Case 1:14-cv-01430-LPS Document 308-16 Filed 06/22/20 Page 1 of 5 PageID #: 20942
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`Exhibit 16
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`DRAM Package | Samsung Semiconductor Global Website
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`DRAM is used in virtually every general-purpose and industrial computing device, such as desktops, laptops, servers, workstation
`computers, camcorders, digital cameras, and as buffer memory in many other digital devices. Several other applications, such as
`gaming consoles, also use DRAM as their main memory.
`
`Samsung is the world's top manufacturer of all types of DRAM memory, such as SDRAM, DDR DRAM, DDR2 DRAM, and DDR3
`DRAM, among others. Apart from the consumer segment, Samsung has an extensive portfolio of DRAM solutions for the industrial
`segment, with specialized designs that feature outstanding quality and reliability, along with the lowest power consumption at the
`fastest speed.
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`Packaging DRAM Memory
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`DRAM memory operates from several hundred MHz to several GHz, based on the deployed application. Due to the specific speed
`requirements, advanced technologies must be applied to the memory's packaging design to improve the performance of DRAM
`devices, and reduce stray parasitic capacitances and lead inductances. Currently, the most commonly used packages for DRAM
`memory are Wire-bonding type BGA (Ball-Grid Array).
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`Figure 1 illustrates a cross-sectional view of a typical DRAM module encapsulated in a BGA package.
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`FCFBGA 1chip
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`WLI DDP
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`WLI QDP
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`The illustration above highlights Flip Chip Technology, the most advanced technique for packaging DRAM, and other similar, high-
`speed memory modules.
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`The Flip Chip technique consists of placing metal bumps on top of pads placed on the surface of the integrated circuit chips. The
`wafer is then cut into individual chips and flipped over (hence the name "Flip Chipâ​​) so that the metal bumps face down and are
`aligned with the pads of the substrate. The final phase - bonding the device to the circuit board - is then completed using one of
`several techniques (such as using a reflow process).
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`Flip Chip is the most advanced packaging technique for DRAM memory, owing to several advantages it offers over other
`techniques, such as maximizing the throughput of the packaging processes, reducing the lead inductance of the device to the
`minimum extent (due to the use of metal bumps), minimizing its power consumption, and enhancing noise rejection at higher
`frequencies.
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`Samsung has the most refined processes in the world for packaging DRAM memory. Samsung's advanced Flip Chip processing
`and packaging techniques ensure DRAM memory of the highest quality, optimized for operating at the highest frequencies, and
`consuming the lowest power. Furthermore, Samsung's production techniques assure maximum output in terms of the number of
`working chips per processed wafer.
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`Key Features and Benefits of Samsung's DRAM Packaging Techniques
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`Samsung's advanced and specialized processing and packaging techniques for DRAM memory provide several important benefits
`to the end application. Some of the most significant features and benefits are listed below:
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`Use of advanced Flip Chip technology :
`DRAM memory devices are most commonly supplied in BGA packages, and Samsung's Flip Chip technology ensures that
`the devices offer the highest levels of performance in terms of both speed and power consumption. Flip Chip technology
`also ensures lower levels of stray capacitances and lead inductances, improving noise immunity for the device.
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`Suitability for mass production :
`Samsung's Flip Chip package is well suited for mass production of not only DRAM memory, but also several other devices,
`such as controllers, DSPs, chipsets, and ASICs.
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`Suitability for future packaging technologies such as TSV (Through Silicon Via) :
`Samsung's Flip Chip package is suitable for devices utilizing PoP designs (such as DRAM memory) supporting up to four
`stack levels.
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`Excellent quality and reliability :
`Samsung's packaging techniques provide exceptional reliability characteristics to the device, statistics for some of which
`are provided below:
`Moisture sensitivity : JEDEC Level 3 (30°C/60%, 192 hours, IR 260°C)
`Unbiased Highly Accelerated Stress Test (uHAST) : 168 hours (130°C, 85% relative humidity, 1 atm)
`Boundary temperature cycles : 1,000 cycles (-55~125°C)
`Temperature, Humidity, Bias (THB) : 1,000 Hours (85°C, 85% relative humidity, 3.3 V, static stress)
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`Application Areas for Samsung's DRAM Packages
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`Samsung's DRAM packaging techniques are the industry-standards and benchmarks for memory devices. Today's highly
`demanding applications require the highest throughputs from the deployed memory, and Samsung's packaging techniques ensure
`that memory does not become a performance bottleneck in such applications.
`
`Some of the application areas for Samsung's Flip Chip DRAM package include:
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`Computing devices and systems :
`Various types of DRAM modules (such as UDIMM, SoDIMM, RDIMM, and LRDIMM) deployed in today's desktops, laptops,
`and servers use BGA packages. Additionally, high-density memory, such as DDP (Dual Die Package) and QDP (Quad Die
`Package) can also leverage the advantages of Samsung's Flip Chip packaging technology. Portable and mobile
`computers can use this technology for the small amount of on-board memory that they carry.
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`Consumer products :
`Consumer electronic products, such as digital TVs and set-top boxes, digital still/video cameras, HDDs, Blu-ray players,
`and automobile navigation systems can greatly benefit from Samsung's Flip Chip technology, which offers the highest
`levels of performance for the memory subsection, while reducing its power consumption.
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`Graphics modules and game consoles :
`High-performance graphic memory (usually deployed in the form of a graphics card) as well as embedded devices and
`systems, such as game consoles, are additional segments that stand to gain significantly from adopting Samsung's Flip
`Chip memory packaging technology.
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`Case 1:14-cv-01430-LPS Document 308-16 Filed 06/22/20 Page 5 of 5 PageID #: 20946
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