Case 1:14-cv-01430-LPS Document 308-29 Filed 06/22/20 Page 1 of 3 PageID #: 21046
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`Exhibit 29
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`Case 1:14-cv-01430-LPS Document 308-29 Filed 06/22/20 Page 2 of 3 PageID #: 21047
`Case 1:14-cv-01430-LPS-CJB Document 109-4 Filed 04/20/16 Page 13 of 66 PageID #:
`MCP Overview | Samsung Semiconductor Global Website
`11/20/2014
` 3318
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`MCP PACKAGE INFO.
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`Samsung Multi-Chip Packages
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`Innovative "chip-stack" design optimizes board space
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`Find out why leading manufacturers choose Samsung Multi-Chip Packages (MCPs) for applications where board space is extremely limited, such as
`smartphones and other mobile handsets, tablets, and multimedia players. MCP memory configurations are designed to support a growing list of
`device capabilities, expanding freedom and choice for users who want to do more with their mobile applications.
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`Unify memory technologies on a single substrate
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`Samsung MCPs combine different memory technologies, including single-level cell (SLC) NAND flash or eMMC and Mobile DRAM such as LPDDR1 (low-power DDR1) and
`LPDDR2 on a single substrate. This flexible approach is designed to deliver benefits including:
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`Enhanced memory and overall system performance through tight coupling and close positioning of memory modules to establish the shortest interconnections possible in a
`small, high-density package
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`Average 30 percent to 40 percent savings in board space for your end product through the stacking of several memory chips in a vertical configuration
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`Minimized bill-of-materials count for simplified manufacturing and cost savings
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`Accelerated time to market through rapid integration of MCP modules, speeding the pace of product development
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`The broad Samsung MCP portfolio includes a myriad of memory configurations, primarily with 2-, 3-, or 4-die packages. The most popular combinations are 1Gb+512Mb;
`2Gb+1Gb; 4Gb+2Gb (NAND and Mobile DRAM); as well as new eMMC-based MCP (eMCP) combos such as 4GB eMMC + 4Gb MDDR, and 32GB eMMC + 8Gb LPDDR2. The
`newest-generation eMCP modules are designed to contain a combination of the fastest eMMC (embedded multimedia card), along with either MDDR or LPDDR2 memory.
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`Deploy the latest technology for mobile processors
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`Samsung MCPs optimize designs for a comprehensive range of new and evolving consumer electronic devices.
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`Many Samsung MCPs are built using the company's low-power memory technology (flash and DRAM) so that mobile devices consume as little power as possible.
`
`Core Samsung MCP technology takes advantage of the company's expertise in wafer thinning, die stacking, and wire bonding.
`
`Memory included in Samsung MCPs is manufactured using highly advanced process technologies, including 20nm-class and 30nm-class.
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`Consistent use of packaging and footprint makes it easy to scale between different Samsung MCP combinations.
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`For virtually any mobile phone, Samsung offers a mass-produced MCP solution to enable the desired feature set. In fact, Samsung has been qualified in many reference designs
`from top-tier chipset vendors. In addition, Samsung can produce custom MCPs quickly to help meet demanding design schedules.
`
`http://www.samsung.com/global/business/semiconductor/product/mcp/overview
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`Case 1:14-cv-01430-LPS Document 308-29 Filed 06/22/20 Page 3 of 3 PageID #: 21048
`Case 1:14-cv-01430-LPS-CJB Document 109-4 Filed 04/20/16 Page 14 of 66 PageID #:
`MCP Overview | Samsung Semiconductor Global Website
`11/20/2014
`Stay competitive in the mobile device market
` 3319
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`Samsung MCPs help you stay ahead of the competition in the fast-moving mobile device market. With minimized power consumption, small size, and high memory density,
`Samsung MCP solutions offer the memory foundation to build a full spectrum of high-end consumer electronic devices. Use Samsung high-density MCPs to capitalize on the
`growing trend for powerful multimedia applications and wireless Internet support that today's consumers expect from their portable devices.
`
`See our catalog for full listings.
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