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`Exhibit 19
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`Application Processor Package | Samsung Semiconductor Global Website
`Case 1:14-cv-01430-LPS Document 308-19 Filed 06/22/20 Page 2 of 4 PageID #: 20959
`Case 1:14-cv-01430-LPS-CJB Document 109-2 Filed 04/20/16 Page 214 of 240 PageID #:
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`Overview
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`Drawing file download :
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`An application processor, or SoC (System on a Chip), is a microprocessor with a specialized architecture for deployment in
`embedded systems, such as digital still/video cameras, digital/smart TVs and set-top boxes, and automotive systems, among others.
`This document describes the specific packaging technology needed for application processors to enable them to achieve the
`required performance at low power consumption levels with limited board space.
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`Packaging Technology for Application Processors
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`An application processor is a highly specialized and complex device operating at frequencies of several hundred MHz, to a few
`GHz, and hence, careful attention must be paid to the design of its packaging. Leading-edge, high-performance application
`processors, such as Samsung's Exynos 4210, are packaged using the Package on Package (PoP) technology, resulting in
`significant savings in board space in the final design.
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`Figure 1 below illustrates a DRAM memory package stacked on top of an application processor, used in a typical PoP design. The
`figure also shows extended details for the package, such as the interconnecting wires, metal bumps, and the stacking balls that
`connect the separated packages.
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`FCFBGAH
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`PoP 2chipstack
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`TSVSiP DDP
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`TSVSiP QDP
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`Application Processor Package | Samsung Semiconductor Global Website
`Case 1:14-cv-01430-LPS Document 308-19 Filed 06/22/20 Page 3 of 4 PageID #: 20960
`Case 1:14-cv-01430-LPS-CJB Document 109-2 Filed 04/20/16 Page 215 of 240 PageID #:
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`Samsung's advanced processing and packaging technology ensure that PoP devices, such as application processors, as well as
`high-density memory chips, are optimized for the highest levels of performance, and the lowest power consumption. The PoP
`technique offers significant benefits, particularly for packaging application processors, since the logic layer at the bottom and the
`memory layer at the top can be selected, assembled, and tested independently.
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`Application processors packaged using Samsung's advanced PoP technologies have ultra-low physical footprints (as low as 12
`mm x 12 mm, to 14 mm x 14 mm), and result in devices with the thinnest profiles, making them ideal for deployment in space-
`constrained applications, such as mobile handsets and portable media players.
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`Key Features and Benefits of Samsung's Packaging Technology for Application
`Processors
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`Samsung's advanced processing and packaging technology ensures that the application processors have some of the most distinct
`features, as listed below:
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`Ultra-low footprints and thinnest profiles :
`Samsung's specialized processes encapsulate application processors in the smallest packages, achieving significant
`reductions in their physical sizes. This, in turn, reduces the board space occupied by the device in the final application. The
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`Application Processor Package | Samsung Semiconductor Global Website
`Case 1:14-cv-01430-LPS Document 308-19 Filed 06/22/20 Page 4 of 4 PageID #: 20961
`Case 1:14-cv-01430-LPS-CJB Document 109-2 Filed 04/20/16 Page 216 of 240 PageID #:
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`process also ensures that the package profile (or height) is kept to as low a value as possible, making it easier to use the
`processor in compact, space-constrained applications such as digital still/video cameras and mobile handsets.
`High-speed device compliant :
`High-end embedded computing devices, such as network processors, usually contain more than 1 computing core per device
`(typically 3 to 4 cores per processor). Samsung's packaging technology is well suited for such high-speed, multi-core
`application processors, which involve extensive on-chip interconnection between the cores.
`High-density I/O capable :
`Application processors usually contain a large number of I/O lines, resulting in the pin counts for the device reaching
`significantly high numbers (as high as 1,000 in certain cases). Using industry-standard alternative versions of the BGA package,
`such as FPBGA (Fine-Pitch Ball Grid Array), Samsung's refined processing techniques ensure reliability for all I/O lines on the
`chip.
`Excellent thermal stability and operational reliability :
`Samsung's packaging technology provides high heat-dissipation capabilities for the device, eliminating the necessity for
`additional heat-dissipation mechanisms, such as heat sinks for the devices. Additionally, the techniques provide significant
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`Areas that can Benefit from Samsung's Packaging Technology for Application
`Processors
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`Samsung's technology for packaging application processors are used in a wide variety of computing, communication, and
`embedded devices. Some of these include:
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`Mobile computing devices :
`Application processors are used in all mobile computers, such as tablets, PDAs, and ebook readers. Samsung's advanced
`processing and packaging technology for application processors can be used to improve and enhance the capabilities and
`performance of such applications.
`Mobile communications devices :
`Mobile phones, smartphones, and VoIP phones also use application processors designed specifically for the networking
`segment. These devices stand to benefit significantly by using Samsung's refined packaging technology for application
`processors.
`Entertainment/gaming devices :
`Today's high-end gaming devices require significant computing power, and most commonly use multi-core processors. Such
`applications stand to gain considerably by using Samsung's packaging technology for their multi-core application processors.
`Consumer products :
`Product-specific application processors are used in a wide range of consumer electronic products, such as digital TVs and set-
`top boxes, DVD/Blu-ray players, and automobile navigation systems. The performance of such devices can be improved
`manifold by adopting Samsung's industry-leading packaging technology for application processors.
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