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`5 37 C.F.R. § 42.104(b).
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`6 37 C.F.R. § 42.108(c).
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`ionized plasma. “Sputter etching is the ejection of atoms from the surface of a
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`substrate due to energetic ion bombardment.”7
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` A “plasma” is a gaseous mixture of electrons, positive ions and neutral
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`molecules that can be formed by applying a strong electric field to a gas. A
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`simplified illustration of a plasma formed between a pair of electrodes 238, 216
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`is shown below in figure 2B of the related U.S. patent number 7,604,716 patent
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`(the ‘716 Patent):8
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`A plasma is on average electrically neutral because there are approximately as
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`many negative electrons in the plasma as positive ions. However, the density
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`of charged particles can vary greatly depending on the strength of the applied
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`electric field and the length of time it is applied.
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`7 Ex. 1101, ‘775 Patent, co. 1, lines 14 – 15.
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`8’716 Patent, Fig. 2B.
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`Figure 2D from the ‘716 patent below shows a “strongly ionized plasma”
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`having a significantly higher density of charged particles than in the figure
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`above, due in part to a stronger electric field applied across the electrodes:
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`The ‘775 patent explains that if the plasma has a high concentration of
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`ions in certain regions, then there is a corresponding lack of uniformity in the
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`etching of the substrate by ion bombardment.9 One way to increase
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`uniformity is to apply more power to the plasma to increase ion density.
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`However, “the amount of applied power that is necessary to achieve a
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`significant increase in uniformity can increase the probability of generating an
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`electrical breakdown condition leading to an undesirable electrical discharge
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`(an electrical arc) in the chamber 104.”10 Accordingly, Dr. Chistyakov
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`9 Ex. 1101, ‘775 Patent, col. 3. lines 34 – 44.
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`10 Ex. 1101, ‘775 Patent, col. 3, lines 52 – 56.
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`describes in the ‘775 patent techniques for increasing the ion density in a
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`plasma, and the uniformity of ions over the surface of a substrate to be etched.
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`B. The ‘775 Patent: Dr. Chistyakov Invents an Improved Plasma
`Source.
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`Dr. Chistyakov invented an improved plasma device for etching material
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`from a substrate. The device combines a pair of electrodes and a magnet for
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`generating electric and magnetic fields in the region proximate to the cathode,
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`to thereby induce a special type of ionization for etching material from a
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`substrate located near the cathode. A cross-sectional side view of one
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`embodiment is shown in figure 2 of the patent reproduced below:
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`In this figure, the cathode is separated from the anode 238 by a gap 244, and
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`the substrate to be etched is located directly beneath the cathode as shown.11 A
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`voltage source 214 applies a bias voltage to the substrate so that the substrate is
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`at a negative potential relative to the cathode, thereby causing positive ions
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`formed by the electrode to accelerate into the substrate thereby etching the
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`surface of the substrate:12
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`The ions in the strongly-ionized plasma accelerate towards the
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`substrate 211 and impact the surface of the substrate 211. The
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`strongly ionized plasma results in a very high etch rate of the
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`substrate material. Furthermore, as described herein in connection
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`with FIG. 6A though FIG. 6D, the strongly-ionized plasma
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`generated by the plasma processing systems according to the
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`present invention tends to diffuse homogenously in the area 246
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`due to the interaction of generated magnetic fields. The
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`homogenous diffusion results in a more uniform distribution of
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`ions impacting the surface of the substrate 211 compared with
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`conventional plasma etching systems, thereby resulting in
`relatively uniform etching of the substrate 211.13
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`11 Ex. 1101, ‘755 patent, col. 5, lines 15 – 18.
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`12 Ex. 1101, ‘755 patent, col. 7, lines 59 - 65.
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`13 Ex. 1101, ‘755 patent, col. 16, lines 48 - 60.
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`To create ions for use in etching, a neutral gas flows in the gap 244 between a
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`cathode 216 and anode 238 where is it ionized by an electric field across the
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`gap.14 The patent explains that “the dimensions of the gap 244 and the total
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`volume in the region 245 are parameters in the ionization process as described
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`herein.”15
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` A voltage is applied across the electrodes, wherein the voltage is chosen to
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`ionize the gas to form a weakly ionized plasma whose conductivity is chosen
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`to “greatly reduce of prevent the possibility of a breakdown condition when
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`high power is applied to the plasma.16 A magnetic field 245 is generated
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`proximate to the cathode 216 to trap electrons in the weakly-ionized plasma at
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`a location proximate to the cathode surface as shown.17
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`The system then applies a strong electrical pulse across the plasma that
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`generates an electric field that produces the optimum conditions for exciting
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`neutral atoms in the weak plasma, and to cause ions in the plasma to strike the
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`14 Ex. 1101, ‘755 patent, col. 5, lines 15 – 18.
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`15 Ex. 1101, ‘755 patent, col. 5, lines 21 - 24.
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`16 Ex. 1101, ‘755 patent, col. 6, lines 6 – 9; col. 7, lines 13 – 15.
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`17 Ex. 1101, ‘755 patent, col. 5, lines 31 – 58; col. 9, lines 31 – 33..
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`cathode to thereby knock “secondary electrons” from the cathode.18 These
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`secondary electrons are also trapped by the magnetic field in the region near
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`the cathode surface.19
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`These secondary electrons from the cathode surface then interact with
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`the excited atoms in the plasma, causing them to ionize and thereby increase
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`the ion density in the plasma. The weakly ionized plasma, the magnetic field,
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`the dimensions of the gap and the corresponding electric pulse thus cooperate
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`to achieve a strongly ionized plasma for etching using a multi-stage ionization
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`process.
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`Dr. Chistyakov further teaches that the type of electric pulse applied to
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`the weakly ionized plasma in combination with the dimensions of the gap
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`between the electrodes can together determine whether the gas atoms directly
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`ionize from the ground state, or first enter an excited state and then ionize
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`from the exited state.20 The specification of the ‘755 patent explains the two
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`types of ionization in more detail and the role of these parameters.
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`18 Ex. 1101, ‘775 Patent, col. 9, lines 14 - 17.
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`19 Ex. 1101, ‘775 Patent, col. 9, lines 31 - 32.
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`20 Ex. 1101, ‘775 Patent, col. 8, line 52 – col. 9, line 22.
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`The typical ionization process is referred to as “direct ionization” or
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`“atomic ionization by electron impact.”21 In this ionization process, a free
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`electron collides with a neutral atom with enough energy to ionize the atom,
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`thereby producing another free electron.22
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`In the multi-stage ionization process described in the ‘775 patent, the
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`strong electric field applied to a weakly ionized plasma is chosen to excite
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`atoms in the weakly ionized plasma from the ground state into an excited
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`state. The patent teaches that this type of ionization (in which ions are first
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`excited before being ionized), can be promoted by tailoring the parameters of
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`the electric pulse for the system’s electrode gap and other operating conditions
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`of the plasma.
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`First, the patent explains the electrodynamics behind atom excitation
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`and ion formation. It says that a ground state atom requires more energy to
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`directly ionize that to enter an excited state:
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`For example, an argon atom requires an energy of about 11.55 eV
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`to become excited …. while neutral atoms require about 15.76 eV
`of energy to ionize.23
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`21 Ex. 1101, ‘775 Patent, col. 3, lines 15 - 27.
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`22 Ex. 1101, ‘775 Patent, col. 3, lines 15 - 27.
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`23 Ex. 1101, ‘775 Patent, col. 9, lines 17 – 19, 26 - 27.
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`Once an atom is in an excited state, it obviously requires less energy to ionized
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`than is required to directly ionize the atom from the ground state:
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`The excited [argon] atoms only require about 4 eV of energy to
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`ionize while neutral atoms require about 15.76 eV of energy to
`ionize.24
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`The patent also explains the formation of secondary electrons from the
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`cathode, and how they are trapped by the magnetic field in the same region
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`where the excited atoms reside.25 Since relatively little energy is required to
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`ionize excited atoms, the excited atoms are ionized when they interact with
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`these trapped electrons, to further increase the density of the plasma in that
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`region.26
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`Next, the patent explains how the electric field in the gap influences the
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`type of ionization that occurs. The ‘775 patent says that a multi-stage
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`ionization (in which ions are first excited before being ionized), can be
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`promoted by tailoring the parameters of the electric pulse for the system’s
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`electrode gap and other operating conditions of the plasma.
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`24 Ex. 1101, ‘775 Patent, col. 9, lines 25 - 28.
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`25 Ex. 1101, ‘775 Patent, col. 9, lines 23 – 35.
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`26 Ex. 1101, ‘775 Patent, col. 9, lines 27 - 35.
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`The dimensions of the gap 244 and the parameters of the applied
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`electric field 260 are chosen to determine the optimum condition
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`for a maximum rate of excitation of the atoms in the region 245.
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`For example, an argon atom requires an energy of about 11.55 eV
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`to become excited. Thus, as the feed gas 264 flows through the
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`region 245, the weakly-ionized plasma is formed and the atoms in
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`the weakly-ionized plasma undergo a stepwise ionization process.
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`***
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`Under appropriate excitation conditions, the portion of the energy
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`applied to the weakly-ionized plasma that is transformed to the
`excited atoms is very high for a pulsed discharge in the feed gas.27
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` The patent also proposes controlling the flow of gas into the plasma in a
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`region where the strong electric field transforms the weakly ionized plasma
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`into a strongly ionized plasma. Figure 3 below shows a pair of electrodes 216
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`and 204 separated by a gap 220:
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`27 Ex. 1101, ‘775 Patent, col. 9, lines 14 – 22; lines 56 - 61.
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`Feed gas 264 flows between the electrodes under the direction of flow
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`controller 210 (fig. 2) to provide a relatively high volume gas exchange in the
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`regions 245 between the electrodes.28 The patent explains that this volume
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`exchange allows the use of high power pulses having a longer duration that
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`results in the formation of a higher density plasma:
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` The level and duration of the high-powered electrical pulse is
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`limited by the level and duration of the power that the strongly-
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`ionized plasma can absorb before the high power discharge
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`contracts and terminates. In one embodiment, the flow rate of the
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`feed gas 264 is increased so that the strength and the duration of
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`the high-power electrical pulse can be increased in order to
`increase the density of the strongly-ionized plasma. 29
` The claims at issue in this Petition are directed at least in part to some of the
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`features just described. The Petition alleges that these claim are obvious in
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`view of the prior art references shown in the following summary of the
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`Petitioner’s proposed grounds.
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`28 Ex. 1101, ‘775 Patent, col. 8, lines 23 - 26.
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`29 Ex. 1101, ‘775 Patent, col. 10, lines 14 - 21.
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`III. Summary of Petitioner’s Proposed Grounds
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`Ground
`1
`2
`3
`4
`5
`6
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`Art
`Claims
`30 – 34, 37 Mozgrin, Mozgrn Thesis, Lantsman
`35
`Mozgrin, Mozgrin Thesis, Lantsman, Kudryavtsev
`36
`Mozgrin, Kudryavtsev
`30 – 35, 37 Wang, Mozgrin, Kudryavtsev
`35
`Wang, Mozgrin, Lantsman, Kudryavtsev
`36
`Wang, Mozgrin
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`IV. Claim Construction Under 37 C.F.R. §§ 42.104(b)(3)
`Pursuant to Rule §42.104(b)(3), the Petitioner “must identify [] how the
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`claim is to be construed” for purposes of comparing the challenged claim to the
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`cited art.
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`A.
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` “Means for exchanging the strongly-ionized plasma with a
`second volume of feed gas.”
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`The function of this claimed means is: exchanging the strongly ionized
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`plasma with a second volume of feed gas while applying “the electric pulse”
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`across the second volume of feed gas. This language indicates that the volume
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`exchange occurs in the region where “the electric pulse” generates a strongly
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`ionized plasma from the weakly-ionized plasma. It also indicates that the
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`exchange occurs during the time that “the electric pulse” is applied, referring
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`back to the previously mentioned pulse for generating “a strongly ionized
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`plasma comprising a first plurality of ions.” Thus, the claim language indicates
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`that the claimed means provides a gas flow in the region where the strongly-
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`ionized plasma is formed, that is fast enough relative to the pulse duration and
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`plasma volume to exchange a volume of the strongly ionized plasma with a
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`second volume of feed gas, during the pulse.
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`The corresponding structure for performing this function is the gas flow
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`control system 210 and the disclosed structures for feeding gas at a high flow
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`rate to the region where the strongly ionized plasma is formed (and
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`equivalents), such as conduit 207 and its structural relation to the electrode
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`configuration 216, 238 shown in figures 2 and 3 below:
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`Fig. 2
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`Fig. 3
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`“Means For Applying an Electric Field Across the Weakly
`ionized Plasma …”
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`B.
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`The function of this claimed means is to apply an electric field across a
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`specified region (i.e., the region were the weakly-ionized plasma resides), so as
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`to achieve a particular plasma condition recited in the claim. That condition
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`requires that atoms in the weakly ionized plasma are caused to enter an excited
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`state and that electrons from the cathode interact with the excited atoms to
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`ionize them. The corresponding disclosed structure is a power supply such as
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`pulsed supply 234 and an electrode structure coupled to the power supply,
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`wherein the geometry of the electrode structure combined with parameters of
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`the voltage emitted by the power supply, generate a type of electric field in the
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`region between the electrodes that induces the type of ionization described. As
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`explained by the ‘755 patent, this type of ionization (in which ions are first
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`excited before being ionized), can be promoted by tailoring the parameters of
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`the electric pulse for the system’s electrode gap and other operating conditions
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`of the plasma.
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`The dimensions of the gap 244 and the parameters of the applied
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`electric field 260 are chosen to determine the optimum condition
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`for a maximum rate of excitation of the atoms in the region 245.
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`For example, an argon atom requires an energy of about 11.55 eV
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`to become excited. Thus, as the feed gas 264 flows through the
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`region 245, the weakly-ionized plasma is formed and the atoms in
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`the weakly-ionized plasma undergo a stepwise ionization process.
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`***
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`Under appropriate excitation conditions, the portion of the energy
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`applied to the weakly-ionized plasma that is transformed to the
`excited atoms is very high for a pulsed discharge in the feed gas.30
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`Thus, this text, in combination with an example electrode configuration shown
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`in figure 3, describe to one skilled in the art an electrode structure and voltage
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`power supply that correspond to the claimed means for applying an electrical
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`pulse across the weakly ionized plasma
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`C. “Means for Ionizing a Feed Gas” (Claim 36) and “Means for
`Ionizing a Volume of Feed Gas” (Claim 37).
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`The general function of this claimed means is to ionize a gas to thereby
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`generate a weakly-ionized plasma, and in particular to ionize a type of gas that
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`the claim calls a “feed gas.” The Petitioner treats the word “feed” in the claim
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`as if it describes any gas, regardless of whether the gas is being fed during
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`ionization. However, this renders superfluous the word “feed” in the
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`expression “feed gas in a chamber” – “a methodology of claim construction
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`30 Ex. 1101, ‘775 Patent, col. 9, lines 14 – 22; lines 56 - 61.
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`that [the Federal Circuit] has denounced.”31 Even under the broadest
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`reasonable interpretation standard, the claim term “feed” cannot be read out of
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`the claim and cannot be deemed superfluous over the claimed “gas in a
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`chamber.”
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`“A feed gas,” as its name implies, is a flow of gas. As explained in the
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`specification, the “electric field in the gap 472 between the electrode 452 and
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`the cathode 204' is adapted to ignite the plasma from the feed gas 226 flowing
`through the gap 472.”32 The function of the claimed means therefore requires
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`ionization of gas that is being fed while it is being ionized to form the weakly-
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`ionized plasma.
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`The corresponding structure disclosed in the specification is the various
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`power supplies disclosed in the patent electrically coupled electrodes that are
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`physically coupled to a structure that supplies feed gas between the electrodes.
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`The patent describes various power supplies for this purpose, for example at
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`column 6, lines 1 – col. 7, line 3. Example structures to which such voltage
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`supplies can be connected include electrode structures 216, 238 coupled to a
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`structure for delivering feed gas, such as represented in figures 2, 3, 10 and 11.
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`31 Stumbo v. Eastman Outdoors, Inc., 508 F.3d 1358, 1362 (Fed. Cir. 2007).
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`32 Ex. 1101, ‘775 Patent, col. 18, lines 9 – 12.
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`V.
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`Petitioner Has Failed to Show a Reasonable Likelihood of Prevailing.
`A. Defects in Ground 1: Petitioner Failed To Demonstrate That
`Claims 30, 37 are Obvious In view of Mozgrin Combined
`with Mozgrin’s Thesis and Lantsman
`1. Overview of Claims 30, 37.
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`The challenged claim 30 is generally directed to a magnetically enhanced
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`plasma processing method for etching the surface of a substrate. Claim 37 is a
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`corresponding apparatus claim that implements the recited etching method,
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`using the means described in the claim construction above.
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`The method and apparatus include a substrate that is position proximate
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`to a cathode, wherein a bias voltage is applied to the substrate to cause ions
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`form a plasma to impact and etch the substrate’s surface. To create the plasma
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`and its ions, the method and device first ionizes a volume of feed gas to form a
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`weakly ionized plasma. As explained in the claim construction above, “a feed
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`gas” as its name implies, is a gas that feeds or flows during ionization.
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` The claimed method and device generates a magnetic field proximate to
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`the weakly ionized plasma to thereby trap ions in the weakly ionized plasma in
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`a region proximate to the cathode. They then apply an electric pulse across the
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`weakly-ionized plasma to generate a strongly ionized plasma.
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`They next exchange the strongly ionized plasma with a second volume
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`of feed gas while applying “the electric pulse” across the second volume of feed
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`gas. This language indicates that the strongly-ionized plasma is displaced from
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`the region with a second volume of feed gas pulse that formed the displaced
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`plasma is applied. The claims indicate that this exchange of a volume of
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`plasma with a volume of feed gas occurs during the electric pulse, because they
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`says that the exchanging step occurs while “the electric pulse” is applied,
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`referring back to the previously mentioned pulse that generates a “strongly
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`ionized plasma comprising a first plurality of ions.” Thus, t