`
`Information technology-
`Telecommunications and information exchange
`between systems-
`Local and metropolitan area networks(cid:173)
`Specific requirements-
`Part ·11 :Wireless LAN Medium Access
`Cont1rol {MAC) and Physical Layer
`{PHY) specifications
`
`Sponsor
`
`LAN MAN Standards Committee
`of the
`IEEE Computer Society
`
`Approved 26 June 1997
`IEEE Standards Board
`
`Abstract: The medium access control (MAC) and physical characteristics for wireless local area
`networks (LANs) are specified in this standard, part of a series of standards for local and metropol(cid:173)
`itan area networks. The medium access control unit in this standard is designed to support physical
`layer units as they may be adopted dependent on the availability of spectrum. This standard con(cid:173)
`tains three physical layer units: two radio units, both operating in the 2400-2500 MHz band, and
`one baseband infrared unit. One radio unit employs the frequency-hopping spread spectrum tech(cid:173)
`nique, and the other employs the direct sequence spread spectrum technique.
`Keywords: ad hoc network, infrared, LAN, local area network, mobility, radio frequency, wireless
`
`The Institute of Electrical and Electronics Engineers, Inc.
`345 East 47th Street, New York, NY 1 0017-2394, USA
`
`Copyright© 1997 by the Institute of Electrical and Electronics Engineers, Inc.
`All rights reserved. Published 1997. Printed in the United States of America.
`
`ISBN 1-55937-935·9
`
`No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior
`written permission of the publisher.
`
`Authorized licensed use limited to: SAMSUNG ELECTRONICS DMC. Downloaded on March 17,2011 at 00:51:20 UTC from IEEE Xplore. Restrictions apply.
`
`Exhibit 1106 001/459
`
`
`
`IEEE Standards documents are developed within the Technical Committees of the IEEE Societies
`and the Standards Coordinating Committees of the IEEE Standards Board. Members of the com(cid:173)
`mittees serve voluntarily and without compensation. They are not necessarily members of the Insti(cid:173)
`tute. The standards developed within IEEE represent a consensus of the broad expertise on the
`subject within the Institute as well as those activities outside of IEEE that have expressed an inter(cid:173)
`est in participating in the development of the standard.
`
`Use of an IEEE Standard is wholly voluntary. The existence of an IEEE Standard does not imply
`that there are no other ways to produce, test, measure, purchase, market, or provide other goods and
`services related to the scope of the IEEE Standard. Furthermore, the viewpoint expressed at the
`time a standard is approved and issued is subject to change brought about through developments in
`the state of the art and comments received from users of the standard. Every IEEE Standard is sub(cid:173)
`jected to review at least every five years for revision or reaffirmation. When a document is more
`than five years old and has not been reaffirmed, it is reasonable to conclude that its contents,
`although still of some value, do not wholly reflect the present state of the art. Users are cautioned to
`check to determine that they have the latest edition of any IEEE Standard.
`
`Comments for revision of IEEE Standards are welcome from any interested party, regardless of
`membership affiliation with IEEE. Suggestions for changes in documents should be in the form of a
`proposed change of text, together with appropriate supporting comments.
`
`Interpretations: Occasionally questions may arise regarding the meaning of portions of standards as
`they relate to specific applications. When the need for interpretations is brought to the attention of
`IEEE, the Institute will initiate action to prepare appropriate responses. Since IEEE Standards rep(cid:173)
`resent a consensus of all concerned interests, it is important to ensure that any interpretation has
`also received the concurrence of a balance of interests. For this reason IEEE and the members of its
`technical committees are not able to provide an instant response to interpretation requests except in
`those cases where the matter has previously received formal consideration.
`
`Comments on standards and requests for interpretations should be addressed to:
`
`Secretary, IEEE Standards Board
`445 Hoes Lane
`P.O. Box 1331
`Piscataway, NJ 08855-1331
`USA
`
`Note: Attention is called to the possibility that implementation of this standard may
`require use of subject matter covered by patent rights. By publication of this standard,
`no position is taken with respect to the existence or validity of any patent rights in
`connection therewith. The IEEE shall not be responsible for identifying patents for
`which a license may be required by an IEEE standard or for conducting inquiries into
`the legal validity or scope of those patents that are brought to its attention.
`
`Authorization to photocopy portions of any individual standard for internal or personal use is
`granted by the Institute of Electrical and Electronics Engineers, Inc., provided that the appropriate
`fee is paid to Copyright Clearance Center. To arrange for payment of licensing fee, please contact
`Copyright Clearance Center, Customer Service, 222 Rosewood Drive, Danvers, MA 01923 USA;
`(508) 750-8400. Permission to photocopy portions of any individual standard for educational class(cid:173)
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`
`Authorized licensed use limited to: SAMSUNG ELECTRONICS DMC. Downloaded on March 17,2011 at 00:51:20 UTC from IEEE Xplore. Restrictions apply.
`
`Exhibit 1106 002/459
`
`
`
`Introduction
`
`(This introduction is not part ofiEEE Std 802.11-1997, but is included for information only.)
`
`This standard is part of a family of standards for local and metropolitan area networks. The relationship
`between the standard and other members of the family is shown below. (The numbers in the figure refer to
`IEEE standard numbers.)
`
`~ a: :::>
`
`u
`w
`en
`0
`~
`C\i
`0
`co
`
`w
`a:
`:::>
`1-
`u
`w
`1-
`J:
`u
`a:
`<(
`o!S
`
`~
`~
`w
`e;
`gj
`co
`
`1-
`z
`w
`::;e
`w
`~
`z
`<(
`::;e
`
`~
`
`C\i
`0
`co
`
`802.2 LOGICAL LINK CONTROL
`
`802.1 BRIDGING
`
`DATA
`LINK
`LAYER
`
`802.3
`MEDIUM
`ACCESS
`
`802.4
`MEDIUM
`ACCESS
`
`802.5
`MEDIUM
`ACCESS
`
`802.6
`MEDIUM
`ACCESS
`
`802.9
`MEDIUM
`ACCESS
`
`802.11
`MEDIUM
`ACCESS
`
`802.12
`MEDIUM
`ACCESS
`
`802.9
`802.6
`802.5
`802.4
`802.3
`802.12
`802.11
`PHYSICAL PHYSICAL PHYSICAL PHYSICAL PHYSICAL PHYSICAL PHYSICAL
`
`PHYSICAL
`LAYER
`
`"Formerly IEEE Std 802.1A.
`
`This family of standards deals with the physical and data link layers as defined by the International Organi(cid:173)
`zation for Standardization/International Electrotechnical Commission (ISOIIEC) Open Systems Intercon(cid:173)
`nection Basic Reference Model (ISO/IEC 7498-1: 1994 ). The access standards define several types of
`medium access technologies and associated physical media, each appropriate for particular applications or
`system objectives. Other types are under investigation.
`
`The standards defining the access technologies are as follows:
`
`• IEEE Std 802
`
`Overview and Architecture. This standard provides an overview to the fam(cid:173)
`ily of IEEE 802 Standards. This document forms part of the 802.1 scope of
`work.
`
`• ANSI/IEEE Std 802.1B
`and 802.llk
`[ISOIIEC 15802-2]
`
`LAN/MAN Management. Defines an Open Systems Interconnection (OSI)
`management-compatible architecture, and services and protocol elements
`for use in a LAN/MAN environment for performing remote management.
`
`• ANSI/IEEE Std 802.1D
`[ISOIIEC 10038]
`
`MAC Bridging. Specifies an architecture and protocol for the interconnec(cid:173)
`tion of IEEE 802 LANs below the MAC service boundary.
`
`• ANSI/IEEE Std 802.1E
`[ISOIIEC 15802-4]
`
`System Load Protocol. Specifies a set of services and protocol for those
`aspects of management concerned with the loading of systems on IEEE
`802LANs.
`
`• ANSI/IEEE Std 802.2
`[ISOIIEC 8802-2]
`
`• ANSI/IEEE Std 802.3
`[ISO/IEC 8802-3]
`
`• ANSI/IEEE Std 802.4
`[ISO/IEC 8802-4]
`
`Logical Link Control
`
`CSMAICD Access Method and Physical Layer Specifications
`
`Token Passing Bus Access Method and Physical Layer Specifications
`
`Copyright© 1997 IEEE. All rights reserved.
`
`iii
`
`Authorized licensed use limited to: SAMSUNG ELECTRONICS DMC. Downloaded on March 17,2011 at 00:51:20 UTC from IEEE Xplore. Restrictions apply.
`
`Exhibit 1106 003/459
`
`
`
`• ANSI/IEEE Std 802.5
`[ISOIIEC 8802-5]
`
`Token Ring Access Method and Physical Layer Specifications
`
`• ANSI/IEEE Std 802.6
`[ISOIIEC 8802-6]
`
`Distributed Queue Dual Bus Access Method and Physical Layer
`Specifications
`
`• ANSI/IEEE Std 802.9
`[ISOIIEC 8802-9]
`
`Integrated Services (IS) LAN Interface at the Medium Access Control
`(MAC) and Physical (PHY) Layers
`
`• ANSI/IEEE Std 802.10
`
`Interoperable LAN/MAN Security
`
`• IEEE Std 802.11
`[ISO/IEC DIS 8802-11]
`
`Wireless LAN Medium Access Control (MAC) and Physical Layer
`Specifications
`
`• ANSI/IEEE Std 802.12
`[ISO/IEC DIS 8802-12]
`
`Demand Priority Access Method, Physical Layer and Repeater
`Specifications
`
`In addition to the family of standards, the following is a recommended practice for a common Physical
`Layer technology:
`
`• IEEE Std 802.7
`
`IEEE Recommended Practice for Broadband Local Area Networks
`
`The following additional working group has authorized standards projects under development:
`
`• IEEE 802.14
`
`Standard Protocol for Cable-TV Based Broadband Communication Network
`
`The reader of this standard is urged to become familiar with the complete family of standards.
`
`Conformance test methodology
`
`An additional standards series, identified by the number 1802, has been established to identify the
`conformance test methodology documents for the 802 family of standards. Thus the conformance test
`documents for 802.3 are numbered 1802.3.
`
`IEEE Std 802.11-1997
`
`This standard defines the protocol and compatible interconnection of data communication equipment via the
`"air," radio or infrared, in a local area network (LAN) using the carrier sense multiple access protocol with
`collision avoidance (CSMA/CA) medium sharing mechanism. The medium access control (MAC) supports
`operation under control of an access point as well as between independent stations. The protocol includes
`authentication, association, and reassociation services, an optional encryption/decryption procedure, power
`management to reduce power consumption in mobile stations, and a point coordination function for time(cid:173)
`bounded transfer of data. The standard includes the definition of the management information base (Mill)
`using Abstract Syntax Notation 1 (ASN.l) and specifies the MAC protocol in a formal way, using the Speci(cid:173)
`fication and Description Language (SDL).
`
`The infrared implementation of the PHY supports 1 Mbit/s data rate with an optional 2 Mbit/s extension.
`The radio implementations of the PHY specify either a frequency-hopping spread spectrum (FHSS) support(cid:173)
`ing 1 Mbit/s and an optional 2 Mbit/s data rate or a direct sequence spread spectrum (DSSS) supporting both
`1 and 2 Mbit/s data rates.
`
`iv
`
`Copyright© 1997 IEEE. All rights reserved.
`
`Authorized licensed use limited to: SAMSUNG ELECTRONICS DMC. Downloaded on March 17,2011 at 00:51:20 UTC from IEEE Xplore. Restrictions apply.
`
`Exhibit 1106 004/459
`
`
`
`This standard contains state-of-the-art material. The area covered by this standard is undergoing evolution.
`Revisions are anticipated to this standard within the next few years to clarify existing material, to correct
`possible errors, and to incorporate new related material. Information on the current revision state of this and
`other IEEE 802 standards may be obtained from
`
`Secretary, IEEE Standards Board
`445 Hoes Lane
`P.O. Box 1331
`Piscataway, NJ 08855-1331 USA
`
`Participants
`
`At the time the draft of this standard was sent to sponsor ballot, the IEEE 802.11 working group had the fol(cid:173)
`lowing voting members:
`
`Stuart J. Kerry and Chris Zegelin, Vice Chairs
`Victor Hayes, Chair
`Bob O'Hara and Greg Ennis, Chief Technical Editors
`George Fishel and Carolyn L. Heide, Secretaries
`
`David Bagby, MAC Group Chair C. Thomas Baumgartner, Infrared Chair and Editor
`Jan Boer, Direct Sequence Chair
`Michael Fischer, State Diagram Editor
`Dean M. Kawaguchi, PHY Group and FH Chair Mike Trompower, Direct Sequence Editor
`
`Jeff Abramowitz
`Keith B. Amundsen
`Phil Belanger
`Manuel J. Betancor*
`John Biddick
`Simon Black
`Alessandro M. Bolea
`Pablo Brenner
`Peter E. Chadwick
`Naftali Chayat
`Jonathon Y. Cheah
`Hae Wook Choi
`Wim Diepstraten
`Robert .T. Egan
`Darwin Engwer
`John Fakatselis
`Matthew Fischer
`Keith S .. Furuya
`Rich Gardner
`Ian Gifford
`
`Howard J. Hall
`Bill Huhn
`Donald C. Johnson
`Mikio Kiyono
`Joseph J. Kubler
`Arthur Lashbrook
`Francisco J. Lopez-Hernandez
`Ronald Mahany
`Bob Marshall
`Jim McDonald
`AkiraMiura
`Wayne D. Moyers
`Ravi P. Nalamati
`Mitsuji Okada
`AI Petrick
`Miri Ratner
`James A. Renfro
`William Roberts
`Jon Walter Rosdahl
`
`Michael Rothenberg
`Chandos A. Rypinski
`Anil K. Sanwalka
`Roy Sebring
`Glen Sherwood
`Thomas Siep
`Nathan Silberman
`Don Sloan
`Greg Smith
`Marvin L. Sojka
`Dave Strohschein
`Bert Sullam
`Mack Sullivan
`Tom Tsoulogiannis
`Jeanine Valadez
`Sarosh Vesuna
`Richard E. White
`Donna A. Woznicki
`Timothy M. Zimmerman
`Johnny Zweig
`
`Major contributions were received from the following individuals:
`
`Robert Achatz
`KenBiba
`Paul Eastman
`Ed Geiger
`Larry van der J agt
`
`*Deceased
`
`Richard Lee
`Kerry Lynn
`Michael Masleid
`John McKown
`K. S. Natarajan
`Jim Neally
`
`Richard Ozer
`Thomas Phinney
`Leon S. Scaldeferri*
`Jim Schuessler
`Fran'l'ois Y. Simon
`
`Copyright© 1997 IEEE. All rights reserved.
`
`v
`
`Authorized licensed use limited to: SAMSUNG ELECTRONICS DMC. Downloaded on March 17,2011 at 00:51:20 UTC from IEEE Xplore. Restrictions apply.
`
`Exhibit 1106 005/459
`
`
`
`The following persons were on the balloting committee:
`
`Bernhard Albert
`Jon M. Allingham
`JackS. Andresen
`KitAthul
`Anthony L. Barnes
`Robert T. Bell
`Manuel J. Betancor
`Simon Black
`Alan L. Bridges
`Graham Campbell
`James T. Carlo
`David E. Carlson
`Peter E. Chadwick
`Naftali Chayat
`Alan J. Chwick
`Ken Clements
`Robert S. Crowder
`Rifaat Dayem
`Wim Diepstraten
`Edward A. Dunlop
`Sourav K. Dutta
`PaulS. Eastman
`Peter Ecclesine
`Gregory Elkmann
`John E. Emrich
`Philip H. Enslow
`Changxin Fan
`Michael A. Fischer
`Harvey A. Freeman
`Robert J. Gagliano
`Patrick S. Gonia
`N. Douglas Grant
`Govert M. Griffioen
`Joseph L. Hammond
`Victor Hayes
`Kenneth C. Heck
`Jan Hoogendoorn
`Russell D. Housley
`Walter K. Hurwitz
`
`Richard J. Iliff
`Tomoaki Ishifuji
`Carlos Islas-Perez
`Raj Jain
`A. Kamerman
`Peter M. Kelly
`YongbumKim
`Mikio Kiyono
`Thaddeus Kobylarz
`Stephen B. Kruger
`Joseph J. Kubler
`DavidJ. Law
`JaiYong Lee
`Jungtae Lee
`Daniel E. Lewis
`Randolph S. Little
`MingT. Liu
`Joseph C. J. Loo
`Donald C. Loughry
`Robert D. Love
`Ronald Mahany
`Jim L. Mangin
`Peter Martini
`P. Takis Mathiopoulos
`Steve Messenger
`Bennett Meyer
`Ann Miller
`David S. Millman
`Hiroshi Miyano
`Stig Frode Mjolsnes
`W. Melody Moh
`John E. Mo.n~gue
`Wayne D. Moyers
`Paul Nikolich
`Ellis S. Nolley
`Robert O'Hara
`Donal O'Mahony
`Roger Pandanda
`Lalit Mohan Patnaik
`.Lucy W, Person
`
`Thomas L. Phinney
`Vikram Prabhu
`Alberto Profumo
`David L. Propp
`VikramPunj
`Andris Putnins
`Fernando Ramos
`James W. Romlein
`Floyd E. Ross
`Michael Rothenberg
`Christoph Ruland
`Chandos A. Rypinski
`Ani! K. Sanwalka
`Gregory D. Schumacher
`Rich Seifert
`Lee A. Sendelbach
`Michael Serrone
`Adarshpal S. Sethi
`Donald A. Sheppard
`Nathan Silberman
`Joseph S. Skorupa
`Michael A. Smith
`Marvin L. Sojka
`Efstathios D. Sykas
`Geoffrey 0. Thompson
`Robert C. Tripi
`Mike Trompower
`David B. Turner
`Mark-Rene Uchida
`James Vorhies
`Yun-Che Wang
`Raymond P. Wenig
`Earl J. Whitaker
`David W. Wilson
`Jerry A. Wyatt
`Qian-Li Yang
`IwenYao
`OrenYuen
`Jonathan M. Zweig
`
`vi
`
`Copyright© 1997 IEEE. All rights reserved.
`
`Authorized licensed use limited to: SAMSUNG ELECTRONICS DMC. Downloaded on March 17,2011 at 00:51:20 UTC from IEEE Xplore. Restrictions apply.
`
`Exhibit 1106 006/459
`
`
`
`When the IEEE Standards Board approved this standard on 26 June 1997, it had the following membership:
`
`Donald C. Loughry, Chair
`
`Richard J. Holleman, Vice Chair
`Andrew G. Salem, Secretary
`
`Clyde R. Camp
`Stephen L. Diamond
`Harold E. Epstein
`Donald C. Fleckenstein
`Jay Forster**
`Thomas F. Garrity
`Donald N. Heirman
`Jim Isaak
`Ben C. Johnson
`
`**Member Emeritus
`
`Lowell Johnson
`Robert Kennelly
`E. G. "AI" Kiener
`Joseph L. Koepfinger**
`Stephen R. Lambert
`Lawrence V. McCall
`L. Bruce McClung
`Marco W. Migliaro
`
`Louis-Fran~ois Pau
`Gerald H. Peterson
`John W. Pope
`Jose R. Ramos
`Ronald H. Reimer
`Ingo Rusch
`JohnS. Ryan
`Chee Kiow Tan
`Howard L. Wolfman
`
`Also included are the following nonvoting IEEE Standards Board liaisons:
`
`Satish K. Aggarwal
`Alan H. Cookson
`
`Kristin Dittmann
`IEEE Standards Project Editor
`
`Copyright© 1997 IEEE. All rights reserved.
`
`vii
`
`Authorized licensed use limited to: SAMSUNG ELECTRONICS DMC. Downloaded on March 17,2011 at 00:51:20 UTC from IEEE Xplore. Restrictions apply.
`
`Exhibit 1106 007/459
`
`
`
`Authorized licensed use limited to: SAMSUNG ELECTRONICS DMC. Downloaded on March 17,2011 at 00:51:20 UTC from IEEE Xplore. Restrictions apply.
`
`Exhibit 1106 008/459
`
`
`
`Contents
`
`1.
`
`Overview .............................................................................................................................................. 1
`
`1.1 Scope .......................................................................................................................................... 1
`1.2 Purpose ....................................................................................................................................... 1
`
`2. Nomtative references ........................................................................................................................... 2
`
`3.
`
`Definitions ............................................................................................................................................ 3
`
`4. Abbreviations and acronyms ................................................................................................................ 6
`
`5. General description .............................................................................................................................. 9
`
`5.1 General description of the architecture ...................................................................................... 9
`5.1.1
`How wireless LAN systems are different.. .................................................................. 9
`5.2 Components of the IEEE 802.11 architecture .......................................................................... 10
`5.2.1
`The independent BSS as an ad hoc network .............................................................. 10
`5.2.2 Distribution system concepts ..................................................................................... 11
`5.2.3
`Area concepts ............................................................................................................. 12
`5.2.4
`Integration with wired LANs ..................................................................................... 14
`5.3 Logical service inlerfacc~ ......................................................................................................... 14
`5.3.1
`Station scn·icc (SS) .................................................................................................... 15
`5.3.2 Distribulion system sen·icc (DSS) ............................................................................. 15
`5.3.3 Multiple logical address spaces ................................................................................. 16
`5.4 Overview of the services .......................................................................................................... 17
`Distribulion of messages within a DS ........................................................................ 17
`5.4.1
`5.4.2
`Services that support 1hc disl.rihulion service ............................................................ 18
`5.4.3
`Access and confidentiality control scn·ices ............................................................... 19
`5.5 Relationships bel ween '>en· ices ................................................................................................ 21
`5.6 Differences between ESS and IBSS J...\Ns .............................................................................. 23
`5.7 Message information contents that support the services .......................................................... 24
`5.7.1
`Data ............................................................................................................................ 25
`5.7.2 Association ................................................................................................................. 25
`5.7.3
`Reassociation ............................................................................................................. 25
`5.7.4 Disassociation ............................................................................................................ 26
`5.7.5
`Privacy ....................................................................................................................... 26
`5.7.6 Authentication ............................................................................................................ 26
`5.7.7
`Deauthentication ........................................................................................................ 27
`5.8 Reference model. ...................................................................................................................... 27
`
`6. MAC service definition ...................................................................................................................... 29
`
`6.1 Overview of MAC services ...................................................................................................... 29
`6.1.1
`Asynchronous data service ........................................................................................ 29
`6.1.2
`Security services ........................................................................................................ 29
`6.1.3 MSDU ordering ......................................................................................................... 29
`6.2 Detailed service specification ................................................................................................... 30
`6.2.1 MAC data services ..................................................................................................... 30
`
`7.
`
`Frame formats .................................................................................................................................... 34
`
`7.1 MAC frame formats ................................................................................................................. 34
`7.1.1
`Conventions ............................................................................................................... 34
`7.1.2
`General frame format ................................................................................................. 34
`
`Copyright© 1997 IEEE. All rights reserved.
`
`ix
`
`Authorized licensed use limited to: SAMSUNG ELECTRONICS DMC. Downloaded on March 17,2011 at 00:51:20 UTC from IEEE Xplore. Restrictions apply.
`
`Exhibit 1106 009/459
`
`
`
`Frame fields ............................................................................................................... 35
`7 .1.3
`7.2 Format of individual frame types ............................................................................................. 41
`7.2.1
`Control frames ........................................................................................................... 41
`7 .2.2 Data frames ................................................................................................................ 43
`7 .2.3 Management frames ................................................................................................... 45
`7.3 Management frame body components ..................................................................................... 50
`7.3.1
`Fixed fields ......................................................... -........................................................ 50
`Information elements ................................................................................................. 55
`7.3.2
`
`8. Authentication and privacy ................................................................................................................ 60
`
`8.1 Authentication services ............................................................................................................ 60
`8.1.1
`Open System authentication ...................................................................................... 60
`8.1.2
`Shared Key authentication ......................................................................................... 61
`8.2 The Wired Equivalent Privacy (WEP) algorithm .................................................................... 62
`8.2.1
`Introduction ................................................................................................................ 62
`8.2.2
`Properties of the WEP algorithm ............................................................................... 63
`8.2.3 WEP theory of operation ........................................................................................... 63
`8.2.4 WEP algorithm specification ..................................................................................... 65
`8.2.5 WEP MPDU expansion ............................................................................................. 65
`8.3 Securit) -Related \HR attributes ............................................................................................... 66
`8.3.1
`.\uthcnt il:ation ·Related \'liB allrihutcs ...................................................................... 66
`Pri\'al:y Related 1\tiB attributes ................................................................................. 66
`8.3.2
`
`9. MAC sublayer f'unct_ional dc-;cription ................................................................................................ 71
`
`9.1 MAC arl:hill.!l:IUr,~ ..................................................................................................................... 71
`9.1.1
`Distributd wordination funl:tion (DCF) ................................................................... 71
`9.1.2
`Point. wordination function (PCF) ............................................................................. 71
`9.1.3
`Cot~xist~nl·c of DCF and PCF .................................................................................... 72
`9.1.4
`I :ragmcntation/def'ntgtnentation O\'cn·iew ................................................................. 72
`9.1.5
`\L\C dat_a ~en·icc ...................................................................................................... 73
`9.2 DCF .......................................................................................................................................... 73
`9.2.1
`Carrier sense mechanism ........................................................................................... 74
`9.2.2 MAC-Level acknowledgments ........... : ...................................................................... 74
`Interframe space (TFS) ............................................................................................... 75
`9.2.3
`9.2.4
`Random backoff time ................................................................................................. 76
`9.2.5 DCF access procedure ................................................................................................ 77
`9.2.6 Directed MPDU transfer procedure ........................................................................... 83
`9.2.7
`Broadcast and multicast MPDU transfer procedure .................................................. 84
`9.2.8 ACK procedure .......................................................................................................... 84
`9 .2.9 Duplicate detection and recovery ............................................................................... 84
`9.2.10 DCF timing relations .................................................................................................. 85
`9.3 PCF ........................................................................................................................................... 87
`9.3.1
`CFP structure and timing ........................................................................................... 88
`9.3.2
`PCF access procedure ................................................................................................ 89
`PCF transfer procedure .............................................................................................. 90
`9.3.3
`Contention-Free polling list ....................................................................................... 93
`9 .3.4
`9.4 Fragmentation ........................................................................................................................... 94
`9.5 Defragmentation ....................................................................................................................... 95
`9.6 Multirate support ...................................................................................................................... 96
`9. 7 Frame exchange sequences ...................................................................................................... 97
`9.8 MSDU transmission restrictions .............................................................................................. 98
`
`x
`
`Copyright© 1997 IEEE. All rights reserved.
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`Authorized licensed use limited to: SAMSUNG ELECTRONICS DMC. Downloaded on March 17,2011 at 00:51:20 UTC from IEEE Xplore. Restrictions apply.
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`Exhibit 1106 010/459
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`
`
`10.
`
`Layer management ........................................................................................................................... 100
`
`10.1 Overview of management model ........................................................................................... 100
`10.2 Generic management primitives ............................................................................................. 100
`10.3 MLME SAP interface ............................................................................................................. 102
`10.3.1 Power management., ................................................................................................ 102
`10.3.2 Scan .......................................................................................................................... 103
`Synchronization ....................................................................................................... 105
`10.3.3
`Authenticate ............................................................................................................. 107
`10.3.4
`De-authenticate ........................................................................................................ 109
`10.3.5
`Associate .................................................................................................................. Ill
`10.3.6
`Reassociate ............................................................................................................... 113
`10.3.7
`Disassociate .............................................................................................................. 115
`10.3.8
`Reset ......................................................................................................................... 116
`10.3.9
`Start .......................................................................................................................... 118
`10.3.10
`10.4 PLME SAP interface .............................................................................................................. 120
`10.4.1 PLME-RESET.request. ............................................................................................ 120
`10.4.2 PLME-DSSSTESTMODE.request .......................................................................... 120
`10.4.3 PLME-DSSSTESTOUTPUT.request ...................................................................... 121
`
`11. MAC sublayer management entity ............