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Case 1:14-cv-01432-LPS Document 279 Filed 06/10/20 Page 1 of 3 PageID #: 17008
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`THE UNITED STATES DISTRICT COURT
`FOR THE DISTRICT OF DELAWARE
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`ELM 3DS INNOVATIONS, LLC
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`Plaintiff,
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`SAMSUNG ELECTRONICS CO., LTD.,
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`Defendants.
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`ELM 3DS INNOVATIONS, LLC
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`Plaintiff,
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`MICRON TECHNOLOGY, INC., et al.
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`Defendants.
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`ELM 3DS INNOVATIONS, LLC
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`C.A. No. 14-1430-LPS-CJB
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`C.A. No. 14-1431-LPS-CJB
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`C.A. No. 14-1432-LPS-CJB
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`Plaintiff,
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`SK HYNIX INC., et al.
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`Defendants.
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`MEMORANDUM ORDER
`IT IS HEREBY ORDERED that the Motions for Clarification (C.A. No. 14-1430 D.I.
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`270; C.A. No. 1431 D.I. 248; C.A. No. 1432 D.I. 262) are GRANTED.1
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`1 The motions have been filed by all defendants: Samsung Electronics Co., Ltd., Samsung
`Semiconductor, Inc., Samsung Electronics America, Inc., and Samsung Austin Semiconductor,
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`Case 1:14-cv-01432-LPS Document 279 Filed 06/10/20 Page 2 of 3 PageID #: 17009
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`The Court clarifies that the claim terms “dice is substantially flexible” and “die is
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`substantially flexible” mean a “dice/die that is largely able to bend without breaking and contains
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`a substantially flexible semiconductor substrate, that is thinned to 50 μm or less and
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`subsequently polished or smoothed such that it is largely able to bend without breaking, and a
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`sufficiently low tensile stress dielectric material.”
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`The foregoing is the construction the Court intended by its earlier claim construction
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`opinion and order to adopt. (See D.I. 266, 267)2 It is the claim construction the Court
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`understands the Court of Appeals for the Federal Circuit to have applied. (See D.I. 266 at 8-9)
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`(“[T]he Federal Circuit construed the ‘substantially flexible’ terms, constructions which this
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`Court now adopts as well.”) (citing Samsung Elecs. Co. v. Elm 3DS Innovations, LLC, 925 F.3d
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`1373, 1377 n.5, 1380 (Fed. Cir. 2019))
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`The Court disagrees with Plaintiff’s suggestion that Defendants have failed to meet their
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`burden to obtain the relief they seek. (See D.I. 274 at 3) The Court inadvertently failed to
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`correctly state its construction of the “dice/die” terms in its previous order. The Court can (and
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`should) correct its error when it becomes aware of it, as it has now become aware thanks to
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`LLC (collectively, “Samsung”); Micron Technology, Inc., Micron Semiconductor Products, Inc.,
`and Micron Consumer Products Group, Inc. (collectively, “Micron”); and SK Hynix Inc., SK
`Hynix America Inc., Hynix Semiconductor Manufacturing America Inc., and SK Hynix Memory
`Solutions Inc. (collectively, “SK Hynix” and, together with Samsung and Micron,
`“Defendants”).
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`Unless otherwise noted, all further references in this Order to the docket index are to
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`Civil Action Number 14-1430.
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` 2
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` In its April 13, 2020 claim construction order, the Court construed the dice/die terms as “Not
`indefinite. A dice/die that is thinned to 50 μm or less and subsequently polished or smoothed
`such that it is largely able to bend without breaking.”
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`Case 1:14-cv-01432-LPS Document 279 Filed 06/10/20 Page 3 of 3 PageID #: 17010
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`Defendants’ motion. Defendants are not required under these circumstances to demonstrate that
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`the Court’s prior construction was clearly erroneous.
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`June 10, 2020
`Wilmington, Delaware
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`_______________________________
`HONORABLE LEONARD P. STARK
`UNITED STATES DISTRICT JUDGE
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`3
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