`
`EXHIBIT B
`
`EXHIBIT B
`
`TO BE FILED
`
`TO BE FILED
`UNDER SEAL
`
`UNDER SEAL
`
`
`
`Case 1:14-cv-01432-LPS Document 269-2 Filed 05/20/20 Page 2 of 2 PageID #: 16902
`°°‘°'9' tflase 1:14-cv-01432-LPS Docume???2%32mflfeertitt‘ifi720/2o Page 2 of 2 PageID #: 16902
`
`Page: 1
`
`Subject: 3DS DRAM from Tachyon Semiconductor
`Date: Tue, 09 Oct 2001 10:43:48 —0400
`From: Glenn Leedy <gle11nleedy@technologist.com>
`Organization: Elm Technology Corporation
`To: Farhad Tabrizi <ftabrizi@hea.com>
`
`Dear Farhad,
`
`This information may be of some help to you and Hyundai. Elm‘s licensee Tachyon Semiconductor expects to have a 3DS
`twelve layer demonstration circuit this December. Tachyon's 3DS DRAM part is in .18;Lm technology but with .l3me cost;
`this is an advantage I think can be of significant help to Hyundai over its competition. Micron and Infineon have
`pledged investment after they receive parts.
`I encourage you to take a good look at Tachyon as soon as possible. The
`Tachyon web site is Tachyonsemi.com, they have offices in Singapore, San Jose and Chicago.
`
`I think there is a good opportunity
`Tachyon is trying to close its second round [it raised $20M in its first round].
`for Hyundai to get access to one good margin design for all of 512Mb, 16b and 4Gb circuits and production by mid-2002,
`but also, an immediate good news release opportunity for Hyundai marketing and investors.
`I would be glad to help you in every way I can in this.
`
`”\
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`Best regards,
`Glenn
`734.944.1570
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`Inbox?id=SBCSOD23.3C630F91%4otechnologist.com&number=124233266
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`HIGHLY CONFIDENTIAL
`
`ELM3DSOOO41228
`
`
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