Case 1:14-cv-01430-LPS Document 308-23 Filed 06/22/20 Page 1 of 3 PageID #: 20996
`
`Exhibit 23
`
`

`

`Case 1:14-cv-01430-LPS Document 308-23 Filed 06/22/20 Page 2 of 3 PageID #: 20997
`Case 1:14-cv-01430-LPS-CJB Document 109-2 Filed 04/20/16 Page 239 of 240 PageID #:
` 3268
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`HMCC has delivered the first
`Draft HMC Specification to
`Adopters! Be among the first to
`review by visiting the About Us
`page and requesting the
`Adopters Agreement.
`We have officially announced the
`date and time of our next HMCC
`Webinar! The purpose of this
`webinar will be to review the
`recent updates to HMCC Rev
`2.1. Please visit our events
`page to register and learn more.
`Dial-in information for the
`webinar will follow soon.
`Discover The
`Technology
`Review the FAQ
`Learn How To
`Participate
`
`Home About Us
`Login
`
`The Technology Resource Center Membership Events Contact Us News
`
`About the Consortium
`The goal of the Hybrid Memory Cube Consortium is to facilitate HMC Integration into a wide variety of
`systems, platforms and applications by defining an adoptable industry-wide interface that enables
`developers, manufacturers and enablers to leverage this revolutionary technology.
`How to Get Involved
`The HMCC is open to an unlimited number of adopters who can apply for access to the HMC Specification
`and participate in the specification review, discussion and development.
`To receive an executable Adopter Agreement fill out and submit an Application.
`Have questions about the HMCC or becoming an Adopter? Contact Us
`HMC Consortium Participants
`Founded by Micron Technology and Samsung Electronics Co. Ltd., the Hybrid Memory Cube Consortium is
`managed by a group of eight developers, each of whom has equal voice and voting power on the final
`specification. This group is responsible for managing the organization, attending management and adoption
`meetings, and developing and optimizing the ongoing HMC interface specification.
`Developer Members:
`
` Altera Corporation
`
` 
`
` ARM
`
` IBM
`
`  
`  Micron Technology,
`Inc
`
`Open-Silicon, Inc.
`
`Samsung Electronics Co.,
`Ltd
`
`Semtech*
`
`    
`
`  
`
`   
`
` 
`
` 
`
`SK hynix
`
` Xilinx, Inc. 
`
` *Semtech and the Semtech logo are registered marks of Semtech Corporation
`Adopter Members:
`
`Accel, Ltd.
`Achronix Semiconductor
`Corporation
`Adaptive Array Systems Limited
`ADATA Technology Co., Ltd.
`AIRBUS
`Alchip Technologies Ltd.
`Altior
`Analog Bits
`APIC Corporation
`Arira Design
`Arnold & Richter Cine Technik
`Asic Research Inc.
`Atria Logic, Inc.
`Avago Technologies U.S. Inc.
`Avery Design Systems
`
`Industrial Technology Research
`Institute (ITRI)
`Infinera Corporation
`Information Sciences Institute /
`University of Southern
`California
`Inphi Corporation
`Institute of Computing
`Technology,Chinese Academy
`of Sciences
`Instituto Nazionale di Fisica
`Nucleare
`Integrated Device Technology
`Intellitech Corporation   
`Intellisis
`Invecas, Inc
`
`Pico Computing
`Praesum Communications
`Ram Charan Company Private
`Limited
`Renesas Electronics Corporation
`ROHDE & SCHWARZ GmbH &
`Co. KG
`S3Craft Technologies
`Science & Technology Innovations
`SEAKR Engineering 
`Semtech Corporation - Snowbush
`IP
`Signal Integrity Software, Inc.
`(SiSoft)
`SIMMTECH Co., Ltd.
`Sintecs BV
`SKA South Africa
`Smart Modular Technologies, Inc.
`Somerset Technology Services,
`
`3/27/2015
`
`Hybrid Memory Cube Consortium - About Us
`
`http://www.hybridmemorycube.org/about.html
`
`1/2
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`Case 1:14-cv-01430-LPS Document 308-23 Filed 06/22/20 Page 3 of 3 PageID #: 20998
`Case 1:14-cv-01430-LPS-CJB Document 109-2 Filed 04/20/16 Page 240 of 240 PageID #:
`Bayside Design Inc.
` 3269
`Ircona
`Inc.
`BroadPak Corporation
`ISI / Nallatech
`STMicroelectronics
`Brocade Communications
`Israel Institute of Technology
`Suitcase TV Ltd.
`Systems, Inc.
`Sundance DSP, Inc.
`Ixia
`Cadence Design Systems, Inc.
`Juniper Networks
`Suzhou Powercore Technology
`Calnex Solutions Ltd.
`Co. Ltd.
`KALRAY
`Cascade Microtech
`Korea Advanced Institute of
`Synopsys Inc.
`Science and Technology
`Synthetic Intelligence
`Compass-EOS
`Convey Computer Corporation
`Lawrence Livermore National
`T-Platforms
`Cray Inc.
`Laboratory
`Tabula
`DAVE Srl
`LeCroy Corporation
`Tech-Trek Ltd.
`Design Magnitude Inc.
`Liquid Logic, LLC
`Technion - Israel Institute of
`Dream Chip Technologies
`LogicLink Design, Inc.
`Technology
`Lomonosov Moscow State
`Technische Universität Dresden,
`GmbH
`Engineering Physics Center of
`University
`HPSN
`Luxtera, Inc.
`Technolution B.V.
`MSU
`Esencia Technologies Inc.
`TekStart LLC
`Marvell
`eSilicon Corporation 
`Mattozetta Technologies
`Tektronix, Inc.
`Exablade Corporation
`Maxeler Technologies Ltd.
`Teledyne LeCroy
`EZchip Semiconductor Ltd.
`Teradyne, Inc
`MediaTek
`FirstPass Engineering
`Mentor Graphics
`Telesoft Technologies Ltd
`FormFactor, Inc.
`Miranda Technologies
`The Regents of the University of
`Fujitsu Advanced Technologies
`Partnership
`California
`Mobiveil, Inc.
`Tilera Corporation
`Ltd.
`Galaxy Computer System Co.,
`Tipalo GmbH
`Module-Projects
`Montage Technology, Inc.
`Tongji University
`Ltd.
`GDA Technologies
`Napatech A/S
`TU Kaiserslautern, Lehrstuhl
`National Instruments
`Entwurf Mikroelektronischer
`GiDEL
`NEC Corporation
`GLOBALFOUNDRIES
`Systeme
`Google Inc.
`UC Irvine
`Netronome
`GraphStream Incorporated
`New Global Technology
`United Microelectronics
`Green Wave Systems Inc.
`Northwest Logic
`Corporation
`HGST, a Western Digital
`Obsidian Research
`Università di Bologna - DEI
`University of Heidelberg ZITI
`Company
`OmniPhy
`HiSilicon Technologies Co., Ltd.
`(Center for Computer Engineering
`Oregon Synthesis
`HiTech Global
`University of Rochester
`Palo Alto Networks
`HOY Technologies
`University of Southern California
`Pennsylania State University
`Huawei Technologies
`Wave Semiconductor
`Pentek, Inc.
`Winbond Electronics Corporation
`Perfcraft
`Woodward McCoach, Inc.
`Wuhan Integrated Circuit Center
`ZTE Corporation
`
`© 2015 Hybrid Memory Cube Consortium
`
`3/27/2015
`
`Hybrid Memory Cube Consortium - About Us
`
`http://www.hybridmemorycube.org/about.html
`
`2/2
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