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`Exhibit 14
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`Overview
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`Flash memory is nonvolatile, solid state semiconductor storage media that retains stored data without the need for any external
`power supply. This document describes the High-density Packaging Technology for Flash memory products, which stacks
`individual memory chips on top of one another within a single package with a low-profile, enabling the production of flash memory
`devices with the highest densities and storage capacities.
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`Packaging Technology for Flash Memory
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`Flash memory packages are commercially available in several package types, such as TSOP (Thin Small Outline Package),, and
`FBGA (Fine-pitch Ball Grid Array), among others. The end application's reading and writing speed, the available footprint, and
`required densityare the primary dictators of the type of packages selected for deployment.
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`Internally, the die stack design for the flash memorystack is critical factors to determine the packaging yield, its reliability of products,
`and its form factor. Figure 1 below illustrates the internal layout of a flash memory die stack structures in a standard BGA package.
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`FBGA HDP
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`FBGA ODP
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`FBGA QDP
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`As the illustration shows, this package "stacksâ​​ several memory dies to achieve the desired storage capacity for the compete chip.
`The immediate advantage of this approach is a significant saving in the total area occupied by the memory device. The die stack
`design is thus extensively used in flash memory for applications where space is severely restricted, such as mobile handsets,
`SSDs, and memory cards, among others.
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`Samsung's advanced processing and packaging techniques for the die stack design ensure that the flash memory devices are
`optimized for the highest levels of speed and data throughputs, the smallest footprint, and the lowest power consumption. Samsung
`is an industry-leader in the flash memory segment and has developed memory with up to 16 die stacks on a single package, using
`the optimized stacking technologies.
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`The leading-edge high-level die stacking technology is resulting in faster and higher capacity nonvolatile storage devices, such as
`solid state drives. Additionally, this technology promises to significantly increase the amount of data storage capacities in newer
`generation computing and communication devices, such as mobile handsets, and portable media players.
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`Key Features and Benefits of Samsung's Packaging Techniques for Flash
`Memory
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`Samsung's advanced packaging techniques for flash memory provide the resulting devices with some of the most distinct features,
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`as listed below:
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`Ultra-high memory densities:
`Samsung is the world's largest memory supplier and Samsung flash memory is the highest density flash memory across
`the electronics and semiconductor segment. As an example, Samsung supplies 128 GB flash memory devices internally
`organized as 16-stack MCP flash memory, with 64 Gb per die.
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`Multi-channel I/O capability:
`Samsung flash memory packages are designed with multi-channel I/O, making them capable of responding to more than 1
`data transfer request at the same time. For example, a flash memory package with 2 I/O channels can simultaneously
`process a read request and a write request (or 2 write requests, or 2 read requests). Samsung flash memory packages
`support a maximum of 4 I/O channels at a world-first.
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`Lowest footprints and thinnest profiles:
`Samsung's industry-leading processes provide the smallest packages for all types of flash memory, resulting in significant
`reductions in their physical sizes, and in the board space occupied by the device in the final application. The processes
`also ensure that the package profile, or height, is kept to its minimum possible value, making it easier to deploy the
`memory device in space-constrained applications such as SSD modules of notebooks, tablets, and mobile handsets.
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`Very high thermal stability and operational reliability:
`Samsung's advanced processes for packaging all types of flash memory ensure that the device operates consistently and
`reliably under extreme temperature conditions.
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`Available in halogen-free composition:
`Samsung's production processes are optimized to use environmentally-friendly constituents. Samsung flash memory
`products are also available in a halogen-free composition to comply with globally defined standards for halogen-free
`electronic devices and components.
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`Areas that can Benefit from Samsung's Packaging Techniques for Flash
`Memory
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`Flash memory is used in a host of consumer, industrial, and automotive electronics, and Samsung's advanced packaging
`techniques provide flash memory a multitude of benefits, such as smaller sizes, increasing densities, and lower power consumption
`levels..
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`Some of the principal areas that stand to benefit from using Samsung's packaging techniques for flash memory include:
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`Computing devices:
`Desktop PCs, notebooks, and servers are gradually switching from HDDs to flash memory-based SSDs for data storage,
`due to the latter's reliability and lower power consumption. Advances in flash memory technologies have now made
`available SSDs that equal (or rival) the storage capacities of HDDs.
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`As buffer memories in hybrid drives:
`A hybrid drive integrates some amount of flash memory onboard a conventional HDD, with the flash memory acting as a
`"buffer" to reduce data access times. Such drives are usually referred to as "hybrid SSDsâ​​ and offer better performance
`than conventional HDDs.
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`As removable storage media:
`Flash memory is widely used as portable storage media, in devices such as USB drives. With higher levels of integration
`and increasing densities of flash memory, higher capacity, flash-based external HDDs are also available. Flash memory is
`also available for devices such as smartphones, tablet computers, and PMPs, as flash cards - a form of removable storage
`media.
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