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`Exhibit 10
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`ULVAC
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`Case 5:20-cv-05676-EJD Document 23-12 Filed 09/25/20 Page 2 of 6
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`Components
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`Systems
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`Markets
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`Services
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`About ULVAC
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`Contact
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`Support
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`ENTRON-EX
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`Plasma Ashing
`Etching
`PVD
`Cluster Systems
`Roll-coater
`In-line Systems
`R&D
`300mm
`Vacuum Distillation
`Evaporation
`Ion Implanter
`Vacuum Furnaces
`CVD
`Freeze Drying
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`http://www.ulvac.com/systems/PVD/PVD300mm/PVD300mmEntron[9/23/2020 4:41:44 PM]
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`ULVAC
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`Case 5:20-cv-05676-EJD Document 23-12 Filed 09/25/20 Page 3 of 6
`Case 5:20-cv-05676-EJD Document 23-12 Filed 09/25/20 Pa e30f6
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`Vacuum Cooling
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`Mass Production 300mm Sputtering
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`The Entron—EX multi—chamber sputtering system is specifically designed for the 300mm Semiconductor market. This system is equipped with
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`the latest process chambers for advanced 300mm processing.
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`Get More Information
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`Request Engineering lnformation
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`978-686—7550
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`Details
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`Key Features
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`> Flexible module configuration.
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`) System can run both PVD and CVD/ALD process.
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`htlp://www.ulvac.com/systcms/PVD/PVD300mm/PVD300mEn1mnP/23/2020 4:41 :44 PM]
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`Download Spec
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`ULVAC
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`Case 5:20-cv-05676-EJD Document 23-12 Filed 09/25/20 Page 4 of 6
`) Many applications includingzmfigg'ewigfifiigfilkl bQREWetBEfiillcfi Afflfifi egfiggcigeag‘éfi Of 6
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`> Process capability for not only Si devices but also compound semiconductor.
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`> 10 process modules maximum.
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`> Single or Tandem platforms are available.
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`) High Throughput system with great reliability.
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`) Highly reliable Rorze EFEM used for atmospheric transfer.
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`> Equipped with the latest control system that complies with the next generation semiconductor Fab.
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`> Semi Compliant.
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`Specifications
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`hflpzllwww.1flvac.conVsystuns/PVDIPVD300nm/PVD300mEnhm[9/23l2020 4:41 :44 PM]
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`TOpiC
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`Case 5:20-cv-05676-EJD Document 23-12 Filed 09/25/20 Page 5 of 6
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`http://www.ulvac.oom/systcms/PVD/PVD300mm/PVD300mmEn1mn[9/23/2020 4:41 :44 PM]
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`Case 5:20-cv-05676-EJD Document 23-12 Filed 09/25/20 Page 6 of 6
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