US007566960B1
`
`(12) United States Patent
`US 7,566,960 B1
`(10) Patent N0.:
`Conn
`
`(45) Date of Patent: Jul. 28, 2009
`
`(54)
`
`(75)
`
`INTERPOSING STRUCTURE
`
`6,104,082 A *
`
`8/2000 Berlin et al.
`
`................ 257/665
`
`Inventor: Robert O. Conn, Los Gatos, CA (US)
`
`(73)
`
`Assignee: Xilinx, Inc., San Jose, CA (US)
`
`(*)
`
`Notice:
`
`Subject to any disclaimer, the term of this
`patent is extended or adjusted under 35
`U.S.C. 154(b) by 112 days.
`
`(Continued)
`FOREIGN PATENT DOCUMENTS
`
`JP
`
`5-160198
`
`*
`
`6/1993
`
`(21)
`
`Appl. No.: 10/698,704
`
`(22)
`
`Filed:
`
`Oct. 31, 2003
`
`Int. Cl.
`
`(51)
`
`(2006.01)
`H05K 1/02
`(2006.01)
`H05K 1/00
`(2006.01)
`H01L 23/02
`US. Cl.
`.............................. 257/686; 257/E23068;
`257/E2307; 257/E23079; 257/777; 257/698;
`257/737; 257/738; 257/723; 257/724; 257/700;
`257/924; 257/678; 361/749; 361/764; 361/735;
`361/790; 361/803; 361/804; 361/767; 361/780;
`361/794
`
`Field of Classification Search ................. 257/686,
`257/777, E23068, E2307, E23079, 737,
`257/738, 723, 724, 700, 698, 924, 678; 361/749,
`361/764, 735, 790, 803, 804, 767, 780, 794;
`438/109, 106, 107
`See application file for complete search history.
`References Cited
`
`U.S. PATENT DOCUMENTS
`
`(52)
`
`(58)
`
`(56)
`
`.................. 361/795
`l/1992 Feng et a1.
`5,081,563 A *
`l/1993 Chance et a1.
`.............. 257/678
`5,177,594 A *
`5,352,926 A * 10/1994 Andrews .................... 257/717
`5,474,458 A * 12/1995 Vafi et a1.
`..................... 439/91
`5,633,785 A
`5/1997 Parker et 31.
`5,640,051 A *
`6/1997 Tomura et a1.
`........... 257/778
`5,705,858 A *
`l/1998 Tsukamoto .......... 257/778
`
`8/1998 Klein ......................... 361/774
`5,796,590 A *
`5,854,534 A
`12/1998 Berlin et a1.
`5,973,930 A * 10/1999 Ikeda et a1.
`
`................. 361/768
`
`(Continued)
`OTHER PUBLICATIONS
`
`U.S.App1. No. 10/698,690, filed Oct. 31, 2003, Conn.
`
`(Continued)
`
`Primary ExamineriAlexander 0 Williams
`(74) Attorney, Agent, or FirmiLester Wallace; Robert M.
`Brush
`
`(57)
`
`ABSTRACT
`
`A capacitive interposer (caposer) is disposed inside an inte-
`grated circuit package between a die and an inside surface of
`the package. Conductive layers within the caposer constitute
`a bypass capacitor. In a through-hole caposer, micro-bumps
`on the die pass through through-holes in the caposer and
`contact corresponding landing pads on the package. As they
`pass through the caposer, power and ground micro-bumps
`make contact with the plates of the bypass capacitor. In a via
`caposer, power and ground micro-bumps on the die are
`coupled to power and ground landing pads on the package as
`well as to the plates of the bypass capacitor by power and
`ground vias that extend through the caposer. In signal redis-
`tribution caposer, conductors within the caposer redistribute
`signals between die micro-bumps and package landing pads.
`In an impedance matching caposer, termination structures
`within the caposer provide impedance matching to a printed
`circuit board trace.
`
`13 Claims, 16 Drawing Sheets
`
`{J
`
`553;)”ch
`1012
`
`CAPOSER
`1018
`
`'TTTTJJTTTTT“
`o. _.-_.4 .- .- ,
`
`
`
`SOLDER
`BALLS
`
`1014
`L$“A%'§G
`
`IVM 1001
`IPR of U.S. Pat. No. 7, 566, 960
`
`

`

`US 7,566,960 B1
`
`Page 2
`
`US. PATENT DOCUMENTS
`
`~~~~~~~~~~~~~ 257/678
`
`6,137,161 A * 10/2000 Gillilandetal.
`6,144,225 A
`11/2000 Lesea
`6,242,932 B1*
`6/2001 Hembree .................... 324/755
`~361/704
`6,246,583 131*
`6/2001 Cronin etal~
`
`~438/118
`6,294,407 B1*
`9/2001 Jacobs ~~~~~~~~
`1/2002 Alagaratnametal.
`6,335,491 B1*
`174/260
`6/2002 HirashimaetaL ~~~~~~~~~~ 257/737
`6400019 B1*
`6,417,688 B1
`7/2002 Dabral etal.
`361/306.3
`6,477,034 B1* 11/2002 Chakravorty et al.
`6,525,922 B2*
`2/2003 Wineretal.
`...........
`361/306.3
`~-
`6529027 131*
`3/2003 Akrametal.
`324/758
`
`4/2003 Edwards et al~
`6,541,365 B2*
`438/612
`6555920 B2*
`4/2003 Chung etal~
`257/779
`
`.257/700
`6,563,210 B2*
`5/2003 Sankman
`
`9/2003 Bohr ~~~~~~~~~~~~~~~~
`~257/700
`6,617,681 B1*
`
`9/2003 Alagaratnam et a1.
`6,618,938 131*
`29/840
`...........
`6,661,088 B1 * 12/2003 Yoda et a1.
`257/700
`6,664,643 B2* 12/2003 Emoto ........
`.257/777
`6,671,947 B2*
`1/2004 Bohr ..........
`.. 29/846
`
`................ 438/108
`6,680,218 B2*
`1/2004 Chung et a1.
`6,683,781 B2
`1/2004 Ho etal.
`6,699,046 B2
`3/2004 Ho etal.
`6,717,821 B2*
`4/2004 Miller et a1.
`................ 361/760
`6,724,638 131*
`4/2004 Inagaki et a1.
`..
`.. 361/763
`
`6,734,540 B2*
`5/2004 Fritz .......................... 257/686
`6,754,407 B2
`6/2004 Chakravorty etal.
`6,756,628 B2*
`6/2004 Echigo et a1.
`............... 257/306
`
`438/107
`6,833,285 131* 12/2004 Ahn et 31~
`~~~~~~
`6,856,167 B2*
`2/2005 Ozguz et a1.
`326/41
`
`4/2005 Conn ~~~~~~~~~~~~~~~
`- 174/534
`6,875,921 Bl *
`5/2005 Alexander et a1.
`257/678
`6,891,258 B1*
`
`..
`6,894,396 B2*
`5/2005 Shioga et a1.
`257/777
`6,970,362 B1* 11/2005 Chakravorty ................ 361/782
`
`
`
`6/2007 Conn
`7,233,061 B1
`............... 257/778
`7/2007 Farooqetal.
`7,245,022 B2*
`2001/0040272 A1* 11/2001 Mashino ..................... 257/532
`2002/0036340 A1*
`3/2002 Matsuo et a1.
`.............. 257/698
`
`2002/0041489 A1*
`4/2002 Fritz
`361/767
`7/2002 Winer et a1.
`............. 361/306.3
`2002/0085336 A1*
`2002/0088977 A1*
`7/2002 Morietal.
`.................... 257/68
`2002/0182804 A1* 12/2002 Echigo et al.
`438/250
`
`1/2003 Sathe ......................... 257/780
`2003/0001287 A1*
`2003/0006494 A1*
`1/2003
`257/686
`2003/0164548 A1*
`9/2003
`. 257/738
`2004/0027813 A1*
`2/2004
`361/767
`2004/0067605 A1*
`4/2004 Koizumi
`..................... 438/108
`
`2004/0201367 A1* 10/2004 Echigo et a1.
`320/166
`.......... 324/754
`2004/0239349 A1* 12/2004 Yamagishi et a1.
`2005/0017333 A1
`1/2005 Bohr
`2005/0179128 A1*
`8/2005 Shiogaet a1.
`
`
`
`............... 257/724
`
`FOREIGN PATENT DOCUMENTS
`
`JP
`JP
`JP
`JP
`
`”1998
`*
`10'32070
`9/1999
`*
`11460860
`2004'79745 A * ”004
`2005444163
`* ”005
`
`OTHER PUBLICATIONS
`U~S~APP1~ No, 10/698,906, filed Oct. 31, 2003, Conn.
`U.S.App1. No. 10/377,863,filed Feb. 28, 2003, Trimberger etal.
`Adel
`Corporation;
`Application
`Note
`«The
`A0161
`ExtenderiExtending the Life of Existing Designs”; Jan. 2002;
`available fromActelCorporation; pp, 1.4,
`Fujipoly; Electronic Packaging Components, downloaded Oct. 10,
`2003 from Fujipolyflpages.
`
`* cited by examiner
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 1 0f 16
`
`US 7,566,960 B1
`
`PACKAGED DEVICE 102
`
`
`
`INTEHPOSER 103 zl’lzt’lz
`
`
`
`PCB101{
`VII/III/I/I/I/I/Il/I/I/I/I/I/I/I/A
`
`212421212
`
`
`
`/
`I I
`
`I
`’1 ‘L/
`I
`I
`I
`
`/
`
`’
`
`PLANE 220
`
`AREA 230
`
`
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 2 0f 16
`
`US 7,566,960 B1
`
`103 THROUGH
`PLANE 220
`
`LAND
`316
`
`DIELECTRIC 310
`
`
`GND I/O SIGNAL
`
`
`
`
`
`’0'.‘.‘.'.'O'§‘§'0‘¢'.:
`
`51010510109090101010
`'10......,,..
`...... 11°
`
`{0310201020320302010‘
`{0101010201091020303
`{0101010T0I0I020t03020
`10203101010310)?
`
`
`
`
`31.9.0.0.OMAOA
`”I...“ I.‘
`1
`93.03.023.03”.
`.9). .‘.°).‘.’.'.'A
`magnum
`!. . 3.0.13.0);
`..—. 33-5,— _ — — — LAYER313
`
`
`
`pa‘h"""’t'fi'l‘
`D.’A.I"'.‘O.b'.
`t.-
`u'd'b’l‘b’d.‘"'fi.h‘
`L'l"'i"""""‘h’l.u
`v'".‘t""""‘.’h"‘l
`I‘"".D..“.§.l.fi.."
`(GND)
`’V"'Q'9.VQ'
`C'QQVO‘.‘
`‘
`0...?!
`'9’."'.'
`.VQVV'Q'VIQQ
`V""""'Y
`
`”0000000
`00000000000.
`~000000000'
`00000000000.
`:00000000001
`00000000000
`
`
`
`
`
`
`
`
`30101030101010”
`1.1010101010101010? LAJEEH? 4
`010101033010103010901
`£019111°1'’I
`IfI1I11 . 11010‘
`010101010101010100101
`
`I/O SIGNAL
`GND
`
`
`BALL
`
`KEEPOUT 318
`317
`
`LAYER 311
`(GND)
`LAYER 312
`
`F | G . 3
`
`1 03 TH ROUGH
`PLAN E 220
`
`LAN D
`3 1 6
`
`
`DIELECTRIC 310
`[/0 SIGNAL
`GND
`
`
`
`
`""""
`0‘0.030;0;0;0‘0‘0;0‘0;
`'
`'
`'
`'
`‘
`'
`'
`'
`'
`'
`'
`'
`'
`'
`'
`'
`'
`'
`'
`‘
`'
`-
`130‘030;¢‘030;030'.0‘
`
`‘
`‘0’0’0‘0’0‘0’010'0!
`10109010101010.010’0'0‘
`
`
`.
`.
`_
`.'0'.0‘_~?0T0_
`
`
`
`
`‘
`07030101070301
`{07070303307033
`.
`.
`03703707035703
`.'0' 53030333701030
`
`
`
`
`Y0
`070‘.
`030‘.— 0301
`' '
`3070—I030
`
`
`{010:(010102020202010.
`02020101031010?!
`0301010101030101010301
`{010201020101010102020
`
`
`
`
`
`
`
`.
`.. W
`’31..
`.........’?e‘
`é‘é‘.........
`S‘A—S‘l‘
`
`
`
`
`
`
`
`
`
`0.1.1.3);"31
`9;‘.’.‘l%’lll!¢°1
`IeOA.A...A.A.A.A.-.5.AI
`5.9.1.1)!!!”qu
`1.0 f A‘A‘A’A’A'A’A‘
`1‘4.A.A€.A\€.IA.2
`.
`. .........,
`,,,,,,,
`.
`
`
` 00000000000-
`
`>00000000004
`00000000000
`
`
`
`L’i’h’l‘b‘t’l".‘.§.b..
`,O.A.A.A.A.‘.A.A.A.t.4
`’§.‘.h.6‘6.l.h.fi.l.fi.dt
`
`
`IIO SIGNAL
`GND
`
`
`
`KEEPOUT 318
`
`LAYER 31 1
`(GN D)
`
`LAYE R 31 2
`(VCC2)
`LAYER313
`(GND)
`
`LAgECH1?1 4
`
`FIG. 4
`
`

`

`U.S. Patent
`
`Jul. 28, 2009
`
`Sheet 3 of 16
`
`US 7,566,960 B1
`
`541
`
`551
`
`551
`
`LAYERS 311/313
`(GND) IN AREA 230
`
`LAYER 312
`IN AREA 23
`
`évccz)
`
`LAYER 314
`IN AREA 23
`
`CSvccn
`
`LAYERS 311/313
`(GND) IN AREA 230
`
`LAYER 312
`IN AREA 23
`
`6vccz)
`
`,.x.x,_.flx..xxx.
`
`”.x.x..x.nx..x,x«Xxxxx.
`
`”XXXXXX
`
`.X
`2% '
`‘,'X
`x: 6
`
`XX
`XX I
`
`xx
`X X
`
`XXXxxx
`
`;.
`
`XXX.Wuxwx
`xxx:xxxx:
`
`,
`
`1
`
`XXXXXX
`
`XXXXXX
`
`XXXXXX
`
`651
`
`641
`
`xxwkxxxxXXX.XXXXXXKXVXXXXXXXXXX
`
`am"?xxxxxxxxxXXXXXXX
`
`0oav3'..:tcwé‘o.vI000%....”
`fiflf¢£§§t
`0...0
`Iémflir
`I..
`
`XXXXXXX
`
`XXXXXXX
`
`651
`
`XXXXXXX
`
`XXXXXXX
`
`WMF
`
`mo6
`
`mC
`
`.‘..
`
`xxhiSXX
`.OIO§§‘O.o.fla
`VVVfifififi?
`
`XXXXXXX
`
`XXXXXXX
`
`XXXXXXX
`
`
`
`
`
`
`
`
`
`
`
`
`

`

`U.S. Patent
`
`Jul. 28, 2009
`
`Sheet 4 of 16
`
`US 7,566,960 B1
`
`751
`
`517
`
`XXXXXX
`
`XXXXX._
`
`LAYERS 311/313
`(GND) IN AREA 230
`
`FIG. 7A
`
`XXXXXX.
`
`XXXXXK.
`
`XXXXXXXXX.
`
`XXX.
`
`XXXXXX
`
`XXXXXX.
`
`XXXXXX!
`
`XXXXXX.
`
`LAYER 312 évccz)
`
`FIG. 7B
`
`LAYER 314 5VCC1)
`IN AREA 23
`
`IG
`
`XXXXXX
`
`XXXXKX
`
`741
`
`XKXXXXX
`
`XXXXXXX
`
`XXXXXXX
`
`KXXVAXXK
`
`XXXXXXX
`
`XXX.XXXX
`
`XXXXXXK
`
`XXXXXXX
`
`PACKAGED
`IC 802
`
`TILED
`INTERPOSER
`
`PCB
`SURFACE
`
`FIG. 8
`
`
`
`
`
`
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 5 0f 16
`
`US 7,566,960 B1
`
`VIA
`CONNECTION
`
`r’
`
`AREA
`
`VIA
`CONNECTION
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`AFIEA 961 \
`/ 9|!
`973
`971
`
`4IIII""iL||||""i|""'
`
`AREA
`rLIIIIIII"
`
`
`
`- |||
`IIII
`962
`
`
`
`
`
`
`II.—_I——_IlIII-I IIIII
`
`
`
`
`
`
`.El.'!—_
`
`
`
`
`
`VIA CONNECTION 972
`
`\
`
`
`
`
`VIA CONNECTION 974
`
`f”
`
`SEEII‘IIé‘é
`1012
`
`
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 6 0f 16
`
`US 7,566,960 B1
`
`DE
`
`
`
`
`
` .1 fivfivfivfivfivfiu
`
`
`
`
`
`
`016
`L
`x
`x
`n
`x
`x
`x
`'v‘lvfiv‘av‘a'vfivfiv
`
`
`
`
`
`pJANAR
`
`SURFACE
`
`1013
`
`FIRST
`cccceccc
`
`$112193
`SURFACE
`OCOOOOOO
`
`
`
`OOOOQOQO
`
`
`QQQQCQQO
`{/,r1024
`
`
`QCQQQQQQ
`QQQGQQQQ
`
`
` CAPOSER
`1025
`1019
`SECOND
`FIG. 11
`mag»!
`SURFACE
`
`
`
`
`VlllllllllIIIIIIIIIIIHIIIIIIIIIIIIIllllllllllllllllllllll’llI4 7".0"O‘0Q-4':'0o
`
`
`
`4?
`’O:4?
`aka»(i
`z??\
`,,
`_
`I, \
`""03;-
`x"
`
`1025
`
`MICRO
`SECOND
`
`BUMPS
`SURFACE
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 7 0f 16
`
`US 7,566,960 B1
`
`
`
`DIE
`1011
`
`
`
`
`GND
`
`«&«“«\M\W\\\N««m\\\m«%«l 1M7
`W/////
`\\\\\\\\\\\\\\\\\\\\\\\\/\\\\\/////7WW
`WM§
`/§
`ASWI/l/l/l/
`1046
`
`
`.\\\\\\\x\\\\\\\\\\\\\\\\\\\\\\\\i
`
`\\\\\\\\\\\\\k\\\\\\\\\\\\\\
`
`\\\\\\\\\\\\\\\\\\\\\\\\.\\\\\\\
`
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`
`1027
`
`
`
`
`
`
`
`—
`'s
`
`—
`
`
`
`AEIII]'930202052621
`
`
`
`1016
`
`
`
`
`SECOND
`
`MICRO
` FIRST
`
`BUMP
`
`
`CONDUCTIVE
`«— 1oo pm—h
`CAPOSER
`1024
`1018
`LAYER
`1030
`
`
`—
`:nliszezfieillm
`1III1919;9;9;9.1
`._
`.
`.
`,
`1052
`
`
`_ _I 1031
`
`
`1025
`THIRD
`
`CONDUCTIVE
`1043
`
`
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`
`
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`
`IIIIIIIIIIIIIIIIIIIIIIIIII
`1051
`
`\\\\\\‘\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\‘\\\\\l\\\\\\\\\\\\
`
`
`
`lm—§:9—I?.?illll
`
`/I:II|—_:o_:ozozo:ozox¢‘/=¢o§mxIIII
`
`1929
` 1033
`1028
`
`
`
`
`
`=1o101ozozozonnn M IIIIpzozoJIIII M Ill{€\_II—I—I-fotoftéfdfofotd 3262926293621Illll llllitofb‘
`
`
`
`
`
`\\
`
`\\\\\\\\\\\\\\\\\\\\
`\\\\\\\\\\\\\\\\\\\\\\\\\\\‘
`////
`
`
`
`1050 1017
`
`
`\\\\\\\\\\\_\\\\\\\\\
`\\\\\\\\\\\\\\\
`/:\\\\\\\\\\\\\\\\\\
`\////////§WA
`\\//////\////\\//\
`/\ ////I/J/Illlll
`
`/IIII
`III/IIII/I/III/IIIIIIIIIIIIII”Ill/Ill
`
`1054
`
`FIG. 13
`
`CAPOSER
`1018
`
`DIE
`
`1011
`
`
`//
`
`GND
`
`
`
`
`
`
`\\\\\\\\\\\/\\\\\\\\\\\\\/\\\\/\/\\V\\/\\\\\xIl\\\,\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\l\/\\\\,\l\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`W//////////////IIIIIIIIII/I/I/I/l/l/l/l/IIIII/I/l/l/l/II.
`IIIIIIII
`III/II
`
`
`
`\\\\\\/\\/\\\/\/\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\ll\\\l\\\l\\\\\\\\\\\\\\\\\
`///§/
`Ail/III/I/I
`
`_\\\\\\\\\\\\\\\\\\\\\\\\\\\'\-\\\\\\\\\\\\\\\\\\\\\\\\/\\//—/\\\\\\\\\\\\\\\\\\\\\\\///\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\&
`
`/§/
`Ill/Illlll
`/§\>\\\\\/_\\\\\/‘\\\\\\\\/\\
`
`
`—
`
`
`
`1052
`IIII'p—"xozozozom
`III—;.-—;.;.2III
`_
`—
`
`lllh’.o!o!o!llll
`mm
`
`
`
`
`
`
`931010101019:lll|
`IIIbzozozozozozo:
`161.3223.
`
`\'\\\\\\\\\\\\\V—\\\\\\\\\\\\\\\\ //\\\\\\\\\\\\\\\\/\\a\\\\\\\\\\\\\\\\\\\
`
`/.\\\l/\\ \/\
`\7
`\'
`\\\\\\\\\\\\\\\\\\\\/\\l\\\\\\\
`\\\\\\\\\\\\\\\\\l\/\\\\\\\-
`III/IIIA\/ 7
`W
`
`
`
`///l'\lll\\\\\\\\\\\V\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\/(\\\l\\l\\\l\\l\\l\\\l\\l\l\l\\l\l\\[\I\!\\\l\l\\\\l\\\\\\\\\\\\\\\\\\\
`\\\\/\/I//l////\\//
`
`[/04
`
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\)\\\\\
`//
`
`
`////////////‘
`
`
`—
`III.n.ochII
`
`In 362626362026!-
`31—33322”
`
`1031
`1032
`
`$7
`
`
`
`l/I/I/I/I/I/I III/III/IIIIIIIIIIIIIM/I/IA
`
`
`
`
`
`FIG. 14
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 8 0f 16
`
`US 7,566,960 B1
`
`1032 THIRD CONDUCTIVE
`
`
`PLOLKWLW1KW;9L’L’L‘LX’LXK’1’L’LQZ’L’L’B
`
`
`RL9AO¢
`
`VA
`
`SAQA'A’AOA‘[III-I'm“... SACROLQAOLVA
`
`
`
`
`
`
`
`1032
`
`
`FIG. 15E
`FIG. 15A
`FIG. 15C
`«
`
`
`
`
`..
`a.» V
`
`. «93'0“»
`
`O
`’9’9’9‘9’9’9’9’9’9’9 9'9‘9'9'9’9’9'9‘
`0 v
`
`
`
`.«0:0:03-932623233939.~
`99999999999999999999999 \
`9
`
`
`
`
`
`
`OGOVO.OOOOOOOO.OOOOOOOQOO.\
`‘9’?9'9’9’9’9’9’9’9‘9’9’9’9’9‘9’9
`99990:9.’9‘99‘3’3’
`
`
`
`
`999
`9
`99999 9999
`9
`99
`99999999999999999
`I‘9'9‘9'9’9.9.9.9'9‘9‘9’9’9‘9’9‘9’9’9’9’9’9’9’9’9’9
`9‘9‘9‘9‘9‘9‘9‘9‘9‘9‘9‘9’9’9‘9‘9‘9‘9 9‘9‘9‘9‘9‘9’9‘
`
`9999999999,
`9999,999
`9 9
`9999-
`9
`9
`.999999999
`,
`9
`99
`9 99
`9
`9
`
`
`
`
`99,9
`9999999
`999
`99 99 9999999999,
`9
`99999,
`99999
`
`
`99999999999
`9999
`99 9
`9
`999999
`,. 9 99 99
`9999
`999999
`99 .
`999999 9 99
`9
`99999
`.99
`’999999999999 99999999999
`
`
`9999999
`9999999999999999999999
`
`
`9
`9
`9
`
`999
`999999
`9999994
`,999999999999999999999999
`
`
` 99999999999999999999999999
`
`9999999
`99
`,
`99999999999 9 9999
`9999
`99999
`»
`>9999
`,......
`999999 999999
`
`9
`999
`,
`99999999 99999
`
`>999999
`.9999.
`-999999
`
`
`99 9
`9
`9999999
`9999
`999999
`~
`«
`‘9999 9
`
`
`\
`-
`'9999
`99 99999 99
`9
`
`
`9999999999999999999999999
`999999
`999999,
` 99999
`
` 999999-
`;9,
`
`99999999999999999999
`99999
`999999
`
`_
`99
`.1
`9
`9999 9
`0
`.
`9999
`
`
`
` 99999999999999999999999994
` 99999 9999999, 9999999999999 9
`
`9
`9
`
`999999
`9
`9
`9999999999999999999999999,
`. 9999999
`999999
`99
`.99999999
`9999999999 9
`999999
`
`
`
`>9
`99999
`9
`9
`999999999999999 99999999
`
`999999
`999994
`9999994
`9999999999999999999999999
`99
`
`9
`
`
`99999991
`
`9994
`,9999999999999999999999999
`<
`9 99
`
`999 9
`9999999999999999999999999-
`,99999999
`’99
`
`
`999999~
`99999999999999999999999999
`9999999999»
`(999999999~
`»9999
`
`9
`999
`99..r9
`9
`9
`9
`99999999999999999999
`9999999999999
`99 99
`
`
`
`
`
`
`
`
`
`
`’9 9’9’9 9'9 9 9 9 9 9 9 9 9 9 9 9 9'9‘9’9’9’9’9’9’9’9‘«
`’9’9‘9‘9’9’9‘9’9‘9’9’9’9‘9 9’9‘9’9’9’9’9‘9‘9’9’9’9’9
`’9’9’9’9’9 9’9’9’9’9’9’9 9 9 9 9‘9 9’9‘9’9’9’9
`99.9999999999999999999999999
`9.9999999999999999999999999
`999999999999999999999999
`
`
`. --- - . .v . - . .-
`
`
`
`
`
`
`
`~9999’9999999‘9’9’9’9’9‘9’9 9.9.9‘9‘9‘
`"’9’9‘9’9’9’9’9’9‘9’9’9’9’999””°"’
`’9’9’9 9’9’9’9‘9’9’9’99999‘9‘9’9’9 ’9’9’9
`
`
`
`
`
`
`
`‘0‘.“‘.0...‘,:.:,0.‘§§.‘§I'
`9.9.9.99.9¢.9.:.2.9.9.9§’.9,.»
`‘O.fi-GOA~9.O,:‘9.90.9.9.9.9.9.
`99.9.9
`«9.9.0
`
`
`
`SECOND
`CONDUCTIVE
`LAYER
`1031
`
` .9:919:929293929291929792932932.2
`
`
`
`. 55
`92.2929.
`«9.9.9.9.sz :9 9.9.9.9.
`'IIIIIIMIIIIIIIIIIIIIIIIJ
`
`1058
`<— 140 um—>
`
`
`
`III...- ’1’A’A’A’A’A‘.
` L’A’A’A’A’.I...
`
`v.9.vsvl.‘III-IIIIIIIIII 59.9.9.9
`
` 'IIIIIIIIIIIIIIIIIIIIIIIIIJ
`’IIIIIIIIIIIIIIIIIIIIIIII/l
`
`
`
`
`
`
`
`
`9'9’9‘9'
`99 9 9 9‘99 . v 9'9‘9
`
`S'9‘9'9‘9‘9‘9‘9
`.0.0.Q.0.0.0.0.0.0\\
`
`9’9’9’9‘9‘9’9’9’9’
`9’9’9’9’9’9’9’9’9’
`
`
`’9‘9’9’9‘9‘9’9’9’9’
`9‘9’9’9’9’9‘9‘9’9’3
`99’9‘9‘9‘9’9‘9‘9‘9’9 9 99 9 9‘9‘9’9‘9’9‘9’9‘9’9’9‘
`
`99999999999999999999999994
`
`
`
`99‘9’9'9‘9’9’9’9‘9‘9'9‘9‘9’9'9‘9’9’9’9‘9’9’9’ ’9'
`
`
`99999999999999999999999?“
`r999999999999999999999999
`
`9’9‘9‘9’9‘ ‘9‘9‘9’9‘9'9‘9‘9‘9‘9‘9'9‘9‘9’9’9‘9'9‘4
`»999999999999999999999999
`
`
`99999 9999999999999999991
`
`9‘9‘9‘9’9°9‘9’9‘9’9‘9’9'9’9‘9’9’9’9‘9‘9‘9‘9’9‘9‘9’9
`
`9‘9’9‘9'9'9‘9‘9‘9‘9’9‘9‘9‘9‘9‘9‘9‘9’9‘9‘9’9’9‘9’9’9‘
`99’9’9’9’9’9’9’9’9’9’9’9’9’9’9’9‘9’9’9’9’9’9’9’9’9‘9
`
`
`9999999999999999999999999‘
`‘9‘9’9‘9’9‘9‘9‘9‘9'9‘9‘9’9‘9‘9‘9’9‘9‘9‘9’9‘9’9‘9‘9‘9‘
`‘9’9‘9’9‘9‘9‘9‘9‘9‘9‘9‘9’9‘9‘9‘9‘9‘9‘9‘9‘9‘9‘9‘9‘9‘
`
`9999999999999999999999999
`’9‘9’9’9‘9‘9’9’9“9‘9‘9‘9‘9°9‘9‘9‘9‘9’9’9‘9’9‘9‘9’v
`’9999999999999999999999999
`
`
`9'9‘9‘9’9'9’9'9‘9‘9’9‘9‘9’9’9’9’9'9’9'9’9’9‘9’9'9’9
`
`"9’9’9’9’9’9'9’9’9’9’9’9‘9’9’9‘9’9‘9’9’9’9’9’9’9’9’9‘999999999999999999999999999
`999999999999999999999999999
`
`
`
` 999999999999999999999999999«
`
`
`999999999999999999999999999
`
`
`.9999 99 99.9 9.9.9.99 999.9.9,9,9.9.9,
`.-- -
`
`
`. 9.9.9
`9?9?9?9‘9?929:9.9:9.9.9.929:9:929 '
`
`
`
`
`
`'99 9 9 9 I
`’9 9 9 9 9I
`99999
`99999
`
`
`
`9‘9‘9‘9’
`‘9‘9’9’9‘
`999
`-999
`9991
`9994
`
`
`’9’9’9‘
`‘9‘9‘9‘
`999'
`9994
`
`9999
`,999
`
`
`
`9’9‘9‘4
`9’9’9‘4
`
`’9’9’9’4
`’
`’9’9’9’4
`‘9‘9’9‘9
`’99‘-
`‘9‘9‘9’4
`
`
`
` \99
`
`999
`
` 9994
`99°9‘9I
`’9'9’9
`9’9‘9
`
`‘9‘9‘«
`9’9’9
`’9“
`
`999,-
`999
`
`
`
`9’9’9‘
`9’9’9
`
`
`9999
`999‘
`
`
`
`’9’9’9‘9
`/9’9’9"
`
`
`9,9999999
`
`"9‘9‘9‘99999‘
`
`9‘9‘9’9‘9999
`
`
`\99999999
`9999
`9999
`99999999
`99999
`9999
`
`
`
`‘99999999‘9
`‘99.
`99999
`
`
`9.9,9,9.9.9.9..
`9
`9.9.9.9.9,
`.
`
`, .
`.
`.
`
`
`
`
`
`9.9.9 ;
`99.9.9 “’9’:§23’9’3’I°9
`
`1030
`
`KO1.26:.IOZOICIIIOX0:03.:OIOXOIOIOIOIOXOIOIOIG‘
`
`
`
` R’L’L’L9ZQ‘ mum-502993932.
`
`
`VIM/Illllllllllllllllllz 1032
`
`
`
`<—140pm—-—>
`
`
`4 “mm-“IIIIIIIWL'.
`1 031
`
`
`
`
`III/IIIII/II/I/Illllll.5’? 3;? [I'll-um. 9.2910192.
`
`
`VIII/IIIIIIIIIIIIIIIIIIIIJ
`
`
`
`1056 1059 1059
`"0:1 III-IIIIIII'III-mll-I OK
`
`
`
`{979 IIm‘I-IIIIII-IIIIIII 974-.
`OROLQZOXOLQ “lull-Ill“...- L’.’.’.‘.’.‘.
`
`'IIII/[IIIIIIIIIIIIIIIIIIIJ
`
`
`
`FIG. 15M
`
`FIG. 15N
`
`FIG. 150
`
`

`

`U.S. Patent
`
`Jul. 28, 2009
`
`Sheet 9 of 16
`
`US 7,566,960 B1
`
`
`
`AI...’39.
`mm“
`
`A.
`”WWII/II
`”III/[fl
`ll 1910102920201
`2010101932mull-nu1010;010:914;
`
`
`Vlllllllllfllllllllllllllll
`
`\\\\\\\\\\\\\\\\\\\\.‘.
`
`
`
`1061
`
`v.
`..
`
`Iawwwwe ast.vcvwb,
`o,
`
`‘
`O O 9‘
`
`
`coo'
`O
`
`fififi?
`00
`figsgfifififi"
`I“fi&&$%%%
`
`
`OOOO 202O.0O .OO
`~06%%%
`70000
`
`.
`‘9.
`.43.}. m I ’~:t;:¢:+’oo
`9000
`O
`»o
`.09
`
`o,
`‘.
`.
`poo:
`04
`900
`90
`
`to
`090
`not
`c
`009
`9
`‘00.
`o
`....
`0
`1043
`h .
`
`
`”vv-.06.
`
`fitDO
`70og
`‘1o,O.
`
`‘99
`00
`
`900
`900
`140m
`Vl1’.
`
`[994
`-¢o«
`900
`999
`
` coon
`%~%§
`’&fi
`6000\
`099
`09900\
`00¢
`oooooo\
`
`.
`,ooooo¢\
`(b
`JWWVVVV5
`
`
`
`
`
`«noooooo‘.
`a. m
`
`
`°Q%*%%%%w
`n4§$¢
`* - - - - mo.g§g:go:€o.o.o.n
`~ AA -
`
`
`
`
`,., . . vv'O‘O‘v»
`00009099900900
`,
`ty,.cu%&h$%%%%%¥%wao
`
`
` IOOQQOOOOOOOOOOOO.
`
`OOOOOOOOOQOOOOOOO
`o
`O
`.
`6 -
`‘O 9
`O.
`wasmvw» 9.0 .....
`
`
`3&55%”3’§V§5%fifi§§3¥¥?§2:§§§
`0
`«
`O0
`.
`5:.:.:.:.:.:..¢.
`'2’".I. ..
`I.
`J $024233:wth§
`9
`a
`9.0.9.0..."
`K
`
`O
`o
`fiflfifi
`9Qo40
`o‘3o
`19' 9'.
`3%;fifi’qa;ofifi?coo4%
`O
`O
`
`.04ookO O O
`
`‘9
`5&5;
`
`0..%.o n
`\
`O.0
`7;‘
`O‘1OO
`0'.
`‘
`e ‘ 0
`115:???
`O
`0000060.
`Amt; o
`O
`.“'n:EEI" %%$%%~
`9090000
`0090900
`V“%%%&flfi¢
`\‘v96UV50
`~¢oooooo
`6006004
`0000000.
`0000009
`
`.9000...
`460. .-
`oooooooo_
`
` ,booooooo
`09909099 .
`o
`oooooooooo....o¢oo.oooo¢
`to...09000000000000.0900.
`ooooooooooooooooooooooooc
`900090000oooooooooooooooo«
`
`
`"fiflfififififlfifififlfififififififififlfih$fi\g.g.¢.9...o.¢.o.¢ o o o o v o o 9.: «9.9.9.9
`
`
`Agfififififlflfl’
`
`O.
`
`
`
`
`
`1057
`
`FIG. 15U
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 10 0f 16
`
`US 7,566,960 B1
`
` IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII) 1047
`/
`
`\\\\\\\\\\\\\\\\\‘\\\\\\\\\\\\\\\\\\\\'\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\l\\il.\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\.\\\\\\\\\\\\\\\\\\\\\\\\\\\\"
`IIIIIIIIIIIIIIIIIIIIIIIII
`1053
`§
`§\\\\\\\\\\\\\\\\\\\\\\.\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\‘\\\\\\\\\\\\\\\\\\\\
`
`
`
`§
`§
`IIIIIIIIIIII'
`
`§
`\\\\\\\\\\\\\\\\\\\\V\\\\\\\
`\\\\\\\\\\\\\\V\\\\\\\V\\\X\\:
`§
`§
`§
`§lIIIIIIIIIIL
`k\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`\\\\\\\\\\\\\\\\\\\\X\\\\\\\\\\\-
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`
`
`
`
`lfléfl
`1016
`E
`E
`SECOND
`
`
`5
`5
`BAKCRC>
`
`
`.
`.
`.
`.
`5
`5
`BUMP
`
`
`:4— 1 00 um _,;
`
`1 046
`VCC
`
`FIRST
`CONDUCWVE
`LAYER
`
`CAPOSEH
`
`\ §
`
`
`
`-——-
`£033.33:__
`
`
`THIRD
`CONDUCTIVE
`LAYER
`
`
`
`\\\\\\\\\\\\\\V3
`I
`l
`I
`JIIIIIIIIII§
`
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`
`1012
`
`1017
`
`1050
`
`
`\\\\\\\\\§\\\\\\\
`§
`§
`\
`Q
`§
`\\\\\lli\\i\i\\i\\l\i\i\\i\i\\i\
`
`1062
`1048
`
`
`.\\\\\\\\_\\\\\\\
`\\\\\\\\\\\\\\\\\‘
`§
`§IIIIIIIIIIIL 1049
`
`:xx\\\\\\\\\\\\\\\\\\\x\\\\\\\
`§
`
`1 .
`.
`.
`Illllllllll 1055
`.\\~
`\\\\\\\\\\\~\\\\\\\\\\\\~\\\\\\\:
`\\\\\\\\\\\\\\\\\
`\
`
`I
`IIIIII
`IIIIIIIIIIIIIV
`‘\\\\\\\\\\\\\\\\\\\
`\ \\\
`\\\\\\\\\\\\\\\\\\\\\\\\\\\
`
`
`1051
`
`
`\\\\\\\\\\‘\\\\\\\\\\\\‘\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\.\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\0‘
`
`mm 1047
`mulnnmnm-mmnnlllm
`$‘
`lllllllllllllllllllWWII”
`§
`
`
`
`1 046
`\\\V\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\‘\\\\\\\\\\\\\\‘\\\‘
`g
`
`3
`lllllllllm
`$
`
`R)
`\\\\\\\\\‘\\V\\\\\\\\\\\\\
`\\\\\\‘\\\\\\\\\\~\\\\\\\. VCC
`Q
`§
`1IIIIIIIIII‘\\\\\
`§
`EIIIIIIIIIL
`
`
`\\\\\\\\\\\\\\\\\\ \\\\\\\—\\\\\\\\\\\\\\\\\\\\\\\\\\\\\-_\\\\\\\\\\\\‘\\\\\\\\\\\\\\W\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`
`
`.‘V0‘Oz.——-——
`1
`
`
`
`
`10‘AA0}.'00.IM
`
`1060
`,.-,———.,
`.Q4A
`
`\\\\\\\\\\\\‘fl\\\\\\\\\\\‘\\\\\\\\\\\\\\-'
`§x\\\\\\‘\\\\\\&
`1
`
`1025
`
`
`
`
`Z/I/flfl/fl/fl/fl;
`S
`IIIIIIIIll
`
`1049
`
`.\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`§
`\\\\\\\\V\\\\\\\\\\\\\\V\
`
`§
`IIIIIIIIIIII
`1054
`lllllllll
`\\\\\\\\\\\\\\\\\\li.l\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\‘t
`
`\\\\\\\\\\\\\\\‘\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\!l.l\\\\\\\\\ll\\\\\‘:\\\\\\\\\\\\\\\\\\\\\\\\\\\‘\\\\\\\\\\\\\\\\\\\
`1051
`lllllllnlllllllIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIi
`
`
`
`
`§ %
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 11 0f 16
`
`US 7,566,960 B1
`
`\\\\\\\\\\\\\\\\\\\\\/\/
`\\///\\\\\/\\\\\\\\\k\\\\\\\\\\\\\\\‘
`
`
`
`
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`l\ll\llllll”lllllll
`/\%/§/\/
`“/\\/\/\\// \\\/\\\/\/\\ \\\\//\/\\
`
`§\\/\/\\\\\\\\/\\\\\\\//\\///\\//\\\\\/\\\\\\\\é‘..
`
`\\\\\\\\\\\\\\\\\\
`
`
`SwEngggD
`
`BUMP CAPOSER
`1018
`
`
`
`TH'RD
`
`
`M1090
`
`
`FIRST
`CONDUCTIVE
`
`
`
`
`1031
`
`SECOND
`CONDUCTIVE
`
`1017
`1025
`LAYER
`
`
`
`/\\\\\\\\\\\\\\/
`\\\\\\\\\\\\\\\\\\\\\
`////\\\\\\\\\\\\\\\
`\IIIIIIIIIIIIIIIIA 1049
`\V
`/ /\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\ 1054
`\\WW\\W\>WW\WXW\ G1a501
`
`
`/IIIIIIIIIII/IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIA
`/\
`
`
`
`
`
`FIG. 18
`
`GND
`
`[III—020101.202 In
`AYAY_WI...
`
`
`
`02010101010101.2010:020:3'
`
`
`
`
`
`SIGNAL
`DIE
`101 1
`#25455
`
`
`
`'/
`//////////////////////I/I//////II/
`\\\\\\\\\\\\\\\\\\\\/\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\‘l
`
`:\\\\\\\\\\\\\\\\/\\/\\\\\\\///\/\
`1046
`1047/
`1’ <<<<<<§<§<§<<x<<x”"
`"’////1/ ///////
`/////////A§ // l):
`
`1024\\\\\\\\\\\\\\\1\\\\\\\\\\m_\\\\\\m\\\\m\\\\/\\\\\\\— \\\\\\\\\\\\\\\\\\\
`1016
`
`
`I—I-IDIOZOXOX'IOI‘—|
`
`m
`15—20;01—010I0A0AI... lml L0:0.0.0.0I\‘'0:021
`
`
`
`
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\ \\\\\\\\\\\’/V///W//////////""" ,,,,,
`1°49
`
`\\\\\\\\\\\\\\\\\\\\\\\\\\\l,\\\\\\\\\\\\\\\\\\'\
`§/
`//IIIIIIIIIIIIIIIIIIA VCC
`/\
`IIll/Illllllllllllll'llllllllllll'lllfllllllll
`
`//\\\\\/\\\\\\\\\//\\\/\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\ \\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`1051
`/§/
`/\\\\\V\\\k\\\\\\\\\\\X\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\X\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\‘
`1054
`////////////////////////M////////////////////7//////////
`
`
`1071
`
`I
`
`OUTPUT
`DRIVER
`
`I
`‘10:“.
`
`”1070 ‘
`M
`1044.-/ 1073
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 12 0f 16
`
`US 7,566,960 B1
`
`
`
`”1/%|1E1///
`SIGNAL
`
`
`
`
` 1‘
`1016
`
`SECOND
`
`FIRST
`CAPOSER CONDUCTIVE
`
`101 8
`LAYER
`1030
`
`
`/CONDUCTIVE
`/\\\\\\\\\\\\>\\\\\\
`x\\\\\\\\\\\\\\\\
`
`
`
`
`////////////////////////////////////////////////////////////////
`§\\x\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx\\\\\\\\\\\\\\\\//\\\/\\\\\\/\\\\\\/Il\\\\\/\xxxxxxxxxxxxxxxxxxxxxxxxxx
`1051
`
`
`
`
`
`1 031
`SECOND
`
`
`
`LAYER
`
`
`
`GND
`
`
`
`FIG. 21
`
`1011
`
`1053
`
`
`
`\\/\\\\/\\/\/\\\l\\\\\\\\/\\\\\\//\\/\/\\\\\/
`
`
`
`
`
`
`
`
`
`
`\\/\\\\\\§l
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`
`
`///////////////////////////////////////////////
`
`
`
`
`
`
`\\\\\\\\\\\>
`
`FIG.22
`
`DRIVER,
`
`1080 [/1074
`\_ _"
`
`

`

`U.S. Patent
`
`Jul. 28
`
`,2009
`
`Sheet 13 of 16
`
`US 7,566,960 B1
`
`$GNAL
`UNE
`1109
`
`1091VCC
`
`VE
`
`\§_
`
`mm\\\\\\\\\\\\\\\\\\\\\\\\\\‘
`
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`
`
`
`1 088
`
`
`
`
`1083
`
`
`
`\\\\\\\\\\\\\\\\\V\\\\V\\\\\‘N
`/
`Illllllllllll
`I
` \\\\V§\\\V§\\V§\\\\\\\\ \
`
`\\\\\\\\\:\\\\\\\\\\\\\\\\\\!\\ll.\\\\‘~\\\‘“\mwmmwuiilimili‘kiimmfifin‘
`
`\\\\\\\\\\\\\\\‘\\\\\\\\\\\\\‘\\\\\\\\\\\\\\\\\\\\\\\‘\\\\\\\\\\\\\\\\\\
`lllllllll
`"In.” 1092GND
`:'///////7////////////
`
`
`
`IIIIIIII
`
`
`///
`\
`\\lllllllll'
`:mmwmi
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`\\\\'\\\\\\'\\\\\\\\\\\\\\\\\\\\\\\\V&
`
`
`
`1085
`
`
` 1086
`
`HRST
`CONDUCHVE
`1103
`
`
`
`1101
`\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
`‘\\\\\\\\‘&\\\\}‘&\\\\\\‘\\\\\"
`LAYER
`
`/'o‘3°o’;’3’3’3°3’3’3‘/rI.O99.9.9.0...9/
`
`
`
`
`
`'//\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\t\\\\\\\\\\\\\\\\\\\\\\\\>\\\
`p‘o‘o‘o’o‘o‘o’o’o’o}
`////:::.o:o‘::o:o::::.z‘:'/
`Mzotoxozeom
`///IIII
`Illa/4%III/{Iggmzs’II/II mm{II/{j
`m:::‘:‘:’:°:’:’::::/ /II|o:6¢E:coo0:.
`=__::::o’o’o’o’o‘o’9:o‘
`//é’o‘o‘o’~ooooo
`/'o‘¢’o‘o’o’o’o’c’
`//l‘:
`ooo
`/‘"W¢V’9‘W4/
`'O‘WW'MQoood
`
`
`
`
`
`
`e?
`
`.‘l
`O
`.7
`
`7 ”090909.1- — $009000!”
`
`
`
`
`WOQOQOQQV
`[ll [0.9.0.001
`000......
`~z°o:.:.:o:m7////;.:.;.;.;.;.:.;.;////
`//,;.;.;.:.;.;.:.;.g/////
`1102
`. .-
`
`
`
`==°¢::’¢’o’o‘o’:’=‘—"———=§o:o:o:¢:o:o:.:of=—
`o:j'I/l/
`Ifio’o’§’¢’¢’¢’o‘¢n
`
`
`
`
`:o:::
`m’:°:':°:°:’:‘:’:‘/
`V—_Z:’o’:’:’:‘:’:’o7—$‘:’:’:‘:’:’:’:‘7
`00......C’
`DOOOOCOQ4'1106
`I
`'WI
`/v go‘:::
`9o’o‘o’o‘o’o’ofi/
`/‘o’§’o'o‘O’on’W
`/‘o‘o‘o‘o‘c’¢‘o’a//
`fl' ’EEEEEV
`AEEEEEEd
`EEEEEEEE flEEEfiEEEE/
`1§\\\\\\
`.
`\\\\\\\\\\\\\.\\\\\/
`A\\\\\\\\\\\\\\\\x\\
`\\\\\\\\~\,
`
`.A\\\\\\\\\¢\\\\\\\ \\\\\\//$\\\\\\\\\\\\\\\\\\\\\\\\\\
`
`
`
`/1032
`1087
`
`
`
`
`
`
`
`
`CAPOSER
`
`
`1.1.0.5
`
`
`\
`\
`‘
`§
`
`\\\\\.\\‘\\\\\\\\\\\\\\\\\\
`\\\\\|\\-\\\\\\\\\\_\\\\\\\\1§\\\\\
`:&\\\\\\\\\\\\\\\\\\\\\\\\\\\
`\\\\\\\\\\\\\\\\Fl\\i\\li\i\i\llll
`:k\\\\\\\\\\\\\\\\\\\\\\\\\\‘\\\
`..
`A-MIIII
`
`:\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\ \\\\\\\\\\
`\\\\\\\\\\\\\\\\\\\'\\\\\\\\\
`
`§
`IIIIIIIIIIIID
`‘
`§
`.
`
`
`\\\\\\\\k\\l\\\\\\l\\\\\\\\\\\\
`
`\\\\\\\\\\\\'\\\\\\\\\\\\\\\\\\\\\\\\\Ԥk\\\\\
`lllllllllllllllllll
`
`
`
`
`\ §
`
`10.8.4
`‘
`1
`‘
`
`
`
`
`
`
`
`1110
`$GNAL
`CXNVDUCHTJR
`
`
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 14 0f 16
`
`US 7,566,960 B1
`
`FIG. 25C
`
`1102
`
`
`
`III/III/III/l/II/
`
`
`
`1104
`FIG. 25B
`
`
`
`
`
`1102
`III/I
`
`III/III
`
`//1/1//04
`
`
`
`
`
`
`//////////////l////// “01
`“01
`I—lllI/Ill/l/IIIIIIIIII= 1102
`=IIIIIIIIIIIIIIII— 1102
`
`////////////////A
`7///////////////////
`
`
`
`
`
`WA\\\\\\\\/// WAme/.\/‘///
`
`=IIIIIl/llI/I/IIIIIII._——_ 1102
`/'///////// ////////////
`IIIIIIIIIIIIIIII—A1106
`
`\1////1//\04///
`
`FIG. 25D
`
`FIG. 25E
`
`FIG. 25F
`
`1 086
`
`1 086
`
`1086
`
`
`
`
`
`Z///"mg/Ill!/1102
`
`
`
`:3....,.,.,.,:,|III/=.
`
`
`
`
`III/Illttztggézsngwll.1‘05
`
`
`
`
`
`
`1087
`
`1087
`
`
`
`
`
`Ill/J! //////////=Z/1101 m
`
`:lllllI/IIIIIIII/lll= 1102 —1III
`
`
`
`
`III/II/II/III/I/I/I/I;
`III/III
`1106
`
`
`
`“04
`FIG. 25G
`
`1101
`
`[1.1102
`
`/1106
`
`FIG. 25H
`
`1087
`
`
`
`FIG. 25I
`
`CAPOSER
`1082
`
`1086
`
`
`
`
`I’
`
`1103
`
`.9.9.. OOOOO
`
`oooooo o o o
`I \\\\\\\\\\\\\\\\\\\_\\\\\\\\V\\\\
`0all.:.:..’........-—_—_v|||]/
`///b'¢'.’¢‘o’o’o’o’o’¢/
`//l’9‘‘o‘o’o'o‘o.o‘o‘
`7////.£1703:”ll/{l 1101
`
`.“1.09.96.6.0.0...
`
`
`
`_=__-|lll(o...¢.o.o.o.o:l I'll——
`
`
`
`
`
`
`7III/II.=:2:::2:3:2:::t:1'7//////IA 1102
`
`A:0:':o:':o:w
`\\\\\\\\\\\\\\\\\\\\\V\\\\\\\\\/
`
`
`
`1104
`
`1087/
`
`FIG. 25J
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 15 0f 16
`
`US 7,566,960 B1
`
`
`
`\\\\\\\\\\\\\\V\\\\\\\\\\\\‘ V
`
`
`
`
`-L\'\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\‘-
`
`
`(Ill:03:
`5:03Illl
`—
`—
`
`[III3633
`£020!llll
`—
`—
`
`5.329202%
`K‘Z‘Z’Z’Z‘Z‘.
`
`
`INTERPOSER
`1200
`
`
`_ - §§\\\\\\\\S\\R\\\\\‘ a
`
`
`‘\\\\\\‘\\\\\\\\\\\\\\\i\\\\\\\\\
`
`
`
`
`
`
`
`DIE
`1209
`
`
`_.\\\\\\\\\\\\\\\\\\\\\\V _
`
`\\\\\\\\V~\\\\\\t
`
`5E .x\\\\\\\\\\\\\\\\\\\\\\‘
`
`1225
`
`FIRST
`SUfiZfi/QCE
`
`1226
`
`
`
`12111224 1227
`
`SOLDER-FILLED
`THROUGH-HOLE
`INTERPOSEH
`
`\\\\\\\\
`
`1228
`
`
`
`
`
`
`
`
`
`
`1220
`'
`\\\\\\\\\\\\\\\\\\\\\\’
`
`
`SURFACE
`
`1221
`
`1214
`
`
`1223
`1291222
`
`
`
`
`
`\
`
`
`
`\M
`
`///////
`WMWWWVWWNMWWNWNWWWW\\\\\\\\¥k\\\\V\\\\\\\\\\\\\\‘h\‘§‘
`WWII/Milli”,
`
`
`
`
`
`
`
`1210
`
`FIG. 27
`
`

`

`US. Patent
`
`Jul. 28, 2009
`
`Sheet 16 0f 16
`
`US 7,566,960 B1
`
`r
`
`
`- vAnvAvAvAv.v.pAv‘v.vAv.vAvAvAnv.‘vAv.v‘v‘v.v.v.v‘vAv.v.vAv.“v.v.vamun- 'AVAVA'AV‘V‘VA‘ In-nn--—---— Luv. .v.v.v.v.v.v.u
`
`................r.....v...................3.............‘.........‘...
`.
`.,
`u~ -
`wrung-nm-A'mamauvrrrrururrr."u.-------_--_--I.
`
`
`1231
`
`
`
`
`
`
`——n 'A'AVAVA'AVAVA‘A'AVAVAVAVAVA'A'A'AVAVAVL'AV‘VA‘A'AVAcum
`u-n- wAuVAVAVAvAVAVAv.‘ —hnv.v.v.v.v.v.nv.v.v.vmzv
`
`..
`.
`
`
`mm....w.w.............................--
`lggg
`_--..............,--..
`12m .. ,..............-...-».
`ooooooooooooo
`I u...o...o:o;o.o;o.-.o:c
`;
`.«~-~ »~
`...............................
`_ — HEE—
`—
`
`
`
`
`
`
`
`
`
`1244
`
`1246
`1238
`
`1230
`
`
`
`
`
`l
`.——1244 7
`
`
`
`
`1229
`
`
`1'
`
`l
`1244
`
`I
`
`
`
`
`
`
`
`
`
`
`
`—+~t-w w“?
`.
`
`'
`
`1 42
`
`1
`
`7i
`124 1"
`
`f
`
`SOLDER-FILLED
`THROUGH-HOLE
`INTERPOSEH
`
`1203
`{
`
`
`
`
`1
`
`am.1.III!
`
`
`
`
`
`.34
`
`
`
`
`
`
`

`

`1
`INTERPOSING STRUCTURE
`
`FIELD OF THE INVENTION
`
`US 7,566,960 B1
`
`2
`
`The present invention relates to an interposer disposed
`inside an integrated circuit package between a die and the
`package, wherein the interposer provides bypass capacitance,
`signal redistribution functionality and/or signal termination
`structures close to the semiconductor die.
`
`BACKGROUND INFORMATION
`
`Systems that include integrated circuit (IC) devices typi-
`cally include decoupling capacitors (also known as bypass
`capacitors) as well. A typical decoupling capacitor is a
`capacitor coupled between the power and ground pins (i.e.,
`terminals) of a packaged IC to reduce noise on the power
`system within the IC. While in some cases the IC itself
`includes some decoupling capacitance, the amount of capaci-
`tance required is such that one or more additional discrete
`decoupling capacitors are usually added external to the pack-
`aged device.
`the location of these discrete decoupling
`In the past,
`capacitors was a less important issue. The switching fre-
`quency of a device was relatively low, e.g., in the range of
`hundreds of kHz (kilohertz) to tens of MHZ (megahertz). The
`transient currents within the device were also relatively low.
`Hence, parasitic inductance in the printed circuit board (PCB)
`mountings was not an important consideration. For example,
`for an IC mounted in a medium-performance package,
`whether leaded or surface-mounted to the PCB, a 0.1 uF
`(microfarad) decoupling capacitor could typically be
`mounted on the PCB anywhere within a few inches of the
`packaged IC.
`Many ICs now operate at clock frequencies in the hundreds
`of MHZ. At these higher frequencies, transient currents are
`significantly higher than in the past, and parasitic inductance
`is a much more important issue. Parasitic inductance within
`the capacitors themselves has been reduced by improving the
`packaging of the capacitors, e.g., by using only surface-
`mount packages and by reducing the size of the packages.
`(Smaller packages inherently have a lower parasitic induc-
`tance.) Parasitic inductance within the PCB mountings has
`also been reduced through improved layout techniques, e.g.,
`by using dedicated power planes in the PCB, by improving
`capacitor land geometries, and by careful placement of the
`capacitors to reduce the distance between the packaged IC
`and the capacitors.
`However, as operating frequencies continue to increase,
`even these measures become inadequate. One bottleneck in
`the current path between a decoupling capacitor and the asso-
`ciated packaged IC are the vias that transport charge from the
`capacitor lands through the PCB to the powerplanes, and then
`from the power planes through the PCB to the device. These
`vias can contribute parasitic inductance in the range of l .5 nH
`(nanohenrys) each. If this via inductance could be reduced or
`eliminated, providing for high-frequency transient current
`would be much easier.
`
`Therefore, it is desirable to provide systems and structures
`that provide decoupling capacitance to IC devices with
`reduced capacitor parasitic inductance. It is further desirable
`to reduce via parasitic inductance in these systems and struc-
`tures.
`
`In addition to the issues set forth above, an active circuit
`disposed on an integrated circuit die typically draws spikes of
`current from local power supply lines on the integrated circuit
`die. An active circuit, for example, can have a VCC power
`
`10
`
`15
`
`20
`
`25
`
`30
`
`35
`
`40
`
`45
`
`50
`
`55
`
`60
`
`65