SEL EXHIBIT 2013
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`INNOLUX CORPORATION v. PATENT OF SEMICONDUCTOR ENERGY
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`LABORATORY CO., LTD.
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`lPR2013-00066
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`‘ Click the process at the bottom to see the details.
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`I! TFT process
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`What is TFT process
`TFT process is very similar to that of manufacturing semiconductors. It is the process to manufacture TFT by arranging the
`thin film transistor on the glass plates under deposition, photolithography and etching repetitively. It is different from
`semiconductor in a sense that it uses glass instead of waters. While the process of semiconductor has about 1,000CC
`process temperature, TFT process uses glass plate to maintain 300 - 5005C process temperature. So it is more
`complicated technology than semiconductor.
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`1, PECVD (Plasma Enhanced Chemical Vapor Deposition)
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`deposition are vacuum state, RF power, panel temperature, response gases and response pressure, The materials to be
`deposited are divided into the insulating layers and semiconductor layers. And the insulating layers consist of gate
`insulating layers, protective layers and etch stopper layers. The semiconductor layers consist of doped amorphous silicon
`layers (n+ a—SizH) that form contact resistance layers with amorphous silicon (a—Si:H) that forms active layers.
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`2. Sputtering process (Deposition promss)
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`Sputtering is the process that gas icons with high energy in the plasma that is formed by RF power or DC power collide
`with the targeted surface and the targeted particles to be deposited are protruded out and are deposited on the panel. In
`general, being equipped with the targeted materials to be deposited on the negative surfaces and using inert gases such
`as He and Ar that don’t influence on the characteristics of deposition materials. the targeted materials that are protruded
`on the panel are getting deposited,
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`3. Photolithography process (Developing process)
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`Photolithography process means that using the principle that if some specific chemicals (photo resist) get sunshine. it has
`a chemical reaction to change its properties. it uses a mask of the pattern that you want to have and applies lights to PR
`selectively to form the same pattern with the mask. This process consists of the PR coating process that coats photo resist
`corresponding to the films of the general picture, the lithography process that applies lights selectively using the mask and
`the developing process that removes PR from the part that gets lights and forms the pattern.
`As the steps of all processes are very weak to various particles and the defects of the patterns cause the defects of all the
`panels, it is important to maintain the clean environment, materials and devices. And this process will get more important
`according to high precision and large scaling ofTFT manufacturing process in the future.
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`4. Dry etch process (Etching)
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`It is the process to use the response materials such as atoms and radicals from gas plasma that is formed under three
`conditions of vacuum. gas and RF power and the phenomenon that the materials deposited on the panel are changed into
`volatile materials. This method is fast to respond and able to etch the minute forms. And as the responses occur in the
`vacuum chamber. it is advantageous in safety.
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`E3 Color Filter process
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`Cell process
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