throbber
Case 5:20-cv-05676-EJD Document 23-6 Filed 09/25/20 Page 1 of 6
`
`
`
`
`Exhibit 4
`
`
`
`
`
`
`
`
`

`

`SAMSUNG AUSTIN SEMICONDUCTOR
`
`Aus‘tin Semiconductor
`
`_
`Case 5:20-cv-05676-EJD Document 23-6 Filed 09/25/20 Page 2 of 6
`Case 5:20-cv-05676-EJD Document 23-6 Flled 09/25/20 Page 2 of 6
`
`SAMSUNG
`
`Foundry Overview
`
`Providing cutting—edge technology since 2017 in Aus’fin
`
`httpsn's\nnv.samsungcom‘115ssasBusinessO\‘en'ie\v[9
`
`52020 3:53:14 PM]
`
`

`

`SAMSUNG AUSTIN SEMICONDUCTOR
`
`Case 5:20-cv-05676-EJD Document 23-6 Filed 09/25/20 Page 3 of 6
`
`Samsung sarted its foundry business in 2005 to provide cutting-edge technologies to a broader market. In 2017, Samsung Foundry
`found
`its home away from home in Ausin. Through several successful collaborations with foundry cusomers and a continuous drive to
`develop
`the mos cutting-edge technologies, Samsung Ausin Semiconductor has become a major player in the foundry market. Samsung
`Ausin Semiconductor
`primarily focuses on the production of 14nm and 28/32nm technologies.
`
`Trailblazer in Cutting-Edge Technology
`Our innovative 3D-sructure FinFet technology is one of the indusry’s mos important milesones
`
`A New Paradigm for All The Bes Advanced Technologies
`
`https://www.samsung.com/us/sas/Business/Overview[9/23/2020 3:53:14 PM]
`
`

`

`SAMSUNG AUSTIN SEMICONDUCTOR
`
`Case 5:20-cv-05676-EJD Document 23-6 Filed 09/25/20 Page 4 of 6
`Samsung Foundry’s mos advanced process technology enables its cusomers to obtain a higher performance
`without having to increase the chip size or maintain the same performance with a smaller chip.
`
`Samsung Foundry has taken a revolutionary sep by implementing
`the innovative 3D-sructure FinFET technology. 3D FinFET is the mos important technology milesone in the foundry
`indusry in the las 10 years of transition into 14nm process for the superior performance, power and scaling benefts.
`
`With the frs 14nm class FinFET ofering for foundry indusry, Samsung Foundry has led technology innovation. Beyond
`14nm technology, Samsung Foundry continues technology innovation for next generation of development.
`
`Continuous Technology Innovation without Borders
`
`Although innovation without borders is the trend of today’s technological advances,
`https://www.samsung.com/us/sas/Business/Overview[9/23/2020 3:53:14 PM]
`
` scaling limit has been imposed on the process evolution
`
`

`

`SAMSUNG AUSTIN SEMICONDUCTOR
`
`Case 5:20-cv-05676-EJD Document 23-6 Filed 09/25/20 Page 5 of 6
`Case 5. 20-c—v--0-5676 EJD Document 23- 6 Filed 09/25/20 Page 5 of 6
`in the semiconduct01 indushy Since 130nm to 28nm continuous scaling-downl1as only been possible thlough 1nate11'al innovations
`
`such as using copper filler. low-k, shess-teclmology. ULK. and HKMG. Subsequently. planar transistors 011 Bulk-Si hit the gate length
`
`scaling limit. however Samsmlg Foundiy found innovative solutions in the shuctlu‘e of transistom with FDSOI and ‘3D FinFET‘.
`
`Technology migration history
`
`Performance
`
`FD-SOI
`
`HK/MG
`
`ULK
`
`Stress Tech
`
`Low-k
`
`FinFET
`
`EUV
`
`Copper
`
`Material Innovation
`Structure innovation
`thhography innovation
`
`
`
`130nm
`
`90nm
`
`65nm
`
`45nm
`
`32/28nm
`
`14nm
`
`10nm
`
`7nm
`
`
`
`httpsni/www. samsung.com/us/sasiBusinessJOverview[912312020 3 :53 : 14 PM]
`
`

`

`SAMSUNG AUSTIN SEMICONDUCTOR
`
`COMPANY
`
`Case 5:20-cv-05676-EJD Document 23-6 Filed 09/25/20 Page 6 of 6
`BUSINESS
`SUSTAINABILITY
`
`Foundiy Oren‘iew
`
`SAS Technology
`
`1 411m
`
`2863211111
`
`4556511111
`
`Our Approach
`
`People
`
`Conununity
`
`Environment
`
`Compliance
`
`Sustainability Report
`
`Vision
`
`Philosophy
`
`History
`
`President Message
`
`Awards & Certificates
`
`CAREERS
`
`Our Talent
`
`Culture
`
`Benefits
`
`Intemships
`
`Job Opportunities
`
`Follow Us
`
`Site Map
`
`Terms of Use/ Privacy Policy
`
`Contact Us
`
`Related Links A
`
`
`
`https:ffwuw.samsung.com’usc’sas:’Businessfi'Overview 9
`
`020 3:53: 14 PM]
`
`

This document is available on Docket Alarm but you must sign up to view it.


Or .

Accessing this document will incur an additional charge of $.

After purchase, you can access this document again without charge.

Accept $ Charge
throbber

Still Working On It

This document is taking longer than usual to download. This can happen if we need to contact the court directly to obtain the document and their servers are running slowly.

Give it another minute or two to complete, and then try the refresh button.

throbber

A few More Minutes ... Still Working

It can take up to 5 minutes for us to download a document if the court servers are running slowly.

Thank you for your continued patience.

This document could not be displayed.

We could not find this document within its docket. Please go back to the docket page and check the link. If that does not work, go back to the docket and refresh it to pull the newest information.

Your account does not support viewing this document.

You need a Paid Account to view this document. Click here to change your account type.

Your account does not support viewing this document.

Set your membership status to view this document.

With a Docket Alarm membership, you'll get a whole lot more, including:

  • Up-to-date information for this case.
  • Email alerts whenever there is an update.
  • Full text search for other cases.
  • Get email alerts whenever a new case matches your search.

Become a Member

One Moment Please

The filing “” is large (MB) and is being downloaded.

Please refresh this page in a few minutes to see if the filing has been downloaded. The filing will also be emailed to you when the download completes.

Your document is on its way!

If you do not receive the document in five minutes, contact support at support@docketalarm.com.

Sealed Document

We are unable to display this document, it may be under a court ordered seal.

If you have proper credentials to access the file, you may proceed directly to the court's system using your government issued username and password.


Access Government Site

We are redirecting you
to a mobile optimized page.





Document Unreadable or Corrupt

Refresh this Document
Go to the Docket

We are unable to display this document.

Refresh this Document
Go to the Docket