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`IN THE UNITED STATES DISTRICT COURT
`FOR THE DISTRICT OF DELAWARE
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`ELM 3DS INNOVATIONS, LLC,
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`Plaintiff,
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`v.
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`SAMSUNG ELECTRONICS CO., LTD., et al.,
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`C.A. No. 14-cv-1430-LPS
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`JURY TRIAL DEMANDED
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`Defendants.
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`ELM 3DS INNOVATIONS, LLC,
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`Plaintiff,
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`v.
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`C.A. No. 14-cv-1431-LPS
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`JURY TRIAL DEMANDED
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`MICRON TECHNOLOGY, INC., et al.,
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`Defendants.
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`ELM 3DS INNOVATIONS, LLC,
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`Plaintiff,
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`v.
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`C.A. No. 14-cv-1432-LPS
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`JURY TRIAL DEMANDED
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`SK HYNIX INC., et al.,
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`Defendants.
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`[PROPOSED] ORDER MODIFYING CLAIM CONSTRUCTION
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`Having considered Defendants’ Motion for Clarification Under L.R. 7.1.5 and all papers
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`filed in support of and opposition to the Motion, IT IS HEREBY ORDERED that:
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`Case 1:14-cv-01432-LPS Document 262-2 Filed 04/29/20 Page 2 of 2 PageID #: 16547
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`The terms “dice is substantially flexible” and “die is substantially flexible” mean a “dice/die that
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`is largely able to bend without breaking and contains a substantially flexible semiconductor
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`substrate, that is thinned to 50 μm or less and subsequently polished or smoothed such that it is
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`largely able to bend without breaking, and a sufficiently low tensile stress dielectric material.”
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`DATED: ___________________
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`______________________________
`Chief, United States District Judge
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`2
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