`
`IN THE UNITED STATES DISTRICT COURT
`FOR THE DISTRICT OF DELAWARE
`
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`ELM 3DS INNOVATIONS, LLC,
`
` Plaintiff,
`
` v.
`
`SAMSUNG ELECTRONICS CO., LTD., et
`al.,
`
` Defendants.
`
`ELM 3DS INNOVATIONS, LLC,
`
` Plaintiff,
`
` v.
`
`MICRON TECHNOLOGY, INC., et al.,
`
` Defendants.
`
`ELM 3DS INNOVATIONS, LLC,
`
` Plaintiff,
`
` v.
`
`SK HYNIX INC., et al.,
`
` Defendants.
`
`
`
`
`
`
`C.A. No. 14-cv-1430-LPS
`
`JURY TRIAL DEMANDED
`
`
`
`
`
`
`C.A. No. 14-cv-1431-LPS
`
`JURY TRIAL DEMANDED
`
`
`
`
`
`
`C.A. No. 14-cv-1432-LPS
`
`JURY TRIAL DEMANDED
`
`
`
`
`
`
`
`PLAINTIFF’S EXHIBITS TO PLAINTIFF’S CLAIM CONSTRUCTION BRIEFS
`
`
`Exhibit
`
`Description
`
`A
`
`B
`
`Declaration of Shefford Baker dated January 25, 2019
`
`Al-sarawi, Said F., A Review of 3-D Packaging Technology, IEEE Transactions
`on Components, Packaging, and Manufacturing Technology, Part B, Vol. 21, No.
`1 (February 1998) (ELMEX_00000001)
`
`
`
`Case 1:14-cv-01432-LPS Document 238 Filed 12/12/19 Page 2 of 3 PageID #: 16022
`
`C
`
`D
`
`E
`
`F
`
`G
`
`H
`
`I
`
`J
`
`K
`
`L
`
`Merriam Webster’s Collegiate Dictionary (10th ed. 1999) (ELMEX_00000227)
`
`Email from Citroen to Ford dated January 24, 2019 re Elm v. Defendants:
`Indefiniteness Position
`
`Defendants’ Fourth Amended Invalidity Contentions (excerpts) dated January 28,
`2019
`
`Müller, Jochen, et al, Smart Card Assembly Requires Advanced Pre-Assembly
`Methods, Semiconductor International (July 2000) (ELM3DS00030869)
`
`Francis, David, Thinning Wafers For Flip Chip Applications, High Density
`Interconnect (ELM3DS00036832)
`
`McGrath, Dylan, Thinning Wafers Beyond CMP, Electronic News, July 6, 1998
`(ELMEX_00000175)
`
`Gurnett, Keith and Tom Adams, Ultra-thin semiconductor wafer applications
`and processes, The Advanced Semiconductor Magazine, Vol. 19 No. 4 (May
`2006) (ELMEX_00000096)
`
`Appellants’ Opening Brief, Samsung Electronics Co., Ltd. et al v. Elm 3DS
`Innovations LLC, Nos. 2017-2474 et al (Fed. Cir. Feb. 16, 2018)
`
`Appellants’ Reply Brief, Samsung Electronics Co., Ltd. et al v. Elm 3DS
`Innovations LLC, Nos. 2017-2474 et al (Fed. Cir. June 5, 2018)
`
`Prosecution History of U.S. Pat. App. No. 12/268,386, September 30, 2015
`Supplemental Response and Amendment
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`
`Dated: December 12, 2019
`
`Of Counsel:
`
`Adam K. Mortara
`Matthew R. Ford
`BARTLIT BECK LLP
`54 West Hubbard Street, Suite 300
`Chicago, IL 60654
`Tel: (312) 494-4400
`adam.mortara@bartlitbeck.com
`matthew.ford@bartlitbeck.com
`
`John M. Hughes
`
`
`
`Respectfully submitted,
`
`FARNAN LLP
`
`
`/s/ Brian E. Farnan
`Brian E. Farnan (#4089)
`Michael J. Farnan (#5165)
`919 North Market Street
`12th Floor
`Wilmington, DE 19801
`Tel: (302) 777-0300
`bfarnan@farnanlaw.com
`mfarnan@farnanlaw.com
`
`
`
`
`Case 1:14-cv-01432-LPS Document 238 Filed 12/12/19 Page 3 of 3 PageID #: 16023
`
`Counsel for Plaintiff ELM 3DS
`INNOVATIONS, LLC
`
`
`Nosson D. Knobloch
`Katherine L.I. Hacker
`BARTLIT BECK LLP
`1801 Wewatta Street, Suite 1200
`Denver, CO 80202
`Tel: (303) 592-3100
`john.hughes@bartlitbeck.com
`nosson.knobloch@bartlitbeck.com
`kat.hacker@bartlitbeck.com
`
`
`
`
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