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`INNOLUX CORPORATION v. PATENT OF SEMICONDUCTOR ENERGY
`
`LABORATORY CO., LTD.
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`|PR2013—00066
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`TCO Laser Scribing System ULT—1400 | ULVAC
`
`ULVAC PRODUCTS
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`EQUIPMENT
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`Top > EQUIPMENT > TCO Laser Scribing System ULT-1400
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`PRODUCT CATEGORY
`
`Sputtering System
`
`TCO Laser Scribing System
`ULT-1400
`
`
`This system is a single-substrate laser scribing system that is used to
`remove the transparent electrode (TCO) films formed on the glass
`substrate by the laser ablation method using the near-infrared
`wavelength pulse oscillating laser.
`This system consists of6 lR lasers, 6 sets of laser light collection
`optical system, bridge type XY stage (X-axis: lower axis, Y‘axis: upper
`axis on bridge), substrate conveyor mechanism, dust collector, laser
`power measuring instrument and control systems. It is achieved high
`accuracy and high stability for using fiber lasers and a stage made of
`
`granite.
`
`Features
`
`- Diode coupled 6 IR lasers:
`Laser light is delivered by optical fiber and set variable pulse width
`
`- Simple and high stability optical system
`
`- Granite XY stage:
`High precision and minimal thermal expansion/contraction
`
`-
`
`Individual laser positioning control:
`Every IR laser has its own Y— and Z-stage
`
`. Automatic measurement and calibration of laser output power
`
`- Tact time < 90 sectULVAC standard pattern)
`Applications
`
`- Thin film solar Cell (TCO Laser scribing)
`
`.
`
`Specifications
`
`
`liubstrate material
`W1400 x D1100 x t=3~5mm
`
`act time
`< 90 sec. (ULVAC standard pattern)
`
`Excitation
`Laser Diode
`
`Laser wavelength
`About 1.06pm
`
`Beam delivery
`Optical Fiber
`
`Beam shape
`About 50-70um circle
`
`Number of beams
`Air cooling
`
`ooling
`Air cooling
`
`IStage size
`_L
`W2420mm x L4570mm x H2100mm
`X axis(upper axis): 2000mm
`alid stroke
`Y axis(lower axis): 1260mm
`
`Z axis(mounted on Y stage): 50mm
`
`
`
`Maximum speed
`X11000mmlsec
`Y2600mm/sec.
`-Y orthogonality
`Below Sum/500mm
`
`Eccuracy of repeatability positioning Below +/-10um
`
`CVD ISystem
`Vacuum Evaporation
`System
`Vapor Deposition
`Polymerization System
`Ashing System
`
`Roll Coater
`Freeze Drying [vacuum
`Drying System
`
`Vacuum Distillation System
`Automatic LeakTester
`Others
`APPLICATIONS
`Semiconductor Process
`(FEOtJBEOL)
`
`Semiconductor Process
`(NonVolatile Memory)
`LED Device
`Power DeVIce
`
`Advanced Packaging
`DeviceMEMS Devrce
`Optical Film
`Magnetic Device
`Thin-film Lithiumton
`Secondary Battery
`
`”TouchPanel
`VWR&DMEquipmentfor Display -~
`~Photovoltaic
`~-
`
`flAutomobiteParts
`IWringMaterials
`.,..Capacuors
`PackagingMaterialswmm
`“Decorative Coating
`"Pharmaceutical
`
`Food Processmg
`
`Electronics Materials
`Functional Materials
`
`
`
`
`
`TCO Laser Scribing System ULT—1400 | ULVAC
`
`Aviation
`Power Transmissron
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`Home Appliance
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`Cautions on use
`
`Contact
`EQUIPMENT
`PRODUCT CATEGORY
`. Sputtering System
`. DVD System
`. Vacuum Evaporation System
`w Vapor Deposition
`Polymerization System
`2 Ashing System
`~ Etching System
`‘
`ton Implantation System
`) Vacuum Furnace
`> Roll Coater
`» Freeze Drying/Vacuum Drying
`System
`, Vacuum Distillation System
`- Automatic Leak Tester
`. Others
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`Link Policy
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`Site Map
`EQUIPMENT
`APPLICATIONS
`’ Seniconductor Process
`(FEOL/BEOL)
`Semiconductor Process (Non
`Volatile Memory)
`» LED Device
`w Power Device
`. Advanced Packaging Device
`- MEMS Device
`- Optical Film
`\ Magnetic Device
`Thin-film Lithium Ion Secondary
`Battery
`LCD
`I DLED
`v Touch Panel
`'- R&D Equipment for Display
`‘ Photovoltaic
`: Magnet
`> Automobile Parts
`* Viking Materials
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`: Packaging Materials
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`a Pharmaceutical
`'- Food Processing
`' HealthCare
`= Electronics Materials
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`'- Aviation
`« PowerTransmission
`~ Home Appliance
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`MATERIALS
`Sputtering Targets
`I For FPD
`. FerSeniconductor
`. ForPhotovoltaic
`,
`lTOTarget
`. 1620 Target
`- Evaporation Deposition
`Materials
`High Performance Materials
`,
`[Ta][Nb]Sheet
`-
`[Tallelvthre/Ear
`v
`[TeHNblTube/Pipe
`‘
`[TaHNbflZr] Reactor Vessels
`.
`[Talle] Heat Exchanger
`:
`[Ta][Nb][Zr] Columns
`,
`[‘l‘a][Nb]|Zr|[TI] Coating
`‘
`['l'filthllZ'ltTIlPiPinQS
`Nano»me|at Ink
`
`CUSTOMER SUPPORT
`Field Service for Equipment
`’ Ftied Service
`, Gloobal CIP
`, Factory Outsourcing
`> Recycling I Cleaning / Reusing
`Resources
`Maintenace tor Component
`« Pump Maintenance Service
`I JCSS Calibration Service
`(Vacuum Gauge)
`~ Termination of Production and
`Maintenance
`Parts Supply
`Surface Treatment
`MEMS Foundry Service
`Analysis Service
`Used Equipment/Refurbish
`
`COM PONENTS
`Vacuum Pump
`i Dry Pump
`i Oil Rotary Pump
`- Mechanical Booster Pump
`:
`Ion Pump
`\ Turbo Molecular Pump
`~ Oil Diffusion Pump
`, Cryo Pump
`. Titanium Getter Pump
`Vacuum Gauge
`Process Gas Monitor
`Leak Detector
`Thin Film
`Measurement/Deposition
`Controller
`VacuumValve
`Parts for Ultravl-figh Vacuum
`Power Supply
`Transfer Robot
`Sefiware
`Catalog Download
`Drawing Data Download
`Termination of Production and
`Maintenance
`
`
`
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`
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