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Case 1:14-cv-01430-CJB Document 502 Filed 04/20/22 Page 1 of 5 PageID #: 28154
`
`IN THE UNITED STATES DISTRICT COURT
`
`FOR THE DISTRICT OF DELAWARE
`
`ELM 3DS INNOVATIONS, LLC,
`Plaintiff,
`
`v.
`SAMSUNG ELECTRONICS CO., LTD.., et al.,
`Defendants.
`
`C.A. No. 14-cv-1430-CJB
`JURY TRIAL DEMANDED
`
`
`
`STIPULATION REGARDING IDENTICAL DIE IN ACCUSED PRODUCTS
`
`Samsung stipulates as follows: In the chart below, the die in the product identified in the
`
`“Samsung Sample” column are identical in all respects relevant to the dielectric stress limitations of
`
`the Asserted Claims to the die from the same process node in the products identified in the
`
`“Identical Die Products” column. For the sake of clarity, the relevant node that is considered
`
`identical for purposes of this stipulation has been bolded in the “Identical Die Products” column.
`
`Elm stipulates as follows: Samsung has represented that it has searched for but has not been
`
`able to locate physical samples from the following process nodes: D11, D14, D28, D46, D56, D68,
`
`D80, D92, D106, D123, D146, FN12, FN19, FN21, FN27, FN32, FN35, FN42, FN51, FN63,
`
`FN73, FN90, V24, and V32. Moreover, Samsung represents that it has made a reasonable search for
`
`samples of each of the Accused Products1 and has produced samples of each Accused Product for
`
`which samples are in its possession, custody, or control. Based on Samsung’s representations, Elm
`
`agrees that it will not seek additional discovery relating to physical samples of Accused Products or
`
`wafers corresponding to any process node at issue in this case. However, Elm reserves the right to
`
`1 The currently accused products include the products listed in Exhibit A to the Representative
`Products Agreement (D.I. 443) and the Samsung products with above-50-micron die identified by
`Samsung in December 2021.
`
`

`

`Case 1:14-cv-01430-CJB Document 502 Filed 04/20/22 Page 2 of 5 PageID #: 28155
`
`request that Samsung search for physical samples of Accused Products or process nodes that are
`
`added to the case at a later date.
`
`Samsung Sample
`
`Process
`Node(s)
`
`KMGX6001BM-B5140Y0
`
`D18,
`FN14-B
`
`Identical Die Products
`KMR210008A-A8090Y0 – Group 6 (D20, FN14-
`A)
`KLMAG1JENB-B0310Y3 – Group 8 (FN14-A)
`KLUDG8J1CB-B0B1008 – Group 24 (FN14-A)
`KMDH6001DM-B422005 - Group 30 (D18, V48)
`KMHC40010M-A810007 – Group 43 (D20,
`FN14-A)
`KLUDG8J1CB-C0B1T07 – Group 68 (FN14-A)
`KLUBG4G1BE-E0B10Y0 – Group 84 (FN14-A)
`The following products with die thicker than 50
`microns:
` K3UH5H50MM-NGCJ0EX (D18)
` K3UH5H50MM-NGCJTTN (D18)
` KMQ310013B-B4190Y0 (D20, FN14)
` K9PHGY8S7E-1CK0TP1 (FN14)
` KMQE10013M-B318T07 (D20, FN14)
` KMFN10012A-B2140Y0 (D20, FN14)
` KMFNX0012M-B214001 (D20, FN14)
` KMQ310006B-B4190Y0 (D20, FN14)
` KMRX1000BM-B614T07 (D20, FN14)
`
`2
`
`

`

`Case 1:14-cv-01430-CJB Document 502 Filed 04/20/22 Page 3 of 5 PageID #: 28156
`
`Samsung Sample
`
`Process
`Node(s)
`
`K3QF4F40BM-AGCF000
`
`D20
`
`Identical Die Products
`KMR210008A-A8090Y0 - Group 6 (D20, FN-
`14A)
`KMWV50017M-B812004 - Group 10 (D20, V48)
`KHA884901X-MC13TNX - Group 16 (D20)
`KMQ310006A-B419001 - Group 18 (D20, FN16)
`K3RG2G20BM-CGCH000 - Group 27 (D20)
`KMHC40010M-A810007 - Group 43 (D20, FN14-
`A)
`KMFR20012M-A305000 - Group 47 (D20, FN16)
`KMRV50014M-B809T04 - Group 61 (D20, V48)
`The following products with die thicker than 50
`microns:
` K3RG1G10BM-BGCH0P3 (D20)
` KHA883901B-MC12TFM (D20)
` KHA843801B-MC12TNV (D20)
` KHA883901B-MC12TNV (D20)
` KHA843801B-MC12TAM (D20)
` K3RG1G10BM-KGCHTP4 (D20)
` K3RG2G20BM-DGCHTTN (D20)
` KHA883901B-MC12TAM (D20)
` KMQ310013B-B4190Y0 (D20, FN14)
` K3RG2G20BM-CGCJTTN (D20)
` KHA841801B-MC12TDM (D20)
` KMFN10012M-B2140Y0 (D20, FN16)
` KMQ310013M-B4190Y0 (D20, FN16)
` K3RG2G20BM-MGCJTTN (D20)
` KHA843801B-MC12TFM (D20)
` KMQE10013M-B318T07 (D20, FN14)
` K4EHE304EA-AGCFTTN (D20)
` KHA844801B-MC42TIC (D20)
` KMFN10012A-B2140Y0 (D20, FN14)
` K3RG2G20CM-CGCJTTN (D20)
` K3RG2G20BM-MGCJ000 (D20)
` KMFNX0012M-B214001 (D20, FN14)
` KHA841801B-MC12T00 (D20)
` K3RG2G20CM-MGCJTTN (D20)
` KMQ310013M-B419TMO (D20, FN16)
` K4FHE3D4HM-AGCJTTN (D20)
` KMQ310006B-B4190Y0 (D20, FN14)
` KHA881901B-MC12TEM (D20)
` KMRX1000BM-B614T07 (D20, FN14)
`
`3
`
`

`

`Case 1:14-cv-01430-CJB Document 502 Filed 04/20/22 Page 4 of 5 PageID #: 28157
`
`Samsung Sample
`
`Process
`Node(s)
`
`K4B8G0446D-MYK0000
`
`D25
`
`KLMCG8GESD-B03P017
`
`FN16
`
`Identical Die Products
`KMR210008M-A8050Y0 - Group 26 (D25, FN16)
`KMR31000BM-B611T01 - Group 42 (D25, FN16)
`KMR4Z0001A-B803002 - Group 60 (D25, FN19)
`K3MF8F80DM-MGCE000 - Group 77 (D25)
`KMR2W0008M-A8030YE - Group 87 (D25,
`FN19)
`The following products with die thicker than 50
`microns:
` K3RG3G30MM-DGCH000 (D25)
` K3QF7F70DM-QGCETTN (D25)
` K3QF7F70DM-HGCE0EX (D25)
` K3RG3G30MM-DGCHTTN (D25)
` K4E6E304ED-EGCE000 (D25)
` K3MF9F90MM-MGCETMB (D25)
` K3QF2F20DM-CGCBTTN (D25)
` KMR310008M-A6110Y0 (D25, FN16)
`
`
`KMR310001M-B6110Y0 - Group 12 (D23, FN16)
`KMQ310006A-B419001 - Group 18 (D20, FN16)
`KMR210008M-A8050Y0 - Group 26 (D25, FN16)
`KMR31000BM-B611T01 - Group 42 (D25, FN16)
`KMFR20012M-A305000 - Group 47 (D20, FN16)
`MBMPCGVFODGW-FKE01 (KDBCK8VWHD-
`UEQ1M01) - Group 51 (FN16)
`KLUCG8G1BD-E0B10Y2 - Group 65 (FN16)
`KLUDGAG1BD-E0B10Y2 - Group 158 (FN16)
`The following products with die thicker than 50
`microns:
` KMFN10012M-B2140Y0 (D20, FN16)
` KMQ310013M-B4190Y0 (D20, FN16)
` KMQN1000SM-B316T01 (D23, FN16)
` KMQN1000SM-B3160Y0 (D23, FN16)
` KLUBG4G1BD-E0B20Y3 (FN16)
` KMQ310013M-B419TMO (D20, FN16)
` KMR310008M-A6110Y0 (D25, FN16)
`
`4
`
`

`

`Case 1:14-cv-01430-CJB Document 502 Filed 04/20/22 Page 5 of 5 PageID #: 28158
`
`Samsung Sample
`
`Process
`Node(s)
`
`K9VKGA8J1M-1CK0000
`
`V48
`
`KLAFGAKWCA-E4T20P8
`
`V64
`
`
`
`
`
`
`
`
`
`
`
`
`Dated: April 13, 2022
`
`FARNAN LLP
`
`
`/s/ Michael J. Farnan
`Brian E. Farnan (#4089)
`Michael J. Farnan (#5165)
`919 North Market Street
`12th Floor
`Wilmington, DE 19801
`Tel: (302) 777-0300
`Fax: (302) 777-0301
`bfarnan@farnanlaw.com
`mfarnan@farnanlaw.com
`
`Attorneys for Plaintiff Elm 3DS
`Innovations, LLC
`
`
`
`Identical Die Products
`KMWV50017M-B812004 - Group 10 (D20, V48)
`KLAEG8KWAM-I0T3T00 - Group 21 (V48)
`KMDH6001DM-B422005 - Group 30 (D18, V48)
`KLMCG2KETM-B041T02 - Group 38 (V48)
`KMRV50014M-B809T04 - Group 61 (D20, V48)
`The following products with die thicker than 50
`microns:
` K9HKGY8S5M-1CE0TP1 (V48)
` K9PMGY8S7M-1CE0TP1 (V48)
`K9OMGY8H5A-CCK0000 - Group 17 (V64)
`
`
`
`
`Respectfully submitted,
`YOUNG CONAWAY STARGATT &
`TAYLOR, LLP
`
`
`/s/Adam W. Poff
`Adam W. Poff (#3990)
`Pilar G. Kraman (#5199)
`Rodney Square
`1000 North King Street
`Wilmington, DE 19801
`Telephone: (302) 571-6600
`apoff@ycst.com
`pkraman@ycst.com
`
`Attorneys for Defendants Samsung Electronics Co.,
`Ltd., Samsung Semiconductor, Inc., Samsung Electronics
`America, Inc., and Samsung Austin Semiconductor,
`LLC
`
`
`IT IS SO ORDERED
`
`Date:
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`The Honorable Christopher J. Burke
`
`
`
`5
`
`

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