`
`BEFORE THE PATENT TRIAL AND APPEAL BOARD
`
`
`
`
`
`
`
`
`
`Oct. 16, 2008
`
`In re U.S. Patent No. 7,876,413
`
`Filed:
`
`Issued:
`
`Inventors: Yoshiharu Hirakata
`Shunpei Yamazaki
`
`Jan. 25, 2011
`
`
`Assignee: Semiconductor Energy Laboratory Co., Ltd.
`
`Title:
`
`Electronic Apparatus with a Flexible Printed Circuit and a
`Transparent Conductive Layer
`
`
`
`Mail Stop PATENT BOARD, PTAB
`Commissioner for Patents
`P.O. Box 1450
`Alexandria, VA 22313-1450
`
`
`
`PETITION FOR INTER PARTES REVIEW OF U.S. PATENT NO. 7,876,413
`UNDER 35 U.S.C. §§ 311-319 AND 37 C.F.R. § 42.100 ET SEQ.
`
`
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`
`TABLE OF CONTENTS
`
`
`TABLE OF CONTENTS ........................................................................................ i
`
`EXHIBIT LIST ...................................................................................................... iii
`
`I. MANDATORY NOTICES ...........................................................................1
`
`A. Real Party-In-Interest................................................................................1
`
`B. Related Matters ..........................................................................................1
`
`C. Lead And Back-Up Counsel......................................................................5
`
`D. Service Information....................................................................................6
`
`II.
`
`PAYMENT OF FEES ...................................................................................6
`
`III. REQUIREMENTS FOR INTER PARTES REVIEW................................6
`
`A. Grounds For Standing ...............................................................................6
`
`B.
`
`Identification of Challenge ........................................................................7
`
`1. Claims for which inter partes review is requested ...............................7
`
`2. The specific art and statutory ground(s) of the challenge ..................7
`
`3. How the challenged claims are to be construed...................................8
`
`4. How the construed claims are unpatentable under the statutory
`
`grounds identified in 37 C.F.R. § 42.204(b)(2)............................................8
`
`5. Supporting evidence relied upon to support the challenge.................9
`
`IV. SUMMARY OF THE ‘413 PATENT ..........................................................9
`
`A. Description Of The Alleged Invention .....................................................9
`
`-i-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`B. Summary Of The Prosecution History...................................................11
`
`THERE IS A REASONABLE LIKELIHOOD THAT AT LEAST ONE
`V.
`CLAIM OF THE ‘413 PATENT IS UNPATENTABLE ...................................13
`
`A.
`
`Identification Of The References As Prior Art .....................................13
`
`B. Summary Of Grounds for Unpatentability ...........................................14
`
`1. Applicant’s Admitted Prior art in view of Sukegawa renders claims
`
`1, 2, 4-7, 9-11, 13-18, 20-22, 24, 25, and 27-29 of the ‘413 patent obvious
`
`
`
`15
`
`2. Sukegawa in view of Nakamoto renders claims 1, 2, 4-7, 9-11, 13-18,
`
`20-22, 24, 25, and 27-29 of the ‘413 patent obvious..................................16
`
`VI. DETAILED EXPLANATION....................................................................16
`
`VII. CONCLUSION ............................................................................................54
`
`CERTIFICATE OF SERVICE ............................................................................56
`
`
`
`
`-ii-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
` EXHIBIT LIST
`1001. U.S. Patent No. 7,876,413 to Hirakata et al.
`
`1002. Prosecution history of application 12/252,793, which matured into the
`
`‘413 patent.
`
`1003. U.S. Patent No. 5,636,329 to Sukegawa et al.
`
`1004. Japanese Patent Publication No. H08-160446 to Nakamoto et al.
`(including English translation)
`
`1005. Declaration of Miltiadis Hatalis, Ph.D.
`
`
`
`-iii-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`Petitioner Chimei Innolux Corp. (“CMI” or “Petitioner”) respectfully
`
`requests inter partes review for claims 1, 2, 4-7, 9-11, 13-18, 20-22, 24, 25, and
`
`27-29 of U.S. Patent No. 7,876,413 (the “‘413 patent,” attached as Ex. 1001) in
`
`accordance with 35 U.S.C. §§ 311–319 and 37 C.F.R. § 42.100 et seq.
`
`I. MANDATORY NOTICES
`Pursuant to 37 C.F.R. § 42.8(a)(1), CMI provides the following mandatory
`
`disclosures.
`
`A. Real Party-In-Interest
`Pursuant to 37 C.F.R. § 42.8(b)(1), Petitioner certifies that CMI is the real
`
`party-in-interest.
`
`B. Related Matters
`Pursuant to 37 C.F.R. § 42.8(b)(2), Petitioner states that the ‘413 patent is
`
`involved in the litigation styled Semiconductor Energy Laboratory Co., Ltd. V.
`
`Chimei Innolux Corp., et al., SACV12-0021-JST (C.D. Cal.), filed on January 5,
`
`2012. This litigation remains pending. The patents-in-suit are U.S. Patents
`
`7,876,413; 6,404,480; 7,697,102; 7,956,978; 8,068,204; and 7,923,311.
`
`This IPR petition is directed to U.S. Patent 7,876,413, however, petitions
`
`corresponding to the remaining patents have been filed previously, one remaining
`
`petition is forthcoming. To this end, the Patent Trial & Appeal Board (PTAB) may
`
`wish to consider consolidating the six (6) patents to a single panel of
`
`Administrative Patent Judges for administrative efficiency. Likewise, the PTAB is
`
`-1-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`encouraged to take immediate jurisdiction over all involved applications as noted
`
`below in B(1) of this Section.
`
`CMI moved to stay the corresponding district court litigation pending the
`
`conclusion of the Inter Partes Review proceedings on October 22, 2012.
`
`Through these filings, CMI is availing themselves of the new alternatives to
`
`time consuming and costly patent litigation that were provided on September 16,
`
`2012 by the Leahy-Smith America Invents Act. As the current proceeding must be
`
`concluded within 12 months by statute, will resolve issues of patentability for not
`
`only the ‘413 patent but all “involved” claims. Moreover, the proceeding will be
`
`exclusively presided over by technically trained Administrative Patent Judges of
`
`the PTAB. CMI is looking forward to a timely and cost effective resolution to this
`
`dispute.
`
`1. Involved Claims
`
`37 C.F.R. 42.3 conveys exclusive jurisdiction to the PTAB over involved
`
`claims subject to the proceeding, as the Board may order. See 35 U.S.C. 6(b), as
`
`amended, 35 U.S.C. 326(c), and Public Law 112-29, section 18. The term
`
`“proceeding” is defined by 37 C.F.R. 42.2 as a trial or preliminary proceeding.
`
`Rule 42.2 also defines the term “preliminary proceeding” as beginning with the
`
`filing of an IPR petition. To this end, the PTAB now has jurisdiction over the
`
`following pending claims.
`
`-2-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`JP 9-289160 (10/06/1997)
`
`6,072,556 (10/1/1998)
`Continuation
`6,239,854 (01/11/2000)
`Continuation
`6,567,146 (03/24/2001)
`Continuation
`7,268,851 (03/10/2003)
`Continuation
`7,440,068 (08/13/2007)
`Continuation
`7,876,413 (10/16/2008)
`Continuation
`8,068,204 (01/20/2011)
`
`13/304,660 (11/27/2011)
`PENDING (Notice of Allowance, 10/01/2012)
`
`
`
`Pending application 13/304,660 has been issued a Notice of Allowance, but
`
`no issue fee has been paid, and prosecution may still be reopened. As an
`
`application claiming priority to the ‘413 patent remains active, this application may
`
`be utilized as a basis to present patentably indistinct claims, and, may, if allowed to
`
`continue, proceed to issuance prior to the determination of the PTAB in this IPR.
`
`The issuance of such indistinct claims during the pendency of this IPR is at least
`
`inconsistent with 37 C.F.R. 42.373(d)(ii), and would provide an “end-around” the
`
`reasonable number of substitute claims that may be presented in this proceeding 37
`
`C.F.R. 42.121(a)(3). As such, further USPTO processing of these proceedings may
`
`-3-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`be prejudicial to the Petitioner’s interests and inconsistent with controlling PTAB
`
`rules.
`
`To this end, the Petitioner requests that the PTAB issue a standing order in
`
`this proceeding, once instituted. The requested Order would require the Patent
`
`Owner to provide written notice in all pending continuation/divisional or reissue
`
`applications of the existence of a related IPR proceeding (within 30 days of
`
`institution). Likewise, should the Patent Owner submit claim amendments and/or
`
`new claims during the very limited pendency of the related IPR, it is requested that
`
`the Standing Order require the Patent Owner to provide a written reminder to the
`
`Examiner with each such submission as to the estoppel impact of a finally refused
`
`or cancelled claim in this proceeding.
`
`While this Requested Order may seem unnecessary due to the already
`
`existing obligation of the Patent Owner under the duties of disclosure, candor, and
`
`good faith, this particular Patent Owner has exhibited a history of especially
`
`egregious conduct in this regard. See Semiconductor Energy Laboratory Co. V.
`
`Samsung Electronics Co., 204 F.3d 1368, 1377-78, 54 USPQ2d 1001, 1008 (Fed.
`
`Cir. 2000) (discussing SEL’s deliberate submission of incomplete information to
`
`the USPTO to mislead the patent examiner.)1
`
`
`1 Previous IPR filings 2013-00028 and 2013-00038 the Requester sought
`suspension of ongoing continuation application prosecution. This request was
`denied (Decisions of November 28, 2012) noting that the examiner had the
`
`-4-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`2. Request for Motion Authorization Pursuant to 37 C.F.R. 42.20(b)
`
`Alternatively, should the Board require that the above noted relief be
`
`requested by motion, pursuant to 37 C.F.R. 42.20(b), Petitioner hereby requests
`
`authorization in this paper to pursue a motion seeking the relief outlined above,
`
`and for the judges assigned to this proceeding to convey such authorization during
`
`the first conference call with counsel.
`
`C. Lead And Back-Up Counsel
`Pursuant to 37 C.F.R. § 42.8(b)(3), Petitioner provides the following
`
`designation of counsel:
`
`Lead Counsel
`Scott A. McKeown
`cpdocketmckeown@oblon.com
`Registration No.: 42,866
`
`OBLON, SPIVAK, McCLELLAND,
`MAIER & NEUSTADT, L.L.P.
`1940 Duke Street
`Alexandria, Virginia 22314
`Tel: (703) 412-6297
`Fax: (703) 413-2220
`
`Back-Up Counsel
`Gregory S. Cordrey
`gcordrey@jmbm.com
`Registration No.: 44,089
`
`JEFFER MANGELS BUTLER &
`MITCHELL LLP
`3 Park Plaza, Suite 1100
`Irvine, California 92614-2592
`Tel: (949) 623-7200
`Fax: (949) 623-7202
`
`
`discretion to consider such action upon discovering patentably indistinct claims in
`those applications. In view of the relative newness of these PTAB proceedings, and
`the likelihood that such matters may be in advertently overlooked in the near term,
`good cause is shown for the requested Order; especially here where the Patent
`Owner has a history of misleading conduct, and derives the vast majority of their
`revenue from patent infringement suits.
`
`-5-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`D.
`
`Service Information
`
`Pursuant to 37 C.F.R. § 42.8(b)(4), service information for lead and back-up
`
`counsel is provided above.
`
`II.
`
`PAYMENT OF FEES
`
`The undersigned authorizes the Office to charge $29,000 to Deposit Account
`
`No. 15-0030 as the fee required by 37 C.F.R. § 42.15(a) for this Petition for Inter
`
`Partes Review. Review of twenty-three (23) claims is being requested, so an
`
`excess claims fee is included in this fee calculation. The undersigned further
`
`authorizes payment for any additional fees that might be due in connection with
`
`this Petition to be charged to the above referenced Deposit Account.
`
`III. REQUIREMENTS FOR INTER PARTES REVIEW
`As set forth below and pursuant to 37 C.F.R. § 42.104, each requirement for
`
`inter partes review of the ‘413 patent is satisfied.
`
`A. Grounds For Standing
`Pursuant to 37 C.F.R. § 42.104(a), Petitioner hereby certifies that the ‘413
`
`patent is available for inter partes review and that the Petitioner is not barred or
`
`estopped from requesting inter partes review challenging the claims of the ‘413
`
`patent on the grounds identified herein. This is because the ‘413 patent has not
`
`been subject to a previous estoppel based proceeding of the AIA, and, the
`
`complaint served on CMI referenced above in Section I(B) was served within the
`
`last 12 months.
`
`-6-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`B.
`
`Identification of Challenge
`
`Pursuant to 37 C.F.R. § 42.104(b), the precise relief requested by Petitioner
`
`is that the Patent Trial and Appeal Board (“PTAB”) invalidate claims 1, 2, 4-7, 9-
`
`11, 13-18, 20-22, 24, 25, and 27-29 of the ‘413 patent.
`
`1. Claims for which inter partes review is requested
`Pursuant to 37 C.F.R. § 42.204(b)(1), Petitioner requests inter partes review
`
`of claims 1, 2, 4-7, 9-11, 13-18, 20-22, 24, 25, and 27-29 of the ‘413 patent.
`
`2. The specific art and statutory ground(s) of the challenge
`Pursuant to 37 C.F.R. § 42.204(b)(2), Inter partes review of the ‘413 patent
`
`is requested in view of the following references, each of which is prior art to the
`
`‘413 patent under 35 U.S.C. § 102(a), (b), and/or (e):
`
`(1) U.S. Patent No. 5,636,329 to Sukegawa et al. (“Sukegawa,” Ex. 1003)
`
`issued on June 3, 1997 from an application filed on June 22, 1995. Sukegawa is
`
`prior art to the ‘413 patent under at least 35 U.S.C. § 102(a) and (e).
`
`(2)
`
`Japanese Patent Publication JP H08-160446 to Nakamoto et al.
`
`(“Nakamoto,” Ex. 1004), published on June 21, 1996 from an application filed on
`
`December 8, 1992. Nakamoto is prior art to the ‘413 patent under at least 35
`
`U.S.C. § 102(a) and (b).
`
`(3) U.S. Patent No. 7,876,413 to Hirakata et al. (Ex. 1001, see Figs. 13,
`
`14A, and 14B, col. 1, l. 25 - col. 3, l. 3) includes admissions by the Applicant
`
`which constitute Admitted Prior Art (“APA”).
`
`-7-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`APA (Ex. 1001) taken in view of Sukegawa (Ex. 1003) renders obvious
`
`claims 1, 2, 4-7, 9-11, 13-18, 20-22, 24, 25, and 27-29 under 35 U.S.C. § 103.
`
`Sukegawa (Ex. 1003) taken in view of Nakamoto (Ex. 1004) renders
`
`obvious claims 1, 2, 4-7, 9-11, 13-18, 20-22, 24, 25, and 27-29 under 35 U.S.C. §
`
`103.
`
`3. How the challenged claims are to be construed
`
`A claim subject to inter partes review receives the “broadest reasonable
`
`construction in light of the specification of the patent in which it appears.” 42
`
`C.F.R. § 42.100(b). Petitioner submits, for the purposes of this inter partes review
`
`only, that the claim terms take on their ordinary and customary meaning that the
`
`terms would have to one of ordinary skill in the art. None of the challenged claims
`
`contains a means-plus-function or step-plus-function limitation, or appeal to recite
`
`a “coined” phrase or defined phrase (lexicography) requiring special consideration.
`
`4. How the construed claims are unpatentable under the statutory
`grounds identified in 37 C.F.R. § 42.204(b)(2).
`
`Pursuant to 37 C.F.R. § 42.204(b)(4), an explanation of how claims 1, 2, 4-
`
`7, 9-11, 13-18, 20-22, 24, 25, and 27-29 of the ‘413 patent are unpatentable under
`
`the statutory grounds identified above, including the identification of where each
`
`element of the claim is found in the prior art patents or printed publications, is
`
`provided in Section VII, below, in the form of claim charts.
`
`-8-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`5. Supporting evidence relied upon to support the challenge
`Pursuant to 37 C.F.R. § 42.204(b)(5), the exhibit numbers of the supporting
`
`evidence relied upon to support the challenges and the relevance of the evidence to
`
`the challenges raised, including identifying specific portions of the evidence that
`
`support the challenges, are provided in Section VI, below, in the form of claim
`
`charts. An Appendix of Exhibits identifying the exhibits is also attached.
`
`IV. SUMMARY OF THE ‘413 PATENT
`
`
`A. Description Of The Alleged Invention
`
`The ‘413 patent describes the state of the prior art in Figs. 13 and 14 (shown
`
`below). When peripheral driving circuits 1504 are enclosed by a sealant 1505,
`
`external connection lines 1508 may have to cross the sealant to exchange signals
`
`with a flexible printed circuit (FPC) 1507. See Fig. 13.
`
`Comparing an area where an external connection line 1508 is present with
`
`an area where external connection line 1508 is not present, a height difference d
`
`
`
`-9-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`may be found (see Fig. 14A below), resulting in undesired display properties (e.g.
`
`uneven color and brightness). The ‘413 patent attempts to minimize height
`
`differences through the use of adjustment layers (see Fig. 2B below).
`
`
`
`The ‘413 patent also includes claim limitation that are related to a third
`
`described embodiment which includes a configuration of the external connection
`
`lines that “makes it possible to reduce electrical resistance of the external
`
`connection lines 403 significantly … to provide preferable display when driven at
`
`a high frequency and a high speed” (Col. 9:6-11). The ‘413 patent accomplishes
`
`this by including a layer with an auxiliary line 401 that runs parallel with external
`
`connection line 403. See Fig. 4A below.
`
`However, the ‘413 patent also recognizes that the inclusion of the auxiliary
`
`line 401 in parallel with external connection line 403 increases the height
`
`
`
`-10-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`difference that caused undesired display properties (see col. 9:12-19). Thus, the
`
`‘413 patent features adjustment layers are provided to minimize height differences.
`
`See Fig. 4B:
`
`
`
`B.
`
`Summary Of The Prosecution History
`
`The ‘413 patent issued from U.S. Patent Application No. 12/252,793, filed
`
`October 16, 2008 (‘413 patent application). The ‘413 patent claims the benefit of
`
`an October 6, 1997 foreign priority date.
`
`On February 1, 2010, the Office issued a Non-Final Rejection including a
`
`non-statutory double patenting rejection on sole claim 1. In response, the Patent
`
`Owner amended sole claim 1 and added new claims 37-64 in an amendment filed
`
`on May 5, 2010.
`
`In a Final Rejection filed June 16, 2010, the Office rejected all pending
`
`claims based on non-statutory double patenting. In response to the double
`
`patenting rejections, Patent Owner filed three terminal disclaimers on September
`
`28, 2010 which the Office approved.
`
`-11-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`The Final Rejection of June 16, 2010 also objected to claims 1, 42, 50, 52,
`
`57, and 64 because they included the language “… the second wiring and the
`
`transparent conductive layer are in direct contact through an opening in the second
`
`insulating film.” The Examiner’s reasoning for the objection was that, according to
`
`Fig. 4A, “the second wiring (403) and the transparent conductive layer (114) are in
`
`direct conduct without any opening.”
`
`With regard to the objected claim language, the Patent Owner and the
`
`Examiner conducted a telephone interview (see Remarks, September 15, 2010,
`
`page 13). During the telephone interview, the Examiner agreed that paragraph
`
`[0093] of the ‘413 patent application provided sufficient support for the claim
`
`language that “…the second wiring and the transparent conductive layer are in
`
`direct contact through an opening in the second insulating film.” Paragraph [0093]
`
`recites:
`
`Referring to Fig. 4A, the external connection lines 403 are
`electrically connected to an FPC (flexible printed circuit) 107 through
`contact holes provided in the resin inter-layer film 113 through an
`ITO (indium tin oxide) film 114.”
`(emphasis provided in Patent Owner’s Remarks, September 15,
`2010).
`The Office issued a Notice of Allowance on October 8, 2010, indicating that
`
`“the prior art of record neither anticipated nor rendered obvious that a liquid crystal
`
`-12-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`display device comprises various related elements as claimed with specific features
`
`recited in the claims…” Specifically, that:
`
`In claims 1, 42, 45, 52, 57, and 59, the second wiring and the
`flexible printed circuit are in electrical contact through the transparent
`conductive layer; and the second wiring and the transparent
`conductive layer are in direct contact through an opening in the
`second insulating film (see Fig. 4A, the opening is the flexible printed
`circuit 107 located position, and a part of the second wiring 403 in
`direct contact a part of the conductive layer 114 through such opening
`wherein the flexible printed conductive layer 107 located, and a part
`of the second wiring 403 in direct contact a part of the transparent
`conductive layer 114).
`(emphasis original).
`The prior art of record was not discussed with particularity.
`
`V. THERE IS A REASONABLE LIKELIHOOD THAT AT LEAST ONE
`CLAIM OF THE ‘413 PATENT IS UNPATENTABLE
`
`
`A.
`
`Identification Of The References As Prior Art
`
`
`
`U.S. Patent No. 5,636,329 to Sukegawa et al. (“Sukegawa,” Ex. 1003),
`
`“Liquid Crystal Display Apparatus Having Terminal Protected From Break Down”
`
`issued on June 3, 1997 from application Serial No. 08/493,537 filed on June 22,
`
`1995. Sukegawa is prior art to the ‘413 patent under at least 35 U.S.C. § 102(a) and
`
`(e).
`
`-13-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`Japanese Patent Publication JP H08-160446 to Nakamoto et al.
`
`(“Nakamoto,” Ex. 1004), “The Tape Carrier and Its Manufacturing Process, and
`
`the Liquid Crystal Display Device Using the Tape Carrier” published on June 21,
`
`1996 from application Japanese Application No. (1994) 305098 filed on December
`
`8, 1992. Nakamoto is prior art to the ‘413 patent under at least 35 U.S.C. § 102(a)
`
`and (b).
`
`U.S. Patent No. 7,876,413 to Hirakata et al. (Ex. 1001) includes admissions
`
`by the Applicant which constitute Admitted Prior Art (“APA”) (see Figs. 13, 14A,
`
`and 14B, col. 1, l. 25 - col. 3, l. 3).
`
`
`
`B.
`
`Summary Of Grounds for Unpatentability
`
`The Examiner’s statement of reasons for allowance characterized claims 1,
`
`2, 4-7, 9-11, 13-18, 20-22, 24, 25, and 27-29 of the ‘413 patent as having a
`
`combination of features that were neither anticipated nor rendered obvious by the
`
`prior art. However, as discussed below, the limitations of claims 1, 2, 4-7, 9-11,
`
`13-18, 20-22, 24, 25, and 27-29 were neither new to the prior art nor were they
`
`claimed in a non-obvious combination.
`
`The APA discloses that many of the limitations in claims 1, 2, 4-7, 9-11, 13-
`
`18, 20-22, 24, 25, and 27-29 regarding conventional LCD displays were old and
`
`well known in the art. Claims 1, 2, 4-7, 9-11, 13-18, 20-22, 24, 25, and 27-29
`
`include limitations that attempt to distinguish the claims from the APA. Those
`
`-14-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`limitations are generally directed to the inclusion of an auxiliary line in addition to
`
`an external connection line that connects to a flexible printed circuit to reduce
`
`electrical resistance (Ex. 1001, col. 9, ll. 6-11).
`
`However, the use of an auxiliary line, even as limited by claims 1, 2, 4-7, 9-
`
`11, 13-18, 20-22, 24, 25, and 27-29 of the ‘413 patent, was neither new nor non-
`
`obvious at the time the invention was made.
`
`1. Applicant’s Admitted Prior art in view of Sukegawa renders
`claims 1, 2, 4-7, 9-11, 13-18, 20-22, 24, 25, and 27-29 of the ‘413
`patent obvious
`
`Similar to the ‘413 patent, Sukegawa describes the use of an auxiliary line
`
`that connects an LCD display with a flexible printed circuit. Sukegawa describes
`
`that the use of the auxiliary line in its provides benefits such as reduced resistance
`
`values (Ex. 1001, col. 7, ll. 16-26), a more secure connection, and less peeling of
`
`the layers in the multi-layered wiring (Ex. 1003, col. 7, ll. 3-8). Sukegawa provides
`
`these benefits through its multilayer connection that includes at least a lower layer
`
`metal wiring, an interlayer insulating film, an upper layer metal wiring, and a
`
`protective insulating film (Ex. 1003, see generally cols. 4 and 5, Fig. 3E).
`
`Thus, the APA in view of Sukegawa renders obvious claims 1, 2, 4-7, 9-11,
`
`13-18, 20-22, 24, 25, and 27-29. A more detailed explanation and analysis is
`
`provided in the claim charts that follow.
`
`-15-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`2. Sukegawa in view of Nakamoto renders claims 1, 2, 4-7, 9-11, 13-
`18, 20-22, 24, 25, and 27-29 of the ‘413 patent obvious
`
`As discussed above, similar to the ‘413 patent, Sukegawa describes the use
`
`of a multilayer connection that includes at least a lower layer metal wiring, an
`
`interlayer insulating film, an upper layer metal wiring, and a protective insulating
`
`film that connects an LCD display with a flexible printed circuit.
`
`Nakamoto describes yet another possible configuration of connecting an
`
`LCD display with a tape carrier, the configuration having a sealant, conductive
`
`lines, and insulating layers. (Ex. 1004, fig. 9.)
`
`Thus, Sukegawa in view of Nakamoto renders obvious claims 1, 2, 4-7, 9-
`
`11, 13-18, 20-22, 24, 25, and 27-29. A more detailed explanation and analysis is
`
`provided in the claim charts that follow.
`
`VI. DETAILED EXPLANATION
`
`Pursuant to 37 C.F.R. § 42.104(b)(4), Petitioner provides in the following
`
`claim charts a detailed comparison of the claimed subject matter and the prior art
`
`specifying where each element of challenged claim is found in the prior art
`
`references. All emphasis is added unless otherwise indicated.
`
`
`Patent 7,876,413
`Claim 1
`1.1 A liquid crystal display
`device comprising:
`
`Admitted Prior Art in ‘413 Patent (“APA”) in
`view of Sukegawa et al. (USPN 5,636,329)
`
`APA: “Fig. 13 shows an example of a liquid
`crystal display device…” (Col. 1:8).
`
`-16-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`1.2 a first wiring over a
`substrate
`
`APA: See Fig. 13, showing a first wiring (short
`ring 1509) over a substrate (substrate 1501)
`
`“There is further provided short rings 1509 which
`are formed by extending scanning lines and signal
`lines.” (Col. 1: 61-62)
`
`1.3 a first insulating film over
`the first wiring
`
`See Hatalis Declaration (Ex. 1005), ¶¶ 34-36.
`APA: See Fig. 14A, showing a first insulating film
`(first interlayer film 1512).
`
`
`
`
`Sukegawa: See Fig. 2C, showing a first insulating
`film (insulation film 3) over the first wiring (lower
`layer metal wiring 2).
`
`
`
`The ‘413 patent is directed to providing
`connections between circuits inside and outside of
`a sealant by using first and second conductive lines
`(Col. 8:42-51). As illustrated by the APA and
`Sukegawa, it was known in the art to provide an
`insulating film between first and second wirings so
`
`-17-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`1.4 a second wiring over the
`substrate and the first
`insulating film
`
`as to provide a more secure connection. See Hatalis
`Declaration (Ex. 1005), ¶¶ 34-36, 88.
`APA: See Fig. 14A, showing a second wiring
`(external connection line 1508) over the substrate
`(substrate 1501) and the first insulating film (first
`interlayer film 1512)
`
`1.5 a second insulating film
`over the second wiring
`
`
`See Hatalis Declaration (Ex. 1005), ¶¶ 34-36.
`APA: See Fig. 14A, showing a second insulating
`film (resin interlayer film 1513) over the second
`wiring (external connection line 1508
`
`1.6 a transparent conductive
`layer over a first region of the
`second wiring
`
`
`See Hatalis Declaration (Ex. 1005), ¶¶ 34-36.
`Sukegawa: See Fig. 2C, showing a transparent
`conductive layer (transparent conductive film 8)
`over a first region of the second wiring (upper layer
`metal wiring 7). “[A] transparent conductive film 8
`made of Indium-Tin-Oxide (ITO)” (Col. 3:17-19).
`
`
`
`The ‘413 patent is directed to providing conductive
`lines to connect to external circuits outside a
`sealant (Col. 1:17-47). As illustrated by Sukegawa,
`it was known in the art to provide connectivity to
`
`-18-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`external circuits through a transparent conductive
`film of indium tin oxide which provides a layer of
`protection. See Hatalis Declaration (Ex. 1005), ¶¶
`37-39, 88.
`APA: See Fig. 13, showing a flexible printed
`circuit (FPC 1507) over a first region of the second
`wiring (external connection line 1508)
`
`1.7 a flexible printed circuit
`over the first wiring and the
`first region of the second
`wiring; and
`
`
`Sukegawa: See Fig. 2C, showing a flexible printed
`circuit (flexible wiring substrate 31) over the first
`wiring (lower layer metal wiring 2) and the first
`region of the second wiring (upper layer metal
`wiring 7-2).
`
`
`The ‘413 patent is directed to providing conductive
`lines to connect to external circuits outside a
`sealant (Col. 1:17-47). As illustrated by the APA
`and Sukegawa, it was known in the art to connect
`to external circuits through a conductive line and
`an FPC. See Hatalis Declaration (Ex. 1005), ¶¶ 40-
`43, 88.
`APA: See Fig. 13, showing a sealant (sealant 1505)
`over the first wiring (short ring 1509) and a second
`region of the second wiring (external connection
`line 1508).
`
`-19-
`
`1.8 a sealant over the first
`wiring and a second region of
`the second wiring
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`
`“…external connection lines 1508 for electrically
`connecting those circuits and circuits outside the
`sealant to transmit signals therebetween” (Col.
`1:55-58)
`
`“There is further provided short rings 1509 which
`are formed by extending scanning lines and signal
`lines.” (Col. 1: 61-62)
`
`See Hatalis Declaration (Ex. 1005), ¶¶ 44-46.
`APA: “FIG. 14A shows sections of a region under
`the sealant 1505 where the external connection
`lines 1508 are provided and a region where no line
`is provided.” (Col. 2:7-9).
`
`See Fig. 14A showing a second insulating film
`(resin interlayer film 1513) above the external
`connection line (external connection line 1508),
`which is a region under sealant 1505.
`
`1.9 wherein the sealant is in
`direct contact with the second
`insulating film
`
`1.10 wherein the second
`wiring overlaps at least part
`of the first wiring
`
`
`See Hatalis Declaration (Ex. 1005), ¶¶ 50-51.
`Sukegawa: See Fig. 2C, showing the second
`wiring (upper layer metal wiring 7) overlapping at
`least part of the first wiring (lower layer metal
`wiring 2)
`
`-20-
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`
`The ‘413 patent is directed to providing external
`connection lines having reduced resistance (Col.
`8:33-35). As illustrated by Sukegawa, it was
`known in the art to provide a second wiring line
`overlapping a first wiring so as to lower the
`resistance of the second line and to provide a more
`secure connection. See Hatalis Declaration (Ex.
`1005), ¶¶ 53-55, 88.
`Sukegawa: See Fig. 2C, showing the first wiring
`(lower layer metal wiring 2) and the second wiring
`(upper layer metal wiring 7) in electrical contact
`through an opening in the first insulation film.
`
`1.11 wherein the first wiring
`and the second wiring are in
`electrical contact through an
`opening in the first insulating
`film
`
`
`
`The ‘413 patent is directed to providing
`connections between circuits inside and outside of
`a sealant by running lines under the sealant (Col.
`1:17-47). As illustrated by Sukegawa, it was
`known in the art to provide electrical contact
`between external connection lines and auxiliary
`lines through an opening in an insulating film so as
`to provide a more secure connection. See Hatalis
`Declaration (Ex. 1005), ¶¶ 56-58, 88.
`APA: “The external connection lines 1508 are
`connected to the external circuits through an FPC
`(flexible printed circuit)” (Col. 1:61-62).
`
`-21-
`
`1.12 wherein the second
`wiring and the flexible
`printed circuit are in
`
`
`
`Inter Partes Review of U.S. Patent No. 7,876,413
`
`electrical contact through the
`transparent conductive layer;
`and
`
`
`Sukegawa: See Fig. 2C, showing the second
`wiring (upper layer metal wiring 7-2) and the
`flexible printed circuit (flexible wiring substrate
`31) in electrical contact through the transparent
`conductive layer (transparent conduc