Case 1:14-cv-01430-LPS Document 308-26 Filed 06/22/20 Page 1 of 5 PageID #: 21035
`
`Exhibit 26
`
`

`

`Case 1:14-cv-01430-LPS Document 308-26 Filed 06/22/20 Page 2 of 5 PageID #: 21036
`Case 1:14-cv-01430-LPS-CJB Document 109-4 Filed 04/20/16 Page 2 of 66 PageID #: 3307
`
`Samsung Mobile Memory
`
`Taking Mobility to New Storage Horizons
`Mobile DRAM | Multi-Chip Packages | eMMC
`
`

`

`Case 1:14-cv-01430-LPS Document 308-26 Filed 06/22/20 Page 3 of 5 PageID #: 21037
`Case 1:14-cv-01430-LPS-CJB Document 109-4 Filed 04/20/16 Page 3 of 66 PageID #: 3308
`
`Samsung Mobile Memory
`
`Mobile DRAM
`
`The future of Mobile DRAM
`
`Performance and battery life are the key metrics upon
`which mobile electronics are measured. Samsung Mobile
`DRAM memory is optimized to deliver on both. Mobile
`Synchronous DRAMs – low power, double data rate
`(LPDDR1, 1.8V and LPDDR2, 1.2V) – are designed to
`consume less power than standard synchronous DRAM,
`and Samsung’s save power by adopting advanced circuit
`architectures that translate into longer battery life.
`
`Particularly well suited for today’s high-performance,
`battery-sensitive mobile electronics, Samsung
`Mobile DRAM can be found in mobile phones, MP3
`players, GPS devices, and digital cameras. MCPs,
`now designed into virtually every mobile phone, also
`commonly pair Mobile DRAM with NAND, PRAM, or
`eMMC components to maximize performance, while
`minimizing the memory footprint.
`
`Samsung Mobile DRAM Technology
`
`• Lower Power Consumption circuit design
`» Supply voltage as low as 1.2V
`» Temperature Compensated Self Refresh (TCSR)
`adjusts refresh rate based on device temperature
`» Partial Array Self Refresh (PASR) adjusts the size
`of the memory array to be refreshed
`» Deep Power Down (DPD) powers down the array
`» Programmable Drive Strength (DS) reduces driver
`strength based on system needs
`
`• High Density: Up to 4Gb
`
`• High performance: 200MHz Mobile-DDR interface
`and 400-533MHz LPDDR2
`
`• Small Form Factor: FBGAs (Fine-pitch Ball Grid
`Arrays), POPs (Package-on-Package) and MCPs
`(Multi-chip Packages)
`
`

`

`Case 1:14-cv-01430-LPS Document 308-26 Filed 06/22/20 Page 4 of 5 PageID #: 21038
`Case 1:14-cv-01430-LPS-CJB Document 109-4 Filed 04/20/16 Page 4 of 66 PageID #: 3309
`
`MCP (Multi-Chip-Package)
`
`The future of MCP: moviMCP™ and PRAM
`
`As the popularity of handheld electronic devices continues
`to expand, the memory solution of choice for mobile
`product designers has become Multi-Chip Package
`technology. MCPs are stacks of discrete memory die
`made into single packages. Samsung, the leader in MCPs,
`offers a broad selection based on leading-edge Flash,
`Mobile DRAM, SRAM, and now even PRAM technology.
`
`• Samsung manufactures all the memory chips used in
`MCPs — DRAM, SRAM, Flash and PRAM
`
`• Samsung has developed MCP technology for 2-to
`16-chip stacks
`
`• For its 16-die MCP, Samsung created a new wafer-
`thinning technology to reduce thickness to the size of a
`human cell — just 30 micrometers
`
`Samsung moviMCP™ is the newest generation of
`MCP technology, designed to support a wide range of
`multimedia applications. Comprised of Samsung’s eMMC
`(embedded MLC NAND and MMC controller) and Mobile
`DRAM, it delivers the performance, density and ease-
`of-use of eMMC with the space and power savings of
`an MCP. moviMCP can eliminate the need to design for
`external memory card slots.
`
`The latest MCP solution from Samsung replaces NOR
`Flash with PRAM – the first MCP of its kind. Samsung’s
`512Mb PRAM is combined with Mobile DRAM to deliver
`performance three times faster than NOR-based MCPs,
`making it ideal to quickly process large-size multimedia
`files. Samsung’s PRAM MCP is backward compatible with
`NOR MCPs.
`
`MCP Technology
`
`• Average 45% board space savings
`
`• As low as 1.2mm thickness for an 8-chip MCP
`
`• Faster system performance at lower power
`
`• Lower BOM count simplifies manufacturing and cost
`
`• Faster time to market
`
`

`

`Case 1:14-cv-01430-LPS Document 308-26 Filed 06/22/20 Page 5 of 5 PageID #: 21039
`Case 1:14-cv-01430-LPS-CJB Document 109-4 Filed 04/20/16 Page 5 of 66 PageID #: 3310
`
`eMMC (Embedded Multimedia Card)
`
`The future of mobile multimedia
`
`Samsung eMMC, also known as moviNAND™, is an
`embedded memory card comprised of high-density
`MLC NAND Flash and an MMC controller in a small
`BGA package. The use of industry-standard packaging,
`interface and firmware makes Samsung’s moviNAND easy
`to use, enabling:
`
`• Faster time to market
`
`• Common application for use as both embedded and
`external flash memory
`
`• Cost-effective, performance scalable solution using
`MLC NAND and MMC controller elements
`
`The global Smartphone market is forecast to grow
`over 22% annually from 2009 to 2015, totaling over
`2.5 billion units by the end of the period. WiFi and 4G
`network-enabled Tablets will push demand even higher.
`Multimedia content is driving this demand as operators
`offer VoD, P2P video sharing, pay-per-view TV and digital
`radio, as more and more users take higher resolution
`pictures and HD video with their handsets. Samsung
`eMMC’s speed, density and compatibility with removable
`media cards make it the best solution with which to
`improve the transfer of large multimedia files.
`
`eMMC Technology
`
`• Up to 64 gigabytes
`
`• 64 megabytes per second data transfer rate
`
`• Industry-standard MMC 4.3 and 4.4 interfaces
`
`• JEDEC-standard 169 FBGA package
`
`For more information visit Samsung online
`
`Mobile DRAM - http://bit.ly/SamsungMobileDRAM
`
`MCP - http://bit.ly/SamsungMCP
`
`eMMC - http://bit.ly/SamsungEMMC
`
`
`
`
`
`Samsung Semiconductor, Inc.
`
`3655 North First St., San Jose, CA 95134-1713
`Tel: 408-544-4000 FAX: 408-544-4950
`www.usa.samsungsemi.com
`
`© 2010. The appearance of all products, dates, figures, diagrams and tables are subject
`to change at any time without notice. Samsung and Samsung Semiconductor, Inc. are
`trademarks of Samsung Electronics Co., Ltd. All other names and brands are the property
`of their respective owners.
`
`BRO-09-DRAM-001 Printed 08/10
`
`